Wafer cleaning device

Abstract

The utility model relates to a wafer cleaning device, which relates to the technical field of semiconductor preparation and comprises a chuck, a cleaning assembly, a first shade and a second shade. Wherein the chuck is used for bearing a wafer and limiting the wafer. The first shade surrounds the chuck, the second shade surrounds the first shade, and the chuck, the first shade and the second shade are arranged at intervals. When a wafer is placed on the chuck and the cleaning assembly is used for cleaning the wafer, the first shielding cover slows down the speed of the sputtered waste liquid and penetrates through the waste liquid, and the penetrated waste liquid is shielded by the second shielding cover and is prevented from being splashed out. Since the first shade can slow down the sputtering speed of the waste liquid and penetrate through the waste liquid, when the waste liquid reaches the second shade, the waste liquid cannot be reflected and flows down slowly, and the problem that the reliability of the wafer is reduced due to the sputtering of the waste liquid is solved. In addition, due to the fact that the cleaning assembly can clean the first shade, reflection of the first shade to the waste liquid can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a wafer cleaning device. BACKGROUND

[0002] In the process of semiconductor manufacturing, cleaning wafers can remove impurities and particles to increase the reliability of wafer products. In the process of cleaning wafers, the existing single-chip cleaning machine rotates the wafers at high speed to ensure that the wafers can be uniformly cleaned. When the nozzle for spraying cleaning liquid moves to the edge of the wafer, the high-speed rotating wafer will carry the cleaning liquid and particles together to the shield and bounce back.

[0003] When the shield is not contaminated at the beginning, the yield of the wafer is not greatly affected, but as the cleaning proceeds, a large number of particles are attached to the shield, and the particles will bounce from the shield to the surface of the wafer, forming a radial pattern defect on the wafer, thereby affecting the yield of the wafer. CONTENT OF THE INVENTION

[0004] Therefore, it is necessary to provide a wafer cleaning device to solve the problem of forming a radial pattern on the wafer during cleaning.

[0005] To achieve the above-mentioned purpose, the utility model provides a wafer cleaning device, which comprises:

[0006] a chuck, a cleaning assembly, a first shield and a second shield;

[0007] The chuck is used for carrying and limiting the wafer;

[0008] The first shield surrounds the chuck, and is used for slowing down the speed of waste liquid splashing and transmitting the waste liquid;

[0009] The cleaning assembly is used for cleaning the wafer and the first shield;

[0010] The second shield surrounds the first shield and is used for shielding the waste liquid, and the chuck, the first shield and the second shield are arranged at intervals.

[0011] In one of the embodiments, the first shield comprises:

[0012] a first shield part and a second shield part;

[0013] In the first direction, the second shield part is located on one side of the first shield part, the second shield part is a mesh structure, the first direction is perpendicular to the chuck and is directed from the chuck to the cleaning assembly;

[0014] The first sub-shield part is used for fixing the second sub-shield part, and the second sub-shield part is used for slowing down the speed of the sputtered waste liquid.

[0015] In one of the embodiments, the wafer cleaning device further comprises:

[0016] The adsorption assembly is arranged on the second sub-shield part, and is in a mesh structure and arranged correspondingly to the second sub-shield part, and is used for adsorbing the sputtered waste liquid.

[0017] In one of the embodiments, the wafer cleaning device further comprises:

[0018] The ultrasonic device is arranged on the side of the first sub-shield part away from the chuck, is connected to the first sub-shield part, and is used for cleaning the first shield.

[0019] In one of the embodiments, the cleaning assembly comprises:

[0020] The support rod and the cleaning nozzle;

[0021] The support rod is used for moving the position of the cleaning nozzle;

[0022] The cleaning nozzle is used for cleaning the wafer and the first shield.

[0023] In one of the embodiments, the cleaning nozzle comprises:

[0024] The first nozzle is arranged opposite to the chuck, and is used for spraying cleaning liquid to clean the wafer;

[0025] The second nozzle is arranged in a direction intersecting with the opening direction of the first nozzle, and is used for spraying air to clean the first shield.

