Spectral chip and electronic device
By designing an array of multiple photosensitive groups and photosensitive units arranged alternately in the spectral chip, along with a light-shielding layer, the shortcomings of RGB chips and multispectral chips are solved, achieving a combination of hyperspectral information and high imaging clarity, thus improving image quality and the acquisition effect of spectral information.
Patent Information
- Application Number
- CN202520250442.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing RGB chips and multispectral chips each have their own advantages and disadvantages in spectral imaging technology. RGB chips have high image clarity but limited spectral information, while multispectral chips have rich spectral information but low image clarity, making it difficult to balance high spectral information and high image clarity.
Design a spectral chip comprising multiple first and second photosensitive groups. Each first photosensitive group includes red, green, and blue photosensitive units, and each second photosensitive group includes multiple photosensitive units that sense different wavelengths. Through alternating array arrangement and light-shielding layer design, ensure comprehensive acquisition of image clarity and spectral information.
It achieves the capture of a wider range of spectral information while maintaining high image clarity, enhances the spatial resolution and spectral range of the image, simplifies the manufacturing process, and improves the image quality and the accuracy of spectral information.
Smart Images
Figure CN223955014U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of spectral imaging technology, specifically relates to spectral chip and electronic equipment. BACKGROUND
[0002] In the spectral imaging technology, RGB chip and multispectral chip each has its advantage and limitation, RGB chip can realize higher spatial resolution, thereby ensuring that the definition of image reaches higher level, but its captured spectral information is relatively limited, and it is difficult to meet the demand for more extensive spectral information. While multispectral chip can provide rich spectral information and cover a wider spectral range, but the spatial resolution is lower, which leads to lower imaging definition. SUMMARY
[0003] The embodiment of the utility model provides a kind of spectral chip and electronic equipment, can obtain rich spectral information, and clear image, can improve the problem in relevant technology.
[0004] In the first aspect, the embodiment of the utility model provides a kind of spectral chip, comprising a plurality of photosensitive regions, each photosensitive region includes:
[0005] A plurality of first photosensitive groups, each first photosensitive group includes a plurality of first photosensitive units, the first photosensitive unit is used to respond to the light signal of first wavelength, and the light signal of first wavelength is visible light;And,
[0006] Second photosensitive group includes a plurality of second photosensitive units, the second photosensitive unit is used to respond to the light signal of second wavelength, and the second wavelength is different from the first wavelength, and at least two second photosensitive units are used to respond to the light signal of different wavelength.
[0007] In an embodiment, each first photosensitive group includes a red light photosensitive unit, a green light photosensitive unit and a blue light photosensitive unit.
[0008] In an embodiment, the first photosensitive group includes four first photosensitive units, four first photosensitive units include a red light photosensitive unit, two green light photosensitive units and a blue light photosensitive unit, four first photosensitive units are arranged in array, and two green light photosensitive units are diagonally arranged.
[0009] In an embodiment, each photosensitive region, each second photosensitive unit is used to respond to the light signal of different wavelength.
[0010] In an embodiment, the area of the first photosensitive unit and the second photosensitive unit is equivalent.
[0011] In an embodiment, the second light-sensing group comprises a plurality of light-sensing subgroups, the plurality of first light-sensing groups and the plurality of light-sensing subgroups are arranged in an array, and in the array arrangement direction, the first light-sensing groups and the light-sensing subgroups are alternately arranged in sequence.
[0012] In an embodiment, the first light-sensing unit adjacent to the light-sensing subgroup in the first light-sensing group is provided with a light-shielding layer on the side facing the light-sensing subgroup; and / or,
[0013] the second light-sensing unit adjacent to the first light-sensing group in the light-sensing subgroup is provided with a light-shielding layer on the side facing the first light-sensing group.
[0014] In an embodiment, the number of the first light-sensing units in each first light-sensing group is the same as the number of the second light-sensing units in each light-sensing subgroup.
[0015] In an embodiment, in each light-sensing region, the number of the first light-sensing groups is greater than or equal to the number of the light-sensing subgroups.
