DCAC mainboard assembly and die box

Abstract

The utility model discloses a DCAC mainboard assembly, which belongs to the technical field of power electronics and comprises a power board, a plurality of radiator assemblies, a first driving board, a second driving board, a first isolation board and a second isolation board. The radiator assemblies are connected to the power board in parallel at intervals, every two radiator assemblies are arranged in pairs and back to back, the opposite sides of the radiator assemblies are connected with the first drive board and the second drive board respectively, the first isolation board is connected between the first drive board and the radiator assemblies and between the second drive board and the radiator assemblies, and the second isolation board is inserted between the first drive board and the second drive board which are opposite. The utility model further discloses a die box, and the die box has the beneficial effects that the limited space of the die box is utilized to the maximum extent, the structure optimization and the heat dissipation effect optimization are realized, and the insulation safety distance is ensured at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of power electronics technical field, and especially a kind of mainboard assembly. BACKGROUND

[0002] In the existing mould box, the heat sink in DCAC mainboard assembly is relatively arranged (as shown in Figure 1 The driving plate on both sides of the heat sink keeps a large distance, which can realize better insulation isolation, but this arrangement causes the entire DCAC mainboard assembly to occupy a larger space. For the mould box with smaller installation space, this method is not conducive to the miniaturization and integration of the mould box.

[0003] The information disclosed in this BACKGROUND section is only for the purpose of increasing the understanding of the background of the utility model and should not be regarded as an acknowledgment or any form of suggestion that it forms prior art known to those of ordinary skill in the art. SUMMARY

[0004] The utility model solves the technical problems of the current DCAC mainboard assembly arrangement, which occupies a larger space.

[0005] The utility model solves the above technical problems by the following technical means:

[0006] The DCAC mainboard assembly includes a power board, multiple heat sink assemblies, a first driving plate, a second driving plate, a first isolation plate, and a second isolation plate. The multiple heat sink assemblies are connected in parallel and spaced apart on the power board. Each two heat sink assemblies are arranged in pairs and opposite each other. The opposite sides of the heat sink assemblies are connected to the first driving plate and the second driving plate, respectively. The first and second driving plates are connected to the heat sink assemblies through the first isolation plate. The opposite first and second driving plates are inserted with the second isolation plate.

[0007] In this embodiment, the heat sink assemblies are arranged in pairs and opposite each other. The opposite sides of the heat sink assemblies are connected to the first driving plate and the second driving plate, respectively. The distance between the first driving plate and the second driving plate is reduced, which reduces the volume of the entire DCAC mainboard assembly and maximizes the use of space in the limited mould box. At the same time, the first isolation plate insulates and isolates the MOS tube on the driving plate and the heat sink assembly. The second isolation plate insulates and isolates the first and second driving plates, which ensures the insulation safety distance of the entire DCAC mainboard assembly.

[0008] Preferably, the circuit devices on the first driving plate are staggered with the circuit devices on the second driving plate.

[0009] The staggered arrangement of the circuit devices on the first driving plate and the circuit devices on the second driving plate is conducive to heat dissipation.

[0010] Preferably, the opposite side of the heat sink assembly is connected with a stud, the stud passes through the first isolation plate, and the end of the stud is locked with the first driving plate and the second driving plate by the first screw.

[0011] Preferably, the top end of the first driving plate and the second driving plate is provided with a plurality of U-shaped grooves, and the first screw is arranged in the U-shaped groove.

[0012] Since the distance between the first driving plate and the second driving plate is small, the traditional bolt connection mode cannot realize installation and disassembly, and the utility model discloses a U-shaped groove is arranged at the top end, the screw rod part of the first screw is arranged in the U-shaped groove, and then locked in the axial direction, so that installation and disassembly are facilitated.

[0013] A plurality of U-shaped grooves are arranged on the first driving plate and the second driving plate, but the groove positions can be consistent, the compatibility of production is facilitated, and the first driving plate and the second driving plate can be grooved simultaneously.

[0014] Preferably, the stud connected with the first driving plate and the stud connected with the second driving plate are staggered.

