Pressure touch device and electronic equipment

Abstract

The embodiment of the utility model provides a pressure touch device and electronic equipment, and the pressure touch device comprises a cover plate; the thin film type touch sensor is arranged on the lower surface of the cover plate and is used for detecting touch operation acting on the upper surface of the cover plate and generating a touch signal; the pressure sensor is used for detecting pressing operation acting on the upper surface of the cover plate and generating a pressure signal; the vibration mechanism is used for generating vibration feedback; and the circuit board is electrically connected with the thin film type touch sensor, the pressure sensor and the vibration mechanism, is at least staggered with the vibration mechanism and is arranged on the lower surface of the thin film type touch sensor, and is used for processing the touch signal and the pressure signal and controlling the vibration mechanism. The pressure touch device can detect touch and pressure and generate vibration feedback, and is small in thickness and low in cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of touch control, in particular to a pressure touch device and an electronic device. BACKGROUND

[0002] With the development of the notebook computer market, the touchpad, an important component of the notebook computer, is endowed with more requirements, such as adding a pressure sensor to realize detection of pressure when a finger is pressed, adding a vibration motor and other vibration mechanisms to provide users with a better interactive experience, and meanwhile, the structure of the whole machine is required to be light and thin. The pressure touchpad is the thickest position of the whole module in the motor area. Under the action of the pressure of the pressure touchpad, the position of the vibration motor is lower, and therefore, the module space required is larger. The thickness of the notebook computer tends to be thinner and thinner, and therefore, great challenges are posed to the thickness of the module, and thus, thinning becomes an important innovative direction of the pressure touchpad.

[0003] In the related art, a printed circuit board (PCB) is used as a touch sensor layer of the pressure touchpad, the touch sensor is located on the PCB close to the cover plate, and meanwhile, devices are arranged on the back of the PCB through surface mounting technology to form a PCB assembly (PCBA). The shape of the PCBA is bound to the industrial design of a specific product, and the device area of the PCBA is consistent with the structure of the whole machine. Further, a vibration motor is arranged below the PCBA. As a result, the pressure touchpad in the related art is thick, and needs to be customized according to the industrial design of a specific product. UTILITY MODEL CONTENT

[0004] In view of the above problems, the embodiments of the present application provide a pressure touch device and an electronic device to solve the above technical problems.

[0005] In a first aspect, the embodiments of the present application provide a pressure touch device, comprising: a cover plate; a thin film touch sensor arranged on the lower surface of the cover plate, used for detecting a touch operation acting on the upper surface of the cover plate and generating a touch signal; a pressure sensor used for detecting a pressing operation acting on the upper surface of the cover plate and generating a pressure signal; a vibration mechanism used for generating a vibration feedback; a circuit board electrically connected with the thin film touch sensor, the pressure sensor and the vibration mechanism, and arranged on the lower surface of the thin film touch sensor in a staggered manner with at least the vibration mechanism, used for processing the touch signal, the pressure signal and controlling the vibration mechanism.

[0006] In some embodiments, the circuit board is arranged on a first area of the lower surface of the thin film touch sensor; the vibration mechanism is arranged on a second area of the lower surface of the thin film touch sensor; wherein the second area is outside the first area and does not overlap with the first area.

[0007] In some embodiments, the circuit board has a hollowed portion, and the vibration mechanism is connected to the lower surface of the thin film touch sensor at least partially through the hollowed portion.

[0008] In some embodiments, the surface of the thin film touch sensor is arranged with a detection electrode; the circuit board is electrically connected with the detection electrode.

[0009] In some embodiments, the thin film touch sensor comprises: a film substrate; a first detection electrode arranged on the upper surface of the film substrate; a second detection electrode arranged on the lower surface of the film substrate; a shielding layer arranged on the second detection electrode, for shielding electromagnetic interference to the first detection electrode and the second detection electrode.

[0010] In some embodiments, the thin film touch sensor further comprises: a first pad portion arranged on a first side of the lower surface of the film substrate; a first connection line connecting the first detection electrode to the first pad portion through the film substrate; a first connection assembly connecting the first pad portion to a side of the circuit board close to the first side; a second pad portion arranged on a second side of the lower surface of the film substrate; a second connection line connecting the second detection electrode to the second pad portion; a second connection assembly connecting the second pad portion to a side of the circuit board close to the second side.

[0011] In some embodiments, the pressure touch device further comprises: a support for fixing the pressure touch device; an elastic pad arranged on the support; a pressure sensor comprising: one or more capacitive pressure detection assemblies sandwiched between the lower surface of the thin film touch sensor and the elastic pad, for detecting a pressing operation and generating a pressure signal; an electrical connection assembly connecting the capacitive pressure detection assemblies to the circuit board for transmitting the pressure signal.

