Zero-degree thermostat with redundancy function

Abstract

The utility model discloses a zero-degree thermostat with a redundancy function, which comprises a soaking block for a temperature control thermocouple to insert; the semiconductor chilling plates are symmetrically arranged on the two sides of the soaking block, the semiconductor chilling plates located on the same diagonal line are common semiconductor chilling plates, and the semiconductor chilling plates located on the other diagonal line are redundant semiconductor chilling plates; the semiconductor chilling plates in the common semiconductor chilling plates synchronously refrigerate, and the semiconductor chilling plates in the redundant semiconductor chilling plates synchronously refrigerate; the cooling fins are arranged on the sides, deviating from the soaking block, of the semiconductor chilling plates; the semiconductor chilling plate is in contact with the soaking block through a heat conducting block; and the semiconductor chilling plate is in contact with the radiating fin through a heat conducting plate. According to the utility model, two sets of independent semiconductor chilling plates are provided, one set works, and the other set is redundant and standby. Therefore, a long-time, stable and constant refrigeration environment is provided for the temperature control thermocouple.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermostat field, concretely relates to zero constant temperature device with redundancy function. BACKGROUND

[0002] Zero constant temperature device is the equipment for providing stable and accurate zero centigrade temperature for thermocouple reference end, and is the updated product replacing ice water mixture to provide zero centigrade temperature. Zero constant temperature device usually uses semiconductor refrigerating sheet to adjust temperature, makes isothermal block constant at zero centigrade, and the measuring end of the thermocouple to be detected is inserted into the hole of isothermal block, and sometimes the detection time is up to several months.

[0003] To ensure that zero constant temperature device works stably for a long time, does not occur the failure of temperature drift caused by semiconductor refrigerator abnormality, need to propose a long-term high reliability constant temperature device scheme. UTILITY MODEL CONTENT

[0004] The utility model solves the problem in providing zero constant temperature device with redundancy function, has two independent semiconductor refrigerating sheets, one works, and the other is redundant standby. Thus, a long time, stable constant refrigeration environment is provided for temperature control thermocouple.

[0005] To solve the above problems, the utility model provides zero constant temperature device with redundancy function, in order to achieve the above purpose, the technical scheme that the utility model solves its technical problems is:

[0006] Zero constant temperature device with redundancy function includes: isothermal block, for temperature control thermocouple insertion;Semiconductor refrigerating sheet, a plurality of semiconductor refrigerating sheets are symmetrically arranged on the two sides of isothermal block, and the semiconductor refrigerating sheet on the same diagonal line is the normal semiconductor refrigerating sheet, and the semiconductor refrigerating sheet on the other diagonal line is the redundant semiconductor refrigerating sheet;The semiconductor refrigerating sheet in normal semiconductor refrigerating sheet synchronously refrigerates, and the semiconductor refrigerating sheet in redundant semiconductor refrigerating sheet also synchronously refrigerates;Radiating fin, the side of semiconductor refrigerating sheet away from isothermal block is equipped with radiating fin;Semiconductor refrigerating sheet and isothermal block are contacted through heat conduction block;Semiconductor refrigerating sheet and radiating fin are contacted through heat conduction plate.

[0007] The beneficial effects of the above technical scheme are that the system has two independent semiconductor refrigerating sheets, one works, and the other is redundant standby. The control unit monitors the working state of semiconductor refrigerating sheet in real time, when one set is abnormal, then the other set of redundant refrigeration mechanism is switched to refrigerate. By monitoring the working state of semiconductor refrigerating sheet in real time, the redundant semiconductor refrigerating sheet is started quickly, so that the zero constant temperature device is always kept at zero centigrade. Thus, a stable microenvironment is provided for temperature control thermocouple, which can ensure that the long time constant refrigeration effect of up to several months can be provided.

[0008] Since the normal semiconductor refrigeration sheet and the redundant semiconductor refrigeration sheet are arranged in staggered diagonal lines, the refrigeration effects of the heat equalizing block by the two sets of refrigeration mechanisms are equivalent when the two sets of refrigeration mechanisms work independently.