[0015] The studs are staggered, which is beneficial to installation and disassembly.

[0016] Preferably, the side of the second isolation plate facing the first driving plate or the second driving plate is provided with a plurality of protrusions, and the protrusions are abutted on the first driving plate or the second driving plate.

[0017] The protrusions are abutted on the first driving plate or the second driving plate, so that the second isolation plate is more reliable in installation.

[0018] Preferably, the bottom of the first driving plate and the second driving plate is electrically connected with the power plate through a plug-in interface.

[0019] Preferably, the heat sink assembly comprises a heat sink body, a MOS tube and a second screw, and the MOS tube is connected to the heat sink body by the second screw.

[0020] Preferably, the second screw is a flat head screw.

[0021] The second screw further optimizes the use of a flat screw head, so that the screw does not protrude much from the surface during installation, reduces the avoidance space, effectively optimizes the wiring path, reduces the occupied space, and leaves a back way for the power plate to have more functional areas.

[0022] The utility model discloses a module box, including box body, above-mentioned DCAC mainboard assembly, DCAC mainboard assembly connects in the box body.

[0023] The utility model has the advantages of:

[0024] (1) The heat sink assembly is arranged in pairs and oppositely, and opposite sides of the heat sink assembly are connected with the first driving plate and the second driving plate respectively, the distance between the first driving plate and the second driving plate is reduced, so that the volume of the whole DCAC mainboard assembly is reduced; meanwhile, the driving plate and the MOS tube on the heat sink assembly are insulated and isolated by the first isolation plate, and the first driving plate and the second driving plate are insulated and isolated by the second isolation plate, so that the insulation safety distance of the whole DCAC mainboard assembly is ensured. The utility model maximizes the use of space in the limited mold box space, realizes the structure optimization and the heat dissipation effect optimization, meanwhile ensures the insulation safety distance, and reflects the simplicity and safety of the utility model.

[0025] (2) The circuit devices on the first driving plate and the circuit devices on the second driving plate are arranged staggeredly, which is beneficial to heat dissipation.

[0026] (3) The utility model discloses a U-shaped groove is set up at the top, can place the screw rod part of first screw by U-shaped groove, and is locked along the axial direction, is convenient for installation, test and dismounting. Meanwhile, a plurality of U-shaped grooves are arranged on the first driving plate and the second driving plate, and the slot positions can be consistent, so that the compatibility of production is facilitated, the first driving plate and the second driving plate can be slotted simultaneously, and the assembly line work is facilitated.

[0027] (4) The copper stud mounting positions are staggered, effectively saving the mounting space, increasing the heat sink area of the heat sink, improving the heat dissipation effect, and being simple and fast to assemble and convenient to maintain and maintain, improving the work efficiency. Accelerate system heat dissipation, realize structural optimization.

[0028] (5) The second isolation plate is installed reliably by abutting on the first driving plate or the second driving plate at the protruding position.

[0029] (6) The second screw further optimizes the use of flat screw head, and the screw does not protrude from the surface when being installed, reducing the avoidance space. Effectively optimize the wiring path, reduce the occupied space, and leave more functional areas for the power board. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the prior DCAC mainboard assembly in the background art;

[0031] Figure 2 It is a structural schematic diagram of the DCAC mainboard assembly of the utility model embodiment;

[0032] Figure 3 It is a top view of the DCAC mainboard assembly of the utility model embodiment;

[0033] Figure 4 It is a partial enlarged view of the DCAC mainboard assembly (the second isolation plate is hidden) of the utility model embodiment;

[0034] Figure 5 This is a partial enlarged view of the DCAC motherboard assembly (hidden second isolation plate) according to an embodiment of this utility model;

[0035] Figure 6 This is a schematic diagram of the structure of the second isolation plate in an embodiment of this utility model;

[0036] Numbering on the map:

[0037] 1. Power board;

[0038] 2. Heat sink assembly; 21. Heat sink body; 22. MOSFET; 23. Second screw; 24. Ceramic gasket; 25. Transistor jack;

