Temperature sensor packaging structure

Abstract

The utility model relates to a temperature sensor packaging structure, and relates to the technical field of temperature sensors, the temperature sensor packaging structure comprises a temperature resistor, a lead wire electrically connected with the temperature resistor, and a packaging sleeve sleeving the temperature sensor and the lead wire, the packaging sleeve is made of PEEK material, a buffer sleeve is arranged in the packaging sleeve, and the temperature sensor is arranged in the buffer sleeve. And the buffer sleeve is sleeved on the outer side of the temperature sensor. The temperature sensor has the advantages that the pollution degree to the environment is reduced, and the temperature sensor can be more suitable for the change effect of thermal expansion and cold contraction.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature sensors, in particular to a temperature sensor packaging structure. BACKGROUND

[0002] The temperature sensor is a common temperature value detection device, which mainly utilizes the principle that the resistance value of the temperature resistor changes with temperature, and the specific situation of the temperature is corresponded by the size of the current.

[0003] For the related technology in the above, the inventor finds that the following defects exist: the conventional high-temperature-resistant temperature sensor packaging is made of materials containing halogen elements, but the halogen element material will produce irritating and toxic gas when burning, especially in the field of temperature sensors, thereby there is a certain safety hazard. SUMMARY

[0004] In order to solve the above problems, the present application provides a temperature sensor packaging structure.

[0005] The temperature sensor packaging structure provided by the present application adopts the following technical scheme:

[0006] A temperature sensor packaging structure, comprising a temperature resistor, a lead wire electrically connected with the temperature resistor, and a packaging sleeve sleeved outside the temperature sensor and the lead wire, wherein the packaging sleeve is made of PEEK material.

[0007] Optionally, a buffer sleeve is arranged in the packaging sleeve, and the buffer sleeve is sleeved outside the temperature sensor.

[0008] Optionally, a plurality of micropores are formed on the buffer sleeve.

[0009] Optionally, a buffer flange is arranged on the buffer sleeve, the buffer flange is located on the side of the temperature resistor close to the lead wire, and the buffer flange is folded to form a buffer gap.

[0010] In summary, the present application has at least one of the following beneficial technical effects:

[0011] 1. By adopting the packaging sleeve made of PEEK material, when high temperature fire occurs, the packaging sleeve will not produce toxic gas when burning;

[0012] 2. By arranging the buffer sleeve and forming micropores on the buffer sleeve, when the packaging part deforms due to thermal expansion and cold contraction, the buffer sleeve can deform to a certain extent, so that the temperature resistor in the buffer sleeve is not easy to be squeezed and damaged;

[0013] 3. When the lead wire of the temperature resistor is pulled, the buffer flange can be deformed to a certain extent, so that the temperature resistor can move forward a small distance, providing a certain space for the lead wire to be broken; BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is the overall structure schematic diagram of the temperature sensor packaging structure in the embodiment of the present application.

[0015] Figure 2 is the explosion structure schematic diagram of the temperature sensor packaging structure in the embodiment of the present application.

[0016] Mark explanation: 1, temperature resistor; 11, lead wire; 2, packaging sleeve; 3, buffer sleeve; 31, micro hole; 32, buffer flange; 33, buffer gap; 4, wire. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings Figures 1-2 The present application is further described in detail.

[0018] The embodiment of the present application discloses a temperature sensor packaging structure.

[0019] Refer to Figure 1 With Figure 2 , the temperature sensor packaging structure includes a temperature resistor 1, two lead wires 11 electrically connected with the temperature resistor 1, and a packaging sleeve 2, the lead wire 11 is used for connecting with the external wire, so as to connect the temperature resistor 1 into the temperature detection circuit, the packaging sleeve 2 is sleeved on the outside of the temperature sensor and the outside of part of the lead wire 11, so as to seal the temperature resistor 1, so as to realize the protection functions such as waterproof, dustproof and corrosion resistance. Wherein, the packaging sleeve 2 is made of plastic material, the material of the packaging sleeve 2 in the embodiment is preferably made of PEEK material, so that the packaging sleeve 2 will not produce toxic gas when burning. Wherein, the packaging sleeve 2 is blow molded and fixed on the outside of the temperature resistor 1.

[0020] The packaging sleeve 2 is also provided with a buffer sleeve 3, the buffer sleeve 3 is wrapped on the outside of the temperature resistor 1, and a plurality of micro holes 31 are formed on the buffer sleeve 3, the micro holes 31 can be formed by piercing the buffer sleeve 3 with a plurality of needles. By setting the buffer sleeve 3, when the buffer sleeve 3 is deformed due to thermal expansion and contraction, the buffer sleeve 3 is deformed to a certain extent, so as to provide a certain space for the temperature resistor 1 to be broken. At the same time, by opening the micro hole 31, the buffer sleeve 3 can better deform.

[0021] Further, the buffer sleeve 3 is provided with a buffer flange 32 at the opening, and the buffer flange 32 is located at the side of the temperature resistor 1 close to the lead wire 11. The buffer flange 32 is bent to form a buffer gap 33. When the lead wire 11 is accidentally pulled by external force, the buffer flange 32 deforms to a certain extent, at this time, the buffer gap 33 becomes smaller, and the temperature resistor 1 can move a small distance forward under the action of the lead wire 11, thereby providing a certain buffer space, so that the lead wire 11 and the temperature resistor 1 maintain good electrical connection and are not easily pulled off by external force.

[0022] The principle of the embodiment of the present application is that when the temperature sensor packaging structure is installed, the lead wire 11 of the temperature sensor 1 is spot welded and fixed with the wire 4, then the buffer sleeve 3 is sleeved, and finally the packaging sleeve 2 is used to package and fix the buffer sleeve 3 and the temperature resistor 1.

[0023] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A temperature sensor package structure, characterized by: The temperature resistor (1), the lead wire (11) electrically connected with the temperature resistor (1), and the packaging sleeve (2) sleeved outside the temperature resistor (1) and the lead wire (11), the packaging sleeve (2) is made of PEEK material; a buffer sleeve (3) is arranged in the packaging sleeve (2), the buffer sleeve (3) is sleeved outside the temperature resistor (1), and a plurality of micropores (31) are formed in the buffer sleeve (3).

2. The temperature sensor package structure of claim 1, wherein: A buffer flange (32) is arranged on the buffer sleeve (3), the buffer flange (32) is located on the side of the temperature resistor (1) close to the lead wire (11), and the buffer flange (32) is folded to form a buffer gap (33).

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