Flexible printed circuit (FPC) antenna board with multi-layer structure

Abstract

The utility model provides an FPC antenna board with a multilayer structure, which belongs to the technical field of FPC antenna board manufacturing, and comprises a substrate, a cover fixedly arranged on the side wall of the substrate, and a transmitting assembly arranged in the inner cavity of the substrate. According to the utility model, through the arrangement of the multi-layer structure, the high-frequency transmitting antenna is fixed on the outer surface of the wrapping shell and is connected with auxiliary components including the printing layer, the connecting layer, the dielectric layer, the heat dissipation layer and the supporting layer, so that high-efficiency signal transmitting and receiving are realized, and a closed circuit formed by the hot melting copper printing layer ensures stable transmission of signals; the electric soldering tin connecting layer and the polyimide dielectric layer provide reliable electrical connection and circuit protection, the hollow design of the aluminum heat dissipation layer effectively improves the heat dissipation efficiency, the glass fiber supporting layer enhances the overall structural strength and thermal conductivity, the performance stability, durability and extreme environment adaptability of the antenna board are improved, and the service life of the antenna board is prolonged. And an efficient and reliable antenna solution is provided for wireless communication equipment.

Description

TECHNICAL FIELD

[0001] The utility model belongs to FPC antenna board manufacturing technical field, and specifically relates to a multilayer structure's FPC antenna board. BACKGROUND

[0002] As a key component in wireless communication technology, the background technology of antenna board originates from the development of early radio transmission and reception technology, and has experienced the evolution process from fixed to mobile, from single frequency band to multi-frequency band, from single function to multi-function integration. Its development process has witnessed the continuous progress of material technology, design concept and manufacturing technology, making the antenna board lighter, thinner, better in performance and more widely applied. Today, the antenna board has been widely used in smart phones, wireless network devices, Internet of Things, automotive electronics, aerospace and other fields, becoming an important bridge connecting the digital world and the physical world.

[0003] During the use of the antenna board, environmental factors have a significant impact on its performance. Long-term exposure to humid, high-temperature, salt spray, ultraviolet and other harsh environments can cause corrosion or aging of the antenna board material, thereby reducing its mechanical strength and electrical performance. This corrosion and aging phenomenon can cause the connection points of the antenna board to loosen, the conductive pattern to fall off, and even cause the entire antenna board to fail, ultimately affecting the stability and service life of the communication equipment. Therefore, a multilayer structure FPC antenna board is needed. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a multilayer structure FPC antenna board, which aims to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A multilayer structure FPC antenna board, comprising,

[0007] a substrate, a cover fixedly installed on the side wall of the substrate, and a transmitting assembly arranged in the inner cavity of the substrate.

[0008] As a preferred scheme of the utility model, the transmitting assembly comprises a cladding shell fixedly installed in the inner cavity of the substrate, and a high-frequency transmitting antenna fixedly installed on the outer surface of the cladding shell.

[0009] As a preferred scheme of the utility model, the transmitting assembly further comprises a connector communicated with the side wall of the high-frequency transmitting antenna, and an auxiliary component arranged at the bottom of the connector.

[0010] As a preferred scheme of the utility model, the auxiliary component includes a printing layer fixedly installed in the inner cavity of the cladding shell, a connecting layer welded at the bottom of the printing layer, a medium layer welded on the surface of the connecting layer, a heat dissipation layer fixedly connected to the outer surface of the medium layer, and a support layer fixedly installed at the bottom of the heat dissipation layer.

[0011] As a preferred scheme of the utility model, the printing layer is made of hot melt copper material, and the printing layer is in the shape of a closed circuit.

[0012] As a preferred scheme of the utility model, the connecting layer is made of electric soldering tin material, the printing layer and the medium layer are welded through the connecting layer, and the medium layer is made of polyimide material.

[0013] As a preferred scheme of the utility model, the heat dissipation layer is made of aluminum material, the heat dissipation layer is in a hollow shape, and the support layer is made of glass fiber material.

[0014] Compared with the prior art, the utility model has the beneficial effects that: the multi-layer structure is arranged, the high-frequency transmitting antenna is fixed on the outer surface of the cladding shell and connected with the auxiliary component including the printing layer, the connecting layer, the medium layer, the heat dissipation layer and the support layer, efficient signal transmission and reception are realized, the closed circuit formed by the hot melt copper printing layer ensures stable signal transmission, the electric soldering tin connecting layer and the polyimide medium layer provide reliable electrical connection and circuit protection, the hollow design of the aluminum heat dissipation layer effectively improves the heat dissipation efficiency, and the glass fiber support layer enhances the overall structural strength and thermal conductivity, improves the performance stability, durability and the ability to adapt to extreme environments of the antenna board, and provides an efficient and reliable antenna solution for wireless communication equipment. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings needed to be used in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor. Among them:

[0016] Fig. 1 It is the overall structure schematic diagram of the utility model;

[0017] Fig. 2 It is the base and covering connection schematic diagram of the utility model;

[0018] Fig. 3 It is the high-frequency transmitting antenna and connector connection schematic diagram of the utility model;

[0019] Fig. 4The printing layer and the connecting layer of the utility model are connected.

