Multi-station wafer coating mechanism

Abstract

The utility model discloses a multi-station wafer coating mechanism, which belongs to the technical field of wafer coating and comprises a conveying frame, a coating box is arranged on the conveying frame, a spraying pipe is arranged on the coating box, and a driving pump is arranged on the coating box. The adjusting structure is arranged on the mounting plate, the temperature adjusting plate is mounted through the rotating shaft, the inclination angle of the temperature adjusting plate can be adjusted according to needs, then the size of the exposed space below the heating pipe is changed, the purpose of adjusting the temperature of a coating acting on the surface of a wafer is achieved, and the device is suitable for drying work of different coating materials; a linkage plate and a linkage shaft are arranged at the end of each temperature adjusting plate, all the temperature adjusting plates can be synchronously driven to rotate, the adjusting convenience is high, a worm wheel, a worm and a micro servo motor are adopted as driving parts, the micro servo motor can drive the worm to rotate forwards and backwards, then the worm wheels drive the temperature adjusting plates to be closed, the adjusting adaptability is high, and the adjusting efficiency is high. And the worm gear and the worm have a self-locking effect, so that the use stability after adjustment can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of wafer coating technology, and in particular to a multi-station wafer coating mechanism. Background Technology

[0002] A wafer coating unit is a device used to uniformly coat the surface of a wafer during semiconductor manufacturing. When using a coating unit for wafer coating, the wafer is transported to the coating point, where coating is completed through chemical or physical methods. To improve the coating rate, existing coating units are equipped with multiple stations, allowing different wafer processing steps to be performed simultaneously, thereby increasing the coating speed.

[0003] In existing multi-station coating systems, after the wafer is coated at the previous station, the conveyor structure transports the wafer to the next station for drying. However, these systems use heating for drying, with a fixed heating element height. This means the drying temperature cannot be adjusted, limiting their application to drying only one type of coating material. For other coating materials, the temperature may become too high or too low, affecting the final drying process. Utility Model Content

[0004] The main objective of this invention is to provide a multi-station wafer coating mechanism that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A multi-station wafer coating mechanism includes a conveyor frame, a coating box on the conveyor frame, a spray pipe on the coating box, a drive pump on the coating box, a drying box on the conveyor frame, a mounting plate inside the drying box, a connecting seat on the lower surface of the mounting plate, a heating tube fixed on the connecting seat, and an adjustment structure on the lower surface of the mounting plate.

[0007] Preferably, the lower end of the conveyor frame is provided with a support, and the conveyor frame is composed of a fixed frame, a conveyor roller and a conveyor belt. The conveyor roller is installed inside the fixed frame and the conveyor belt is sleeved on the conveyor roller.

[0008] Preferably, the lower end of the spray pipe is provided with a diverter pipe, which passes through the coating box. The end of the diverter pipe is provided with a nozzle. The mounting plate is provided with a suspension rod, which is fixed to the top of the inside of the drying box.

[0009] Preferably, the adjustment structure includes a side plate, a temperature regulating plate, a rotating shaft, an arc-shaped hole, a linkage shaft, a linkage plate, a worm gear, a mounting bracket, a micro servo motor, and a worm. The side plate is fixed to the lower surface of the mounting plate. The temperature regulating plate is rotatably mounted on the side plate via the rotating shaft. The arc-shaped hole is opened on the side plate. The linkage shaft and the linkage plate are rotatably connected, and the linkage shaft passes through the arc-shaped hole. The end of the linkage shaft is connected to the temperature regulating plate.

[0010] Preferably, one of the rotating shafts is connected to the worm gear, the mounting bracket is fixed on the side plate, the micro servo motor and the worm are mounted on the mounting bracket, and the micro servo motor is connected to the worm, and the worm is meshed with the worm gear.

[0011] Compared with the prior art, this utility model has the following advantages: This multi-station wafer coating mechanism has an adjustment structure on the mounting plate. The temperature regulating plate is mounted on the rotating shaft, and the tilt angle of the temperature regulating plate can be adjusted as needed, thereby changing the size of the exposed space below the heating tube and achieving the purpose of adjusting the temperature of the coating layer acting on the wafer surface. It is suitable for drying different coating materials. The end of the temperature regulating plate is equipped with a linkage plate and a linkage shaft, which can synchronously drive all temperature regulating plates to rotate, making adjustment convenient. The worm gear, worm shaft and micro servo motor are used as the driving parts. The micro servo motor can drive the worm shaft to rotate forward and backward, and then drive the temperature regulating plate to close through the worm gear, making adjustment highly adaptable. The worm gear and worm shaft have a self-locking effect, which can ensure the stability of use after adjustment. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the drying oven of this utility model;

[0014] Figure 3 This is a schematic diagram of the adjustment structure of this utility model;

[0015] Figure 4 This utility model Figure 3 Enlarged view of point A in the middle.