[0016] In a second aspect, embodiments of the present application provide an electronic device comprising the spectral chip according to any one of the above.
[0017] In an embodiment, the electronic device further comprises a control device, and the control device is adapted to perform fusion processing on a first image acquired by the first light-sensing group and a second image acquired by the second light-sensing group to obtain a multispectral image.
[0018] The embodiments of the present application have the following beneficial effects:
[0019] In the embodiments of the present application, the spectral chip comprises a plurality of light-sensing regions, each light-sensing region comprises a plurality of first light-sensing groups and a second light-sensing group, a plurality of first light-sensing units in the plurality of first light-sensing groups sense visible light, and the precise sensing of visible light can effectively ensure the definition of the image, and a plurality of second light-sensing units in the second light-sensing group can sense light signals different from the first wavelength, and at least two second light-sensing units sense light signals of different wavelengths, which makes the spectral chip capable of capturing more extensive spectral information and covering a wider spectral range, i.e., in the embodiments of the present application, by arranging a plurality of first light-sensing groups for precise sensing of visible light in each light-sensing region of the spectral chip, and a second light-sensing group composed of a plurality of second light-sensing units capable of sensing different wavelengths and different from the first wavelength, an image with rich spectral information and clear definition can be obtained. BRIEF DESCRIPTION OF DRAWINGS
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a three-dimensional schematic diagram of the first structure of the spectral chip provided in an embodiment of this utility model;
[0022] Figure 2 yes Figure 1 A top view schematic diagram of the first structure of the spectral chip in the image;
[0023] Figure 3 This is a top view schematic diagram of the second structure of the spectral chip provided in an embodiment of this utility model;
[0024] Figure 4 This is a top view schematic diagram of the third structure of the spectral chip provided in an embodiment of this utility model;
[0025] Figure 5 This is a top view schematic diagram of the fourth structure of the spectral chip provided in the embodiment of this utility model.
[0026] Explanation of icon numbers:
[0027] 100. Spectral chip; 101. Photosensitive area; 1. First photosensitive group; 11. First photosensitive unit; 2. Second photosensitive group; 21. Second photosensitive unit; 22. Photosensitive subgroup; 3. Light-shielding layer. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.
[0029] The following is combined Figures 1 to 5 Describing the spectral chip of this application, Figure 1This is a three-dimensional schematic diagram of the first structure of the spectral chip provided in an embodiment of this utility model. Figure 2 This is a top view of the first structure of the spectral chip provided in an embodiment of this utility model. Figure 3 This is a top view of a second structure of the spectral chip provided in an embodiment of this utility model. Figure 4 This is a top view of the third structure of the spectral chip provided in an embodiment of this utility model. Figure 5 This is a top view of the fourth structure of the spectral chip provided in the embodiments of this utility model.
[0030] Reference Figure 1 and Figure 2 The spectral chip 100 includes multiple photosensitive areas 101, and each photosensitive area 101 includes multiple sets of first photosensitive groups 1 ( Figure 1 and Figure 2 The diagram illustrates that each photosensitive area 101 includes two groups of first photosensitive groups 1) and second photosensitive groups 2, and each group of first photosensitive groups 1 includes multiple first photosensitive units 11 ( Figure 1 and Figure 2 The diagram illustrates that each first photosensitive group 1 includes four first photosensitive units 11, which are used to sense light signals of a first wavelength, which are visible light; the second photosensitive group 2 includes multiple second photosensitive units 21. Figure 1 and Figure 2 The diagram shows eight second photosensitive units 21, which are used to sense light signals of a second wavelength that are different from the first wavelength. At least two second photosensitive units 21 are used to sense light signals of different wavelengths.