[0012] In some embodiments, the pressure sensor comprises: first, second, third and fourth capacitive pressure detection assemblies located at four corners of the thin film touch sensor, wherein the first and second capacitive pressure detection assemblies are adjacent, and the third and fourth capacitive pressure detection assemblies are adjacent; a first electrical connection assembly comprising a first connection end connected to the first capacitive pressure detection assembly, a second connection end connected to the second capacitive pressure detection assembly, and a third connection end connected to the circuit board; a second electrical connection assembly comprising a first connection end connected to the third capacitive pressure detection assembly, a second connection end connected to the fourth capacitive pressure detection assembly, and a third connection end connected to the circuit board.

[0013] In some embodiments, the pressure sensor comprises: one or more stress detection components arranged on a bracket for fixing the pressure touch device, for detecting a pressing operation and generating a pressure signal; an electrical connection component electrically connecting the stress detection components to a circuit board for transmitting the pressure signal; and the pressure touch device further comprises: the bracket for fixing the pressure touch device; and an elastic pad sandwiched between a lower surface of the thin film touch sensor and the bracket.

[0014] In some embodiments, the pressure sensor comprises: first, second, third and fourth stress detection components located at four corners of the thin film touch sensor, wherein the first and second stress detection components are adjacent, and the third and fourth stress detection components are adjacent; a first electrical connection component comprising first and second connection ends connected to the first and second stress detection components, and a third connection end connected to the circuit board; and a second electrical connection component comprising first and second connection ends connected to the third and fourth stress detection components, and a third connection end connected to the circuit board.

[0015] In some embodiments, the vibration mechanism comprises: a linear motor arranged on the lower surface of the thin film touch sensor.

[0016] In some embodiments, the pressure touch device further comprises: the bracket for fixing the pressure touch device; and the vibration mechanism comprises: a voice coil motor, which comprises: a coil arranged on the lower surface of the thin film touch sensor; a magnet arranged on the bracket below the coil; and a gap between the coil and the magnet.

[0017] In some embodiments, the electronic components of the circuit board are arranged on the lower surface of the circuit board.

[0018] In some embodiments, the thin film touch sensor further has an optical processing area, and an optical sensor is arranged below the optical processing area.

[0019] In a second aspect, the embodiments of the present application provide an electronic device, comprising: the pressure touch device mentioned above; and a processing unit connected to the circuit board of the pressure touch device.

[0020] The pressure touch device and the electronic device provided by the embodiments of the present application separate the touch sensor from the circuit board, so that the circuit board does not need to be bound to the industrial design of a specific product, and the material cost and design cost of the circuit board can be reduced; the thin film touch sensor is adopted, so that the thickness can be reduced compared with a PCBA touch panel; the circuit board and the vibration mechanism are arranged on the lower surface of the touch sensor in a staggered manner, so that the overall thickness of the touch device can be reduced. In summary, the pressure touch device of the embodiments of the present application can detect touch and pressure and generate vibration feedback, and has a smaller thickness and a lower cost.

[0021] These aspects or other aspects of the present application are more fully set forth in the following description of the embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

[0023] Figure 1 A structural schematic diagram of an electronic device to which the technical solutions in the embodiments of the present application can be applied is shown.

[0024] Figure 2 A structural schematic diagram of a touch device to which the technical solutions in the embodiments of the present application can be applied is shown.

[0025] Figure 3 An exploded view of a touch device in an embodiment of the present application is shown.

[0026] Figure 4 A layout view of a touch device in an embodiment of the present application is shown.

[0027] Figure 5 A layout view of another touch device in an embodiment of the present application is shown.

[0028] Figure 6 A stack view of a touch device in an embodiment of the present application is shown.

[0029] Figure 7 A stack view of another touch device in an embodiment of the present application is shown.

[0030] Figure 8 A stack view of still another touch device in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below are exemplary only, and are for the purpose of explanation of the present application, and are not to be understood as limiting the present application.

[0032] In the following, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings of the embodiments of the present application, so that those skilled in the art can better understand the solutions of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0033] It should be noted that in the embodiments of the present application, in this document, the terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations.

[0034] Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the sentence "includes a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.

[0035] In the description of the embodiments of the present application, the words "example" or "for example" are used to mean example, illustration or description. Any embodiment or design scheme described as "example" or "for example" in the embodiments of the present application is not interpreted as more preferred or having more advantages than another embodiment or design scheme. The use of the words "example" or "for example" is intended to present the relative concept in a clear manner.

[0036] In addition, "multiple" in the embodiments of the present application means two or more, and therefore "multiple" in the embodiments of the present application can also be understood as "at least two". "At least one" can be understood as one or more, for example, as one, two or more. For example, including at least one means including one, two or more, and does not limit which ones are included, for example, including at least one of A, B and C, which can include A, B, C, A and B, A and C, B and C, or A and B and C.

