Micro host

Abstract

The utility model discloses a micro host, relates to computer host technical field, the micro host includes casing, heat dissipation subassembly and mainboard, the casing is equipped with the accommodation space, casing includes air outlet, first air passing port and second air passing port, the air outlet is provided in the casing side wall in the first direction, and the first air passing port is provided with the first air passing port and the second air passing port is provided with the second air passing port. The first air passing opening and the second air passing opening are formed in the two opposite side walls of the machine shell in the second direction, and the first direction and the second direction intersect. The heat dissipation assembly comprises a main heat dissipation device and a first side heat dissipation device, the main heat dissipation device is arranged in the containing space and arranged on the side, away from the air outlet, in the first direction and generates first airflow flowing in the first direction, and the first side heat dissipation device is arranged close to the first air passing opening and generates second airflow flowing in the second direction; the mainboard is arranged in the housing accommodating space, and the first air flow and the second air flow both flow through the mainboard. According to the technical scheme provided by the utility model, the heat dissipation efficiency of the micro host can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer host technology field especially relates to a micro host. BACKGROUND

[0002] Computer includes host and display, along with user's life demand, the micro host has appeared on the market, and the micro host has the characteristics such as small volume and small weight, thereby making the micro host easy to carry. However, due to space limitation, the internal components of micro host are densely arranged on the motherboard, leading to heat dissipation becoming a big challenge.

[0003] In the related art, the micro host is provided with an air inlet on the side, and an air outlet on the bottom. The heat dissipation fan in the micro host draws air into the micro host, so that the air can exchange heat with the structure in the micro host, and the heat dissipation fan can discharge the heat-exchanged air from the bottom of the micro host. However, as users have higher and higher performance requirements for the micro host, the micro host needs to use a central processing unit, a graphics card and a solid state disk with higher performance, resulting in an increase in the heat generation of the micro host. The heat dissipation efficiency of the existing micro host does not meet the heat dissipation requirement, so that the performance of the micro host cannot be fully released. SUMMARY

[0004] The main purpose of the utility model is to provide a micro host, which aims to improve the heat dissipation efficiency of the micro host.

[0005] To achieve the above purpose, the micro host provided by the utility model comprises:

[0006] A shell is provided with a containing space, the shell comprises an air outlet, a first air passage and a second air passage, the air outlet is arranged on one side wall of the shell in a first direction, the first air passage and the second air passage are arranged on the opposite two side walls of the shell in a second direction, and the first direction and the second direction are arranged intersectingly;

[0007] A heat dissipation assembly comprises a main heat sink and a first side heat sink, the main heat sink is arranged in the containing space and is arranged on one side away from the air outlet in the first direction, to generate a first airflow flowing in the first direction, and the first side heat sink is arranged close to the first air passage to generate a second airflow flowing in the second direction;

[0008] A motherboard is arranged in the containing space of the shell, and the first airflow and the second airflow flow through the motherboard.

[0009] In an embodiment, the first side heat sink is provided with a plurality of first side heat sinks arranged along the length direction of the side wall where the first air passage is located.

[0010] In an embodiment, the first air passage is configured as a long strip shape, and extends along the length direction of the side wall, and is arranged corresponding to the first side heat sink.

[0011] In an embodiment, the first air passage is arranged corresponding to the first side heat sink.

[0012] In an embodiment, the first air passage includes a plurality of air grating holes, and extends along the length direction of the side wall, and is arranged corresponding to the first side heat sink.

[0013] In an embodiment, the heat dissipation assembly further includes a second side heat sink, the second side heat sink is arranged close to the second air passage, and the first side heat sink and the second side heat sink cooperate to make the second air flow from the first side heat sink to the second side heat sink, the second side heat sink is arranged corresponding to the first side heat sink, and the shape and number of the second air passage correspond to the shape and number of the first air passage.

[0014] In an embodiment, the first direction, the thickness direction of the main board, and the thickness direction of the case are arranged in parallel, and the length direction or the width direction of the main board is arranged in parallel with the second direction.