[0016] In the diagram: 1. Conveyor frame; 2. Coating box; 3. Spraying pipe; 4. Drive pump; 5. Drying oven; 6. Mounting plate; 7. Connecting seat; 8. Heating element; 9. Adjustment structure; 901. Side plate; 902. Temperature regulating plate; 903. Rotating shaft; 904. Arc-shaped hole; 905. Linkage shaft; 906. Linkage plate; 907. Worm gear; 908. Mounting frame; 909. Miniature servo motor; 910. Worm; 10. Suspension rod; 11. Bracket. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] like Figures 1-4 As shown, a multi-station wafer coating mechanism includes a conveyor frame 1, a coating box 2 mounted on the conveyor frame 1, a spray pipe 3 mounted on the coating box 2, a drive pump 4 mounted on the coating box 2, a drying chamber 5 mounted on the conveyor frame 1, a mounting plate 6 inside the drying chamber 5, a connecting seat 7 on the lower surface of the mounting plate 6, a heating element 8 fixed on the connecting seat 7, and an adjustment structure 9 on the lower surface of the mounting plate 6. A support 11 is provided at the lower end of the conveyor frame 1, and the conveyor frame 1 consists of a fixed frame, conveyor rollers, and a conveyor belt. The conveyor rollers are mounted inside the fixed frame, and the conveyor belt is sleeved on the conveyor rollers. A diverter pipe is provided at the lower end of the spray pipe 3, and the diverter pipe passes through the coating box 2. A nozzle is provided at the end of the diverter pipe. A suspension rod 10 is provided on the mounting plate 6, and the suspension rod 10 is fixed to the top of the interior of the drying chamber 5.

[0019] When using a coating mechanism for wafer coating, the conveyor frame 1 is stably placed by the support 11. The drive pump 4 on the spray pipe 3 is connected to the coating material box. The adjustment structure 9 is adjusted according to the coating material, and then the coating process begins. After the conveyor frame 1 is started, the conveyor belt in the conveyor frame 1 runs, placing the wafer on the conveyor belt. The wafer moves under the conveyor belt, and at the same time, the heating tube 8 between the connecting seats 7 on the mounting plate 6 generates heat. When the wafer moves into the coating box 2, the drive pump 4 starts to drive the coating material into the spray pipe 3, and then sprays it out through the nozzle at the end of the split pipe. The sprayed coating material adheres to the wafer, thereby achieving wafer coating. After coating is completed, the conveyor belt continues to move the wafer. When the wafer moves into the drying box 5 and continues to move, the heat generated by the heating tube 8 acts on the wafer through the adjustment structure 9 to dry the coating material. If necessary, the adjustment structure 9 can be restarted to adjust the temperature.

[0020] According to the above implementation scheme, the adjustment structure 9 includes a side plate 901, a temperature regulating plate 902, a rotating shaft 903, an arc-shaped hole 904, a linkage shaft 905, a linkage plate 906, a worm gear 907, a mounting bracket 908, a micro servo motor 909, and a worm 910. The side plate 901 is fixed to the lower surface of the mounting plate 6. The temperature regulating plate 902 is rotatably mounted on the side plate 901 via the rotating shaft 903. The arc-shaped hole 904 is opened on the side plate 901. The linkage shaft 905 and the linkage plate 906 are rotatably connected, and the linkage shaft 905 passes through the arc-shaped hole 904. The end of the linkage shaft 905 is connected to the temperature regulating plate 902. One of the rotating shafts 903 is connected to the worm gear 907. The mounting bracket 908 is fixed on the side plate 901. The micro servo motor 909 and the worm 910 are mounted on the mounting bracket 908, and the micro servo motor 909 is connected to the worm 910. The worm 910 is meshed with the worm gear 907.