[0037] It should be noted that in the embodiments of the present application, the association relationship of the associated objects described by "and / or" represents that there can be three relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B together, and the existence of B alone. In addition, the character " / ", if not specially specified, generally represents a "or" relationship between the associated objects before and after it.

[0038] It should be noted that the "connection" in the embodiments of the present application can be understood as an electrical connection, and the connection between two electrical elements can be direct or indirect connection between the two electrical elements. For example, A and B are connected, which can be direct connection between A and B, or indirect connection between A and B through one or more other electrical elements.

[0039] Figure 1 The structural schematic diagram of an electronic device to which the technical solutions of the embodiments of the present application can be applied is shown in FIG. 1. Figure 1 As shown in FIG. 1, the typical hardware structure of the electronic device 100 can include a processor 101, a memory 102, a radio device 103, an audio output unit 104, an A / V input unit 105, a display unit 106, a user input unit 107, an interface unit 108, and a power supply 109. It should be understood that the electronic device 100 can include more or fewer components than those shown in FIG. 1, or the components shown in FIG. 1 can be combined or further divided into other components. In addition, the electronic device 100 can include a plurality of processors, memories, radio devices, audio output units, A / V input units, display units, user input units, interface units, and power supplies. Figure 1 The above-mentioned components of the electronic device 100 are merely exemplary and are not intended to limit the electronic device 100.

[0040] The display unit 106 includes various types of display panels and can display visual graphics, such as a graphical user interface (GUI). The user input unit 107 can include a keyboard, a mouse, and the like. The audio output unit 104 includes a speaker and the like. The A / V input unit 105 includes an image processor 1051 and a microphone 1052.

[0041] The memory 102 can store data and instructions executable on the processor 101, including an operating system 111 and the like. Referring to FIG. 1, Figure 1 As shown in FIG. 1, the memory 102 stores one or more application programs 110. The one or more application programs 110 include weather, instant messaging, telephone, short message, email, or stock, and the like.

[0042] Please continue to refer to Figure 1As shown, in the embodiments of the present application, the electronic device 100 further includes a touchpad 120. The touchpad 200 can detect touch operations, pressing operations, and generate vibration feedback based on the touch operations and / or pressing operations. Specifically, in a notebook computer, the touchpad 120 can accurately control the position of the cursor on the display unit 106 through the sliding operation of a finger or a stylus. For example, when editing a document, the cursor can be finely moved to a specified document paragraph, facilitating operations such as insertion, deletion, and modification of text; in a graphic design software, the cursor can also be accurately positioned at the position of a graphic element to be drawn or modified, just as accurately as moving the cursor using a mouse, except that the operation is more direct, and the corresponding displacement is achieved by sliding a finger on the surface of the touchpad 120. In some implementations, the right-click or left-click operation of the mouse can also be simulated by lightly pressing the area below the touchpad 120 or using a single-finger click on the surface of the touchpad. In daily use, operations such as opening an application icon on the desktop, selecting a file or folder, etc. can be completed with the aid of such simulated right-click or left-click, which is consistent with the effect of clicking operation using a mouse.

[0043] Figure 2 A structural schematic diagram of a touch device capable of applying the technical solutions of the embodiments of the present application is shown. The touch device 200 can be an external touchpad, such as Figure 2 As shown, the touch device 200 includes a touch module 210 and a communication interface 220. The touch module 210 is configured to detect touch operations, pressing operations, and generate vibration feedback based on the touch operations and / or pressing operations. The communication interface 220 is configured to communicate with external electronic devices such as personal computers, tablet computers, etc., so as to use the touch device 200 as an external touch input device of the electronic device (e.g. the electronic device 100 shown). Figure 1 The communication interface 220 can include but is not limited to a wired interface such as a universal serial bus (USB) interface, and can also include wireless interfaces such as Bluetooth, ZigBee, Wi-Fi, etc. In some implementations, the touch device 200 can further include a rechargeable battery (not shown in the figure) for supplying power to the touch module 210 and the communication interface 220. In some implementations, the USB interface can transmit power from the electronic device and the like. Figure 2

[0044] In related technologies, the touchpad 120 and the touch layer and device layer in the touch device 200 are integrated on a whole PCB, and the integrated PCBA needs to be customized according to the industrial design and structure of the product, which is not conducive to the universal design of multiple products, increases the risk of spare parts, and increases the difficulty of material storage and maintenance. The touch PCB is relatively thick, which is not conducive to the ultra-thin design of the overall structure. Therefore, the embodiments of the present application provide a pressure touch device, which can be applied to Figure 1 As shown, the touchpad 120 or​Figure 2 The touch device 200 is shown.