[0009] The effect of the heat conducting block is to ensure uniform transmission of coldness and avoid local high temperature or local low temperature.

[0010] As a further improvement of the utility model, each semiconductor refrigeration sheet comprises a refrigeration plate, and each refrigeration plate has two wires drawn out; the size of each semiconductor refrigeration sheet is equal; the normal semiconductor refrigeration sheet comprises two semiconductor refrigeration sheets, and the redundant semiconductor refrigeration sheet comprises two semiconductor refrigeration sheets; the wires between the two semiconductor refrigeration sheets in the normal semiconductor refrigeration sheet pass through the centroid of the heat equalizing block, and the wires between the two semiconductor refrigeration sheets in the redundant semiconductor refrigeration sheet pass through the centroid of the heat equalizing block.

[0011] The above technical solution has the beneficial effect that each semiconductor refrigeration sheet is a standard same component, so the normal semiconductor refrigeration sheet and the redundant semiconductor refrigeration sheet each comprise the same components, and the difference lies in the different positions and working states, so the names are distinguished.

[0012] As a further improvement of the utility model, the side vertical surface of the heat equalizing block is composed of alternating flat surfaces and convex curved surfaces, the heat conducting block realizes surface contact with the flat surfaces, and the cross-sectional profile of the outer wall of the heat equalizing block at any height is the same.

[0013] The above technical solution has the beneficial effect that the heat equalizing block is close to a cylinder, but the flat surfaces ensure sufficient contact area.

[0014] As a further improvement of the utility model, the top of the heat equalizing block has a central hole located on the axis of the heat equalizing block, and the top of the heat equalizing block also has a plurality of side holes arranged in a ring array around the axis of the heat equalizing block, and the central hole and the side holes are used for selectively inserting the temperature control thermocouples.

[0015] The above technical solution has the beneficial effect that the central hole is the most symmetrical center, so after a single temperature control thermocouple is inserted, the temperature environment is most stable.

[0016] As a further improvement of the utility model, the projection area of the semiconductor refrigeration sheet towards the heat equalizing block is equal to the projection area of the heat conducting block towards the heat equalizing block, the projection area of the heat conducting plate towards the heat equalizing block is greater than the projection area of the heat conducting block towards the heat equalizing block, and the projection area of the heat dissipation sheet towards the heat equalizing block is greater than the projection area of the heat conducting plate towards the heat equalizing block.

[0017] The beneficial effect of the above technical solution is that the heat dissipation area is gradually expanded, thereby ensuring the heat transfer capacity.

[0018] As a further improvement of the utility model, the heat dissipation fin comprises an integral back plate and fin, and the plurality of fins are arranged in parallel and at intervals, and the heat conduction plates and the fins are respectively located on both sides of the back plate.

[0019] The beneficial effect of the above technical solution is that the fin greatly expands the surface area of the heat dissipation fin.

[0020] As a further improvement of the utility model, the heat conduction plates on both sides of the heat block are fixed to each other through the connecting rods, and the connecting rods allow the heat conduction plates on both sides of the heat block to have a mutual pressing force.

[0021] The beneficial effect of the above technical solution is that the various components are connected as a whole, thereby ensuring mutual contact and heat transfer.

[0022] As a further improvement of the utility model, the connecting rod is a hexagonal prism with an internal threaded hole at the end, and the heat conduction plates and the internal threaded hole are jointly penetrated by a countersunk bolt; the heat dissipation fin and the heat conduction plate are in surface contact, the heat conduction plates are assembled through the bolts, and the bolts and the countersunk bolts are interlaced with each other.

[0023] The beneficial effect of the above technical solution is that the head of the countersunk bolt is embedded, which is convenient for the heat dissipation fin to be in surface contact with the heat conduction plate.

[0024] As a further improvement of the utility model, the heat block, the semiconductor refrigeration fin and the heat dissipation fin are collectively wrapped by a machine shell, the machine shell is provided with a central hole and a heat dissipation hole, the vertical projection of the central hole intersects the heat block, and the vertical projection of the heat dissipation hole intersects the heat dissipation fin.

