Heating block for LCC ceramic packaging lead bonding process

Abstract

The utility model discloses a heating block used for an LCC ceramic packaging lead bonding technology. The heating block comprises a heating block body, a heating boss on the upper surface of the heating block and a magnetic adsorption ring around the heating boss. A vacuum adsorption groove is formed in the boss surface of the heating block, a vacuum connecting hole is formed in the back surface of the heating block, the vacuum connecting hole is communicated with the vacuum adsorption groove, and the vacuum connecting hole is used for being connected with a vacuum pump of the lead bonding machine. According to the utility model, the heating block can directly fix the ceramic packaging tube shell on the boss through double adsorption of vacuum and magnetic force, the ceramic packaging tube shell does not need to be fixed by matching a pressing plate with the heating block, the pressing plate does not need to be aligned with the ceramic packaging tube shell, the fixing process of the ceramic packaging tube shell is simplified, and the production efficiency is improved. Meanwhile, the magnetic adsorption rings on the periphery of the boss have a certain heat transfer effect on the ceramic packaging tube shell, and the bonding quality and reliability of the lead can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor packaging technical field especially relates to a kind of heating block for LCC ceramic packaging wire bonding process. BACKGROUND

[0002] The full name of LCC ceramic packaging is ceramic leadless chip carrier, which is a surface mount packaging form designed for leadless chip. The electrical connection between LCC packaging device and PCB circuit board is realized by the metallized pads distributed around the bottom surface of the ceramic packaging tube. There is a sealing ring above the LCC ceramic packaging tube, which is used for parallel seam welding with the cover plate. Both the sealing ring and the cover plate are made of 4J42 Kovar alloy. Due to the leadless design, LCC packaging chip has smaller packaging volume and higher density, which is suitable for applications requiring lightness, thinness and smallness, such as mobile devices, smart wear, etc. In addition, LCC packaging chip also has good high-frequency characteristics and good anti-interference performance, so it has been widely used in wireless communication, high-frequency circuit and other fields.

[0003] Wire bonding is a technology that connects the pads of a chip to a packaging substrate, tube or lead frame through metal wires (such as gold, copper or aluminum wires). It is mainly used to achieve electrical connection and is the most important and widely used chip interconnection technology in microelectronic packaging, which directly determines the reliability of electrical connection. Figure 1 is a sectional view of a conventional LCC ceramic packaging wire bonding heating block, Figure 2 is a schematic diagram of the front and back structures of LCC ceramic packaging tube. During the LCC ceramic packaging wire bonding process, the conveying component of the automatic wire bonding machine loads the ceramic packaging tube 3 between the continuously heated heating block 1 and the pressing plate 4. When the position of the ceramic packaging tube 3 is aligned, the pressing plate 4 is pressed onto the sealing ring 301 of the ceramic packaging tube 3, so that the ceramic packaging tube 3 is fixed on the heating block 1. The ceramic packaging tube 3 is heated by the heating boss 2 of the heating block, and then the wire bonding process is performed by ultrasonic thermal compression welding. After the bonding is completed, the pressing plate 4 is released, and the ceramic packaging tube 3 is guided out by the conveying component, thereby completing the wire bonding process.

[0004] The heating block 1 is made of RAMAX abrasive tool steel material and has no magnetism. The heating boss 2 mainly plays the role of heating and supporting the ceramic packaging tube 3 during the bonding process, and cooperates with the pressing plate 4 to fix the ceramic packaging tube 3. Because the pressing plate 4 is pressed, the alignment accuracy of the pressing plate 4 and the ceramic packaging tube 3 is high, and at the same time, the pressing plate 4 will cause damage to the surface of the sealing ring 301 of the ceramic packaging tube, with obvious indentation, which will affect the subsequent parallel seam welding process and reduce the yield of parallel seam welding.

[0005] Because the bottom surface of the ceramic package tube 3 has the metallized pad 302, the whole bottom surface of the tube is uneven. If a vacuum adsorption groove is arranged on the heating boss table of the heating block, the ceramic package tube is fixed by vacuum adsorption, the boss table needs to avoid the metallized pad around the bottom surface of the tube and only adsorbs the ceramic package tube through the middle flat area. In this case, on the one hand, the table of the heating boss is small and the heating effect is poor, which will affect the wire bonding quality of the ceramic tube, on the other hand, the vacuum adsorption area of the heating boss to the tube is small and the ceramic package tube cannot be fixed only by vacuum adsorption. During the wire bonding process, the tube will be warped under stress, which will affect the reliability and yield of the wire bonding process. SUMMARY

[0006] To solve the above technical problems, the utility model discloses a kind of heating block for LCC ceramic package wire bonding process, heating boss table of heating block is provided with vacuum adsorption groove, and heating boss is provided with magnetic adsorption ring around it. Heating block is double-adsorbed by vacuum and magnetic force, can directly fix ceramic package tube on the boss of heating block, without using pressing plate again, without carrying out the alignment of pressing plate and ceramic package tube, the fixing process of ceramic package tube is simplified, also will not be influenced to the later parallel seam welding process by damaging sealing ring, magnetic adsorption ring is close to the bottom surface of ceramic package tube, and it plays a certain heat transfer role to ceramic package tube, which is beneficial to improve wire bonding quality and reliability.