[0021] When adjusting the adjustment structure 9, the micro servo motor 909 on the mounting bracket 908 on the side plate 901 is activated. The micro servo motor 909 drives the worm gear 910 to rotate. Driven by the worm gear 910, the worm wheel 907 drives the shaft 903 at the end of the first temperature regulating plate 902 to rotate, thereby driving the first temperature regulating plate 902 to rotate between the side plates 901. During this process, as the first temperature regulating plate 902 rotates, the corresponding linkage shaft 905 moves together in the arc-shaped hole 904, thereby driving the remaining linkage shafts 905 to rotate through the linkage plate 906, so that the remaining temperature regulating plates 902 rotate synchronously with the first temperature regulating plate 902, achieving synchronous adjustment of all temperature regulating plates 902. As the temperature regulating plates 902 rotate, the gap between adjacent temperature regulating plates 902 changes, thereby changing the size of the space through which temperature can pass, achieving the purpose of adjusting the drying temperature. After adjustment, there is a self-locking effect between the worm gear 907 and the worm 910, which ensures good stability of the temperature regulating plate 902 after adjustment and guarantees the performance.

[0022] It should be noted that an adjustment structure 9 is set on the mounting plate 6, and a temperature regulating plate 902 is mounted on the rotating shaft 903. The tilt angle of the temperature regulating plate 902 can be adjusted as needed, thereby changing the size of the exposed space below the heating tube 8, and achieving the purpose of adjusting the temperature of the coating on the wafer surface. This is suitable for drying different coating materials. A linkage plate 906 and a linkage shaft 905 are set at the end of the temperature regulating plate 902, which can synchronously drive all the temperature regulating plates 902 to rotate, making the adjustment convenient. A worm gear 907, a worm 910, and a micro servo motor 909 are used as the driving parts. The micro servo motor 909 can drive the worm 910 to rotate forward and backward, and then drive the temperature regulating plate 902 to close through the worm gear 907. The adjustment adaptability is high. The worm gear 907 and the worm 910 have a self-locking effect, which can ensure the stability of use after adjustment.

[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-station wafer coating mechanism, comprising a conveyor frame (1), a coating box (2) on the conveyor frame (1), a spray pipe (3) on the coating box (2), a drive pump (4) on the coating box (2), and a drying oven (5) mounted on the conveyor frame (1), characterized in that: The inside of the drying box (5) is provided with a mounting plate (6), and the lower surface of the mounting plate (6) is provided with a connecting seat (7), a heating tube (8) is fixed on the connecting seat (7), and the lower surface of the mounting plate (6) is provided with an adjusting structure (9).

2. The multi-station wafer coating mechanism of claim 1, wherein: The lower end of the conveying frame (1) is provided with a support (11), and the conveying frame (1) is composed of a fixed frame, conveying rollers and a conveying belt, the conveying rollers are installed on the inner side of the fixed frame, and the conveying belt is sleeved on the conveying rollers.

3. The multi-station wafer coating mechanism of claim 2, wherein: The lower end of the spraying pipe (3) is provided with a shunt pipe which penetrates the coating box (2), the end of the shunt pipe is provided with a spray head, the mounting plate (6) is provided with a hanging rod (10), and the hanging rod (10) is fixed to the inner top end of the drying box (5).

4. The multi-station wafer coating mechanism of claim 3, wherein: The adjusting structure (9) comprises side plates (901), temperature adjusting plates (902), rotating shafts (903), arc-shaped holes (904), linkage shafts (905), linkage plates (906), worm gears (907), mounting frames (908), micro servo motors (909) and worms (910), the side plates (901) are fixed to the lower surface of the mounting plate (6), the temperature adjusting plates (902) are rotatably installed on the side plates (901) through the rotating shafts (903), the arc-shaped holes (904) are formed in the side plates (901), the linkage shafts (905) and the linkage plates (906) are rotatably connected, and the linkage shafts (905) penetrate the arc-shaped holes (904), and the ends of the linkage shafts (905) are connected to the temperature adjusting plates (902).

5. The multi-station wafer coating mechanism of claim 4, wherein: One of the rotating shafts (903) is connected with the worm gear (907), the mounting frame (908) is fixed to the side plate (901), the micro servo motor (909) and the worm (910) are installed on the mounting frame (908), and the micro servo motor (909) is connected with the worm (910), and the worm (910) is meshedly connected with the worm gear (907).

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