Heat dissipation structure and handheld heater

Abstract

The utility model discloses a heat dissipation structure and a handheld heater, and relates to the technical field of structure heat dissipation, the heat dissipation structure comprises a main body, heat conduction silica gel, a sleeve radiator and a shell, the main body comprises a PCB and a heat dissipation chip, and the heat dissipation chip is arranged on the PCB; the heat conduction silica gel is arranged on one side, back to the PCB, of the heat dissipation chip; the sleeve radiator is arranged on the periphery of the PCB in a sleeving mode and abuts against the heat conduction silica gel. And the casing is sleeved on the sleeve radiator.

Description

TECHNICAL FIELD

[0001] The utility model relates to structure heat dissipation technical field, especially hand held heater of a kind of heat dissipation structure. BACKGROUND

[0002] Traditional heat dissipation structure usually installs heat conduction chip or graphene material heat conduction to shell to complete heat dissipation on heating chip. However, such method has significant defects, in high-temperature, high-power application scene (such as aerosol generating device), the volume and heat conduction capacity of traditional heat dissipation structure are difficult to meet the demand of rapid heat dissipation, cannot effectively control the working temperature of core device, limit the improvement of overall heat dissipation performance.

[0003] Therefore, a new heat dissipation structure with significantly optimized heat dissipation efficiency is needed to solve the key problem of whole machine heat dissipation, guarantee its stable operation and prolong service life. UTILITY MODEL CONTENT

[0004] The main purpose of the utility model is to provide a kind of heat dissipation structure and hand held heater, to improve the heat dissipation efficiency of whole machine.

[0005] To achieve the above-mentioned purpose, the heat dissipation structure provided by the utility model comprises:

[0006] Main body, the main body includes PCB board and heat dissipation chip, the heat dissipation chip is located at the PCB board;

[0007] Heat-conducting silica gel, the heat-conducting silica gel is located at the side of the heat dissipation chip away from the PCB board;

[0008] Sleeve heat sink, the sleeve heat sink is sleeved on the outer periphery of the PCB board and abuts against the heat-conducting silica gel;And

[0009] Shell, the shell is sleeved on the sleeve heat sink.

[0010] The utility model further provides a kind of hand held heater, hand held heater includes power supply and heat dissipation structure, the power supply is located in the shell, and is electrically connected with the PCB board. DRAWINGS

[0011] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the drawings needed to be used in the embodiment or prior art description will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in these drawings without creative labor.

[0012] Figure 1 The structure diagram of one embodiment of the heat dissipation structure provided by the utility model.

[0013] Figure 2 For Figure 1 A cross-sectional view along A-A;

[0014] Figure 3 For the structure diagram of the support in the heat dissipation structure;

[0015] Figure 4 For the structure diagram of the heat dissipation shield in the heat dissipation structure.

[0016] BRIEF DESCRIPTION OF DRAWINGS

[0017] Reference Name Reference Name 1000 Heat dissipation structure 134 Clamping convex part 11 PCB board 13a Mounting groove 11a Clamping recess 2 Thermally conductive silica gel 12 Heat dissipation chip 3 Sleeve heat sink 13 Support 31 Butt recess 131 Mounting part 4 Housing 132 Butt part 5 Heat dissipation shield 133 Stop part 5a Mounting space

[0018] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] It should be noted that if the present application embodiments involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0021] In addition, if the present application embodiments involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.

[0022] The present application provides a heat dissipation structure 1000.

[0023] Referring to Figure 1 and Figure 2 In an embodiment of the present application, the heat dissipation structure 1000 comprises a main body, a heat-conducting silica gel 2, a sleeve radiator 3 and a shell 4, the main body comprises a PCB board and a heat dissipation chip 12, the heat dissipation chip 12 is arranged on the PCB board; the heat-conducting silica gel 2 is arranged on the side of the heat dissipation chip 12 away from the PCB board; the sleeve radiator 3 is sleeved on the outer periphery of the PCB board and abuts against the heat-conducting silica gel 2; and the shell 4 is sleeved on the sleeve radiator 3.

