Cold spraying copper structure

Abstract

The utility model discloses a cold spraying copper structure which comprises a heat conduction assembly, a heat dissipation assembly and a fastening assembly, the heat dissipation assembly and the fastening assembly are arranged on the heat conduction assembly, the heat conduction assembly comprises a copper bottom plate and a heat pipe fixed on the copper bottom plate, the heat dissipation assembly comprises an aluminum extrusion block, an installation groove is formed in the lower end face of the aluminum extrusion block, and the heat pipe is arranged in the installation groove. The end, away from the copper bottom plate, of the heat pipe is fixed to the aluminum extrusion block, a plurality of heat conduction pieces distributed at equal intervals are fixed to the upper end face of the aluminum extrusion block, the fastening assembly comprises a plurality of screws and springs arranged on the outer sides of the four screws in a sleeving mode, and the four screws penetrate through the two ends of the aluminum extrusion block and are distributed on the periphery of the chip. And pressure can be applied from the four corners of the chip conveniently. According to the cold spraying copper structure, the vacuum gas atomization copper powder is sprayed on the lower end face of the copper bottom plate and the inner wall of the mounting groove to form the cold spraying copper layer, the result of thermal resistance test performance shows that the thermal resistance of cold spraying copper is smaller than or equal to that of plated nickel, and better heat conduction efficiency can be obtained.

Description

TECHNICAL FIELD

[0001] The utility model relates to a chip heat dissipation structure, concretely is a cold copper spraying structure. BACKGROUND

[0002] At present, the structure for GPU chip heat dissipation usually adopts copper or aluminum as core contact material and directly contacts with GPU chip, and the surface of copper or aluminum material is plated with nickel, thereby avoiding oxidation, but the existence of nickel plating layer can cause that the core contact material cannot directly contact with GPU chip, and to a certain extent, influences the effect of heat conduction. The applicant finds in the actual research and development process that a layer of cold copper spraying is sprayed on the surface of core contact material to form a copper layer, and better heat conduction effect can be obtained. Therefore, the applicant provides a cold copper spraying structure for GPU chip heat dissipation. CONTENT OF UTILITY MODEL

[0003] The utility model discloses a purpose at providing a kind of cold copper spraying structure, a layer of vacuum air atomization copper powder is sprayed on the lower end face of copper bottom plate and the inner wall of mounting groove, forms cold copper spraying layer, the result shows that the thermal resistance of cold copper spraying is less than or equal to plating nickel, and better heat conduction efficiency can be obtained.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of cold copper spraying structure, including heat conduction component, the heat dissipation component and fastening component being arranged on heat conduction component, heat conduction component includes copper bottom plate and heat pipe being fixed on copper bottom plate, the heat dissipation component includes aluminum extrusion block, mounting groove is arranged on the lower end face of aluminum extrusion block, heat pipe is arranged in mounting groove, and the end of heat pipe away from copper bottom plate is fixed with aluminum extrusion block, a plurality of equidistantly distributed heat dissipation fins are fixed on the upper end face of aluminum extrusion block, fastening component includes a plurality of screws and spring being sleeved on the outside of four screws, four screws all pass through the both ends of aluminum extrusion block, four screws are distributed in the four corners of chip, to facilitate the pressure from the four corners of chip is applied, heat conduction component and heat dissipation component are fixed in the upper of chip, a layer of vacuum air atomization copper powder is sprayed on the lower end face of copper bottom plate and the inner wall of mounting groove, and nickel plating in traditional processing mode is not used, because vacuum air atomization copper powder is attached on the surface of copper bottom plate and aluminum extrusion block can obtain better heat conduction effect, vacuum air atomization copper powder can generate a copper layer.

[0005] Preferably, the heat pipe is arranged with multiple heat pipes, and the multiple heat pipes are arranged horizontally and closely.

[0006] Preferably, each heat pipe has two heat conduction planes, and the two heat conduction planes are symmetrical to the upper and lower end faces of the heat pipe.