[0031] In the spectral chip 100 of this invention, each photosensitive area 101 includes multiple sets of first photosensitive groups 1 and second photosensitive groups 2. Multiple first photosensitive units 11 in the multiple sets of first photosensitive groups 1 sense visible light. By accurately sensing visible light, the clarity of the image can be effectively guaranteed. Multiple second photosensitive units 21 in the second photosensitive group 2 can sense light signals with different wavelengths than the first wavelength, and at least two second photosensitive units 21 sense light signals with different wavelengths. This allows the spectral chip 100 to capture a wider range of spectral information and cover a wider spectral range. That is, in the spectral chip 100 of this invention, by setting multiple sets of first photosensitive groups 1 for accurately sensing visible light and second photosensitive groups 2 composed of multiple second photosensitive units 21 that can sense light signals with different wavelengths than the first wavelength in each photosensitive area 101 of the spectral chip 100, a clear image with rich spectral information can be obtained.
[0032] Understandably, each first photosensitive group 1 includes multiple first photosensitive units 11. The first photosensitive units 11 are used to sense light signals of a first wavelength. The first photosensitive group 1 can be a combination of sensors covering different visible spectrum bands. For example, the multiple first photosensitive units 11 include cyan light-sensitive units, yellow light-sensitive units, magenta light-sensitive units, etc.
[0033] In one embodiment, see Figure 2 , Figure 3 , Figure 4 or Figure 5 Each first photosensitive group 1 includes a red light photosensitive unit, a green light photosensitive unit, and a blue light photosensitive unit. In this embodiment, multiple first photosensitive units 11 include red (R) light photosensitive units, green (G) light photosensitive units, and blue (B) light photosensitive units. Since the human visual system primarily relies on red, green, and blue cone cells to perceive color, using RGB photosensitive units can directly simulate the human eye's color perception pattern, thereby allowing images to more realistically reproduce colors found in nature. The RGB color model is the most commonly used color space in digital image processing. Adopting this RGB photosensitive unit design simplifies subsequent image processing. Currently, most modern displays operate based on the RGB three-primary-color principle. Images captured using RGB photosensitive units can be directly and efficiently displayed on these devices without complex conversion operations. In these devices, each pixel consists of three sub-pixels: red, green, and blue. This layout efficiently utilizes space to achieve high-resolution imaging. Furthermore, RGB sensor technology is quite mature, resulting in relatively low manufacturing costs for related hardware. In other words, in this embodiment, by directly setting the photosensitive units corresponding to the three primary colors of human vision, RGB color information can be directly acquired, ensuring that the image achieves a high level of color reproduction and clarity, providing a clear visual foundation for the image, and also simplifying the image processing process and reducing production costs.
[0034] In one embodiment, see Figure 2 , Figure 3 , Figure 4 or Figure 5The first photosensitive group 1 includes four first photosensitive units 11, the four first photosensitive units 11 include one red photosensitive unit, two green photosensitive units, and one blue photosensitive unit, the four first photosensitive units 11 are arranged in an array, and the two green photosensitive units are diagonally arranged. In this embodiment, the sensitivity of the human eye to green light is higher than that to other colors, and based on this characteristic, two green photosensitive units are arranged in the first photosensitive group 1. The diagonal arrangement can cover the image area more widely in the two-dimensional plane, and collect green light information from different angles. When collecting images, the color details containing green can be captured more comprehensively, so that the color transition related to green in the image is more natural, and the balance of the image color is improved. Moreover, the optimized color sampling structure increases the collection points of effective color information in a unit area, which helps to improve the spatial resolution of the image, further enhances the image clarity, and makes the picture details more rich and real.
[0035] In an embodiment, see Figure 2 , Figure 3 , Figure 4 or Figure 5 In each photosensitive region 101, each second photosensitive unit 21 is used to sense light signals of different wavelengths. In this embodiment, each second photosensitive unit 21 senses light signals of different wavelength ranges, so that the spectral chip 100 can capture more dispersed light signals of different wavelength ranges. This can greatly widen the spectral range that the spectral chip 100 can sense, and collect more types of spectral information, providing a basis for obtaining images with rich spectral information. For example, as shown in Figure 2 , eight second photosensitive units 21 are arranged, and the eight second photosensitive units 21 correspond to eight channels (B4, B5, B6, B7, B8, B9, B10, B11), plus the three channels (B1, B2, B3) corresponding to the first photosensitive group 1, a total of eleven channels.