[0024] In the technical scheme of the present application, the shell 4 is sleeved on the sleeve radiator 3, the sleeve radiator 3 is sleeved on the outer periphery of the PCB board and abuts against the heat-conducting silica gel 2; the heat generated by the PCB board can be directly conducted to the sleeve radiator 3 and also conducted to the sleeve radiator 3 through the heat-conducting silica gel 2, and then conducted to the shell 4 and the air outside through the sleeve radiator 3 to complete heat dissipation through heat exchange; the whole sleeve radiator 3 is designed to closely adhere to the inner wall of the shell 4 and simultaneously contact the PCB board; when the whole machine is running, the heat generated by the heating device can not only be directly dissipated through the sleeve radiator 3, but also be dissipated through heat transfer among the heat dissipation chip 12, the heat-conducting silica gel 2 and the sleeve radiator 3, forming multiple heat dissipation paths; in this way, the heat dissipation area and the heat dissipation path between the PCB board and the shell 4 are increased, the heat conduction efficiency is improved, the heat dissipation efficiency of the whole machine is improved, and the electronic elements on the PCB board can be ensured to be in a safe working temperature.

[0025] Referring to Figure 1 and Figure 3 In an embodiment of the present application, the main body further comprises a support 13, the PCB board is arranged on the support 13, and the support 13 abuts against the sleeve radiator 3 to support the PCB board. The support 13 can support the PCB board in the sleeve radiator 3, avoid movement or shaking of the PCB board in the sleeve radiator 3, provide firm support for the PCB board, and thus enhance the structural stability of the heat dissipation structure 1000; at the same time, the abutment of the support 13 and the sleeve radiator 3 not only can play a supporting role, but also can serve as a new heat dissipation path, the support 13 itself can serve as a channel for heat conduction, quickly transfer the heat generated by the PCB board to the sleeve radiator 3, and further improve the heat conduction efficiency; when the support 13 firmly supports the PCB board, it can ensure that the PCB board and the sleeve radiator 3 are in close contact and the contact area between the PCB board and the sleeve radiator 3 is always maximized, thereby enhancing the heat dissipation effect of the heat dissipation structure 1000.

[0026] In an embodiment of the utility model, the support 13 is formed with a mounting portion 131 and an abutting portion 132 matched with the sleeve radiator 3, and the PCB is arranged on the mounting portion 131; the mounting portion 131 is connected with the abutting portion 132, and one end of the abutting portion 132 away from the mounting portion 131 abuts against the inner wall of the sleeve radiator 3. The mounting portion 131 and the abutting portion 132 of the support 13 form a stable support structure, the mounting portion 131 is used for mounting the PCB, and the abutting portion 132 is matched with the sleeve radiator 3 to provide firm support for the PCB, thereby ensuring the stability of the heat dissipation structure 1000 during operation; meanwhile, the cooperation of the mounting portion 131 and the abutting portion 132 enables the PCB to be quickly positioned and fixed on the support 13, and the matching design of the support 13 and the sleeve radiator 3 simplifies the mounting process of the radiator, thereby improving the dismounting efficiency of the heat dissipation structure 1000.

[0027] In an embodiment of the utility model, the support 13 is further formed with a stop portion 133, the stop portion 133 is connected with the mounting portion 131 and the abutting portion 132 respectively, and the mounting portion 131 and the abutting portion 132 are formed with a mounting groove 13a used for mounting the PCB. The stop portion 133 of the support 13 forms the mounting groove 13a with the mounting portion 131 and the abutting portion 132, thereby providing stable support and positioning for the PCB and ensuring that the PCB will not be displaced due to vibration or external force during operation, thereby improving the stability of the whole machine; the design of the mounting groove 13a enables the PCB to be in closer contact with the support 13, the abutting portion 132 of the support 13 can be in close contact with the inner wall of the sleeve radiator 3, thereby further optimizing the heat dissipation path and improving the heat dissipation efficiency.