[0045] With reference to Figures 3 to 8 As shown, the pressure touch device provided by the embodiments of the present application comprises a cover plate 301, a thin film touch sensor 310, a pressure sensor 320, a vibration mechanism 330 and a circuit board 340. The cover plate 301 can comprise glass, plastic or composite material such as glass fiber reinforced plastic. The thin film touch sensor 310 is arranged on the lower surface of the cover plate 301 and can be fixed to the lower surface of the cover plate 301 through an adhesive layer 302 such as double-sided tape. The thin film touch sensor 310 is used to detect touch operation on the upper surface of the cover plate 301 and generate touch signal, and the touch operation can be generated by a finger, a stylus or the like. The thin film touch sensor 310 is adapted to the shape and size of the cover plate 301, and specifically, if the cover plate 301 is rectangular, the length and width of the thin film touch sensor 310 are substantially equal to those of the cover plate 301. In a specific implementation, the larger the touch effective area ratio of the cover plate 301, the larger the touch effective area ratio of the thin film touch sensor 310.

[0046] With continued reference to Figures 3 to 8 As shown, in the embodiments of the present application, the thin film touch sensor 310 is adapted to the shape and size of the cover plate 301 to detect touch operation on the upper surface of the cover plate 301 and generate touch signal. The circuit board 340 is used to process the touch signal, and the shape and size of the circuit board 340 are irrelevant to the shape and size of the cover plate 301. Therefore, the shape and size of the circuit board 340 can be irrelevant to the appearance of the pressure touch device (mainly the size and shape of the touch area), and the same circuit board 340 can be used in pressure touch devices with different appearances. In the embodiments of the present application, the area of the circuit board 340 is reduced, and the pressure sensor 320 and the vibration mechanism 330 are arranged on the lower surface of the thin film touch sensor 310 in a staggered manner. Specifically, the length of the circuit board 340 is less than the length of the thin film touch sensor 310, and the width of the circuit board 340 is less than the width of the thin film touch sensor 310. Preferably, the length of the circuit board 340 is at least 1 / 2 of the length of the thin film touch sensor 310, and the width of the circuit board 340 is at least 3 / 10 of the width of the thin film touch sensor 310. In a specific implementation, the length of the thin film touch sensor 310 is between 80 mm and 150 mm, and the length of the circuit board 340 is between 50 mm and 100 mm; the width of the thin film touch sensor 310 is between 50 mm and 100 mm, and the width of the circuit board 340 is between 15 mm and 50 mm.

[0047] Further, the circuit board 340 is arranged on the lower surface of the thin film touch sensor 310 in a staggered manner with the vibration mechanism 330, which greatly reduces the thickness of the touch module. In some implementations, the pressure sensor 320, the vibration mechanism 330 and the circuit board 340 can all be arranged on the lower surface of the thin film touch sensor 310 in a staggered manner. As shown in Figures 3 to 7 The pressure sensor 320 includes a plurality of pressure detection components, which are arranged on the four corners of the lower surface of the thin film touch sensor 310 in a staggered manner with the circuit board 340.

[0048] In some embodiments, as shown in Figures 3 to 8 The pressure touch device further includes a support 360 for fixing the pressure touch device. The support 360 is provided with a receiving space 361 for accommodating the vibration mechanism 300. The vibration mechanism 300 can be arranged in the receiving space 361.

[0049] In the embodiments of the present application, the surface of the thin film touch sensor 310 is provided with detection electrodes, and the circuit board 340 is connected with the detection electrodes. In specific implementations, the thin film touch sensor 310 can include a film substrate and detection electrodes formed on the surface of the film substrate. The detection electrodes can be made of at least one of indium tin oxide (ITO) or copper, nickel, gold, silver palladium and alloys thereof. The film substrate can be made of a polyethylene terephthalate (PET) substrate, a polyimide (PI) substrate or a polyethylene naphthalate (PEN) substrate.

[0050] In some implementations, the detection electrodes are formed on the upper surface of the film substrate (i.e. the surface of the thin film touch sensor 310 close to the cover plate 301). When there is no touch operation, the detection electrodes have a stable capacitance value. When a finger approaches or touches the detection electrodes, the human body itself is also a conductor, which forms a new capacitive coupling with the detection electrodes, so that the capacitance value of the detection electrodes changes. The circuit board 340 can detect these changes in capacitance, and through certain algorithms, the position of the touch and other information can be calculated.

[0051] In some implementations, detection electrodes are formed on the upper surface (the surface close to the cover plate 301) and the lower surface (the surface away from the cover plate 301) of the film substrate, respectively referred to as first detection electrodes and second detection electrodes. The projections of the first detection electrodes and the second detection electrodes on the film substrate are interlaced with each other, the first detection electrodes serving as an array of sensing electrodes and the second detection electrodes serving as an array of driving electrodes. When a finger touches, the finger touch changes the mutual capacitance between the driving electrodes and the sensing electrodes. The circuit board 340 can send an excitation signal to the second detection electrodes and then receive a response signal generated due to the change in mutual capacitance through the first detection electrodes. The circuit board 340 can perform amplification, filtering, etc. on the response signal and then convert the response signal into a digital signal. In some embodiments, in order to avoid the influence of other metal parts on the touch signal, a shielding layer is arranged on the second detection electrodes for shielding the electromagnetic interference of the circuit board 340, etc. on the first detection electrodes and the second detection electrodes. The shielding layer can include an indium tin oxide (ITO) film, a steel sheet, a copper foil or other conductive thin film.

