Cooling device
By setting up cooling chambers around electronic devices and utilizing the design of medium flow channels and cooling flow channels, efficient multi-faceted heat dissipation is achieved, solving the problems of low heat dissipation efficiency and insufficient space utilization in existing technologies, and adapting to the application requirements of complex spaces.
Patent Information
- Application Number
- CN202520425105.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-11
AI Technical Summary
Existing heat dissipation methods for electronic devices are inefficient and have insufficient space utilization, making it difficult to meet the needs of rapid heat dissipation and adapting to complex spaces.
A cooling device that uses a base plate and side plates to form a cooling chamber allows the medium to flow through a medium channel, an inlet channel, an outlet channel, and multiple cooling channels. A flow-guiding structure diverts the medium to the cooling channels, achieving radiative heat transfer from all sides and multi-faceted heat conduction, supporting multi-layer stacking of devices.
It improves heat dissipation efficiency, increases space utilization, adapts to complex application environments, and ensures the heat dissipation requirements of multi-layer electronic devices.
Smart Images
Figure CN223957839U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a cooling device. Background Technology
[0002] Electronic components such as transformers, inductors, circuit boards, and chips generate a significant amount of heat during operation. Operating under high temperatures can lead to component failure, necessitating heat dissipation and cooling. Current technology utilizes a planar cooling system with a cooling plate connected to the bottom of the component. However, this method limits the amount of heat that can be conducted from the component to the cooling plate, resulting in low heat dissipation efficiency and difficulty in meeting the demands for rapid heat dissipation. Furthermore, this method has low space utilization, making it unsuitable for applications with limited space and complex conditions. Utility Model Content
[0003] Therefore, it is necessary to provide a cooling device with high space utilization and high heat dissipation efficiency.
[0004] A cooling device includes a base plate and at least one set of cooling components disposed on the base plate at an angle to the base plate. The base plate is provided with a medium inlet, a medium outlet and a medium flow channel, and the medium flow channel connects the medium inlet and the medium outlet.
[0005] The cooling assembly includes at least two side plates, which are arranged opposite each other and together with the bottom plate to form a cooling cavity;
[0006] The side plate is provided with an inlet channel, an outlet channel, and multiple cooling channels. The multiple cooling channels are distributed along the height direction of the side plate and extend along the length direction of the side plate. The inlet channel and the outlet channel are respectively connected to the medium channel. The inlet end of the multiple cooling channels is connected to the inlet channel, and the outlet end of the multiple cooling channels is connected to the outlet channel.
[0007] The cooling device includes a flow-guiding structure, part of which is located in the medium flow channel. The flow-guiding structure is capable of guiding part of the medium from the medium flow channel to the liquid inlet channel and then diverting it to multiple cooling channels.
[0008] In one embodiment, the flow-guiding structure includes a flow-blocking element and a flow-guiding element. The flow-guiding element is disposed at a position corresponding to the liquid inlet channel and is used to guide a portion of the medium to flow into the liquid inlet channel. The flow-blocking element is used to slow down the flow velocity of the medium in the medium channel at the position of the flow-guiding element.
[0009] In one of the embodiments, the flow guide member comprises a flow guide block, which is arranged to extend from the bottom plate to the liquid inlet channel; and a flow guide gap is formed between the side wall of the flow guide block and the inner wall of the liquid inlet channel.
[0010] In one of the embodiments, the flow guide block extends into the liquid inlet channel, and a flow guide surface is formed on the side of the flow guide block facing the medium inlet; and a gap is formed between the flow guide surface and the inner wall of the liquid inlet channel.
[0011] In one of the embodiments, a plurality of openings are formed in the flow guide block, and the openings are distributed along the height direction of the flow guide block; each of the openings extends from the flow guide surface to the opposite side of the flow guide block and penetrates through the flow guide block; and the cooling channels are connected to the flow guide gap through the openings.
[0012] In one of the embodiments, a blocking portion is arranged on each of the opposite sides of the flow guide block away from the flow guide surface, and the blocking portion extends from the flow guide block to the cooling channel and partially extends into the cooling channel.
[0013] In one of the embodiments, the flow guide block comprises a first body and a second body, and the first body and the second body are connected by a plug-in connection.
[0014] In one of the embodiments, the flow guide block is provided with a clamping portion, and the clamping portion is connected to the bottom plate or the side plate by a clamping connection.
[0015] In one of the embodiments, the flow guide member further comprises a protruding portion, which is arranged on the bottom plate and extends from the bottom plate to the liquid inlet channel; and the flow guide block is arranged above the protruding portion along the height direction of the side plate.
[0016] In one of the embodiments, the flow guide block and the bottom plate are connected by a clamping connection or a welding connection, and the bottom of the flow guide block and the protruding portion are connected by an abutting connection or a gap connection.
[0017] Alternatively, the flow guide block and the side plate are connected by a clamping connection or a welding connection, and the bottom of the flow guide block and the protruding portion are connected by an abutting connection or a gap connection.
[0018] Alternatively, the flow guide block is provided with a clamping portion, and the clamping portion is connected to the protruding portion by a clamping connection.