[0025] The beneficial effect of the above technical solution is that the machine shell provides a whole shell structure for the entire device, which plays a wrapping protection role on the internal components and is also convenient for heat exchange between the internal and external environments.

[0026] As a further improvement of the utility model, the machine shell is further provided with a display screen, a constant temperature button, a power button and an alarm lamp, the display screen displays the temperature of the heat block, the constant temperature button controls the heat block to be at a constant temperature, the power button controls the on-off of the semiconductor refrigeration fin, and when the temperature of the heat block is higher than a set threshold value, the alarm lamp flashes to alarm.

[0027] The beneficial effect of the above technical solution is that this design improves the operability and is convenient for personnel to observe and operate the zero-degree thermostat at any time. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0029] Figure 1 is an exploded view of an embodiment of the present application;

[0030] Figure 2 is a perspective view of an embodiment of the present application;

[0031] Figure 3 is an electric control principle diagram of an embodiment of the present application.

[0032] 1 - heat sink; 101 - back plate; 102 - fin; 2 - heat conduction plate; 3 - semiconductor refrigeration sheet; 301 - refrigeration plate; 302 - wire; 4 - heat conduction block; 5 - temperature control thermocouple; 6 - heat block; 601 - center hole; 602 - side hole; 603 - flat surface; 604 - convex curved surface; 7 - hexagonal prism; 701 - internal thread hole; 8 - bolt; 9 - countersunk bolt; 10 - machine shell; 11 - heat dissipation hole; 12 - center hole; 13 - display screen; 14 - handle; 15 - constant temperature button; 16 - power button; 17 - alarm lamp. DETAILED DESCRIPTION

[0033] The content of the present application will be further described in detail below in combination with specific embodiments:

[0034] In order to achieve the purpose of the present application, the zero constant temperature device with redundancy function comprises: a heat block 6 for inserting a temperature control thermocouple 5; a plurality of semiconductor refrigeration sheets 3 symmetrically arranged on both sides of the heat block 6, the semiconductor refrigeration sheets 3 on the same diagonal line being normal semiconductor refrigeration sheets, and the semiconductor refrigeration sheets 3 on the other diagonal line being redundant semiconductor refrigeration sheets; the semiconductor refrigeration sheets 3 in the normal semiconductor refrigeration sheets are synchronously refrigerated, and the semiconductor refrigeration sheets 3 in the redundant semiconductor refrigeration sheets are also synchronously refrigerated; a heat sink 1 arranged on the side of the semiconductor refrigeration sheet 3 away from the heat block 6; a heat conduction block 4 arranged between the semiconductor refrigeration sheet 3 and the heat block 6; and a heat conduction plate 2 arranged between the semiconductor refrigeration sheet 3 and the heat sink 1.

[0035] The beneficial effect of the above technical scheme is that the system has two independent semiconductor refrigerating plates, one of which works and the other of which is redundant. The control unit monitors the working state of the semiconductor refrigerating plate in real time, and when an abnormality occurs in one, the other redundant refrigerating mechanism is switched to refrigerate. By monitoring the working state of the semiconductor refrigerating plate in real time, the redundant semiconductor refrigerating plate is quickly started, thereby ensuring that the zero-degree thermostat always maintains zero degrees Celsius. Thus, a stable microenvironment is provided for the temperature control thermocouple, which can ensure that a long-term constant refrigeration effect, such as lasting for several months, is provided. Since the commonly used semiconductor refrigerating plate and the redundant semiconductor refrigerating plate are staggered and arranged in diagonal lines, the refrigeration effect of the two refrigerating mechanisms on the heat equalizing block is equivalent. The effect of the heat conducting block is to ensure uniform transmission of coldness and avoid local high or low temperature. The heat conducting plate and the heat sink, on the other hand, provide a step-by-step heat dissipation mechanism to ensure step-by-step and uniform heat dissipation, thereby in turn ensuring the stability of refrigeration.