[0015] In an embodiment, the air outlet is arranged on the bottom side wall of the case, and the main heat sink is arranged close to the top side wall of the case, so that the first air flow flows downward in the accommodation space.

[0016] In an embodiment, the main board is arranged close to the memory and the solid state disk on one side of the air outlet, and the memory and the solid state disk are arranged close to the first side heat sink.

[0017] In an embodiment, the heat dissipation assembly further includes a heat dissipation fin, one side of the heat dissipation fin abuts against the memory and / or the solid state disk, and the heat dissipation fin extends along the second direction, so that the second air flow flows through the fin gap of the heat dissipation fin.

[0018] In an embodiment, the heat dissipation assembly further includes a heat conduction plate, the heat conduction plate is arranged between the main board and the main heat sink, and abuts against the main board and the main heat sink respectively, and the plane of the heat conduction plate is arranged in parallel with the plane of the main board.

[0019] In an embodiment, the heat conduction plate is configured as a vacuum cavity heat conduction plate.

[0020] In an embodiment, the main heat sink includes a solid state active heat dissipation plate or a heat dissipation fan.

[0021] In an embodiment, the first side heat sink comprises a solid active heat sink plate or a heat dissipation fan.

[0022] In the technical scheme of the utility model, the air outlet, the first air passage and the second air passage are arranged on the casing, the first side heat sink can introduce the air current from the outside into the accommodating space through one of the first air passage and the second air passage, part of the introduced air current is sucked away by the air inlet end of the main heat sink, and then flows to the air outlet from the air outlet end of the main heat sink to form the first air current; the other part flows to the other one of the first air passage and the second air passage under the urging of the first side heat sink to form the second air current. By installing at least two heat sinks in the accommodating space, the first air current and the second air current intersect in the accommodating space, and the first air current and the second air current both flow through the main board, so that the heat dissipation of the main board is strengthened, and the heat dissipation performance of the micro mainframe is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative labor.

[0024] Figure 1 The structural schematic diagram of one embodiment of the micro mainframe provided by the utility model is shown in the figure.

[0025] Figure 2 The Figure 1 The exploded view of the embodiment shown in the figure.

[0026] Explanation of reference numerals:

[0027] 100, casing; 11, accommodating space; 12, air outlet; 13, first air passage; 14, second air passage;

[0028] 200, heat dissipation assembly; 21, main heat sink; 22, first side heat sink; 23, second side heat sink; 24, heat dissipation fin;

[0029] 300, main board.

[0030] The realization, functional characteristics and advantages of the utility model will be further explained by combining with the embodiments and referring to the drawings. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present utility model.

[0032] It should be noted that if the embodiments of the present utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture, and if the specific posture changes, the directional indications also change accordingly.

[0033] In addition, if the embodiments of the present utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel solutions are included, for example, "A and / or B" includes A solution, or B solution, or A and B solutions. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0034] The present utility model provides a kind of micro host computer.

[0035] Please refer to Figures 1 to 2 In an embodiment of the present utility model, the micro host computer includes:

[0036] The shell 100 is provided with a containing space 11, and the shell 100 includes an air outlet 12, a first air passage 13 and a second air passage 14. The air outlet 12 is arranged on one side wall of the shell 100 in a first direction. The first air passage 13 and the second air passage 14 are arranged on opposite two side walls of the shell 100 in a second direction. The first direction and the second direction are arranged intersectingly.

[0037] The heat dissipation assembly 200 includes a main heat dissipator 21 and a first side heat dissipator 22. The main heat dissipator 21 is arranged in the containing space 11 and is arranged on the side away from the air outlet 12 in the first direction to generate a first airflow flowing in the first direction. The first side heat dissipator 22 is arranged close to the first air passage 13 and generates a second airflow flowing in the second direction.

[0038] The main plate 300 is arranged in the accommodating space 11 of the shell 100, and the first air flow and the second air flow both flow through the main plate 300.