[0019] In one of the embodiments, the flow guide member further comprises a flow blocking portion, which is arranged on the bottom of the side plate corresponding to the position of the liquid inlet channel and extends from the bottom plate.
[0020] In one of the embodiments, the flow guide block is provided with a clamping portion, and the clamping portion is connected to the flow blocking portion by a clamping connection.
[0021] In one of the embodiments, the flow guide member comprises a flow guide pipe, which is arranged in the liquid inlet channel, the liquid inlet end of the flow guide pipe is communicated with the medium channel, and the liquid outlet end of the flow guide pipe is communicated with the cooling channel; a plurality of openings are arranged on the flow guide pipe, the plurality of openings are distributed along the height direction of the flow guide pipe, and each of the openings is communicated with the cooling channel.
[0022] Alternatively, the flow guide pipe comprises a first pipe body and a second pipe body, the first pipe body and the second pipe body are arranged side by side in the liquid inlet channel, the liquid inlet end of the first pipe body is communicated with the medium channel, the liquid outlet end of the first pipe body is communicated with the liquid inlet end of the second pipe body and the cooling channel; a plurality of openings are arranged on the second pipe body.
[0023] In one of the embodiments, the flow guide member further comprises a flared cover, which is arranged in the medium channel; the flared cover is flared from the side close to the flow guide pipe to the side away from the flow guide pipe; the flared end of the flared cover is communicated with the medium channel, and the other end is communicated with the liquid inlet end of the flow guide pipe; the outer wall of the flared end of the flared cover is in abutment with the inner wall of the medium channel, and the other end of the flared cover is in clamping or clearance fit with the liquid inlet end of the flow guide pipe.
[0024] In one of the embodiments, the flow resistance member is arranged in the medium channel at a position corresponding to the liquid inlet channel and the liquid outlet channel, the side of the flow resistance member close to the liquid inlet channel is provided with a first gap, and the side of the flow resistance member close to the liquid outlet channel is provided with a second gap.
[0025] Compared with the prior art, the cooling cavity of the cooling device is formed by the bottom plate and the side plate, and the device to be cooled is placed in the cooling cavity. The device is cooled by the bottom plate and the side plate in a three-dimensional space form, the conventional single-face heat conduction form is changed into a four-around radiation heat conduction and multi-face heat conduction form, and the heat dissipation efficiency is high. The device can be stacked in multiple layers in the cooling cavity, which greatly saves space, can adapt to small space and complex application environment, and meets the high space utilization rate.
[0026] The liquid inlet ends and the liquid outlet ends of the plurality of cooling channels are respectively connected to the liquid inlet channel and the liquid outlet channel, each cooling channel is relatively independent, and mutual interference between the cooling channels is unlikely to occur, which can better adapt to the heat dissipation demand of the electronic device stacked in multiple layers in the cooling cavity, and further improve the heat dissipation efficiency. The flow guide structure can better distribute the medium, avoid the case that the medium in the side plate is too little, ensure good heat dissipation of the side plate to the device, and improve the three-dimensional heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor.
[0028] Figure 1 The structural schematic diagram of the first embodiment of the cooling device provided by the present application is shown.
[0029] Figure 2 The perspective view of the cooling device provided by the present application is shown. Figure 1 The perspective view of the cooling device provided by the present application is shown.
[0030] Figure 3 The perspective view of the cooling device provided by the present application is shown. Figure 1 The perspective view of the cooling device provided by the present application is shown.
[0031] Figure 4 The partial enlarged view of the cooling device provided by the present application is shown. Figure 2 The partial enlarged view of the cooling device provided by the present application is shown.
[0032] Figure 5 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 3 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. The structural schematic diagram of the guide member in the cooling device provided by the present application is shown.
[0033] The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 6 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 3 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. The structural schematic diagram of the guide member in the cooling device provided by the present application is shown.
[0034] The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 7 The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown.
[0035] The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. Figure 8 The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown.
[0036] The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. Figure 9 The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown.
[0037] The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. Figure 10 The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown.
[0038] The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. Figure 11 The structural schematic diagram of the second embodiment of the cooling device provided by the present application is shown. Figure 10 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. The structural schematic diagram of the guide member in the cooling device provided by the present application is shown.
[0039] The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 12 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 11 The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. The structural schematic diagram of the guide member in the cooling device provided by the present application is shown.
[0040] The structural schematic diagram of the guide member in the cooling device provided by the present application is shown. Figure 13 The structural schematic diagram of the sixth embodiment of the cooling device provided by the present application is shown. The structural schematic diagram of the sixth embodiment of the cooling device provided by the present application is shown.
[0041] The structural schematic diagram of the sixth embodiment of the cooling device provided by the present application is shown. Figure 14Structure diagram of the seventh embodiment of the cooling device provided in the present application.
[0042] Figure 15 For Figure 14 Structure diagram of the middle side plate.
[0043] Figure 16 For Figure 14 Structure diagram of the middle flow guide.
[0044] Figure 17 Structure diagram of the eighth embodiment of the cooling device provided in the present application.