[0036] In an embodiment, see Figure 2 , Figure 3 , Figure 4 or Figure 5The area of the first light-sensing unit 11 is equal to that of the second light-sensing unit 21. In the embodiment, the equal area of the first light-sensing unit 11 and the second light-sensing unit 21 helps to reduce the manufacturing difficulty. In the chip manufacturing process, the light-sensing units with similar areas can use more unified manufacturing process parameters. For example, in the process of photoetching and etching, no complex process adjustment is needed for light-sensing units with different areas, which simplifies the manufacturing process and reduces the variables and complexity in the manufacturing process. The first light-sensing unit 11 and the second light-sensing unit 21 with similar areas are easier to plan and arrange, which helps to reduce the layout disorder problem caused by the difference in shape and size of the light-sensing units, thereby improving the regularity of the chip layout. When sensing light signals, it helps to make the first light-sensing unit 11 and the second light-sensing unit 21 have relatively consistent light sensing ability under the same space limitation, which is conducive to the balanced sensing of light signals as a whole, whether it is visible light or other wavelengths of light, which can be collected under relatively uniform sensing conditions, helping to improve the image quality and the accuracy of spectral information.
[0037] In an embodiment, see Figure 2 , Figure 3 , Figure 4 or Figure 5 The second light-sensing group 2 includes a plurality of light-sensing subgroups 22, and the plurality of first light-sensing groups 1 and the plurality of light-sensing subgroups 22 are arranged in an array, and in the arrangement direction of the array, the first light-sensing groups 1 and the light-sensing subgroups 22 are arranged alternately. In the embodiment, the first light-sensing groups 1 are mainly responsible for capturing the spatial information of the image, which determines the sharpness of the image; and the light-sensing subgroups 22 are mainly responsible for obtaining spectral information. Arranging them in an array and alternately, when light shines on the chip, for each small area, the first light-sensing group 1 can quickly capture the spatial details of the area, such as the outline and shape of the object, and at the same time, the light-sensing subgroup 22 adjacent to it can immediately collect the spectral information of the area. This close combination at the microscopic level enables each image element to have clear spatial information and rich spectral information at the same time during imaging, realizing the synchronous acquisition of high definition and rich spectral information.
[0038] In an embodiment, see Figure 1In the embodiment, when the light irradiates the chip, the light may be scattered or refracted due to the close distance between the light sensing units, which causes the light crosstalk between the different light sensing units. For example, the signal of the visible light sensed by the first light sensing group 1 may interfere with the accurate reception of the specific wavelength light signal by the photosensing group 22, and vice versa. For the first light sensing unit 11, the light shielding layer 3 can prevent the interference of the non-visible light from the photosensing group 22 on the sensing of the visible light, ensuring the accuracy of the sensing of the visible light. For the second light sensing unit 21, the light shielding layer 3 can prevent the interference of the visible light from the first light sensing group 1 on the sensing of the other wavelength light signal, thereby improving the accuracy of the sensing of the target wavelength light signal by the respective light sensing unit, and further improving the clarity of the image and the accuracy of the spectral information.
[0039] In an embodiment, referring to Figure 2 , Figure 3 , Figure 4 or Figure 5 , the number of the first light sensing units 11 in each first light sensing group 1 is the same as the number of the second light sensing units 21 in each photosensing group 22 (for example, the number of the first light sensing units 11 in each first light sensing group 1 and the number of the second light sensing units 21 in each photosensing group 22 are both four as shown in the figure). In the embodiment, the number of the first light sensing units 11 in each first light sensing group 1 is the same as the number of the second light sensing units 21 in each photosensing group 22, which can maintain a balance in the layout of the chip and the design of the light signal sensing. From the perspective of data processing, the same number of light sensing units can simplify the algorithm design for subsequent light signal data processing, facilitate the relatively balanced analysis and processing of the two different types of light signals (visible light and other wavelength light signals), and help to improve the image quality and the integration effect of the spectral information.