[0036] In some other embodiments of the present application, each semiconductor refrigerating plate 3 comprises a refrigerating plate 301, and each refrigerating plate 301 has two wires 302 drawn out; the size of each semiconductor refrigerating plate 3 is equal; the commonly used semiconductor refrigerating plate comprises two semiconductor refrigerating plates 3, and the redundant semiconductor refrigerating plate comprises two semiconductor refrigerating plates 3; the connecting line between the two semiconductor refrigerating plates 3 in the commonly used semiconductor refrigerating plate passes through the centroid of the heat equalizing block 6, and the connecting line between the two semiconductor refrigerating plates 3 in the redundant semiconductor refrigerating plate passes through the centroid of the heat equalizing block 6.

[0037] The beneficial effect of the above technical scheme is that each semiconductor refrigerating plate is a standard identical component, so the commonly used semiconductor refrigerating plate and the redundant semiconductor refrigerating plate each consist of identical components, and the difference lies mainly in the different positions and working states, so they are distinguished by different names.

[0038] In some other embodiments of the present application, the side surface of the heat equalizing block 6 itself is composed of alternating flat surfaces 603 and convex curved surfaces 604, the heat conducting block 4 realizes surface contact with the flat surfaces 603, and the outer wall of the heat equalizing block 6 itself has the same profile at any height.

[0039] The beneficial effect of the above technical scheme is that the heat equalizing block as a whole is close to a cylinder, but the flat surfaces ensure sufficient contact area.

[0040] In some other embodiments of the present application, the heat equalizing block 6 itself has a central hole 601 on the axis of the heat equalizing block 6 itself, and the heat equalizing block 6 itself also has a plurality of side holes 602 arranged in a ring array around the axis of the heat equalizing block 6 itself, and the central hole 601 and the side holes 602 are used for the temperature control thermocouple 5 to be selectively inserted.

[0041] The beneficial effect of the above technical scheme is that the center hole is the most symmetrical center position, so after a single temperature control thermocouple is inserted, the temperature environment is most stable.

[0042] In some other embodiments of the present application, the projection area of the semiconductor refrigeration sheet 3 towards the heat spreading block 6 is equal to the projection area of the heat conducting block 4 towards the heat spreading block 6, the projection area of the heat conducting plate 2 towards the heat spreading block 6 is greater than the projection area of the heat conducting block 4 towards the heat spreading block 6, and the projection area of the heat dissipation sheet 1 towards the heat spreading block 6 is greater than the projection area of the heat conducting plate 2 towards the heat spreading block 4.

[0043] The beneficial effect of the above technical scheme is that the heat dissipation area is gradually expanded, thereby ensuring the heat transfer capacity.

[0044] In some other embodiments of the present application, the heat dissipation sheet 1 comprises an integral back plate 101 and fins 102, the fins 102 are arranged in parallel and at intervals, and the heat conducting plate 2 and the fins 102 are located on both sides of the back plate 101.

[0045] The beneficial effect of the above technical scheme is that the fins greatly expand the surface area of the heat dissipation sheet.

[0046] In some other embodiments of the present application, the heat conducting plates 2 on both sides of the heat spreading block 6 are fixed to each other through connecting rods, and the connecting rods allow the heat conducting plates 2 on both sides of the heat spreading block 6 to have a mutual extrusion force.

[0047] The beneficial effect of the above technical scheme is that the components are connected as a whole, thereby ensuring mutual contact and heat transfer.

[0048] In some other embodiments of the present application, the connecting rod is a hexagonal prism 7 with an internal threaded hole 701 at the end, the heat conducting plate 2 and the internal threaded hole 701 are jointly provided with a countersunk bolt 9, the heat dissipation sheet 1 and the heat conducting plate 2 realize surface contact, the heat conducting plates 2 are assembled through the bolt 8, and the bolt 8 and the countersunk bolt 9 are interlaced.

[0049] The beneficial effect of the above technical scheme is that the head of the countersunk bolt is embedded, which facilitates the surface contact between the heat dissipation sheet and the heat conducting plate.

[0050] As shown in the drawings, Figure 2 In some other embodiments of the present application, the heat spreading block 6, the semiconductor refrigeration sheet 3, and the heat dissipation sheet 1 are collectively wrapped by a machine shell 10, the machine shell 10 is provided with a central hole 12 and a heat dissipation hole 11, the vertical projection of the central hole 12 intersects with the heat spreading block 6, and the vertical projection of the heat dissipation hole 11 intersects with the heat dissipation sheet 1.