[0007] Preferably, the copper bottom plate is coated with heat-conducting paste at the end away from the heat pipe, and the heat-conducting paste is arranged with multiple pieces, and the multiple pieces of heat-conducting paste are evenly distributed on the lower end face of the copper bottom plate.

[0008] Preferably, four screw grooves are arranged on the aluminum extrusion block, and a sinking groove and a positioning groove are sequentially arranged in the screw grooves from top to bottom.

[0009] Preferably, the heat-conducting sheet comprises aluminum sheets and top end blocks arranged on top of the aluminum sheets, the aluminum sheets are fixed to the upper end face of the aluminum extrusion block, and a flow guide inclined wall is arranged between two adjacent aluminum sheets.

[0010] Preferably, the fastening assembly further comprises four E-shaped rings, the four E-shaped rings are attached to the lower end face of the aluminum extrusion block, and the bottoms of the four screws respectively pass through the four E-shaped rings.

[0011] Preferably, the heat-conducting assembly further comprises a back plate, the back plate is arranged at one end of the heat-conducting assembly away from the heat-dissipating assembly, and the back plate comprises a plate body and threaded holes formed in the four threaded columns.

[0012] Compared with the prior art, the utility model has the advantages that a cold copper layer is formed by spraying a layer of vacuum air atomized copper powder on the lower end face of the copper back plate and the inner wall of the mounting groove, the thermal resistance of the cold copper layer is less than or equal to that of the nickel plating layer, better heat conduction efficiency can be obtained, compared with the nickel plating layer commonly used in the prior art, better heat conduction effect can be obtained, and the GPU chip can be better cooled. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a side view of the utility model embodiment;

[0014] Figure 2 It is an explosion view of the utility model;

[0015] Figure 3 It is a schematic view of the heat-dissipating assembly of the utility model;

[0016] Figure 4 It is a schematic view of the utility model embodiment;

[0017] Figure 5 It is a schematic view of the utility model Figure 4 It is an enlarged view of A in the utility model;

[0018] Figure 6 It is a side view of the utility model in use;

[0019] Figure 7 It is a schematic view of the back plate of the utility model;

[0020] Figure 8 It is one of the schematic views of the utility model in use;

[0021] Figure 9It is the second schematic view of the utility model for use.

[0022] The reference signs and names in the drawing are as follows: 1, heat conduction assembly; 11, copper bottom plate; 12, heat pipe; 13, heat conduction plane; 14, heat conduction paste; 2, heat dissipation assembly; 21, aluminum extrusion block; 22, mounting groove; 23, screw groove; 231, sinking groove; 232, positioning groove; 24, heat conduction sheet; 241, aluminum sheet; 242, top end block; 243, flow guide inclined wall; 3, fastening assembly; 31, screw; 32, spring; 33, E-shaped ring; 4, back plate; 41, plate body; 42, stud; 43, chip accommodating groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0024] In the description of the embodiments of the utility model, it should be understood that the directions or position relations indicated by the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" are the directions or position relations shown in the drawings, and are only for the convenience of describing the embodiments of the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular direction, be constructed and operated in a particular direction, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0025] In the embodiments of the utility model, unless otherwise specifically specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication inside two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0026] Please refer toFigure 1 The utility model provides a kind of embodiment: a cold copper spraying structure, including heat conduction component 1, the heat dissipation component 2 and fastening component 3 being set on heat conduction component 1.