[0007] To achieve the above purpose, the technical scheme of the utility model is as follows:

[0008] A kind of heating block for LCC ceramic package wire bonding process, comprising: heating block body, for installation connection with wire bonding machine, the back surface of the heating block body has vacuum connection hole;Heating boss, on the upper surface of the heating block body, the boss table has vacuum adsorption groove, and the vacuum adsorption groove is connected with the vacuum connection hole on the back surface of the heating block body;Magnetic adsorption ring, fixedly installed around the heating boss, and the height of the magnetic adsorption ring is lower than the boss table.

[0009] The table of the heating boss is square, and the size is smaller than the bottom surface size of the ceramic package tube, and avoids the metallized pad of the bottom surface.

[0010] The vacuum adsorption groove of the boss table is X-shaped, and the X points to the opposite corner of the table.

[0011] The magnetic adsorption ring uses one of samarium-cobalt magnet, ferrite magnet and alnico magnet.

[0012] The height of the magnetic adsorption ring is lower than the boss table by 0.03mm-0.05mm.

[0013] The utility model discloses obtain the beneficial result is: the utility model provides a kind of heating block for LCC ceramic packaging wire bonding process, including heating block body, heating boss of heating block upper surface and magnetic adsorption ring;Heating block can be directly fixed ceramic packaging tube shell on its boss by vacuum and magnetic double adsorption, without using pressing plate, can carry out wire bonding, without carrying out the alignment of pressing plate and ceramic packaging tube shell, the fixing process of ceramic packaging tube shell is simplified, also will not be influenced by damaging ceramic packaging tube shell sealing ring to subsequent parallel seam welding process;In addition, magnetic adsorption ring is close to ceramic packaging tube shell bottom surface, and it plays certain heat transfer effect to ceramic packaging tube shell, it is favorable to improve wire bonding quality and reliability. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the sectional view of conventional LCC ceramic packaging wire bonding heating block.

[0015] Figure 2 It is the front and back structure schematic view of ceramic packaging tube shell.

[0016] Figure 3 It is the structure section schematic view of the utility model heating block.

[0017] Figure 4 It is the structure overhead schematic view of the utility model heating block.

[0018] Figure 5 It is the structure side schematic view of the utility model heating block.

[0019] Figure 6 It is the schematic view of the utility model example embodiment heating block adsorption fixed ceramic packaging tube shell.

[0020] In the drawings, the component name represented by each sign is as follows:

[0021] 1, heating block body;101, vacuum connection hole;2, heating boss;201, magnetic adsorption ring;202, vacuum adsorption groove;3, ceramic packaging tube shell;301, sealing ring;302, metallized pad;4, pressing plate. DETAILED DESCRIPTION

[0022] To make the above purpose, features and advantages of the utility model can be more obvious and easy to understand, the specific embodiment of the utility model is explained in detail with the drawings below.In the following description, a lot of specific details are set forth to facilitate a full understanding of the utility model.However, the utility model can be implemented in many other ways different from the description herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the following disclosed specific embodiments.

[0023] In the description of the utility model, need understanding is, the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and so on indicate the orientation or position relation based on the orientation or position relation shown in the drawing, just is for the convenience of describing the utility model and simplifying the description, and is not indicate or imply that the indicated device or element must have a particular orientation, is constructed and operated with a particular orientation, therefore can not be understood as the limitation to the utility model.

[0024] Please refer to Figures 3 to 6 The utility model discloses a kind of heating block for LCC ceramic package wire bonding process, which includes heating block body 1, heating boss 2 on the upper surface of heating block body 1 and magnetic adsorption ring 201.Heating boss 2 is arranged on the upper surface of heating block body 1, vacuum connection hole 101 is arranged on the back of heating block body 1, vacuum adsorption groove 202 is arranged on the table of heating boss 2, and vacuum adsorption groove 202 is connected with vacuum connection hole 101 in a through manner.Heating block is installed on wire bonding machine, vacuum connection hole 101 is connected with the vacuum pump of wire bonding machine, and ceramic package tube shell 3 on the upper surface is sucked by vacuum adsorption groove 202.Heating boss 2 is provided with magnetic adsorption ring 201 around, since the sealing ring 301 of ceramic package tube shell 3 is 4J42 Kovar material, magnetic adsorption ring 201 generates magnetic adsorption force to sealing ring 301, and the fixation of ceramic package tube shell 3 is strengthened.The height of magnetic adsorption ring 201 is lower than the table height of heating boss 2, to ensure that magnetic adsorption ring 201 cannot be pressed to the metallized pad 302 on the bottom surface of ceramic package tube shell 3, if the height of magnetic adsorption ring 201 is equal to or higher than the table height of heating boss 2, magnetic adsorption ring 201 can be pressed to metallized pad 302, which causes the bottom surface of ceramic package tube shell 3 to be unable to be attached to the boss table, and affects vacuum adsorption.Under the action of vacuum and magnetic force double adsorption force, heating block can fix ceramic package tube shell 3, and wire bonding can be carried out without using pressing plate, and alignment of pressing plate and ceramic package tube shell is not needed, so that the fixation process of ceramic package tube shell 3 is simplified.Magnetic adsorption ring 201 is close to the bottom surface of ceramic package tube shell 3, which can conduct heat to the bottom surface of ceramic package tube shell 3, and is beneficial to improve the quality and reliability of wire bonding.