[0052] Further, in some embodiments, in order to better fit the thin film touch sensor 310 with the cover plate 301, the first detection electrodes located on the upper surface (i.e. the surface close to the cover plate 301) of the thin film touch sensor 310 are connected to the lower surface (i.e. the surface away from the cover plate 301) of the thin film touch sensor 310 through first connecting lines (not shown in the figure). Preferably, the first connecting lines can include a lead wire and a metallized via on the film substrate, the lead wire connecting the first detection electrodes to the metallized via. The connecting assembly 311 connects the thin film touch sensor 310 to the circuit board 340 at the lower surface of the thin film touch sensor 310. In a specific implementation, the circuit board 340 and the thin film touch sensor 310 can be connected through a zero insertion force (ZIF) connector or a flexible printed circuit (FPC) board.

[0053] In further embodiments, with reference to Figure 3 , Figure 4 and Figure 5As shown, the thin film touch sensor 310 can include a first pad portion (not shown in the figure) disposed on a first side of the lower surface of the film substrate, a first connecting line (not shown in the figure) passing through the film substrate to connect the first detection electrode to the first pad portion, a first connecting component 311a connecting the first pad portion to a side of the circuit board 340 close to the first side, a second pad portion (not shown in the figure) disposed on a second side of the lower surface of the film substrate, a second connecting line (not shown in the figure) connecting the second detection electrode to the second pad portion, and a second connecting component 311b connecting the second pad portion to a side of the circuit board 340 close to the second side. Specifically, the first side can be one of the long side direction and the short side direction of the film substrate, and the second side can be the other of the long side direction and the short side direction of the film substrate. Referring to Figures 3 to 5 As shown, the first pad portion and the first connecting component 311a are located in the long side direction of the film substrate, and the second pad portion and the second connecting component 311b are located in the short side direction of the film substrate. In this embodiment, the thin film touch sensor 310 is connected to the side of the circuit board 340 through the corresponding connecting components, greatly reducing the length of the connecting line and the signal interference caused by the crossing of the connecting line.

[0054] Preferably, as shown in Figure 3 , Figure 4 and Figure 5 , the circuit board 340 is electrically connected to the thin film touch sensor 310 through an FPC board, i.e., the first connecting component 311a and the second connecting component 311b are FPC boards. In a specific implementation, the FPC board can be soldered to the thin film touch sensor 310 through a tin paste, or the FPC board can be pressed to the thin film touch sensor 310 through anisotropic conductive film (ACF). The FPC board can be electrically connected to the circuit board 340 through a ZIF connector or a board-to-board (BTB) connector.

[0055] In some embodiments, as shown in Figure 4 and 5 , the thin film touch sensor 310 further has an optical processing area S3, and an optical sensor is disposed below the optical processing area S3. The optical processing area S3 can transmit specific light corresponding to the optical sensor. The optical sensor can include optical devices such as ultrasonic fingerprint with display icons and optical fingerprint sensors. In a specific implementation, as shown in Figure 4 and 5 , the optical processing area S3 can be arranged on the left side or the right side of the vibration mechanism 330 and the circuit board 340. In combination of the optical processing area S3 and the fingerprint application, the optical processing area S3 is preferably arranged on the left side of the device surface, i.e., on the right side of the touch panel from the touch surface, so that the unlocking can be performed by the right hand.

[0056] In some implementations, such as Figure 4 As shown, circuit board 340 is arranged in a first region S1 on the lower surface of thin-film touch sensor 310, and vibration mechanism 330 is arranged in a second region S2 on the lower surface of thin-film touch sensor 310. The second region S2 is located outside the first region S1 and does not overlap with the first region S1. In a specific implementation, as shown... Figure 6 , Figure 7 and Figure 8 As shown, the circuit board 340 can be attached to the first region S1 using an adhesive layer 303 such as double-sided tape, and the vibration mechanism 330 can be attached to the second region S2 using an adhesive layer 303 such as double-sided tape. Furthermore, in order to improve the vibration feedback effect, the second region S2 is usually close to the center of the lower surface of the thin-film touch sensor 310.