[0027] Please refer to Figure 2 Heat conduction component 1 includes copper bottom plate 11 and heat pipe 12 fixed on copper bottom plate 11, in the embodiment, the connecting mode between copper bottom plate 11 and heat pipe 12 adopts welding, heat pipe 12 is provided with multiple, multiple heat pipes 12 are horizontally arranged and adhere to each other, each heat pipe 12 has two heat conduction planes 13, two heat conduction planes 13 are symmetrical to the upper and lower two end faces of heat pipe 12, heat pipe 12 is flattened when processing, can obtain heat conduction plane 13, by being provided with heat conduction plane 13 on heat pipe 12, it can make the greater contact area between heat pipe 12 and copper bottom plate 11, in turn better heat conduction, copper bottom plate 11 is coated with heat conduction paste 14 at the end far from heat pipe 12, heat conduction paste 14 is provided with several pieces, and several pieces of heat conduction paste 14 are evenly distributed on the lower end surface of copper bottom plate 11, when copper bottom plate 11 is attached with the chip to be cooled, several pieces of heat conduction paste 14 will be extruded and fill the gap between copper bottom plate 11 and chip, to play the role of heat conduction, heat dissipation component 2 includes aluminum extrusion block 21, and mounting groove 22 is provided on the lower end surface of aluminum extrusion block 21, and a plurality of equidistantly distributed heat dissipation fins 24 are fixed on the upper end surface of aluminum extrusion block 21, and fastening component 3 includes a plurality of screws 31 and spring 32 sleeved on the outer side of four screws 31, and four screws 31 all pass through the two ends of aluminum extrusion block 21, and four screws 31 are distributed around the chip, to facilitate the pressure from the four corners of the chip, heat conduction component 1 and heat dissipation component 2 are fixed above the chip, and fastening component 3 further includes four E-shaped rings 33, and four E-shaped rings 33 are all attached to the lower end surface of aluminum extrusion block 21, and the bottom of four screws 31 respectively passes through four E-shaped rings 33;In addition, a layer of vacuum air atomized copper powder is sprayed on the lower end surface of copper bottom plate 11 and the inner wall of mounting groove 22, to form a cold copper spraying layer, and nickel plating in the traditional processing mode is not used, because the vacuum air atomized copper powder is attached to the surface of copper bottom plate 11 and aluminum extrusion block 21, better heat conduction effect can be obtained, the vacuum air atomized copper powder layer can generate a copper layer, the thickness value of the copper layer is 100±40 μm, the thermal conductivity value of the copper layer is greater than or equal to 260 W (m*K), the roughness value of the copper layer is less than or equal to 60 μm, the flatness value of the copper layer is less than or equal to 0.08, the hardness value of the copper layer is greater than or equal to 107 HV, and the porosity of the copper layer is less than or equal to 0.5%, from the thermal resistance test performance, the thermal resistance of cold copper spraying is less than or equal to nickel plating, to obtain better heat conduction efficiency.

[0028] Please refer to Figure 3Four screw grooves 23 are arranged on the aluminum extrusion block 21, and a sunken groove 231 and a positioning groove 232 are sequentially arranged in the screw groove 23 from top to bottom, the depth value of the sunken groove 231 is between 0.3mm and 0.7mm, and the depth value of the positioning groove 232 is between 1.2mm and 1.8mm, wherein the positioning groove 232 is used for abutting and positioning one end of the spring 32, the other end of the spring 32 abuts the head of the screw 31, and the positioning groove 232 can avoid the phenomenon that the spring 32 shakes or is misaligned.

[0029] Please refer to Figure 4 The heat pipe 12 is arranged in the mounting groove 22, and one end of the heat pipe 12 away from the copper bottom plate 11 is fixed to the aluminum extrusion block 21.

[0030] Please refer to Figure 5 The heat conduction sheet 24 includes an aluminum sheet 241 and a top end block 242 arranged on the top of the aluminum sheet 241, the aluminum sheet 241 is fixed to the upper end face of the aluminum extrusion block 21, a flow guide inclined wall 243 is arranged between two adjacent aluminum sheets 241, and the inclination angle of the flow guide inclined wall 243 is between 70° and 85°. When the cold copper spraying structure is used, a fan needs to be provided above the cold copper spraying structure, the fan blows directly to the heat dissipation assembly 2, so that the heat is dissipated, when the wind blown by the fan above the heat dissipation assembly 2 blows into the area between the two aluminum sheets 241, the wind is affected by the flow guide inclined wall 243, and the wind is better gathered between the two aluminum sheets 241, so that a better cooling effect is obtained, and the surface of the top end block 242 is designed in a circular arc shape, so that external objects are prevented from being scratched.