[0026] In one of the embodiments, the wafer cleaning device further comprises:

[0027] The fan filtering unit and the exhaust device;

[0028] The fan filtering unit is used for providing clean air inside the wafer cleaning device;

[0029] The exhaust device is used for exhausting waste gas inside the wafer cleaning device.

[0030] In one of the embodiments, the first shield and the second shield are both in an arc structure, and the concave surface of the arc structure faces the chuck.

[0031] In one of the embodiments, in the direction perpendicular to the chuck, the height of the first shield is less than the height of the second shield.

[0032] In one embodiment, the wafer cleaning device further comprises:

[0033] A first lifting device is arranged on one side of the chuck, and is used to adjust the position of the chuck.

[0034] A second lifting device is arranged on one side of the first shield and the second shield, and is used to adjust the position of the first shield and the second shield to shield the waste liquid.

[0035] Compared with the prior art, the above technical solution has the following unexpected technical effects:

[0036] In the above wafer cleaning device, the chuck, the cleaning assembly, the first shield and the second shield are included. The chuck is used to carry the wafer and limit the wafer. The first shield surrounds the chuck, the second shield surrounds the first shield, and the chuck, the first shield and the second shield are arranged at intervals. When the wafer is placed on the chuck and the cleaning assembly is used to clean the wafer, the first shield slows down the speed of the sputtered waste liquid and transmits the waste liquid. The transmitted waste liquid is shielded by the second shield to prevent splashing. Since the first shield can slow down the speed of the sputtered waste liquid and transmit the waste liquid, when the waste liquid reaches the second shield, it will not be reflected, but will flow down slowly, improving the problem of wafer reliability decrease caused by sputtering of the waste liquid. In addition, since the cleaning assembly can also clean the first shield, the reflection of the waste liquid by the first shield can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0038] Figure 1 An existing schematic diagram of forming a radial pattern defect on a wafer;

[0039] Figure 2 A cross-sectional structure schematic diagram of a wafer cleaning device according to an embodiment of the present application is provided;

[0040] Figure 3 A three-dimensional structure schematic diagram of a wafer cleaning device according to an embodiment of the present application is provided;

[0041] Figure 4 Another cross-sectional structure schematic diagram of a wafer cleaning device according to an embodiment of the present application is provided;

[0042] Figure 5FIG. 1 shows a perspective view of a wafer cleaning device according to an embodiment of the present application;

[0043] Figure 6 FIG. 2 shows a cross-sectional view of a wafer cleaning device according to another embodiment of the present application;

[0044] Figure 7 FIG. 3 shows a structure diagram of a second sub-shield according to an embodiment of the present application;

[0045] Figure 8 FIG. 4 shows a structure diagram of a cleaning nozzle according to an embodiment of the present application.

[0046] Reference signs: 01-chuck; 02-cleaning assembly; 02a-supporting rod; 02b-cleaning nozzle; 02b1-first nozzle; 02b2-second nozzle; 03-first shield; 03a-first sub-shield; 03b-second sub-shield; 04-second shield; 05-waste tank; 06-adsorption assembly; 07-ultrasonic device; a-wafer. DETAILED DESCRIPTION

[0047] In order to facilitate the understanding of the present application, the present application will be described more fully below in connection with the accompanying drawings. The embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present application is more complete and comprehensive.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application.

[0049] It should be understood that when a layer is referred to as being "on" or "adjacent" or "connected to" another layer, it can be directly on, adjacent to, or connected to the other layer, or intervening layers can be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," or "directly connected to" another layer, there are no intervening layers present.