[0039] In the technical scheme of the utility model, the shell 100 is provided with an air outlet 12, a first air passage 13 and a second air passage 14, the first side radiator 22 can introduce the air flow from the outside into the accommodating space 11 through one of the first air passage 13 and the second air passage 14, part of the introduced air flow is sucked away by the air inlet end of the main radiator 21, and then flows to the air outlet 12 from the air outlet end of the main radiator 21 to form the first air flow; the other part flows to the other one of the first air passage 13 and the second air passage 14 under the urging of the first side radiator 22 to form the second air flow. By installing at least two radiators in the accommodating space 11, the first air flow and the second air flow intersect in the accommodating space 11, and the first air flow and the second air flow both flow through the main plate 300, so that the heat dissipation of the main plate 300 is strengthened, and the heat dissipation performance of the micro host computer is improved.

[0040] In an embodiment, the main radiator 21 is configured as a heat dissipation fan, and the first side radiator 22 is also configured as a heat dissipation fan. In other embodiments, one of the main radiator 21 and the first side radiator 22 can be configured as a heat dissipation fan, and the other one can be configured as a solid-state active heat dissipation plate; or both of them are configured as solid-state active heat dissipation plates. In the current technology, the heat dissipation efficiency of the heat dissipation fan is higher than that of the solid-state active heat dissipation plate, but the solid-state active heat dissipation plate has the advantages of small size, good dustproofness and mutual superposition, and the use of the solid-state active heat dissipation plate helps to further reduce the size of the micro host computer.

[0041] In an embodiment, the first side radiator 22 is provided in plurality and arranged along the length direction of the side wall where the first air passage 13 is located. By increasing the number of the first side radiator 22, the air flow intensity introduced into the accommodating space 11 is increased, and then the intensity of the first air flow and the second air flow is increased, which helps to improve the heat dissipation performance of the micro host computer. In other embodiments, the first side radiator 22 can be provided in one.

[0042] In an embodiment, the cross-sectional shape of the first air passage 13 is configured as a long strip shape and extends along the length direction of the side wall, and is correspondingly arranged with the plurality of first side radiators 22, which helps to increase the air passage amount of the first air passage 13 and further improve the heat dissipation performance of the micro host computer. In other embodiments, the first air passage 13 is provided in plurality and correspondingly arranged with the plurality of first side radiators 22 one by one. In another embodiment, the first air passage 13 includes a plurality of air-permeable grating holes, and the first air passage 13 extends along the length direction of the side wall and is correspondingly arranged with the plurality of first side radiators 22.

[0043] In an embodiment, the heat dissipation assembly 200 further comprises a second side heat sink 23, which is arranged close to the second air passage 14, and the first side heat sink 22 and the second side heat sink 23 cooperate to make the second air flow from the first side heat sink 22 to the second side heat sink 23. The second side heat sink 23 can cooperate with the first side heat sink 22, that is, one of the first side heat sink 22 and the second side heat sink 23 blows air into the accommodation space 11, and the other one exhausts air out of the accommodation space 11, so as to enhance the intensity of the second air flow. Further, the second side heat sink 23 can be configured as a solid active heat sink or a heat dissipation fan; further, when the heat dissipation structures of the first side heat sink 22 and the second side heat sink 23 are the same, that is, both are heat dissipation fans or both are solid active heat sinks. Further, when the first side heat sink 22 is provided with a plurality of first side heat sinks 22, the second side heat sink 23 is provided with a plurality of second side heat sinks 23 and is arranged in one-to-one correspondence with the plurality of first side heat sinks 22. At this time, the shape and number of the second air passage 14 are arranged in correspondence with the shape and number of the first air passage 13, that is, when the cross-sectional shape of the first air passage 13 is configured as a long strip shape and extends along the length direction of the side wall, and is arranged in correspondence with the plurality of first side heat sinks 22, the cross-sectional shape of the second air passage 14 is also configured as a long strip shape and extends along the length direction of the side wall of the second air passage 14, and is arranged in correspondence with the plurality of second side heat sinks 23; when the first air passage 13 is provided with a plurality of first air passages 13 and is arranged in one-to-one correspondence with the plurality of first side heat sinks 22, the second air passage 14 is provided with a plurality of second air passages 14 and is arranged in one-to-one correspondence with the plurality of second side heat sinks 23; when the first air passage 13 comprises a plurality of air-permeable grating holes and extends along the length direction of the side wall, and is arranged in correspondence with the plurality of first side heat sinks 22, the second air passage 14 comprises a plurality of air-permeable grating holes and extends along the length direction of the side wall, and is arranged in correspondence with the plurality of second side heat sinks 23.