[0045] Figure 18 Structure diagram of the ninth embodiment of the cooling device provided in the present application.
[0046] Figure 19 Structure diagram of the tenth embodiment of the cooling device provided in the present application.
[0047] Figure 20 Structure diagram of the eleventh embodiment of the cooling device provided in the present application.
[0048] Figure 21 For Figure 20 Partial enlarged view in the structure diagram.
[0049] Figure 22 For Figure 20 Structure diagram of the bottom plate.
[0050] Figure 23 Perspective view of the cooling device in the present application.
[0051] Reference signs: 1, bottom plate; 11, medium inlet; 12, medium outlet; 13, medium flow channel; 14, groove; 2, cooling assembly; 20, side plate; 21, liquid inlet flow channel; 22, liquid outlet flow channel; 23, cooling flow channel; 3, cooling cavity; 4, flow guiding structure; 5, flow resistance member; 51, first notch; 52, second notch; 6, flow guide; 61, flow guide block; 601, flow guide surface; 602, flow guide gap; 603, opening; 604, blocking part; 605, clamping part; 606, clamping groove; 611, first body; 612, second body; 62, convex part; 63, flow blocking part; 64, flow guide pipe; 641, first pipe body; 642, second pipe body; 65, flared cover; 71, first opening; 711, insertion slot; 72, second opening; 721, flange; 8, end cover. DETAILED DESCRIPTION
[0052] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the detailed description of the specific embodiments of the present application is made below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different manners according to the present application, and it is contemplated that some improvement and modification can be made by those skilled in the art without departing from the scope of the present application. Therefore, the specific embodiments disclosed below are not intended to limit the scope of the present application.
[0053] It is to be noted that when a component is referred to as being "on" or "disposed on" another component, it can be directly on the other component or there can be intervening components present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or there can be intervening components present. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar terms as used in the description of the specification are for the purpose of illustration only and do not indicate an exclusive orientation.
[0054] In addition, the terms "first", "second", and the like, are used merely to describe items that differ from one another, without necessarily implying a relative importance or a quantity. Thus, a feature defined with "first" or "second" can implicitly or explicitly include at least one of the features. In the description of the specification, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0055] In the present application, unless otherwise explicitly specified and limited, "on", "under", "above", and "over" of a first feature to a second feature can be that the first feature is in direct contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, "above", "over", and "on" of a first feature to a second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is horizontally higher than the second feature. "Below", "under", and "under" of a first feature to a second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is horizontally lower than the second feature.
[0056] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more of the associated listed items.
[0057] Please refer to Figures 1 to 23The application provides a cooling device, which comprises a bottom plate 1 and a cooling assembly 2. The cooling assembly 2 is arranged on the bottom plate 1 at an angle and at least one set is arranged. The bottom plate 1 is provided with a medium inlet 11, a medium outlet 12 and a medium flow channel 13, and the medium flow channel 13 is connected with the medium inlet 11 and the medium outlet 12. The cooling assembly 2 comprises at least two side plates 20. The two side plates 20 are oppositely arranged and surround the bottom plate 1 to form a cooling cavity 3. The side plate 20 is provided with an inlet flow channel 21, an outlet flow channel 22 and a plurality of cooling flow channels 23. The plurality of cooling flow channels 23 are distributed along the height direction of the side plate 20 and are arranged in the length direction of the side plate 20. The inlet flow channel 21 and the outlet flow channel 22 are respectively connected with the medium flow channel 13, the inlet ends of the plurality of cooling flow channels 23 are respectively connected with the inlet flow channel 21, and the outlet ends of the plurality of cooling flow channels 23 are respectively connected with the outlet flow channel 22. The cooling device comprises a flow guide structure 4, part of the flow guide structure 4 is arranged in the medium flow channel 13, and the flow guide structure 4 can guide part of the medium from the medium flow channel 13 to the inlet flow channel 21 and branch to the plurality of cooling flow channels 23.
[0058] It can be understood that the cooling cavity 3 of the cooling device is formed by surrounding the bottom plate 1 and the side plate 20, and the device to be cooled is placed in the cooling cavity 3. During cooling, the medium enters the medium flow channel 13 from the medium inlet 11 on the bottom plate 1 and flows to the medium outlet 12 from the medium flow channel 13, and passes through the two side plates 20. When the medium flows through the inlet flow channel 21 on the side plate 20, part of the medium is guided by the flow guide structure 4 to flow to the inlet flow channel 21 and branch to the plurality of cooling flow channels 23, and the medium in the plurality of cooling flow channels 23 flows in the corresponding cooling flow channel 23 to the outlet flow channel 22 and converges in the medium flow channel 13 again from the outlet flow channel 22. The medium not entering the inlet flow channel 21 continues to flow along the medium flow channel 13 until it flows to the position of the outlet flow channel 22, and the two parts of the medium converge and then flow out from the medium outlet 12 on the bottom plate 1.