[0040] In an embodiment, referring to Figure 2 , Figure 3 , Figure 4 or Figure 5 , in each photosensing region 101, the number of the first light sensing groups 1 is greater than or equal to the number of the photosensing groups 22 (in Figure 2 and Figure 4 , the number of the first light sensing groups 1 is equal to the number of the photosensing groups 22, Figure 3 and Figure 5In the embodiment, the number of the first light-sensing groups 1 is greater than the number of the light-sensing subgroups 22. In the embodiment, the first light-sensing groups 1 mainly sense visible light, which is important for ensuring the definition of the image. The large number of the first light-sensing groups 1 ensures sufficient sensing of the visible light, thereby better ensuring the definition of the image. Meanwhile, on the basis of sufficient sensing of the visible light, the light-sensing subgroups 22 sense light signals of other wavelengths to enrich the spectral information. This number relationship helps to widen the collection range of the spectral information as much as possible on the premise of ensuring the basic quality (definition) of the image.
[0041] The four structures of the spectral chip 100 are described in detail below to more clearly illustrate the technical solutions of the present application. Figure 1 and Figure 2 ( Figure 2 Each of the first light-sensing groups 1 and each of the light-sensing subgroups 22 is framed by a dashed line), each light-sensing region 101 of the spectral chip 100 of the first structure includes two groups of the first light-sensing groups 1 and the second light-sensing groups 2, the second light-sensing groups 2 include two light-sensing subgroups 22, the two groups of the first light-sensing groups 1 and the two light-sensing subgroups 22 form a 2*2 array, each of the first light-sensing groups 1 includes one red light-sensing unit (see R in the figure, corresponding to channel B1), two green light-sensing units (see G in the figure, corresponding to channel B2), and one blue light-sensing unit (see B in the figure, corresponding to channel B3), each of the light-sensing subgroups 22 includes four second light-sensing units 21, and there are a total of eight second light-sensing units 21, each of the second light-sensing units 21 is used for sensing light signals of different wavelength ranges (corresponding to channels B4, B5, B6, B7, B8, B9, B10, B11), and therefore the spectral chip 100 includes eight channels (see B1, B2, B3…B7, B8 in the figure). Figure 3 ( Figure 3 Each of the first light-sensing groups 1 and each of the light-sensing subgroups 22 is framed by a dashed line), each light-sensing region 101 of the spectral chip 100 of the second structure includes five groups of the first light-sensing groups 1 and the second light-sensing groups 2, the second light-sensing groups 2 include four light-sensing subgroups 22, the five groups of the first light-sensing groups 1 and the four light-sensing subgroups 22 form a 3*3 array, each of the first light-sensing groups 1 includes one red light-sensing unit, two green light-sensing units, and one blue light-sensing unit, each of the light-sensing subgroups 22 includes four second light-sensing units 21, and there are a total of sixteen second light-sensing units 21, each of the second light-sensing units 21 is used for sensing light signals of different wavelength ranges, and therefore the spectral chip 100 includes nineteen light-sensing units of channels (see B1, B2, B3…B18, B19 in the figure). Figure 4 ( Figure 4In the third structure, each photosensitive region 101 of the spectral chip 100 includes eight first photosensitive groups 1 and second photosensitive groups 2, the second photosensitive group 2 includes eight photosensitive subgroups 22, the eight first photosensitive groups 1 and the eight photosensitive subgroups 22 form a 4*4 array, each first photosensitive group 1 includes one red light photosensitive unit, two green light photosensitive units, and one blue light photosensitive unit, each photosensitive subgroup 22 includes four second photosensitive units 21, and there are thirty-two second photosensitive units 21 in total, each second photosensitive unit 21 is used to sense light signals of different wavelength ranges, and therefore, the spectral chip 100 includes thirty-five channel photosensitive units (see B1, B2, B3, ……, B34, B35 in the figure). As shown in FIG. 4B, the spectral chip 100 includes thirty-five channel photosensitive units (B1, B2, B3, ……, B34, B35) arranged in a 4*4 array. Figure 5 ( Figure 5 In the fourth structure, each photosensitive region 101 of the spectral chip 100 includes thirteen first photosensitive groups 1 and second photosensitive groups 2, the second photosensitive group 2 includes twelve photosensitive subgroups 22, the thirteen first photosensitive groups 1 and the twelve photosensitive subgroups 22 form a 5*5 array, each first photosensitive group 1 includes one red light photosensitive unit, two green light photosensitive units, and one blue light photosensitive unit, each photosensitive subgroup 22 includes four second photosensitive units 21, and there are forty-eight second photosensitive units 21 in total, each second photosensitive unit 21 is used to sense light signals of different wavelength ranges, and therefore, the spectral chip 100 includes fifty-one channel photosensitive units (see B1, B2, B3, ……, B50, B51 in the figure).