[0051] The beneficial effects of adopting the above technical solution are: the casing provides an integrated outer shell structure for the entire equipment, which plays a role in wrapping and protecting the internal components, and at the same time facilitates heat exchange between the internal and external environments.

[0052] like Figure 2 As shown, in some other embodiments of this utility model, the housing 10 is also provided with a display screen 13, which displays the temperature of the heat spreader 6. The housing 10 is also provided with a constant temperature button 15, a power button 16, and an alarm light 17. The constant temperature button 15 controls the heat spreader 6 to be at a constant temperature, and the power button 16 controls the power supply to the semiconductor cooling chip 3. When the temperature of the heat spreader 6 is higher than the set threshold, the alarm light 17 will flash to sound an alarm.

[0053] The beneficial effects of adopting the above technical solution are: this design improves operability and makes it easier for personnel to observe and operate the zero-degree thermostat at any time.

[0054] Figure 1 The casing 10 is hidden inside. Figure 2 This is the complete product outline drawing of this technical solution.

[0055] The thermal block 4 is made of thermally conductive silicone, which uses glass fiber as the base material. It has a thermal conductivity of 5.0W / mK, a breakdown voltage of >5000V, and is self-adhesive on both sides.

[0056] like Figure 2 As shown, Figure 2 yes Figure 1 The assembly drawing shows the effect after adding the housing 10, which is fixed with a handle 14. The top of the housing 10 has a heat dissipation hole 11, which is located directly above the heat sink 1.

[0057] like Figure 1 As shown, the plane on which the fin 102 is located is vertical and parallel to the through direction of the heat dissipation hole 11.

[0058] The redundant zero-degree thermostat system mainly consists of a thermoelectric cooler 3, a heat spreader 6, a temperature control thermocouple 5, a heat conduction block 4, a heat sink 1, and a control unit. The hot side of the thermoelectric cooler 3 faces the heat sink 1, and the cold side faces the heat spreader 6. The thermoelectric coolers 3 operate in diagonal pairs.

[0059] like Figure 3 As shown, the principle of the control unit is as follows: The central processing unit (MCU) detects the temperature of the temperature distribution block 6 through the temperature-controlled thermocouple 5, and the drive circuit controls the operation of the thermoelectric cooler 3 to keep the temperature distribution block 6 at zero degrees Celsius. The MCU detects the operating current of the thermoelectric cooler 3 through two Hall current sensors. When the operating current of the thermoelectric cooler 3 is abnormal, the redundant thermoelectric cooler is quickly activated, while the commonly used thermoelectric cooler is shut down to ensure that the zero-degree thermostat is always kept at zero degrees Celsius.

[0060] Among them, the central processing unit MCU has a drive circuit pointing to the commonly used semiconductor refrigeration piece, and the commonly used semiconductor refrigeration piece also has a current detection circuit pointing to the central processing unit MCU; the central processing unit MCU has a drive circuit pointing to the redundant semiconductor refrigeration piece, and the commonly used semiconductor refrigeration piece also has a current detection circuit pointing to the central processing unit MCU.

[0061] As shown in Figure 3 The monitoring temperature of the temperature control thermocouple 5 is one of the state indication parameters of the central processing unit MCU.

[0062] The zero constant temperature device further comprises a turbo key, i.e. a strong force key, and the rapid refrigeration function is started by pressing the strong force key. When the strong force key is pressed, the commonly used semiconductor refrigeration piece and the redundant semiconductor refrigeration piece work simultaneously, rapid refrigeration is achieved, and after the set temperature is reached, the circuit of the redundant semiconductor refrigeration piece is disconnected, only the commonly used semiconductor refrigeration piece circuit is reserved, and the commonly used semiconductor refrigeration piece continues to work.