[0059] During the process, the medium in the medium flow channel 13 on the bottom plate 1 and the medium in the cooling flow channel 23 on the side plate 20 can absorb the heat emitted by the device in the cooling cavity 3, and the device is cooled by the bottom plate 1 and the side plate 20 in a three-dimensional space, which changes the conventional single-face heat conduction form into a four-around radiation heat transfer and multi-face heat conduction form, and the cooling efficiency is high. The device can be stacked in multiple layers in the cooling cavity 3, which greatly saves space and can adapt to small space and complex application environment, and meets the high space utilization rate.
[0060] Meanwhile, the inlet end and the outlet end of each cooling flow channel 23 are independently connected to the inlet flow channel 21 and the outlet flow channel 22, respectively, and each cooling flow channel 23 is relatively independent. The cooling flow channels 23 located in the upper layer are adapted to the heat dissipation of the electronic devices stacked in the upper layer, and the cooling flow channels 23 located in the middle layer and the lower layer also correspond to each other, and the cooling flow channels 23 do not easily interfere with each other. Thus, the heat dissipation requirements of the electronic devices stacked in the cooling cavity 3 can be better adapted, and the heat dissipation efficiency is further improved. The flow guide structure 4 can better guide the medium into the cooling flow channel 23, avoid the situation that there is too little medium in the side plate 20, ensure that the side plate 20 has good heat dissipation for the device, and improve the three-dimensional heat dissipation effect.
[0061] Exemplarily, the included angle between the cooling assembly 2 and the bottom plate 1 is 90°. Of course, in other embodiments, the specific angle can also be selected according to actual needs.
[0062] Exemplarily, the cooling assembly 2 is provided as a group. Of course, in other embodiments, it can be provided as multiple groups and arranged at different positions of the bottom plate 1. The specific number can be selected according to actual needs.
[0063] Exemplarily, each cooling assembly 2 includes two side plates 20. Of course, in other embodiments, it can also be provided as more than two, and the specific number can be selected according to actual needs. The two adjacent side plates 20 are arranged to form a cooling cavity 3, realizing product integration.
[0064] Further, the flow guide structure 4 includes a flow resistance member 5 and a flow guide member 6. The flow guide member 6 is arranged at a position corresponding to the inlet flow channel 21, for guiding part of the medium to flow into the inlet flow channel 21. The flow resistance member 5 is used to slow down the flow speed of the medium at the position of the flow guide member 6 in the medium flow channel 13.
[0065] As can be understood, after the medium enters the medium flow channel 13 from the medium inlet 11, when the medium flows to the position where the flow resistance member 5 is located, the flow resistance member 5 will block the flow of the medium, thereby slowing down the flow rate of the medium, slowing down the flow speed of the medium at the position of the flow guide member 6, avoiding too much medium directly flowing away from the medium flow channel 13, ensuring that there is enough medium at this position to be guided by the flow guide member 6 into the inlet flow channel 21, and further ensuring that the cooling flow channel 23 has enough medium to absorb heat, ensuring the heat dissipation effect.
[0066] Meanwhile, by controlling the shape and length of the flow guide member 6, the medium can be guided into the cooling flow channel 23 at different height positions and different regions, thereby controlling the medium at a certain height and a certain region to be in a large flow, improving the heat dissipation efficiency of this place, better adapting to the situation that heat is concentrated in a certain place, and being able to adapt to more application environments and adapt to more complex heat management scenarios.
[0067] Further, the flow resistance member 5 is arranged in the medium flow channel 13 at a position corresponding to the interval between the liquid inlet flow channel 21 and the liquid outlet flow channel 22. The flow resistance member 5 is provided with a first gap 51 on the side close to the liquid inlet flow channel 21, and a second gap 52 on the side close to the liquid outlet flow channel 22. The flow resistance member 5 is arranged at a relatively long distance, and has a long-distance flow resistance effect on the medium. The first gap 51 and the second gap 52 can provide space for the liquid inlet flow channel 21 and the liquid outlet flow channel 22, and can also surround the flow guide member 6, so as to better realize the flow concentration of the medium at the position of the flow guide member 6.
[0068] Exemplarily, the flow resistance member 5 includes fins, and the fins are provided with passages for the medium flow channel 13. Of course, the flow resistance member 5 can also adopt, for example, convex points formed upward from the bottom of the bottom plate 1, or a needle fin structure, and the specific structure can be selected according to actual needs.
[0069] In an embodiment, referring to Figure 4 , the flow guide member 6 includes a flow guide block 61, which is arranged in the liquid inlet flow channel 21 by extending from the bottom plate 1. The flow guide block 61 has a flow guide gap 602 for the medium flow channel 13 between the side wall of the flow guide block 61 and the inner wall of the liquid inlet flow channel 21. The arrangement of the flow guide gap 602 and the extending direction of the flow guide block 61 better realizes the guiding effect on the medium, and ensures that the medium is guided to the corresponding cooling flow channel 23.
[0070] In an embodiment, referring to Figure 7 , the height of the flow guide block 61 extends to the position of the bottom cooling flow channel 23. Under the action of gravity, the large flow of the medium will be in the several cooling flow channels 23 at the bottom position, which is convenient for adapting to the heat dissipation scheme of the high-heat region at the bottom.