[0044] In an embodiment, the first direction, the thickness direction of the mainboard 300 and the thickness direction of the cabinet 100 are arranged in parallel, and the length direction or the width direction of the mainboard 300 is arranged in parallel with the second direction. That is, the first air passage 13 and the second air passage 14 are arranged on two circumferential side walls of the cabinet 100 respectively, and the air outlet 12 is arranged on the top side wall or the bottom side wall of the cabinet 100, the first air flow blows vertically through the mainboard 300 to take away the heat on the mainboard 300, and the second air flow blows through the mainboard 300 in a direction parallel to the plane where the mainboard 300 is arranged, thereby taking away the heat on the mainboard 300, so as to construct a three-dimensional air duct in the micro host and realize multi-directional heat dissipation of the micro host. In other embodiments, the first air flow can blow through the mainboard 300 in a direction parallel to the plane where the mainboard 300 is arranged, and the second air flow blows vertically through the mainboard 300, that is, the first air passage 13 and the second air passage 14 are arranged on the top side wall and the bottom side wall of the cabinet 100 respectively, and the air outlet 12 is arranged on any circumferential side wall of the cabinet 100.

[0045] In an embodiment, the air outlet 12 is arranged on the bottom side wall of the casing 100, which helps to prevent dust from falling into the accommodation space 11 through the air outlet 12 during long-time use of the microcomputer. The main heat sink 21 is arranged close to the top side wall of the casing 100, so that the first air flow flows from top to bottom in the accommodation space 11. At this time, the cooperation of the first air flow and the second air flow helps to blow dust away from the motherboard 300, avoiding dust accumulation on the motherboard 300. In other embodiments, the air outlet 12 can also be arranged on the top side wall of the casing 100, and the main heat sink 21 can be arranged close to the bottom side wall of the casing 100.

[0046] In an embodiment, the memory and the solid state disk are arranged on the side of the motherboard 300 close to the air outlet 12, and the memory and the solid state disk are arranged close to the first side heat sink 22. In the microcomputer, the central processing unit (CPU) and the graphics card (GPU) generate the most heat when they are working under high load. This is because these two components will generate a large amount of heat when performing computing and graphics rendering tasks. Therefore, a vertical air duct perpendicular to the motherboard 300 is usually arranged to carry away most of the heat generated by the central processing unit and the graphics card on the motherboard 300. In the microcomputer, in addition to the central processing unit and the graphics card, other components such as the memory (RAM) and the solid state disk (SSD) can also generate considerable heat under high load. Arranging the memory and the solid state disk close to the first side heat sink 22, i.e., making the second air flow flow through the memory and the solid state disk, the second air flow can preferentially and effectively dissipate heat from the memory and the solid state disk. In other embodiments, the memory and the solid state disk can also be arranged close to the second side heat sink 23.

[0047] In an embodiment, the heat dissipation assembly 200 further comprises heat dissipation fins 24, one side of the heat dissipation fins 24 abuts against the memory and / or the solid state disk, and the heat dissipation fins 24 extend along the second direction to make the second air flow flow through the fin gaps of the heat dissipation fins 24. At this time, the second air flow has more contact area with the heat dissipation fins 24, which can more fully carry away the heat on the heat dissipation fins 24, improve the heat dissipation effect of the memory and the solid state disk, and further help to enhance the heat dissipation efficiency of the microcomputer. In other embodiments, the heat dissipation fins 24 can not be arranged.