[0025] Further, the table of heating boss 2 is square, and the size thereof is smaller than the bottom surface size of ceramic package tube shell 3, because the bottom surface of ceramic package tube shell 3 is square, so that the contact area of boss table and the bottom surface of ceramic package tube shell can be increased;the greater the contact area, the better the heating effect of heating boss 2 on ceramic package tube shell 3;the size of boss is smaller than the bottom surface size of ceramic package tube shell 3 and avoids the metallized pad 302 around the bottom surface, because the metallized pad 302 is not in the same plane with the bottom surface, after avoiding the metallized pad 302, heating boss 2 can be closely attached to the bottom surface of ceramic package tube shell 3, to ensure that vacuum adsorption groove 202 can effectively suck ceramic package tube shell 3.

[0026] Further, the vacuum adsorption groove of the platform of the heating boss 2 is X-shaped, and the X points to the diagonal of the platform. Because the length of the diagonal of the square is longer than the length of the side, this is conducive to increasing the area of the vacuum adsorption groove 202, thereby increasing the adsorption force on the bottom surface of the ceramic packaging tube shell 3.

[0027] Further, the magnetic adsorption ring 201 is made of one of samarium-cobalt magnets, ferrite magnets and alnico magnets. These magnet materials can withstand high temperatures. During the wire bonding process, the temperature of the heating block reaches 150 DEG C or above, so as to ensure that the magnetic adsorption ring 201 has magnetism at high temperatures and maintains the magnetic adsorption force on the ceramic packaging tube shell 3.

[0028] Further, the height of the magnetic adsorption ring 201 is lower than the height of the platform of the heating boss 2 by 0.03mm-0.05mm. Because the thickness of the metallized pad 302 on the bottom surface of the ceramic packaging tube shell 3 is within 0.03mm, in this case, the magnetic adsorption ring 201 is close to the bottom surface of the ceramic packaging tube shell 3, which can both heat the ceramic packaging tube shell 3 and not touch the metallized pad 302, thereby affecting the vacuum adsorption of the heating boss 2 on the ceramic packaging tube shell 3.

[0029] In summary, the heating block for the LCC ceramic packaging wire bonding process disclosed in the utility model, including heating block body, heating boss on the upper surface of the heating block and magnetic adsorption ring, the platform of the heating boss is provided with a vacuum adsorption groove, and the heating boss is provided with a magnetic adsorption ring around; during the wire bonding process, the vacuum adsorption groove of the platform of the heating boss adsorbs the bottom surface of the ceramic packaging tube shell, and at the same time, because the sealing ring of the ceramic packaging tube shell is 4J42 Kovar alloy, the magnetic adsorption ring around the heating boss generates a magnetic force on the sealing ring on the ceramic packaging tube shell, further fixing the ceramic packaging tube shell, so that the wire bonding can be carried out without using a pressing plate, and the alignment of the pressing plate and the ceramic packaging tube shell is not needed, the fixing process of the ceramic packaging tube shell is simplified, and the sealing ring of the ceramic packaging tube shell is not damaged, so as to affect the subsequent parallel seam welding process; in addition, the magnetic adsorption ring is close to the bottom surface of the ceramic packaging tube shell, which plays a certain heat transfer role on the ceramic packaging tube shell, and is conducive to improving the wire bonding quality and reliability.

[0030] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the description.

[0031] The above-described embodiments only express one specific implementation of the present application, which is described more specifically and in detail, but cannot be understood as a limitation on the scope of the application patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A heating block for LCC ceramic package wire bonding process, characterized in that: it comprises a heating block body for mounting connection with a wire bonder, a vacuum connection hole is provided in the center of the back surface of the heating block body; a heating boss is provided on the upper surface of the heating block body, the boss top surface has a vacuum adsorption groove, and the vacuum adsorption groove is connected with the vacuum connection hole in the back surface of the heating block body; a magnetic adsorption ring is fixedly installed around the heating boss, and the height of the magnetic adsorption ring is lower than the top surface of the heating boss. The top surface of the heating boss is square, the size of which is smaller than the bottom surface size of the ceramic package tube shell, and the metallized pads on the bottom surface are avoided.

2. The heating block of claim 1, wherein, The vacuum adsorption groove on the top surface of the heating boss is X-shaped, and the X points to the opposite corners of the top surface.

3. The heating block of claim 1, wherein, The magnetic adsorption ring adopts one of samarium-cobalt magnet, ferrite magnet and aluminum-nickel-cobalt magnet.

4. The heating block according to claim 1, characterized in that, The height of the magnetic adsorption ring is 0.03mm-0.05mm lower than the top surface of the heating boss.

5. The heating block of claim 1, wherein, ​

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