[0071] Exemplarily, the flow guide block 61 is a protrusion formed by a convex portion 62 upward from the bottom of the bottom plate 1. The protrusion is in an integrated structure with the bottom plate 1, and is convenient for forming.
[0072] In an embodiment, referring to Figures 2 to 5 , Figure 8 , the flow guide block 61 extends into the liquid inlet flow channel 21. The flow guide block 61 has a flow guide surface 601 on the side facing the medium inlet, and there is a spacing between the flow guide surface 601 and the inner wall of the liquid inlet flow channel 21 to form a flow guide gap 602. The medium flows through the flow guide surface 601 via the flow guide gap 602, and most of the medium is guided to the top end position of the flow guide block 61 by the flow guide surface 601. The flow guide block 61 is extended into the liquid inlet flow channel 21, and then the length of the flow guide block 61 is controlled, so that the large flow of the medium can be in the cooling flow channels 23 at the middle position or the top position or the bottom position, which is convenient for adapting to the heat dissipation scheme of the high-heat region at the middle or the top or the bottom.
[0073] Exemplarily, the top of the flow guide block 61 extends to the top of the side plate 20. Of course, the extended length of the flow guide block 61 can also be selected according to actual needs, which is not limited hereto and will not be repeated here.
[0074] Exemplarily, the flow guide surface 601 is an arc surface structure, and the flow guiding effect is better. Exemplarily, the flow guide block 61 can also have an arc structure as a whole.
[0075] In an embodiment, referring to Figures 8 to 10 , a plurality of openings 603 are formed on the flow guide block 61 and are distributed along the height direction of the flow guide block 61. Each opening 603 extends from the flow guide surface 601 to the side opposite to the flow guide block 61 and penetrates through the flow guide block 61. The plurality of cooling flow channels 23 are connected to the flow guide gap 602 through the plurality of openings 603, respectively.
[0076] As can be understood, in the process of flowing upwards along the flow guide block 61, part of the medium can flow into the cooling flow channel 23 at the corresponding position through the opening 603, the medium can be distributed into the plurality of cooling flow channels 23, and the heat dissipation scheme can be adapted to the uniform heat dissipation requirement of each region without special high-heat area.
[0077] Exemplarily, the number of openings 603 corresponds to the number of cooling flow channels 23 one by one, to ensure uniform distribution. Of course, in other embodiments, the openings 603 can be arranged only corresponding to part of the cooling flow channels 23. Different sizes of openings 603 can be arranged for cooling flow channels 23 at different positions.
[0078] Further, the opposite sides of the flow guide block 61 away from the flow guide surface 601 are respectively provided with a blocking portion 604, which is arranged to extend from the flow guide block 61 to the cooling flow channel 23 and partially extends into the cooling flow channel 23. The blocking portion 604 increases the lateral area of the flow guide block 61, reduces the flow of the medium from the gap between the flow guide block 61 and the cooling flow channel 23 to the cooling flow channel 23, and more concentratedly guides the medium to the region requiring large flow, to ensure the effect of high-heat concentrated heat dissipation.
[0079] Exemplarily, the blocking portion 604 is arranged in plurality, and the number corresponds to the number of cooling flow channels 23. The blocking portion 604 is arranged at the positions corresponding to the two sides of the flow guide surface 601 of the flow guide block 61. Preferably, it is symmetrically arranged.
[0080] Exemplarily, the blocking portion 604 and the flow guide block 61 are an integral molding structure, which is more convenient to process.
[0081] In an embodiment, referring to Figure 11 , Figure 12 , the flow guide block 61 comprises a first body 611 and a second body 612. The first body 611 and the second body 612 are inserted and fitted.
[0082] It can be understood that the presence of the blocking part 604 increases the difficulty of assembling the flow guide block 61. After the flow guide block 61 is divided into the first body 611 and the second body 612, the volume during single installation is smaller, which effectively reduces the assembly difficulty of the flow guide block 61, and avoids collision between the blocking part 604 and other structures during installation.
[0083] Exemplarily, the first body 611 and the second body 612 are connected by tenon joint, the connection is firm, and the medium is not easy to leak from the connection to the cooling channel.
[0084] In an embodiment, the flow guide block 61 is provided with a clamping part 605 which is clamped and matched with the bottom plate 1. The flow guide block 61 is conveniently disassembled and replaced to meet different heat dissipation requirements. In other embodiments, the clamping part 605 is arranged to be clamped and matched with the side plate 20.
[0085] Exemplarily, referring to Figure 8 , the clamping part 605 is arranged on the bottom of the flow guide block 61, and the bottom plate 1 is provided with a clamping groove 606 which is clamped and matched with the clamping part 605, so as to realize clamping of the flow guide block 61 and the bottom plate 1.
[0086] Exemplarily, referring to Figure 9 , the side plate 20 is provided with a clamping groove 606 which is clamped and matched with the clamping part 605, so as to realize clamping of the flow guide block 61 and the side plate 20. Of course, it is not limited to this, and the clamping grooves 606 can also be arranged on the bottom plate 1 and the side plate 20 respectively to be clamped and matched with the clamping part 605, so as to improve the fixing effect.