[0050] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It should also be understood that the term "comprising" or "including" or "having" or the like, as used herein, specifies the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0051] Based on the content in the background art, as the cleaning proceeds, a large number of particles adhere to the mask, the particles rebound from the mask to the surface of the wafer, forming radial pattern defects on the wafer, thereby affecting the yield of the wafer. Referring to Figure 1 , Figure 1 is a schematic diagram of existing radial pattern defects formed on a wafer. These radial patterns will affect the yield of the wafer.

[0052] Based on this, the present application provides a wafer cleaning device, which includes a chuck, a cleaning assembly, a first mask, and a second mask. The chuck is used to carry and position the wafer. The first mask surrounds the chuck, and the second mask surrounds the first mask. The chuck, the first mask, and the second mask are arranged in a spaced manner. When the wafer is placed on the chuck and cleaned by the cleaning assembly, the first mask slows down the speed of the splashed waste liquid and transmits the waste liquid. The transmitted waste liquid is blocked by the second mask to prevent splashing. Since the first mask can slow down the speed of the splashed waste liquid and transmit the waste liquid, when the waste liquid reaches the second mask, it will not reflect again, but flow down slowly, thereby improving the problem of wafer reliability reduction caused by waste liquid splashing. In addition, since the cleaning assembly can also clean the first mask, the reflection of the waste liquid by the first mask can be reduced.

[0053] In order to make the purpose, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0054] In one embodiment, referring to Figure 2 , Figure 2 is a schematic diagram of a cross-sectional structure of a wafer cleaning device according to an embodiment of the present application; referring to Figure 3 , Figure 3 is a schematic diagram of a three-dimensional structure of a wafer cleaning device according to an embodiment of the present application. The wafer cleaning device includes a chuck 01, a cleaning assembly 02, a first mask 03, and a second mask 04.

[0055] The chuck 01 is used to carry and position the wafer a.

[0056] The first mask 03 surrounds the chuck 01, and the first mask 03 is used to slow down the speed of the splashed waste liquid and transmit the waste liquid.

[0057] The cleaning assembly 02 is used to clean the wafer a and the first mask 03.

[0058] The second mask 04 surrounds the first mask 03 and is used to block the waste liquid. The chuck 01, the first mask 03, and the second mask 04 are arranged in a spaced manner.

[0059] Specifically, when cleaning the wafer a, the wafer a needs to be placed in the cleaning device first, wherein the chuck 01 is used to place the wafer a. The chuck 01 can be a circular chuck 01 to match the shape of the wafer a, so as to better limit the wafer a.

[0060] A first mask 03 surrounding the wafer a can be arranged outside the chuck 01. It should be noted that the first mask 03 can slow down the speed of the waste liquid splashing and can pass through the splashed waste liquid. The material of the first mask 03 can be Teflon material.

[0061] A second mask 04 can be arranged outside the first mask 03. Since the first mask 03 can pass through the waste liquid, the second mask 04 needs to be arranged to shield the waste liquid so that it flows to the waste liquid tank 05, avoiding the waste liquid splashing out to pollute the environment.

[0062] The cleaning assembly 02 can clean the wafer a and the first mask 03. On the one hand, the wafer a is cleaned to ensure the reliability of the wafer a in the subsequent process. On the other hand, the first mask 03 is cleaned to avoid the reflection of the waste liquid.

[0063] The chuck 01, the first mask 03, and the second mask 04 are arranged at intervals to ensure that the waste liquid finally flows to the waste liquid tank 05. If they are not arranged at intervals, most of the cleaning waste liquid cannot flow into the waste liquid tank 05, and the waste liquid passing through the first mask 03 to the second mask 04 can still reflect due to the lack of spacing.

[0064] In this embodiment, since the first mask 03 can slow down the speed of the waste liquid splashing and pass through the waste liquid, when the waste liquid reaches the second mask 04, it will not reflect again, but flow down slowly, improving the problem of the reliability of the radial pattern on the wafer a caused by the waste liquid splashing. In addition, since the cleaning assembly 02 can also clean the first mask 03, the reflection of the waste liquid by the first mask 03 can be reduced.