[0048] In an embodiment, the heat dissipation assembly 200 further comprises a heat conduction plate arranged between the main plate 300 and the main heat sink 21 and abutting against the main plate 300 and the main heat sink 21 respectively, and a plane where the heat conduction plate is arranged is parallel to a plane where the main plate 300 is arranged. When the micro mainframe is working, the heat on the main plate 300 can be transferred to the heat conduction plate, and the first airflow can exchange heat with the heat conduction plate, so as to reduce the heat of the main plate 300, the heat conduction plate can make the surface temperature of the main plate 300 more uniform, so as to avoid that the local temperature of the main plate 300 is too high, and the heat conduction plate can increase the contact area between the first airflow and the main plate 300, and then improve the heat dissipation efficiency of the main plate 300. Further, the heat conduction plate is configured as a vacuum cavity heat plate. In other embodiments, the heat conduction plate can not be arranged.

[0049] The above merely describes exemplary embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A micro host, characterized by, The application relates to a computer case. The computer case comprises a case body provided with a containing space, an air outlet, a first air passage and a second air passage, the air outlet is arranged on a side wall of the case body in a first direction, the first air passage and the second air passage are arranged on opposite side walls of the case body in a second direction, and the first direction and the second direction are arranged in an intersecting mode; a heat dissipation assembly comprising a main heat radiator and a first side heat radiator, the main heat radiator is arranged in the containing space and is arranged on a side away from the air outlet in the first direction, and generates a first airflow flowing in the first direction, and the first side heat radiator is arranged close to the first air passage and generates a second airflow flowing in the second direction; a mainboard arranged in the containing space of the case body, and the first airflow and the second airflow both flow through the mainboard.

2. The microhost of claim 1, wherein, The first side heat radiator is arranged in a plurality of modes and is arranged along the length direction of the side wall where the first air passage is arranged.

3. The microhost of claim 2, wherein, The first air passage is configured in a long strip shape in a cross section and extends along the length direction of the side wall, and is arranged in a corresponding mode with the plurality of first side heat radiators; and / or, the first air passage is arranged in a plurality of modes and is arranged in a one-to-one corresponding mode with the plurality of first side heat radiators; and / or, the first air passage comprises a plurality of air-permeable grating holes, and the first air passage extends along the length direction of the side wall and is arranged in a corresponding mode with the plurality of first side heat radiators.

4. The microhost of claim 3, wherein, The heat dissipation assembly further comprises a second side heat radiator, the second side heat radiator is arranged close to the second air passage, and the first side heat radiator and the second side heat radiator are matched to make the second airflow flow from the first side heat radiator to the second side heat radiator, the second side heat radiator is arranged in a plurality of modes and is arranged in a one-to-one corresponding mode with the plurality of first side heat radiators, and the shape and number of the second air passage are arranged in a corresponding mode with the shape and number of the first air passage.

5. The microhost of claim 1, wherein, The first direction, the thickness direction of the mainboard and the thickness direction of the case body are arranged in parallel, and the length direction or the width direction of the mainboard is arranged in parallel with the second direction.

6. The microhost of claim 5, wherein, The air outlet is arranged on the bottom side wall of the case body, and the main heat radiator is arranged close to the top side wall of the case body, so that the first airflow flows downwards in the containing space.

7. The microhost of claim 1, wherein, The memory and the solid state disk are arranged on the side surface of the mainboard close to the air outlet, and the memory and the solid state disk are arranged close to the first side heat radiator.

8. The microhost of claim 7, wherein, The heat dissipation assembly further comprises heat dissipation fins, one side of the heat dissipation fins abuts against the memory and / or the solid state disk, and the heat dissipation fins extend along the second direction, so that the second airflow flows through the fin gaps of the heat dissipation fins.

9. The microhost of claim 8, wherein, The heat dissipation assembly further comprises a heat conduction plate arranged between the mainboard and the main heat radiator and abutting against the mainboard and the main heat radiator respectively, and a plane where the heat conduction plate is arranged is arranged in parallel with a plane where the mainboard is arranged.

10. The microhost of claim 9, wherein, The heat conduction plate is configured as a vacuum cavity heat plate; and / or, the main heat radiator comprises a solid-state active heat dissipation plate or a heat dissipation fan; and / or, the first side heat radiator comprises a solid-state active heat dissipation plate or a heat dissipation fan.

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