[0039] 3. First drive board; 4. Second drive board; 5. First isolation plate; 6. Second isolation plate; 61. Protrusion; 7. Stud; 8. First screw. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0041] Example 1:

[0042] like Figure 2 , Figure 3 As shown, the DCAC mainboard assembly includes a power board 1, multiple heat sink assemblies 2, multiple first driver boards 3, multiple second driver boards 4, multiple first isolation boards 5, and multiple second isolation boards 6; the multiple heat sink assemblies 2 are connected to the power board 1 in parallel at intervals, with each pair of heat sink assemblies 2 arranged in pairs facing away from each other, as shown. Figure 4 As shown, the heat sink assembly 2 located at the edge can also be a single unit, not part of a group. The opposite sides of the heat sink assembly 2 are respectively connected to the first drive plate 3 and the second drive plate 4. The first drive plate 3, the second drive plate 4 and the heat sink assembly 2 are respectively connected to the first isolation plate 5. The second isolation plate 6 is inserted between the oppositely arranged first drive plate 3 and second drive plate 4.

[0043] Specifically, the power board 1 serves as a support component, and the heat sink assembly 2 can be fixedly connected to the power board 1 by means of screws or other means. The first drive board 3 and the second drive board 4 are electrically connected to the power board 1 through a plug-in interface.

[0044] like Figure 4 ,Figure 5 As shown in the drawings, the heat sink assembly 2 comprises a heat sink body 21, a MOS tube 22, a second screw 23, a ceramic gasket 24, and a transistor bone piece 25. The back side of the MOS tube 22 is connected to the transistor bone piece 25. The MOS tube 22 and the transistor bone piece 25 are fixedly connected to the heat sink body 21 through the second screw 23 and the ceramic gasket 24.

[0045] The heat sink body 21 has an E-shaped structure. The MOS tube 22 is connected to the back of the heat sink body 21. The side where the fins are located is outwardly arranged. The opposite middle part of the fins can be used to install an electric element such as a capacitor. The second screw 23 is a flat head screw. The second screw 23 further optimizes the use of a flat screw head. When the screw is installed, it will not protrude much from the surface, reducing the avoidance space. The wiring path is effectively optimized, the occupied space is reduced, and more functional areas are left for the power board 1.

[0046] In this embodiment, the circuit devices on the first drive board 3 are arranged staggered with the circuit devices of the second drive board 4, which is conducive to heat dissipation.

[0047] As shown in the drawings, Figure 4 , Figure 5 A pair of heat sink bodies 21 are connected to opposite sides of the stud 7. The stud 7 can be welded to the back of the heat sink body 21. The stud 7 passes through the first isolation plate 5. The other end of the stud 7 is locked with the first drive board 3 and the second drive board 4 through the first screw 8.

[0048] The first isolation plate 5 is an epoxy isolation plate, and the second isolation plate 6 is a PC isolation plate. The isolation plate plays a role in fixing, isolating and supporting, preventing circuit interference and improving equipment stability.

[0049] In this embodiment, the heat sink assembly 2 is arranged in pairs and opposite to each other. The opposite sides of the heat sink assembly 2 are respectively connected to the first drive board 3 and the second drive board 4. The distance between the first drive board 3 and the second drive board 4 is reduced, so that the size of the entire DCAC mainboard assembly is reduced. At the same time, the first drive board 3 and the second drive board 4 are insulated and isolated from the MOS tube 22 on the heat sink assembly 2 through the first isolation plate 5. The first drive board 3 and the second drive board 4 are insulated and isolated from each other through the second isolation plate 6, so as to ensure the insulation safety distance of the entire DCAC mainboard assembly. This embodiment maximizes the use of space in the limited mold box space, optimizes the structure, optimizes the heat dissipation effect, and at the same time ensures the insulation safety distance, which embodies the simplicity, safety and practicability of the utility model.

[0050] Embodiment two:

[0051] As shown in the drawings, Figure 4 , Figure 5 On the basis of the above-mentioned embodiment one, a plurality of U-shaped grooves are formed at the top end of the first drive board 3 and the second drive board 4. The first screw 8 is arranged in the U-shaped groove.