[0042] According to the embodiment of the second aspect of the application, an electronic device is provided, which includes a spectral chip 100, the structure of the spectral chip 100 is as described above, and since the vehicle adopts all the technical solutions of the above-mentioned embodiments, it at least has the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
[0043] In an embodiment, the electronic device further comprises a control device, the control device being adapted to fuse the first image acquired by the first photosensitive group 1 and the second image acquired by the second photosensitive group 2 to obtain a multispectral image. In this embodiment, the electronic device is additionally provided with a control device for fusing the images acquired by the first and second photosensitive groups, which can realize efficient synthesis of the multispectral image. The first image acquired by the first photosensitive group 1 focuses on spatial information, and the second image acquired by the second photosensitive group 2 focuses on spectral information. The control device can quickly and accurately fuse the two images, eliminating the need for manual intervention or complex external processing procedures, improving the efficiency of image generation, and allowing users to obtain multispectral images more timely for subsequent analysis or application. Through fusion processing, the control device combines clear spatial details and rich spectral characteristics, making up for the shortcomings of a single image, so that the generated multispectral image not only has clear contours, but also can accurately reflect the characteristics of the material, composition, etc. of the object, greatly improving the accuracy and reliability of recognition in image classification, target recognition, etc. The fused multispectral image enables the electronic device to be applicable to more professional scenarios, thereby significantly widening the application range of the electronic device and improving its use value.
[0044] According to the embodiment of the third aspect of the present application, a spectral imaging method is provided, based on any one of the spectral chips 100 as above, the spectral imaging method comprising:
[0045] S100: acquiring a first image by the first photosensitive group 1 and acquiring a second image by the second photosensitive group 2;
[0046] S200: fusing the first image and the second image to obtain a multispectral image.
[0047] In this embodiment, the first photosensitive group 1 obtains a high-resolution visible light image, and the second photosensitive group 2 obtains a low-resolution multispectral image. Fusing the high-resolution visible light image and the low-resolution multispectral image can obtain a high-resolution multispectral image. Therefore, by acquiring the first image by the first photosensitive group 1 and acquiring the second image by the second photosensitive group 2, and then fusing the first image and the second image, an image with rich spectral information and clear details can be obtained.
[0048] In an embodiment, the second photosensitive group 2 comprises a plurality of photosensitive subgroups 22, the plurality of first photosensitive groups 1 and the plurality of photosensitive subgroups 22 are arranged in an array, and in the arrangement direction of the array, the first photosensitive groups 1 and the photosensitive subgroups 22 are alternately arranged in sequence. The step S100 of acquiring the first image by the first photosensitive group 1 and acquiring the second image by the photosensitive subgroup 22 adjacent to the first photosensitive group 1 comprises:
[0049] S110: obtaining a first initial image by the first photosensitive group 1 and obtaining a second initial image by the photosensitive sub-group 22 adjacent to the first photosensitive group 1;
[0050] S120: performing difference processing on the first initial image based on the gray value of the second initial image to obtain a first image, and performing difference processing on the second initial image based on the gray value of the first initial image to obtain a second image.