[0065] In another embodiment of the present application, referring to Figure 4 , Figure 4 Another cross-sectional structure schematic diagram of a wafer cleaning device is provided for the embodiment of the present application; referring to Figure 5 , Figure 5 Another perspective structure schematic diagram of a wafer cleaning device is provided for the embodiment of the present application; the first mask 03 comprises: a first sub-mask part 03a and a second sub-mask part 03b.

[0066] Among them, in the first direction x, the second sub-mask part 03b is located on one side of the first sub-mask part 03a, the second sub-mask part 03b is a mesh structure, the first direction x is perpendicular to the chuck 01, and is directed from the chuck 01 to the cleaning assembly 02.

[0067] The first sub-shield part 03a is used to fix the second sub-shield part 03b, and the second sub-shield part 03b is used to slow down the speed of the splashed waste liquid.

[0068] Specifically, in the first direction x, the first sub-shield part 03a and the second sub-shield part 03b are arranged from bottom to top. The second sub-shield part 03b can be a mesh structure (as shown in the figure), which can ensure that the splashed waste liquid can pass through the first shield 03 while slowing down the speed of the waste liquid, and then reach the second shield 04. Figure 5

[0069] The first sub-shield part 03a is used to fix the second sub-shield part 03b, and can be a solid structure, so that the waste liquid attached to the second sub-shield part 03b can slowly flow into the waste liquid tank 05. It should be noted that the first sub-shield part 03a can also be a mesh structure, so that the waste liquid can pass through the first shield 03 more easily.

[0070] In some embodiments, the first sub-shield part 03a and the second sub-shield part 03b can be an integral structure.

[0071] In this embodiment, the second sub-shield part 03b is a mesh structure, which can slow down the splashed waste liquid while passing through the waste liquid, and the first sub-shield part 03a fixes and supports the second sub-shield part 03b to ensure the stability of the second sub-shield part 03b.

[0072] In another embodiment of the present application, referring to Figure 6 , Figure 6 Another cross-sectional structure schematic diagram of a wafer cleaning device is provided for the embodiment of the present application; referring to Figure 7 , Figure 7 A structure schematic diagram of a second sub-shield part is provided for the embodiment of the present application; the wafer cleaning device further comprises:

[0073] The adsorption assembly 06 is located on the second sub-shield part 03b, and the adsorption assembly 06 is a mesh structure corresponding to the second sub-shield part 03b, and is used to adsorb the splashed waste liquid.

[0074] Specifically, the adsorption assembly 06 can be prepared by using a water-absorbing material, for example, the water-absorbing material can be a sponge. When the waste liquid passes through the second sub-shield part 03b, part of the waste liquid will inevitably be retained on the second sub-shield part 03b. In order to reduce the reflection of the waste liquid, the adsorption assembly 06 can be added to absorb part of the waste liquid.

[0075] It should be noted that since the second sub-shield part 03b is a mesh structure, in order to ensure that the waste liquid can pass through, the adsorption assembly 06 is also a mesh structure (as shown in the figure) Figure 7 ​The second sub-shield part 03b is provided corresponding to the first sub-shield part 03a and is attached to the solid part of the first sub-shield part 03a, which can not only pass the waste liquid but also reduce the reflection of the waste liquid.

[0076] In the embodiment, the adsorption assembly 06 can adsorb part of the waste liquid and further reduce the reflection of the waste liquid.

[0077] In another embodiment of the present application, referring to Figure 4 With Figure 6 The wafer cleaning device further comprises:

[0078] The ultrasonic device 07 is located on the side of the first sub-shield part 03a away from the chuck 01 and is connected to the first sub-shield part 03a for cleaning the first shield 03.

[0079] Specifically, the second sub-shield part 03b is located above the first sub-shield part 03a. When cleaning the wafer a, the waste liquid will pass through the second sub-shield part 03b. After the wafer a is cleaned, there will be some residue on the first sub-shield part 03a.