[0063] The above examples are only for illustrating the technical concept and characteristics of the present application, the purpose is to enable the person skilled in the art to understand the content of the present application and implement it, and it cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A zero degree thermostat with redundancy, characterized in that, It includes: The heat block, the temperature control thermocouple is inserted; The semiconductor refrigeration piece, a plurality of semiconductor refrigeration pieces are symmetrically arranged on both sides of the heat block, on the same diagonal line, the semiconductor refrigeration piece is the commonly used semiconductor refrigeration piece, on the other diagonal line, the semiconductor refrigeration piece is the redundant semiconductor refrigeration piece; The semiconductor refrigeration piece in the commonly used semiconductor refrigeration piece is synchronous refrigeration, and the semiconductor refrigeration piece in the redundant semiconductor refrigeration piece is also synchronous refrigeration; The fin, the side of the semiconductor refrigeration piece away from the heat block is provided with a fin; The semiconductor refrigeration piece and the heat block are contacted through the heat conduction block; The semiconductor refrigeration piece and the fin are contacted through the heat conduction plate.

2. The zero degree thermostat with redundancy as defined in claim 1, wherein: Each semiconductor refrigeration piece includes a refrigeration plate, and each refrigeration plate leads out two wires; The size of each semiconductor refrigeration piece is equal; The commonly used semiconductor refrigeration piece includes two semiconductor refrigeration pieces, and the redundant semiconductor refrigeration piece includes two semiconductor refrigeration pieces; The connecting line between the two semiconductor refrigeration pieces in the commonly used semiconductor refrigeration piece passes through the centroid of the heat block, and the connecting line between the two semiconductor refrigeration pieces in the redundant semiconductor refrigeration piece passes through the centroid of the heat block.

3. The zero degree thermostat with redundancy as defined in claim 1, wherein: The side vertical surface of the heat block itself is composed of alternating flat surfaces and convex curved surfaces, the heat conduction block and the flat surface realize surface contact, and the outer wall of the heat block itself is the same at any height of the cross section profile.

4. The zero degree thermostat with redundancy as defined in claim 1, wherein: The heat block itself top has a center hole, the center hole is located on the heat block itself axis, the heat block itself top also has a plurality of side holes, the side holes are arranged in annular array around the heat block itself axis, the center hole and the side hole are selectively inserted for the temperature control thermocouple.

5. The zero degree thermostat with redundancy as recited in claim 1, wherein: The projection area of the semiconductor refrigeration piece towards the heat block is equal to the projection area of the heat conduction block towards the heat block, the projection area of the heat conduction plate towards the heat block is greater than the projection area of the heat conduction block towards the heat block, and the projection area of the fin towards the heat block is greater than the projection area of the heat conduction plate towards the heat block.

6. The zero degree thermostat with redundancy as recited in claim 1, wherein: The fin includes an integral back plate and a fin, a plurality of fins are arranged in parallel and are spaced apart, and the heat conduction plate and the fin are located on the two sides of the back plate respectively.

7. The zero degree thermostat with redundancy as recited in claim 1, wherein: The heat conduction plates on both sides of the heat block are fixed to each other through the connecting rods, and the connecting rods allow the heat conduction plates on both sides of the heat block to have extrusion force to each other.

8. The zero degree thermostat with redundancy as defined in claim 7, wherein: The connecting rod is a hexagonal prism with an internal threaded hole at the end, and the heat conduction plate and the internal threaded hole are jointly penetrated by a countersunk bolt; The fin and the heat conduction plate realize surface contact, the heat conduction plates are assembled through the bolts, and the bolts and the countersunk bolts are staggered with each other.

9. The zero degree thermostat with redundancy as claimed in any one of the claims 1 to 8, wherein: The heat block, the semiconductor refrigeration piece and the fin are wrapped by the shell, the shell is provided with a center hole and a heat dissipation hole, the vertical projection of the center hole intersects with the heat block, and the vertical projection of the heat dissipation hole intersects with the fin.

10. The zero degree thermostat with redundancy as defined in claim 9, wherein: The shell is also provided with a display screen, the display screen displays the temperature of the heat block, the shell is also provided with a constant temperature button, a power button and an alarm lamp, the constant temperature button controls the heat block to be at a constant temperature, the power button controls the on-off of the semiconductor refrigeration piece, and when the temperature of the heat block is higher than the set threshold, the alarm lamp will flash and alarm.

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