[0057] In some embodiments, the circuit board 340 has a cutout portion, through which the vibration mechanism 330 at least partially passes and connects to the lower surface of the thin-film touch sensor 310. In specific implementations, such as... Figure 5 As shown, the cutout portion can be located inside the circuit board 340, forming an annular opening inside the circuit board 340. The shape of the annular opening can be set according to the shape of the vibration mechanism 330. In some specific implementations, the cutout portion can be located at the edge of the circuit board 340, forming an opening at the edge of the circuit board 340. The shape of the opening can be set according to the shape of the vibration mechanism 330. Specifically, as shown... Figure 6 , Figure 7 and Figure 8 As shown, the circuit board 340 can be adhered and fixed to the lower surface of the thin-film touch sensor 310 using an adhesive layer 303 such as double-sided adhesive. The vibration mechanism 330 passes through the cutout portion and is adhered and fixed to the lower surface of the thin-film touch sensor 310 using an adhesive layer 303 such as double-sided adhesive. In this embodiment, when the touch area is small, a small-sized vibration mechanism 330 can be used to meet the vibration feedback effect.

[0058] In some implementations, pressure sensor 320 may include a pressure-capacitance sensor. Specifically, such as Figure 6 , Figure 7 As shown, the pressure sensor 320 includes an electrical connection assembly 321 and one or more capacitive pressure sensing components 322. The capacitive pressure sensing component 322 is sandwiched between the thin-film touch sensor 310 and the elastic pad 350, and is electrically connected to the electrical connection assembly 321. The capacitive pressure sensing component 322 is used to detect pressing operations and generate a pressure signal. The electrical connection assembly 321 connects the capacitive pressure sensing component 322 to a circuit board 340. The electrical connection assembly 321 is used to transmit the pressure signal generated by the capacitive pressure sensing component 322, and may include an FPC board, etc.

[0059] Preferably, as shown in Figure 3 , Figure 4 and Figure 5 , four capacitive pressure detection components 322 can be included, located at four corners of the thin film touch sensor 310, respectively, as a first capacitive pressure detection component 322a, a second capacitive pressure detection component 322b, a third capacitive pressure detection component 322c and a fourth capacitive pressure detection component 322d. The first capacitive pressure detection component 322a and the second capacitive pressure detection component 322b are adjacent, and are connected to the circuit board 340 through a first electrical connection component 321a, which includes a first connection end connected to the first capacitive pressure detection component 322a, a second connection end connected to the second capacitive pressure detection component 322b, and a third connection end connected to the circuit board 340. The third capacitive pressure detection component 322c and the fourth capacitive pressure detection component 322d are adjacent, and are connected to the circuit board 340 through a second electrical connection component 321b, which includes a first connection end connected to the third capacitive pressure detection component 322c, a second connection end connected to the fourth capacitive pressure detection component 322d, and a third connection end connected to the circuit board 340. The first electrical connection component 321a and the second electrical connection component 321b can be FPC boards.

[0060] Referring to Figure 6 and Figure 7 , the pressure touch device further includes an elastic pad 350 and a support 360. The support 360 is used to fix the pressure touch device. The elastic pad 350 is clamped between the capacitive pressure detection component 322 and the support 360. The elastic pad 350 is used to provide cushioning, which can include a silica gel pad, a rubber pad, etc. When pressure acts on the upper surface of the cover plate 301, the pressure is conducted through the cover plate 301 and the thin film touch sensor 310 to the capacitive pressure detection component 322. The capacitive pressure detection component 322 generates a change in capacitance under the pressing force, and the circuit board 340 detects the change in capacitance of the capacitive pressure detection component 322 to calculate the size of the pressing force.

[0061] Furthermore, the capacitive pressure sensing assembly 322 includes a pressure-sensing element and a fixed electrode. The pressure-sensing element is typically an elastic diaphragm made of materials such as a metal film or silicon wafer. As one electrode of a capacitor, it deforms under pressure, thereby changing the capacitance parameters. An insulating layer is provided between the pressure-sensing element and the fixed electrode. This insulating layer isolates the electrode, prevents short circuits, and, as part of the dielectric, its material and thickness significantly affect the capacitance characteristics. Pressure applied to the pressure-sensing element causes displacement, resulting in changes in the distance between the electrodes, the effective area of ​​the electrodes, or the dielectric constant of the dielectric, thus altering the capacitance value. By measuring the change in capacitance, the magnitude of the pressure acting on the electrode can be calculated.

[0062] In some implementations, the pressure sensor 320 may include a stress sensor. Specifically, such as Figure 8 As shown, the pressure sensor 320 includes one or more stress detection components 323 and an electrical connection component 324. The stress detection component 323 is arranged on a bracket 360 for fixing the pressure touch device. Figure 8 As shown, an elastic pad 350 is sandwiched between the lower surface of the thin-film touch sensor 310 and the bracket 360. The elastic pad 350 may include a silicone pad, a rubber pad, etc. When the thin-film touch sensor 310 is subjected to pressure, the pressure is transmitted to the bracket 360 through the elastic pad 350. The stress detection component 323 detects the stress generated in the bracket 360 under the pressure, and the circuit board 340 can calculate the magnitude of the pressure based on the stress. The stress detection component 323 may include a resistance strain gauge and a measuring circuit. When the bracket 360 deforms under force, the resistance strain gauge deforms accordingly, and the change in resistance is converted into a voltage or current signal output by the measuring circuit.