[0051] In the embodiment, when the first initial image is obtained by the first photosensitive group 1, the region corresponding to the adjacent photosensitive sub-group 22 is regarded as pixel missing, at this time, the pixel missing is processed by difference processing based on the gray value of the second initial image to obtain the first image after reconstruction, and similarly, when the second initial image is obtained by the photosensitive sub-group 22 adjacent to the first photosensitive group 1, the region corresponding to the adjacent first photosensitive group 1 is regarded as pixel missing, at this time, the pixel missing is processed by difference processing based on the gray value of the first initial image to obtain the second image after reconstruction. That is, for the first initial image, the region corresponding to the adjacent photosensitive sub-group 22 is regarded as pixel missing, and the difference processing is performed based on the gray value of the second initial image, so that the possible value of the missing pixel can be inferred according to the existing image information around, so that the first image is supplemented with reasonable pixel value in the region where the pixel is originally missing, and the integrity of the image is reconstructed. Similarly, for the second initial image, the similar effect can also be achieved by the gray value of the first initial image, so as to ensure the integrity of the second image. The continuity of the first image and the second image after difference processing is restored, the definition and accuracy of the image are improved, and the final image has clear details brought by high resolution and rich spectral information.
[0052] The embodiments of the utility model are introduced in detail above, the principle and implementation mode of the utility model are described in this paper by applying specific examples, the above embodiment is only used to help understanding the method and core idea of the utility model; meanwhile, for the person skilled in the art, according to the idea of the utility model, the specific implementation mode and application range will have changes, and the content of the specification should not be understood as the limitation of the utility model.
Claims
1. A spectroscopic chip, characterized by comprise a plurality of light sensing regions, each of the light sensing regions comprising: a plurality of first light sensing groups, each of the first light sensing groups comprising a plurality of first light sensing units, the first light sensing units being configured to sense light signals of a first wavelength, the first wavelength being in a visible light range; and a second light sensing group comprising a plurality of second light sensing units, the second light sensing units being configured to sense light signals of a second wavelength, the second wavelength being different from the first wavelength, at least two of the second light sensing units being configured to sense light signals of different wavelengths.
2. The optical chip of claim 1, wherein, Each of the first light sensing groups comprises a red light sensing unit, a green light sensing unit, and a blue light sensing unit.
3. The optical chip of claim 2, wherein, The first light sensing group comprises four first light sensing units, the four first light sensing units comprising one red light sensing unit, two green light sensing units, and one blue light sensing unit, the four first light sensing units being arranged in an array, and the two green light sensing units being arranged diagonally.
4. The optical chip of claim 1, wherein, Each of the second light sensing units in each of the light sensing regions is configured to sense light signals of different wavelengths.
5. The optical chip of claim 1, wherein, The first light sensing units and the second light sensing units have a same area.
6. The optical chip of claim 1, wherein, The second light sensing group comprises a plurality of light sensing subgroups, the plurality of first light sensing groups and the plurality of light sensing subgroups being arranged in an array, and in a direction of the array, the first light sensing groups and the light sensing subgroups are arranged alternately.
7. The optical chip of claim 6, wherein, The first light sensing units in the first light sensing group adjacent to the light sensing subgroup are provided with a light shielding layer on a side facing the light sensing subgroup; and / or The second light sensing units in the light sensing subgroup adjacent to the first light sensing group are provided with a light shielding layer on a side facing the first light sensing group.
8. The optical chip of claim 6, wherein, The number of the first light sensing units in each of the first light sensing groups is the same as the number of the second light sensing units in each of the light sensing subgroups.
9. The optical chip of claim 6, wherein, In each of the light sensing regions, the number of the first light sensing groups is greater than or equal to the number of the light sensing subgroups.
10. An electronic device, comprising: The electronic device further comprises a control device, the control device being adapted to fuse a first image acquired by the first light sensing groups and a second image acquired by the second light sensing groups to obtain a multispectral image.
11. The electronic device of claim 10, wherein, The electronic device further comprises a control device, the control device being adapted to fuse a first image acquired by the first light sensing groups and a second image acquired by the second light sensing groups to obtain a multispectral image.