[0087] Exemplarily, the clamping part 605 and the flow guide block 61 are an integral structure, and the clamping part 605 partially protrudes from the side of the flow guide block 61.
[0088] In other embodiments, referring to Figure 2 , Figure 9 , Figure 10 , Figure 13 , the flow guide piece 6 further includes a convex part 62 which is arranged on the bottom plate 1 and extends from the bottom plate 1 to the liquid inlet flow channel 21. In the height direction of the side plate 20, the flow guide block 61 is at least partially arranged above the convex part 62.
[0089] It can be understood that the convex part 62 and the flow guide block 61 are distributed in an upper and lower manner and cooperate to guide the medium. The flow guide piece 6 is equivalent to being separated into two parts in the height direction, i.e., the convex part 62 and the flow guide block 61, so that the length of either the convex part 62 or the flow guide block 61 does not need to be set to be long, and the structure is more stable.
[0090] Exemplarily, the convex part 62 is a protrusion formed by the upward convex part 62 of the bottom plate 1. The protrusion is an integral structure with the bottom plate 1, and is convenient for molding.
[0091] Further, the flow guide block 61 is provided with a clamping portion 605 which is clamped with the protruding portion 62. The protruding portion 62 and the flow guide block 61 are as far as possible integrated as a whole, so as to avoid the gap between the two being too large and affecting the flow guiding effect.
[0092] For example, referring to Figure 13 , the clamping portion 605 is arranged at the bottom of the flow guide block 61, and the clamping groove 606 is arranged at the top of the protruding portion 62. The clamping portion 605 is clamped with the clamping groove 606, so as to realize the connection of the two.
[0093] Of course, it is not limited to this. In other embodiments, the clamping portion 605 of the flow guide block 61 can also be clamped between the bottom plate 1 and the side plate 20. There is a certain gap between the flow guide block 61 and the protruding portion 62, and the flow guide block 61 can also be guided as a whole.
[0094] Of course, it is not limited to this. In other embodiments, the flow guide block 61 and the bottom plate 1 are clamped and matched or welded together. The bottom of the flow guide block 61 and the protruding portion 62 are abutted or gap matched. For example, the clamping portion 605 is arranged at the side of the flow guide block 61, and the clamping groove is arranged on the bottom plate 1 corresponding to the position of the clamping portion 605. The clamping portion 605 is clamped into the clamping groove, or directly welded with the clamping groove.
[0095] Of course, it is not limited to this. In other embodiments, the flow guide block 61 and the side plate 20 are clamped and matched or welded together. The bottom of the flow guide block 61 and the protruding portion 62 are abutted or gap matched. For example, the clamping portion 605 is arranged at the side of the flow guide block 61, and the clamping groove is arranged on the side plate 20 corresponding to the position of the clamping portion 605. The clamping portion is clamped into the clamping groove, or directly welded with the clamping groove.
[0096] In other embodiments, referring to Figure 14 , Figure 17 The flow guide 6 further comprises a flow blocking portion 63. The flow blocking portion 63 is arranged at the bottom of the side plate 20 corresponding to the position of the liquid inlet flow channel 21, and extends towards the bottom plate 1.
[0097] It can be understood that the flow blocking portion 63 extends from the bottom of the side plate 20 towards the bottom plate 1, that is, it can cut off the flow of the medium in the medium flow channel 13, and block the medium, so that the medium is more concentrated at the position of the liquid inlet flow channel 21, so that the flow guide block 61 can guide more medium into the cooling flow channel 23, and the heat dissipation effect is improved.
[0098] For example, referring to Figure 15 , the flow blocking portion 63 is in a C-shaped structure, and the notch is directed towards the medium inlet 11.
[0099] Further, referring to Figure 16The flow guide block 61 is provided with a locking part 605, which engages with the flow blocking part 63. For example, the locking parts 605 are provided on both sides of the flow guide block 61, and the flow blocking part 63 is provided with strip-shaped slots 606 corresponding to the positions of the locking parts 605 on both sides. The locking parts 605 and the slots 606 engage to facilitate the loading and unloading of the flow guide block 61.
[0100] For example, the lower part of the slot 606 on the flow deflector 63 has an open structure, which makes it easy for the card part 605 to be directly inserted.
[0101] In other embodiments, see Figure 18 , Figure 19 The flow guide 6 includes a flow guide tube 64. The flow guide tube 64 is disposed in the liquid inlet channel 21. The liquid inlet end of the flow guide tube 64 is connected to the medium channel 13, and the liquid outlet end of the flow guide tube 64 is connected to the cooling channel 23. The flow guide tube 64 is provided with a plurality of openings 603, which are distributed along the height direction of the flow guide tube 64 and are respectively connected to the cooling channel 23.
[0102] Understandably, some of the medium in the medium flow channel 13 flows into the guide pipe 64 through the inlet end of the guide pipe 64, and then flows to the corresponding cooling flow channel 23 through the outlet end of the guide pipe 64 and the opening 603. There is no gap between the guide pipe 64 and the inlet flow channel 21, so there will be no leakage. This allows for better distribution of the medium flowing to each cooling flow channel 23, making it more suitable for heat dissipation schemes that require even distribution of the medium.