[0028] In an embodiment of the utility model, the two side walls of the support 13 relative to the PCB are each formed with a clamping protrusion 134, the PCB is formed with a clamping groove 11a corresponding to each clamping protrusion 134, and the support 13 is clamped with the PCB to limit the PCB in the mounting groove 13a. The clamping protrusions 134 of the two side walls of the support 13 are matched with the clamping grooves 11a on the PCB to form a stable clamping structure, thereby ensuring the firm fixation of the PCB in the mounting groove 13a and effectively preventing the PCB from loosening or being displaced due to vibration or external force during operation, thereby improving the operation stability of the whole machine; the design of the clamping structure enables the PCB to be more convenient to mount and dismount, compared with the traditional screw fixation or other connection modes, the clamping structure does not need additional tools or complex operation, and the mounting can be completed only by simply inserting the PCB into the mounting groove 13a and clamping, thereby improving the assembly efficiency of the heat dissipation structure 1000.

[0029] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4In an embodiment of the present application, the heat dissipation structure 1000 further comprises a heat dissipation shield 5 connected to the heat-conducting silica gel 2, and the side of the heat dissipation shield 5 opposite to the heat-conducting silica gel 2 abuts against the sleeve radiator 3. The heat dissipation shield 5 is a multifunctional electronic component mainly used to solve the problems of heat dissipation and electromagnetic interference in electronic devices. It is usually made of high-thermal-conductivity metal materials (such as aluminum, copper or alloy), and its outer shape is designed to closely fit electronic components. Through the filling of a small gap by a heat-conducting interface material, it ensures that heat can be efficiently conducted from the heat source to the surface of the shield, and then dissipated to the environment through natural convection. The shell of the shield can effectively shield electromagnetic waves and reduce electromagnetic interference between the internal circuit of the whole machine and the external environment, thereby improving the stability of the whole machine. The heat dissipation shield 5, by being connected to the heat-conducting silica gel 2, can directly receive heat from the heat dissipation chip 12 and quickly conduct it to the sleeve radiator 3, which can significantly reduce the thermal resistance in the heat conduction process and improve the heat dissipation efficiency. At the same time, the metal material (such as aluminum alloy or copper) of the heat dissipation shield 5 itself has high thermal conductivity, which can further optimize the heat dissipation performance. By combining the heat dissipation shield 5 with the heat-conducting silica gel 2 and the sleeve radiator 3, not only can high-efficiency heat dissipation be achieved, but also reliable electromagnetic shielding protection can be provided for electronic devices, which can effectively prevent the influence of external electromagnetic interference on internal sensitive components, and also prevent the leakage of electromagnetic signals generated by internal components, ensuring the stable operation of the whole machine.

[0030] In an embodiment of the present application, the heat dissipation shield 5 and the PCB form an installation space 5a, and the heat dissipation chip 12 and the heat-conducting silica gel 2 are located in the installation space 5a. The installation space 5a formed by the heat dissipation shield 5 and the PCB makes the installation of the heat dissipation chip 12 and the heat-conducting silica gel 2 more convenient, and can simplify the assembly process of the heat dissipation structure 1000; by limiting the heat dissipation chip 12 and the heat-conducting silica gel 2 in the installation space 5a through the heat dissipation shield 5, it is ensured that the heat dissipation chip 12 together with the heat-conducting silica gel 2 can abut against the PCB, avoiding the displacement of the heat dissipation chip 12 or the heat-conducting silica gel 2 to reduce the contact area, so that stable heat dissipation can be achieved in the heat dissipation path from the heat-conducting silica gel 2 to the sleeve radiator 3.

[0031] Please refer to Figure 1 and Figure 2In an embodiment of the present application, the sleeve radiator 3 is formed with an abutting recess 31, and the abutting recess 31 abuts against the heat dissipation shield 5. The abutting recess 31 on the sleeve radiator 3 is in close contact with the heat dissipation shield 5, which can effectively increase the contact area between the two, thereby improving the heat conduction efficiency, so that the heat generated by the heat dissipation chip 12 can be quickly transferred to the heat dissipation shield 5 through the heat-conducting silica gel 2, and then conducted to the sleeve radiator 3 through the abutting recess 31, further improving the heat dissipation performance; the abutting recess 31 is a special-shaped structure, which is recessed in the wall of the sleeve radiator 3, and can limit other structures in the sleeve radiator 3, avoiding the rotation of the support 13 or other structures such as the PCB in the sleeve radiator 3 affecting the structural stability of the heat dissipation structure 1000, so that the heat dissipation structure 1000 can stably dissipate heat.