[0080] The ultrasonic device 07 is connected to the first sub-shield part 03a, which can clean the first sub-shield part 03a through the ultrasonic device 07, thereby prolonging the service life of the first sub-shield part 03a.

[0081] The ultrasonic device 07 can vibrate left and right in a direction parallel to the chuck 01, so that the waste liquid and particles attached to the first sub-shield part 03a fall off, facilitating the cleaning of the wafer a in the next time.

[0082] In the embodiment, the ultrasonic device 07 is provided to clean the first shield 03, prolong the service life of the first shield 03, and save costs. The ultrasonic device 07 is located on the side of the first sub-shield part 03a away from the chuck 01, which can avoid damage to the ultrasonic device 07 by the waste liquid.

[0083] In another embodiment of the present application, referring to Figure 2 , Figure 4 And Figure 6 The cleaning assembly 02 comprises a support rod 02a and a cleaning nozzle 02b.

[0084] The support rod 02a is used to move the position of the cleaning nozzle 02b.

[0085] The cleaning nozzle 02b is used to clean the wafer a and the first shield 03.

[0086] Specifically, the cleaning assembly 02 is provided with the cleaning nozzle 02b and the support rod 02a. The support rod 02a can support the cleaning nozzle, and the support rod 02a moves above the chuck 01, thereby driving the cleaning nozzle 02b to move, so as to uniformly clean the wafer a.

[0087] The cleaning nozzle 02b can clean the first mask 03 while cleaning the wafer a, avoiding the first mask 03 from being blocked or reflecting due to too much residual waste liquid.

[0088] In the embodiment, the support rod 02a can improve the cleaning uniformity of the cleaning assembly 02, and the cleaning nozzle 02b can clean the first mask 03 while cleaning the wafer a, avoiding the first mask 03 from being blocked and reducing the reflection of waste liquid.

[0089] In another embodiment of the present application, referring to Figure 8 , Figure 8 An embodiment of the present application provides a structural schematic diagram of a cleaning nozzle; the cleaning nozzle 02b comprises a first nozzle 02b1 and a second nozzle 02b2.

[0090] The first nozzle 02b1 is arranged opposite to the chuck 01, and is used for spraying cleaning liquid to clean the wafer a.

[0091] The opening direction of the second nozzle 02b2 is arranged cross the opening direction of the first nozzle 02b1, and the second nozzle 02b2 is used for spraying gas to clean the first mask 03.

[0092] Specifically, the cleaning nozzle 02b comprises the first nozzle 02b1, the first nozzle 02b1 is arranged opposite to the chuck 01, Figure 8 The arrow n represents the spraying direction of the first nozzle 02b1, that is, the first nozzle 02b1 is arranged opposite to the wafer a on the upper side of the wafer a. The first nozzle 02b1 is used for spraying cleaning liquid, and the cleaning liquid includes but is not limited to deionized water and the like. The first nozzle 02b1 sprays deionized water to flush the wafer a, at this time, most of the waste liquid will flow into the waste liquid tank 05 from the chuck 01. Part of the waste liquid will be sputtered, so that part of the waste liquid will pass through the first mask 03, be slowed down by the first mask 03, and when reaching the second mask 04, the waste liquid will not be reflected again, and slowly flow into the waste liquid tank 05 from the side wall of the second mask 04.

[0093] The second nozzle 02b2 is used for spraying gas, and the gas can be nitrogen. The opening direction of the second nozzle 02b2 is arranged cross the opening direction of the first nozzle 02b1. For example, Figure 8 As shown, the included angle between the second nozzle 02b2 and the first nozzle 02b1 can be an acute angle, which is not specifically limited, and can also be a right angle or an obtuse angle. It should be noted that the flow and angle of the gas sprayed by the second nozzle 02b2 can be controlled to avoid backflow and pollution of the wafer a. For example, in an embodiment, as shown in Figure 8 The arrow m represents the spraying direction of the second nozzle 02b2,

[0094] When cleaning the wafer a, nitrogen is sprayed from the second nozzle 02b2. When the support rod 02a moves the cleaning nozzle 02b, the second nozzle 02b2 is close to the second sub-shield part 03b, and the nitrogen sprayed from the second nozzle 02b2 can blow the waste liquid and particles remaining in the gap of the second sub-shield part 03b to the first shield 03 and the second shield 04, and finally into the waste liquid tank 05. In this way, not only can the reflection of the sputtering waste liquid be reduced, but also the first shield 03 can be cleaned in real time, thereby improving the service life of the first shield 03.