[0103] For example, see Figure 18 The guide tube 64 includes a first tube body 641 and a second tube body 642. The first tube body 641 and the second tube body 642 are arranged side by side in the liquid inlet channel 21. The liquid inlet end of the first tube body 641 is connected to the medium channel 13, and the liquid outlet end of the first tube body 641 is connected to the liquid inlet end of the second tube body 642 and the cooling channel 23. Multiple openings 603 are formed on the second tube body 642.
[0104] Furthermore, the lower part of the first tube 641 is the liquid inlet, the upper part is the liquid outlet, and the lower side is set as an opening to connect with the medium flow channel 13.
[0105] For example, see Figure 19 The flow guide 6 also includes an expanding mask 65, which is placed inside the medium flow channel 13. The expanding mask 65 is flared from the side near the flow guide tube 64 to the side away from the flow guide tube 64. The flared end of the expanding mask 65 is connected to the medium flow channel 13, and the other end is connected to the liquid inlet end of the flow guide tube 64.
[0106] It can be understood that the flared end increases the area of contact with the medium, so that the medium can be retained in the flow guide pipe 64 through the flared cover 65, the medium flow in the side plate 20 is increased, and the heat dissipation efficiency of the side plate 20 is improved.
[0107] Further, the flared end of the flared cover 65 abuts against the inner wall of the medium flow channel 13, and the other end of the flared cover 65 is clamped or gap-fitted with the liquid inlet end of the flow guide pipe 64.
[0108] In an embodiment, referring to Figure 4 , Figure 6 , a plurality of first openings 71 are provided at the bottom of the side plate 20 in the height direction of the side plate 20, the plurality of first openings 71 are respectively arranged corresponding to the liquid inlet flow channel 21 and the liquid outlet flow channel 22, and are respectively communicated with the corresponding liquid inlet flow channel 21 or liquid outlet flow channel 22. A plurality of second openings 72 are provided in the bottom plate 1, and the plurality of second openings 72 are communicated with the medium flow channel 13; the plurality of first openings 71 and the plurality of second openings 72 are arranged one by one.
[0109] Further, the second opening 72 has a flange 721 which is inserted into the first opening 71 and sealedly fitted with the opening. The bottom plate 1 is provided with a groove 14 which surrounds the second opening 72, and the inner wall of the groove 14 and the flange 721 are continuous planes. The insertion and fitting of the bottom plate 1 and the side plate 20 are realized by the flange 721, and the connection between the two is sealed to avoid liquid leakage.
[0110] In other embodiments, referring to Figures 20 to 22 , the second opening 72 can be provided with a flange 721, and the first opening 71 can be provided with a slot 711, and the flange 721 is inserted into the slot 711 and sealedly fitted with the slot 711. Only the flange 721 and the slot 711 are needed to cooperate, which effectively simplifies the structure of the sealing parts and reduces the manufacturing cost. Only a simple flange 721 is needed at the second opening 72, and the wall thickness of the side plate 20 can be set thinner, the heat radiation receiving effect is better, and the heat dissipation effect is effectively improved.
[0111] Exemplarily, the slot 711 is a chamfer, a round corner or the like provided on the first opening 71, which is convenient for processing.
[0112] In an embodiment, referring to Figure 23 , the width of the medium flow channel 13 is D1, the width of the cooling flow channel 23 is D2, and the width of the liquid inlet flow channel 21 is D3. Among them, D1, D2, D3 satisfy the following relationship: D1>D2>D3.
[0113] It can be understood that under this ratio limitation, the condition that most of the medium is introduced into the cooling flow channel 23 can be avoided, and the medium flow channel 13 still has a large amount of medium flow, and the normal heat dissipation work of the bottom plate 1 is ensured.
[0114] In an embodiment, referring to Figures 1 to 19 The two ends of the cooling flow channel 23 are respectively provided with openings. The cooling assembly 2 further comprises two end covers 8, which are respectively arranged at the two ends of the side plate 20 and connected with the end portions of the side plate 20, for closing the two ends of the cooling flow channel 23. The two ends of the cooling flow channel 23 are both open, which facilitates machining, and then are closed by the end covers 8 to ensure a sealed environment.
[0115] Exemplarily, the cooling flow channel 23 is integrally formed with the side plate 20, for example, by die casting, milling or the like. Exemplarily, the two side plates 20 share one end cover 8 at one end, and the end cover 8, the side plate 20 and the bottom plate 1 jointly form the cooling cavity 3.
[0116] The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.