[0020] In the figure: 101, base; 102, cover; 103, transmitting assembly; 103a, cladding shell; 103b, high-frequency transmitting antenna; 103c, connector; 103d, auxiliary component; 103d-1, printing layer; 103d-2, connecting layer; 103d-3, medium layer; 103d-4, heat dissipation layer; 103d-5, support layer. DETAILED DESCRIPTION

[0021] In order to make the above objects, features and advantages of the utility model more apparent, obvious and easy to understand, the specific embodiments of the utility model are described in detail below with reference to the drawings of the specification.

[0022] In the following description, a lot of specific details are set forth in order to give a thorough understanding of the utility model, but the utility model can also be implemented in other ways different from the description, and those skilled in the art can make similar generalization without departing from the connotation of the utility model, therefore the utility model is not limited by the specific embodiments disclosed below.

[0023] Secondly, the "one embodiment" or "embodiment" referred to herein means that specific features, structures or characteristics can be included in at least one implementation of the utility model. "In one embodiment" appearing in different places in the specification does not mean the same embodiment, nor is it an embodiment that is independent or alternative to other embodiments.

[0024] Embodiment

[0025] Reference Figs. 1-4 For the first embodiment of the utility model, the embodiment provides a multilayer structure FPC antenna board, comprising,

[0026] The base 101, the cover 102 fixedly installed on the side wall of the base 101 and the transmitting assembly 103 arranged in the inner cavity of the base 101 are provided.

[0027] The transmitting assembly 103 includes the cladding shell 103a fixedly installed in the inner cavity of the base 101 and the high-frequency transmitting antenna 103b fixedly installed on the outer surface of the cladding shell 103a.

[0028] Specifically, the high-frequency transmitting antenna 103b adopts the ANT 4 # type antenna, which has extremely high integration, almost no additional cost, easy debugging and production and other characteristics and is widely used.

[0029] The transmitting assembly 103 further includes the connector 103c communicated on the side wall of the high-frequency transmitting antenna 103b and the auxiliary component 103d arranged at the bottom of the connector 103c.

[0030] The auxiliary component 103d comprises a printed layer 103d-1 fixedly installed in the inner cavity of the cladding shell 103a, a connecting layer 103d-2 welded at the bottom of the printed layer 103d-1, a medium layer 103d-3 welded on the surface of the connecting layer 103d-2, a heat dissipation layer 103d-4 fixedly connected to the outer surface of the medium layer 103d-3, and a support layer 103d-5 fixedly installed at the bottom of the heat dissipation layer 103d-4.

[0031] The printed layer 103d-1 is made of hot-melt copper material and has a closed circuit shape.

[0032] Further, the copper material has good dielectric properties, and the printed closed circuit can be used for signal reception.

[0033] The connecting layer 103d-2 is made of soldering tin material, the printed layer 103d-1 and the medium layer 103d-3 are welded through the connecting layer 103d-2, and the medium layer 103d-3 is made of polyimide material.

[0034] Preferably, the polyimide material has excellent flexibility and heat resistance and can remain stable under extreme temperature changes, improving the durability of the device.

[0035] The heat dissipation layer 103d-4 is made of aluminum material and has a hollow shape, and the support layer 103d-5 is made of glass fiber material.

[0036] It should be noted that the glass fiber has good structural strength and heat conduction properties, facilitating heat dissipation during device use.

[0037] In use, the high-frequency transmitting antenna 103b fixedly installed on the outer surface of the cladding shell 103a is used to transmit signals, the connector 103c is in communication with the side wall of the antenna, the high-frequency antenna is connected with the auxiliary component 103d, the printed layer 103d-1 is made of hot-melt copper material and forms a closed circuit for signal reception and transmission, the connecting layer 103d-2 is made of soldering tin material and welds the printed layer 103d-1 and the medium layer 103d-3 together to ensure reliable electrical connection, the medium layer 103d-3 is made of polyimide material and has flexibility and heat resistance to protect the internal circuit and adapt to extreme temperature changes, the heat dissipation layer 103d-4 is made of aluminum material and has a hollow structure to facilitate heat dissipation and maintain the stability of the device under high-temperature working conditions, and the support layer 103d-5 is made of glass fiber material and has good structural strength and heat conduction properties to provide support for the entire auxiliary component 103d and help heat dissipation.