[0031] Please refer to Figure 6 The cold copper spraying structure further includes a back plate 4, and the back plate 4 is arranged at one end of the heat conduction assembly 1 away from the heat dissipation assembly 2.

[0032] Please refer to Figures 7 to 9 The back plate 4 includes a plate body 41 and a stud 42 fixed to four corners of the plate body 41, threaded holes are formed in the top of the four studs 42, the bottoms of the four screws 31 are respectively installed in the threaded holes of the four studs 42, and a chip containing groove 43 is arranged on the plate body 41 and penetrates through both sides of the plate body 41, when the cold copper spraying structure and the chip to be cooled are installed, the chip is located in the chip containing groove 43.

[0033] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A cold copper spray structure comprising a heat conducting component (1), a heat dissipating component (2) arranged on the heat conducting component (1) and a fastening component (3), characterized in that: The heat conducting assembly (1) comprises a copper bottom plate (11), the upper end surface of the copper bottom plate (11) is fixed with a heat pipe (12), the heat dissipating assembly (2) comprises an aluminum extrusion block (21), the lower end surface of the aluminum extrusion block (21) is provided with a mounting groove (22), the heat pipe (12) is arranged in the mounting groove (22), and the end, away from the copper bottom plate (11), of the heat pipe (12) is fixed with the aluminum extrusion block (21), the upper end surface of the aluminum extrusion block (21) is fixed with a plurality of heat conducting fins (24) which are distributed at equal intervals, the fastening assembly (3) comprises a plurality of screws (31) and a spring (32) which is sleeved outside the four screws (31), the four screws (31) all pass through the two ends of the aluminum extrusion block (21), and the lower end surface of the copper bottom plate (11) and the inner wall of the mounting groove (22) are all sprayed with a layer of vacuum air atomized copper powder.

2. A cold-coppered structure according to claim 1, characterized in that: The heat pipe (12) is provided with a plurality of heat pipes (12), and the plurality of heat pipes (12) are arranged horizontally and closely to each other.

3. A cold-coppered structure according to claim 2, characterized in that: Each heat pipe (12) is provided with two heat conducting planes (13), and the two heat conducting planes (13) are symmetrical to the upper and lower end surfaces of the heat pipe (12).

4. A cold-coppered structure according to claim 1, characterized in that: The end, away from the heat pipe (12), of the copper bottom plate (11) is coated with heat conducting paste (14), and the heat conducting paste (14) is provided with a plurality of blocks, and the plurality of blocks of heat conducting paste (14) are uniformly distributed on the lower end surface of the copper bottom plate (11).

5. A cold-coppered structure according to claim 1, characterized in that: The aluminum extrusion block (21) is provided with four screw grooves (23) which penetrate through the two sides of the aluminum extrusion block (21), and the screw grooves (23) are sequentially provided with a sunken groove (231) and a positioning groove (232) from top to bottom.

6. A cold-coppered structure according to claim 1, characterized in that: The heat conducting fin (24) comprises an aluminum sheet (241) and a top end block (242) arranged on the top of the aluminum sheet (241), the aluminum sheet (241) is fixed to the upper end surface of the aluminum extrusion block (21), and a flow guide inclined wall (243) is arranged between two adjacent aluminum sheets (241).

7. A cold-coppered structure according to claim 1, characterized in that: The fastening assembly (3) further comprises four E-shaped rings (33), the four E-shaped rings (33) are all attached to the lower end surface of the aluminum extrusion block (21), and the bottoms of the four screws (31) respectively pass through the four E-shaped rings (33).

8. A cold-coppered structure according to claim 1, characterized in that: Further comprising a back plate (4), the back plate (4) is arranged at the end, away from the heat dissipating assembly (2), of the heat conducting assembly (1), and the back plate (4) comprises a plate body (41) and a stud (42) fixed to the four corners of the plate body (41), the top of the four studs (42) is all tapped with a threaded hole, and the bottoms of the four screws (31) are respectively arranged in the threaded holes of the four studs (42).

Images