[0117] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A cooling device, comprising a bottom plate (1) and at least one group of cooling assemblies (2) arranged at an angle with the bottom plate (1), the bottom plate (1) being provided with a medium inlet (11), a medium outlet (12) and a medium flow channel (13) connecting the medium inlet (11) and the medium outlet (12); characterized in that, the cooling assembly (2) comprises at least two side plates (20) arranged opposite to each other and surrounding the bottom plate (1) to form a cooling cavity (3); the side plate (20) is provided with an inlet flow channel (21), an outlet flow channel (22) and a plurality of cooling flow channels (23), the plurality of cooling flow channels (23) being distributed along the height direction of the side plate (20) and extending along the length direction of the side plate (20); the inlet flow channel (21) and the outlet flow channel (22) are respectively connected with the medium flow channel (13), the inlet ends of the plurality of cooling flow channels (23) are respectively connected with the inlet flow channel (21), and the outlet ends of the plurality of cooling flow channels (23) are respectively connected with the outlet flow channel (22); the cooling device comprises a flow guiding structure (4), part of the flow guiding structure (4) is arranged in the medium flow channel (13), and the flow guiding structure (4) can guide part of the medium from the medium flow channel (13) to the inlet flow channel (21) and branch to the plurality of cooling flow channels (23).
2. Cooling device according to claim 1, characterized in that the flow guiding structure (4) comprises a flow resistance member (5) and a flow guiding member (6), the flow guiding member (6) is arranged at a position corresponding to the inlet flow channel (21) and is used for guiding part of the medium to flow into the inlet flow channel (21); the flow resistance member (5) is used for slowing down the flow speed of the medium in the medium flow channel (13) at the position of the flow guiding member (6).
3. Cooling device according to claim 2, characterized in that the flow guiding member (6) comprises a flow guiding block (61), the flow guiding block (61) extends from the bottom plate (1) to the inlet flow channel (21); the flow guiding block (61) has a flow guiding surface (601) on the side facing the medium inlet (11), and the flow guiding surface (601) has a spacing with the inner wall of the inlet flow channel (21) to form a flow guiding gap (602).
4. Cooling device according to claim 3, characterized in that the flow guiding block (61) extends into the inlet flow channel (21), the flow guiding block (61) has a flow guiding surface (601) on the side facing the medium inlet (11), and the flow guiding surface (601) has a spacing with the inner wall of the inlet flow channel (21) to form a flow guiding gap (602).
5. Cooling device according to claim 4, characterized in that a plurality of openings (603) are arranged on the flow guiding block (61) and distributed along the height direction of the flow guiding block (61); each opening (603) extends from the flow guiding surface (601) to the opposite side of the flow guiding block (61) and penetrates through the flow guiding block (61); the plurality of cooling flow channels (23) are respectively connected with the flow guiding gap (602) through the plurality of openings (603).
6. Cooling device according to claim 4, characterized in that The guide block (61) is provided with a blocking part (604) on each of the opposite sides away from the guide surface (601), the blocking part (604) is arranged to extend from the guide block (61) to the cooling flow channel (23) and extend into the cooling flow channel (23).
7. The cooling device of claim 3, wherein The guide block (61) comprises a first body (611) and a second body (612), and the first body (611) and the second body (612) are connected in a plug-in manner.
8. The cooling device of claim 3, wherein The guide block (61) is provided with a clamping part (605) which is connected with the bottom plate (1) or the side plate (20) in a clamping manner.
9. The cooling device of claim 3, wherein The guide block (61) and the bottom plate (1) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. Alternatively, the guide block (61) and the side plate (20) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. Alternatively, the guide block (61) is provided with a clamping part (605) which is connected with the convex part (62) in a clamping manner. The guide block (61) and the bottom plate (1) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection.
10. The cooling device of claim 3, wherein, The guide block (61) and the side plate (20) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection.
11. The cooling device of claim 2, wherein, Alternatively, the guide block (61) is provided with a clamping part (605) which is connected with the convex part (62) in a clamping manner. The guide block (61) and the bottom plate (1) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. Alternatively, the guide block (61) and the side plate (20) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. Alternatively, the guide block (61) is provided with a clamping part (605) which is connected with the convex part (62) in a clamping manner. The guide block (61) and the bottom plate (1) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. The guide block (61) and the side plate (20) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection. Alternatively, the guide block (61) is provided with a clamping part (605) which is connected with the convex part (62) in a clamping manner. The guide block (61) and the bottom plate (1) are connected in a clamping manner or a welding manner, and the bottom of the guide block (61) and the convex part (62) are in abutment or gap connection.
12. Cooling device according to claim 11, characterized in that The flow guide (6) further comprises a flared cover (65) disposed in the medium flow channel (13); the flared cover (65) is flared from a side close to the flow guide pipe (64) to a side away from the flow guide pipe (64); a flared end of the flared cover (65) is in communication with the medium flow channel (13), and the other end is connected with the liquid inlet end of the flow guide pipe (64); An outer wall of the flared end of the flared cover (65) abuts against an inner wall of the medium flow channel (13), and the other end of the flared cover (65) is clamped or gap-fitted with the liquid inlet end of the flow guide pipe (64).
13. Cooling device according to any of claims 2 to 12, characterized in that The flow resistance member (5) is disposed in the medium flow channel (13) at a position corresponding to between the liquid inlet flow channel (21) and the liquid outlet flow channel (22); a first gap (51) is arranged on a side of the flow resistance member (5) close to the liquid inlet flow channel (21); and a second gap (52) is arranged on a side of the flow resistance member (5) close to the liquid outlet flow channel (22).