[0063] Better, with Figure 3 , Figure 4 and Figure 5 Similarly, it may include four stress detection components 323 located at the four corners of the thin-film touch sensor 310. An electrical connection component 324 electrically connects the stress detection components 323 to the circuit board 340. The electrical connection component 324 may include an FPC board, etc. Specifically, the pressure sensor 320 includes: first, second, third, and fourth stress detection components located at the four corners of the thin-film touch sensor, wherein the first and second stress detection components are adjacent, and the third and fourth stress detection components are adjacent; a first electrical connection component including first and second connection terminals connected to the first and second stress detection components, and a third connection terminal connected to the circuit board 340; and a second electrical connection component including first and second connection terminals connected to the third and fourth stress detection components, and a third connection terminal connected to the circuit board 340.

[0064] In some implementations, such as Figure 6and Figure 8 As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction. Figure 7 As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction.

[0065] As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction. Figure 6 、 Figure 7 and Figure 8 As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction.

[0066] As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction. Figure 4 and 5 As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction.

[0067] As shown in FIG. 3B, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged on the lower surface of the thin film touch sensor. In other embodiments, as shown in FIG. 3C, the vibration mechanism 330 includes a voice coil motor, and the coil of the voice coil motor is arranged on the lower surface of the thin film touch sensor 310, and the magnet of the voice coil motor is arranged on the bracket 360 and below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. When the coil is supplied with current, the coil will move in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction. Figures 6 to 8In a typical implementation, the cover plate 301 is glass with a thickness of about 0.8 mm; the adhesive layer 302 is double-sided tape with a thickness of about 0.05 mm; the thin film touch sensor 310 has a thickness of between 0.05 mm and 0.2 mm, about 0.137 mm; the adhesive layer 303 is double-sided tape with a thickness of about 0.05 mm at the portion connected to the circuit board 340 and a thickness of about 0.1 mm at the portion connected to the vibration mechanism 330; the circuit board 340 has a thickness of between 0.3 mm and 0.5 mm, about 0.4 mm, and the electronic components on the lower surface have a maximum thickness of 1.2 mm; the pressure detection sensor 310 has a thickness of about 0.8 mm; the vibration mechanism 330 has a thickness of between 2 mm and 3 mm, about 2 mm if it is a linear motor (LAR), and about 2.3 mm if it is a voice coil motor (VCM); the support 360 has a thickness of about 0.4 mm; and the vibration mechanism 330 and other parts have a stroke of about 0.5 mm. The overall thickness of the pressure touch device is low.

[0068] The embodiments of the present application also provide an electronic device including the pressure touch device and a processing unit. The pressure touch device is connected to the processing unit of the electronic device, and the pressure touch device transmits the processed touch signal and pressure signal to the processing unit for processing. The processing unit can generate a feedback control signal according to the pressure signal and the touch signal, and the circuit board of the pressure touch device can control the vibration mechanism to generate vibration feedback according to the feedback control signal. The electronic device can include Figure 1 As shown in the electronic device 100, the circuit board 340 can be connected to the processor 101 through the electrical connection assembly, the processor 101 receives the touch signal and pressure signal processed by the circuit board 340, generates a feedback control signal according to the pressure signal and the touch signal, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback according to the feedback control signal. In some implementations, the circuit board 340 can be connected to the embedded controller (EC) of the electronic device 100 through the electrical connection assembly 370, and the processor 101 is connected to the embedded controller. The embedded controller receives the touch signal and pressure signal processed by the circuit board 340, transmits the touch signal and pressure signal to the processor 101, generates a feedback control signal according to the pressure signal and the touch signal, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback according to the feedback control signal.

[0069] The embodiments of the present application separate the touch layer of the pressure touch device from the device area, customize the touch layer according to the product industrial design, reduce the difficulty of stackable design, the circuit board can be designed universally, more likely to realize the universal design of various products, reduce the design difficulty, storage difficulty and cost, the circuit board and the vibration mechanism below the touch layer are staggered, the overall thickness of the pressure touch device is reduced, the product thickness can be reduced, the touch layer is partially treated specially, the design has better light transmittance, meets the optical devices such as ultrasonic fingerprint and optical fingerprint with logo, and the pressure touch plate is combined and applied; since the touch layer reduces the thickness to a certain extent, different motors can be combined more conveniently, including traditional motors with thicker thickness and voice coil motors (VCM), so as to reduce the cost.