[0095] In the embodiment, the first nozzle 02b1 and the second nozzle 02b2 are arranged at an angle to facilitate cleaning the first shield 03 while cleaning the wafer a. The substances sprayed from the first nozzle 02b1 and the second nozzle 02b2 are also different to adapt to different components that need to be cleaned.

[0096] In another embodiment of the present application, the wafer cleaning device further comprises a fan filtering unit and an exhaust device.

[0097] The fan filtering unit is configured to provide clean air inside the wafer cleaning device.

[0098] The exhaust device is configured to exhaust waste gas inside the wafer cleaning device.

[0099] Specifically, the fan filtering unit can filter particulate matter, microorganisms and other impurities in the air to provide clean air inside the wafer cleaning device, prevent dust and other pollutants from falling on the surface of the wafer a and other objects to be cleaned, and affect the cleaning effect and product quality. In addition, the fan filtering unit can form a uniform and stable airflow inside the wafer cleaning device, ensuring that the pollutants generated during the cleaning process can be carried away in time, and the gas generated by the evaporation of the cleaning liquid and the gas for cleaning the first shield 03 are uniformly diffused, which is conducive to improving the consistency and stability of the cleaning.

[0100] During the semiconductor cleaning process, the exhaust device can exhaust the waste gas from the device in time to avoid its accumulation in the device, prevent harm to the cleaning environment and the operator, and also reduce the potential impact of the waste gas on product quality.

[0101] For example, the fan filtering unit and the exhaust device continuously blow nitrogen downward, and after the nitrogen sprayed from the cleaning nozzle 02b is blown horizontally, the nitrogen will maintain a downward airflow under the action of the fan filtering unit and the exhaust device. The backflow of nitrogen is avoided.

[0102] In the embodiment, the fan filtering unit and the exhaust device are arranged to further reduce the backflow of particles or waste liquid.

[0103] In another embodiment of the present application, with reference to Figure 8 The first shield 03 and the second shield 04 are both arc-shaped structures, and the concave surface of the arc-shaped structure faces the chuck 01.

[0104] Specifically, the first shield 03 and the second shield 04 are both arc-shaped structures, which can better prevent the splashed waste liquid from splashing out.

[0105] The concave surface of the arc-shaped structure faces the chuck 01. When the splashed waste liquid passes through the first shield 03, if the speed of the waste liquid is still relatively large, due to the arrangement of the arc-shaped structure, the angle of the reflected waste liquid will be more towards the space between the first shield 03 and the second shield 04, thereby avoiding being reflected onto the wafer a.

[0106] In the embodiment, the first shield 03 and the second shield 04 are both arc-shaped structures, and the concave surface of the arc-shaped structure faces the chuck 01, which can better prevent the splashed waste liquid from being reflected onto the wafer a.

[0107] In another embodiment of the present application, referring to Figure 8 and Figure 2 In the direction perpendicular to the chuck 01, the height of the first shield 03 is less than the height of the second shield 04.

[0108] In the embodiment, the height of the first shield 03 is less than the height of the second shield 04, which can prevent the waste liquid passing through the first shield 03 from splashing out of the second shield 04 and thereby polluting the equipment.

[0109] In another embodiment of the present application, the wafer cleaning device further comprises: a first lifting device located on one side of the chuck 01, used to adjust the position of the chuck 01;

[0110] A second lifting device is located on one side of the first shield 03 and the second shield 04, and is used to adjust the position of the first shield 03 and the second shield 04 to shield the waste liquid.