[0052] Since the first driving plate 3 and the second driving plate 4 are arranged in the manner of the embodiment, the distance between the two is small, and the traditional bolt connection mode cannot realize installation and disassembly, the U-shaped groove is arranged at the top of the first driving plate 3 and the second driving plate 4, the screw rod part of the first screw 8 is placed in the U-shaped groove and locked in the axial direction, and thus installation and disassembly are facilitated.

[0053] In addition, the stud 7 connected with the first driving plate 3 and the stud 7 connected with the second driving plate 4 are arranged staggeredly, which is beneficial to installation and disassembly.

[0054] It should be noted that different electrical appliances can be connected on the first driving plate 3 and the second driving plate 4 as required, but the positions of the U-shaped grooves can be consistent, which is beneficial to the compatibility of production, and the first driving plate 3 and the second driving plate 4 can be grooved simultaneously.

[0055] Similarly, the top of the first isolation plate 5 can also be adaptively provided with a U-shaped groove, which is beneficial to installation of the stud 7. The hole or the U-shaped groove of the first isolation plate 5 is aligned with the U-shaped groove of the first driving plate 3 or the second driving plate 4.

[0056] As shown in Figure 2 , Figure 6 , the side of the second isolation plate 6 facing the first driving plate 3 or the second driving plate 4 is provided with a plurality of protrusions 61, the protrusions 61 abut on the first driving plate 3 or the second driving plate 4, so that the second isolation plate 6 is more reliable in installation. The second isolation plate 6 can be directly inserted between the first driving plate 3 and the second driving plate 4, the protrusions 61 abut on the first driving plate 3 or the second driving plate 4 in a blank manner, and the second isolation plate 6 is provided with a bending shape at both ends, so that the abutment of the second isolation plate 6 on the first driving plate 3 and the second driving plate 4 is more reliable.

[0057] The second isolation plate 6 can be formed by welding two plate structures, and each plate is bent.

[0058] The embodiment discloses a module box, which comprises a box body and the DCAC mainboard assembly in the above-mentioned embodiment one or embodiment two, and the DCAC mainboard assembly is connected in the box body. Figure 1 The mounting mode shown in

[0059] The above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A DCAC motherboard assembly, characterized by, The DCAC mainboard assembly comprises a power plate, a plurality of radiator assemblies, a first driving plate, a second driving plate, a first isolation plate and a second isolation plate.

2. The DCAC motherboard assembly of claim 1, wherein, The circuit devices on the first driving plate are staggered with the circuit devices on the second driving plate.

3. The DCAC motherboard assembly of claim 1, wherein, The opposite side of the radiator assembly is connected with a stud, the stud passes through the first isolation plate, and the end of the stud is locked with the first driving plate and the second driving plate by the first screw.

4. The DCAC motherboard assembly of claim 3, wherein, A plurality of U-shaped grooves are formed at the top end of the first driving plate and the second driving plate, and the first screw is arranged in the U-shaped groove.

5. The DCAC motherboard assembly of claim 3, wherein, The stud connected with the first driving plate and the stud connected with the second driving plate are staggered.

6. The DCAC motherboard assembly of claim 1, wherein, A plurality of protrusions are arranged on the side of the second isolation plate facing the first driving plate or the second driving plate, and the protrusions abut against the first driving plate or the second driving plate.

7. The DCAC motherboard assembly of claim 1, wherein, The bottom of the first driving plate and the second driving plate is electrically connected with the power plate through the plug-in interface.

8. The DCAC motherboard assembly of claim 1, wherein, The radiator assembly comprises a radiator body, a MOS tube and a second screw, and the MOS tube is connected to the radiator body by the second screw.

9. The DCAC motherboard assembly of claim 8, wherein, The second screw is a flat head screw.

10. A mold box characterized by, The DCAC mainboard assembly comprises a box body and the DCAC mainboard assembly of any one of claims 1-9, and the DCAC mainboard assembly is connected in the box body.

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