[0070] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as the above preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the equivalent embodiments within the scope of the technical solution of the present application without departing from the technical solution of the present application. Any modification, change and modification of the above embodiments according to the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A pressure touch device, characterized by, The pressure touch device comprises: a cover plate; a thin film touch sensor arranged on the lower surface of the cover plate for detecting a touch operation on the upper surface of the cover plate and generating a touch signal; a pressure sensor for detecting a pressing operation on the upper surface of the cover plate and generating a pressure signal; a vibration mechanism for generating vibration feedback; a circuit board electrically connected to the thin film touch sensor, the pressure sensor and the vibration mechanism, and arranged on the lower surface of the thin film touch sensor in a position different from the vibration mechanism, for processing the touch signal, the pressure signal and controlling the vibration mechanism.

2. The pressure touch device according to claim 1, wherein: the circuit board is arranged on a first area of the lower surface of the thin film touch sensor; the vibration mechanism is arranged on a second area of the lower surface of the thin film touch sensor; the second area is outside the first area and does not overlap with the first area. 3.The pressure touch device of claim 1, wherein, the circuit board has a hollow part, and the vibration mechanism is connected to the lower surface of the thin film touch sensor at least partially through the hollow part. 4.The pressure touch device of claim 1, wherein, a detection electrode is arranged on the surface of the thin film touch sensor, and the circuit board is electrically connected to the detection electrode. 5.The pressure touch device of claim 4, wherein, The thin film touch sensor comprises: a film substrate; a first detection electrode arranged on the upper surface of the film substrate; a second detection electrode arranged on the lower surface of the film substrate; a shielding layer arranged on the second detection electrode for shielding electromagnetic interference on the first detection electrode and the second detection electrode. 6.The pressure touch device of claim 5, wherein, The thin film touch sensor further comprises: a first pad part arranged on a first side of the lower surface of the film substrate; a first connection line connecting the first detection electrode to the first pad part through the film substrate; a first connection assembly connecting the first pad part to a side of the circuit board close to the first side; a second pad part arranged on a second side of the lower surface of the film substrate; a second connection line connecting the second detection electrode to the second pad part; a second connection assembly connecting the second pad part to a side of the circuit board close to the second side. 7.The pressure touch device of claim 1, wherein, The pressure touch device further comprises a support for fixing the pressure touch device and an elastic pad arranged on the support. The pressure sensor comprises: one or more capacitive pressure detection assemblies clamped between the lower surface of the thin film touch sensor and the elastic pad for detecting the pressing operation and generating the pressure signal; an electrical connection assembly connecting the capacitive pressure detection assemblies to the circuit board for transmitting the pressure signal. 8.The pressure touch device of claim 7, wherein, The pressure sensor comprises: first, second, third and fourth capacitive pressure detection assemblies located at four corners of the thin film touch sensor, wherein the first and second capacitive pressure detection assemblies are adjacent, and the third and fourth capacitive pressure detection assemblies are adjacent; a first electrical connection assembly comprising a first connection end connected to the first capacitive pressure detection assembly, a second connection end connected to the second capacitive pressure detection assembly, and a third connection end connected to the circuit board. A second electrical connection assembly includes first and second connection ends connected to the third and fourth capacitive pressure detection assemblies, and a third connection end connected to the circuit board. 9.The pressure touch device of claim 1, wherein, The pressure sensor includes: One or more stress detection assemblies arranged in a bracket for fixing the pressure touch device, for detecting the pressing operation and generating the pressure signal; An electrical connection assembly electrically connecting the stress detection assemblies to the circuit board for transmitting the pressure signal; The pressure touch device further includes a bracket for fixing the pressure touch device. An elastic pad is clamped between the lower surface of the thin film touch sensor and the bracket. 10.The pressure touch device of claim 9, wherein, The pressure sensor includes: First, second, third and fourth stress detection assemblies located at four corners of the thin film touch sensor, wherein the first and second stress detection assemblies are adjacent, and the third and fourth stress detection assemblies are adjacent; A first electrical connection assembly includes first and second connection ends connected to the first and second stress detection assemblies, and a third connection end connected to the circuit board; A second electrical connection assembly includes first and second connection ends connected to the third and fourth stress detection assemblies, and a third connection end connected to the circuit board. 11.The pressure touch device according to any one of claims 1-10, wherein, The vibration mechanism includes a linear motor arranged on the lower surface of the thin film touch sensor.

12. The pressure touch device according to any one of claims 1-10, wherein, The pressure touch device further includes a bracket for fixing the pressure touch device. The vibration mechanism includes a voice coil motor, which includes a coil arranged on the lower surface of the thin film touch sensor, and a magnet arranged on the bracket below the coil; the coil and the magnet have a gap therebetween.

13. The pressure touch device according to any one of claims 1 to 10, wherein, The electronic elements of the circuit board are arranged on the lower surface of the circuit board.

14. The pressure touch device according to any one of claims 1-10, wherein, The thin film touch sensor further has an optical processing area, below which an optical sensor is arranged.

15. An electronic device, comprising: The pressure touch device of any one of claims 1-14; A processing unit connected to the circuit board of the pressure touch device. ​

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