[0111] Specifically, the first lifting device is connected with the chuck 01, and the second lifting device is connected with the first shield 03 and the second shield 04. When the wafer a needs to be cleaned, the first lifting device adjusts the chuck 01 to move downward, and the chuck 01 rotates. The second lifting device adjusts the first shield 03 and the second shield 04 to move upward, so that they are higher than the chuck 01, thereby better preventing the waste liquid from splashing.

[0112] In the embodiment, the first lifting device and the second lifting device cooperate with each other to ensure that the waste liquid can be completely shielded when the wafer a is cleaned, thereby avoiding polluting the equipment.

[0113] In the description of the present specification, the description of the terms "some embodiments", "another embodiment", and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0114] The technical features of the above-described embodiments can be combined in any manner. For the sake of brevity, not all possible combinations are described, however, any combination of the technical features is considered to be within the scope of the present specification.

[0115] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these are all within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The wafer cleaning device comprises: a chuck, a cleaning assembly, a first shield and a second shield; the chuck is used for carrying and positioning a wafer; the first shield surrounds the chuck, and is used for slowing down the speed of waste liquid and allowing the waste liquid to pass through; the cleaning assembly is used for cleaning the wafer and the first shield; the second shield surrounds the first shield, and is used for shielding the waste liquid, and the chuck, the first shield and the second shield are arranged at intervals.

2. The wafer cleaning apparatus of claim 1, wherein The first shield comprises: a first sub-shield part and a second sub-shield part; in a first direction, the second sub-shield part is located on one side of the first sub-shield part, the second sub-shield part is a mesh structure, the first direction is perpendicular to the chuck and is directed from the chuck to the cleaning assembly; the first sub-shield part is used for fixing the second sub-shield part, and the second sub-shield part is used for slowing down the speed of the waste liquid.

3. The wafer cleaning apparatus of claim 2, wherein The wafer cleaning device further comprises: an adsorption assembly located on the second sub-shield part, the adsorption assembly is a mesh structure, and is arranged correspondingly with the second sub-shield part, and is used for adsorbing the waste liquid.

4. The wafer cleaning apparatus of claim 2, wherein The wafer cleaning device further comprises: an ultrasonic device located on a side of the first sub-shield part away from the chuck, and connected with the first sub-shield part, and used for cleaning the first shield.

5. The wafer cleaning apparatus of claim 1, wherein The cleaning assembly comprises: a support rod and a cleaning nozzle; the support rod is used for moving the position of the cleaning nozzle; the cleaning nozzle is used for cleaning the wafer and the first shield.

6. The wafer cleaning apparatus of claim 5, wherein The cleaning nozzle comprises: a first nozzle opening, which is arranged opposite to the chuck, and is used for spraying cleaning liquid to clean the wafer; a second nozzle opening, which is arranged in a direction intersecting with the opening direction of the first nozzle opening, and is used for spraying air to clean the first shield.

7. The wafer cleaning apparatus of claim 6, wherein The wafer cleaning device further comprises: a fan filtering unit and an exhaust device; the fan filtering unit is used for providing clean air inside the wafer cleaning device; the exhaust device is used for exhausting waste gas inside the wafer cleaning device.

8. The wafer cleaning apparatus of claim 1, wherein The first shield and the second shield are both arc-shaped structures, and the concave surface of the arc-shaped structure faces the chuck.

9. The wafer cleaning apparatus of claim 1, wherein In a direction perpendicular to the chuck, the height of the first shield is smaller than the height of the second shield.

10. The wafer cleaning apparatus of claim 1, wherein The wafer cleaning device further comprises: a first lifting device located on one side of the chuck, and used for adjusting the position of the chuck; a second lifting device located on one side of the first shield and the second shield, and used for adjusting the position of the first shield and the second shield to shield the waste liquid.

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