[0032] The material of the sleeve radiator 3 can be aluminum, copper, alloy or other metals. In an embodiment of the present application, the material of the sleeve radiator 3 is aluminum. The thermal conductivity of aluminum is high, so that the sleeve radiator 3 can quickly conduct heat from the heat generating device to the surface of the shell 4, achieving efficient heat dissipation; at the same time, the aluminum sleeve radiator 3 can quickly respond to temperature changes and evenly dissipate heat, avoiding local overheating; aluminum has low density, and compared with other heat dissipation materials such as copper, the aluminum sleeve radiator 3 is more lightweight; aluminum has good plasticity and processability, and can be made into a complex heat dissipation structure 1000 through extrusion, casting and other methods, which is convenient for production and manufacturing; aluminum has good oxidation resistance and corrosion resistance, and is suitable for use in various environments.

[0033] The present application also provides a handheld heater, which comprises a power supply and a heat dissipation structure 1000. The specific structure of the heat dissipation structure 1000 is referred to the above embodiments. Since the handheld heater adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. The power supply is arranged in the shell 4 and electrically connected with the PCB.

[0034] The above is only an exemplary embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields based on the technical concept of the present application and the contents of the present application are included in the patent protection scope of the present application.

Claims

1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure of a handheld heater. The heat dissipation structure comprises a main body, a heat conduction silica gel, a sleeve heat sink and a shell. The main body comprises a PCB board and a heat dissipation chip. The heat dissipation chip is arranged on the PCB board. The heat conduction silica gel is arranged on one side of the heat dissipation chip which is away from the PCB board. The sleeve heat sink is sleeved on the outer periphery of the PCB board and abuts against the heat conduction silica gel.

2. The heat dissipating structure according to claim 1, wherein The shell is sleeved on the sleeve heat sink.

3. The heat dissipating structure according to claim 2, wherein The main body further comprises a support.

4. The heat dissipating structure according to claim 3, wherein The PCB board is arranged on the support.

5. The heat dissipating structure according to claim 4, wherein The support abuts against the sleeve heat sink to support the PCB board.

6. The heat dissipating structure of claim 1, wherein The support is formed with a mounting portion and an abutting portion which is adapted to the sleeve heat sink.

7. The heat dissipating structure according to claim 6, wherein The PCB board is arranged on the mounting portion.

8. The heat dissipating structure of claim 7, wherein The mounting portion is connected with the abutting portion.

9. The heat dissipating structure according to any one of claims 1 to 8, wherein One end of the abutting portion which is away from the mounting portion abuts against the inner wall of the sleeve heat sink.

10. A hand-held heater characterized by, The support is further formed with a stop portion. The stop portion is connected with the mounting portion and the abutting portion respectively. The mounting portion and the abutting portion are formed with a mounting groove for mounting the PCB board. The support is formed with a clamping protrusion on the two side walls which are opposite to the PCB board. The PCB board is formed with a clamping groove which corresponds to the clamping protrusion. The support and the PCB board are clamped to limit the PCB board in the mounting groove. The heat dissipation structure further comprises a heat dissipation shield. The heat dissipation shield is connected with the heat conduction silica gel. One side of the heat dissipation shield which is away from the heat conduction silica gel abuts against the sleeve heat sink. The heat dissipation shield and the PCB board enclose a mounting space. The heat dissipation chip and the heat conduction silica gel are arranged in the mounting space. The sleeve heat sink is formed with an abutting recess. The abutting recess abuts against the heat dissipation shield. The sleeve heat sink is made of aluminum. The handheld heater comprises a power supply and the heat dissipation structure. The power supply is arranged in the shell and is electrically connected with the PCB board.

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