[0038] In summary, through the high-frequency transmitting antenna 103b fixed on the outer surface of the cladding shell 103a, the assembly can effectively transmit signals, the connector 103c communicates with the antenna side wall, and the antenna is closely connected with the auxiliary components 103d including the hot-melt copper printing layer 103d-1, the electric soldering tin connecting layer 103d-2, the polyimide medium layer 103d-3, the aluminum heat dissipation layer 103d-4, and the glass fiber support layer 103d-5, the printing layer 103d-1 forms a closed circuit responsible for signal reception and transmission; the connecting layer 103d-2 ensures the reliable welding of the printing layer 103d-1 and the medium layer 103d-3, guaranteeing electrical connection; the medium layer 103d-3 protects the internal circuit with its flexibility and heat resistance, adapting to extreme temperatures; the hollow structure of the aluminum heat dissipation layer 103d-4 effectively dissipates heat, maintaining the stability of the device at high temperatures; and the glass fiber support layer 103d-5 provides structural strength and heat conduction performance, supporting the entire auxiliary components 103d and assisting in heat dissipation. This structural design not only improves the stability and durability of the assembly, but also ensures the continuity and reliability of signal transmission in harsh environments.

[0039] Importantly, it should be noted that the constructions and arrangements of the present application shown in the various example embodiments are illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter described in this application. For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be reversed or otherwise varied, and the nature or number of discrete elements or positions can be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the present inventive subject matter. The order or sequence of any process or method steps can be changed or re-sequenced without departing from the generality of the application. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the example embodiments without departing from the scope of the present inventive subject matter. Accordingly, the present inventive subject matter is not limited to particular embodiments described, but extends to various modifications that nevertheless fall within the scope of the appended claims.

[0040] Furthermore, in an effort to provide a concise description of exemplary embodiments, all features of an actual implementation can not be described (i.e., those unrelated to the presently contemplated best mode of carrying out the present inventive subject matter, or those unrelated to enabling the present inventive subject matter).

[0041] It is to be understood that the development of the particular implementations described herein was not determined merely by the availability of certain items or materials. Rather and more generally, specific implementations can be determined, for example, based on the particular requirements of the instrument or system to which that implementation relates. For example, a specific implementation of a reagent or kit can be determined based on the number of assays or assays types that are to be performed by the instrument or system that implementation relates to.

[0042] It should be noted that the above examples are only used to illustrate the technical solutions of the present application, not to limit it. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A multi-layered FPC antenna board, characterized by: The utility model relates to a high-frequency transmission antenna, including, A base (101), a cover (102) fixedly installed on the side wall of the base (101), and a transmission assembly (103) arranged in the inner cavity of the base (101); The transmission assembly (103) includes a cladding shell (103a) fixedly installed in the inner cavity of the base (101), and a high-frequency transmission antenna (103b) fixedly installed on the outer surface of the cladding shell (103a); The transmission assembly (103) further includes a connector (103c) communicated on the side wall of the high-frequency transmission antenna (103b), and an auxiliary component (103d) arranged at the bottom of the connector (103c); The auxiliary component (103d) includes a printing layer (103d-1) fixedly installed in the inner cavity of the cladding shell (103a), a connecting layer (103d-2) welded at the bottom of the printing layer (103d-1), a dielectric layer (103d-3) welded on the surface of the connecting layer (103d-2), a heat dissipation layer (103d-4) fixedly connected on the outer surface of the dielectric layer (103d-3), and a support layer (103d-5) fixedly installed at the bottom of the heat dissipation layer (103d-4).

2. The multi-layered FPC antenna board of claim 1, wherein: The printing layer (103d-1) is made of hot-melt copper material, and the printing layer (103d-1) is in the shape of a closed circuit.

3. The multi-layered FPC antenna board of claim 1, wherein: The connecting layer (103d-2) is made of electric soldering tin material, the printing layer (103d-1) and the dielectric layer (103d-3) are welded through the connecting layer (103d-2), and the dielectric layer (103d-3) is made of polyimide material.

4. The multi-layered FPC antenna board of claim 1, wherein: The heat dissipation layer (103d-4) is made of aluminum material, the heat dissipation layer (103d-4) is in the shape of a hollow, and the support layer (103d-5) is made of glass fiber material.

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