Semiconductor chip gluing device with curing structure

Abstract

The utility model discloses a semiconductor chip gluing device with a curing structure, which comprises a support frame, and a curing mechanism and an adjustable gluing mechanism are mounted on the support frame. The curing mechanism comprises a first hydraulic telescopic rod, a workbench, a protection plate, a connecting block, an arc-shaped fixing plate, a curing cover, an ultraviolet lamp and a control assembly. According to the utility model, through the installation of the curing mechanism, curing treatment can be carried out in time according to needs after gluing is completed, so that the possibility of occurrence of problems such as glue flowing and infirm bonding is reduced, and the processing quality of chips is improved to a certain extent; through design control of a limiting plate, an electric sliding table, a mounting block, a second hydraulic telescopic rod, a supporting table, a glue barrel, a glue storage cavity, a partition plate, a pump body, a glue outlet pipe and a flow adjusting valve, on one hand, the position of the gluing device can be adjusted according to needs, on the other hand, the flow speed and the outflow amount of glue are controlled through the flow adjusting valve, and the phenomena of glue waste and uneven gluing are avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, and in particular to a semiconductor chip coating device with a curing structure. Background Technology

[0002] A semiconductor chip is an integrated circuit made of semiconductor materials. It has unique electrical properties and is widely used in various electronic devices. In the packaging process of semiconductor chips, coating is a key step.

[0003] Existing semiconductor chip coating equipment has the following drawbacks:

[0004] 1. Traditional adhesive application equipment often focuses only on applying adhesive, while neglecting the need for rapid and uniform curing of the adhesive after application. If the adhesive cannot be cured in a timely and effective manner after chip application, problems such as adhesive flow and poor adhesion may occur, affecting the performance and quality of the chip.

[0005] 2. Traditional adhesive coating equipment also has shortcomings in terms of quantitative control of adhesive and uniformity of adhesive coating, which cannot meet the requirements of high-precision semiconductor chip packaging. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor chip coating device with a curing structure.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A semiconductor chip coating apparatus with a curing structure includes a support frame on which a curing mechanism and an adjustable coating mechanism are mounted.

[0009] The curing mechanism includes a first hydraulic telescopic rod, a worktable, a protective plate, a connecting block, an arc-shaped fixing plate, a curing cover, ultraviolet lamps, and a control component. Two movable slots are formed on the surface of the worktable. The bottom ends of the curing cover are slidably connected to the inner walls of the two movable slots. Multiple ultraviolet lamps are installed on the top inner wall of the curing cover. The control component includes a temperature sensor, a control switch, a heating element, and signal lines. The temperature sensor is connected to the input terminal of the control switch via a signal line, and the output terminal of the control switch is connected to both the ultraviolet lamps and the heating element via signal lines.

[0010] The above scheme, with its installation of a curing mechanism, including a first hydraulic telescopic rod, worktable, protective plate, connecting block, arc-shaped fixing plate, curing cover, ultraviolet lamp, and control components, enables timely curing after adhesive application, thereby reducing the possibility of problems such as adhesive flow and poor adhesion, and improving the chip processing quality to a certain extent.

[0011] Preferably, the adjustable glue applicator includes a limiting plate, an electric slide table, a mounting block, a second hydraulic telescopic rod, a support platform, a glue bucket, a glue storage chamber, a partition, a pump body, a glue outlet pipe, and a flow regulating valve. The mounting block is slidably connected to the surface of the electric slide table, the bottom end of the second hydraulic telescopic rod is inserted into the top of the mounting block, the top ends of the two second hydraulic telescopic rods are respectively fixedly connected to the two ends of the bottom surface of the support platform, and the glue bucket is placed on the top surface of the support platform.

[0012] The above scheme, which includes an adjustable glue application mechanism, a limit plate, an electric slide table, a mounting block, a second hydraulic telescopic rod, a support platform, a glue bucket, a glue storage chamber, a partition, a pump body, a glue outlet pipe, and a flow regulating valve, allows for the adjustment of the glue application device's position as needed. Furthermore, the flow regulating valve controls the glue's flow rate and volume, preventing glue waste and uneven application.

[0013] Preferably, the glue bucket has a glue storage chamber inside through a partition, the pump body is fixedly placed on the bottom inner wall of the glue bucket, the discharge port of the pump body is fixedly connected to one end of the glue discharge pipe, and the flow regulating valve is installed on the outer wall of the other end of the glue discharge pipe.

[0014] Preferably, the bottom two ends of the workbench are fixedly connected to the top of the two first hydraulic telescopic rods, and the two protective plates are respectively inserted into the top two sides of the workbench. The outer wall of one side of the arc-shaped fixed plate is slidably connected to the inner surface of the protective plate through a connecting block.

[0015] Preferably, the two first hydraulic telescopic rods are fixedly connected to the two ends of the bottom surface of the support frame, and the two sides of the workbench are slidably connected to the inner walls of the top two sides of the support frame.

[0016] Preferably, the two electric slides are fixedly connected to the outer walls of the two sides of the support frame, and limit plates are fixed at both ends of the electric slides.

[0017] The beneficial effects of this utility model are as follows:

[0018] 1. By installing a curing mechanism, the first hydraulic telescopic rod, workbench, protective plate, connecting block, arc-shaped fixing plate, curing cover, ultraviolet lamp and control components can be set up to cure the adhesive in a timely manner as needed after the adhesive is applied, thereby reducing the possibility of problems such as adhesive flow and poor adhesion, and improving the processing quality of the chip to a certain extent.

[0019] 2. By installing an adjustable glue application mechanism, including a limit plate, electric slide, mounting block, second hydraulic telescopic rod, support platform, glue bucket, glue storage chamber, partition, pump body, glue outlet pipe, and flow regulating valve, the position of the glue application device can be adjusted as needed. On the other hand, the flow rate and flow volume of the glue can be controlled by the flow regulating valve to avoid glue waste and uneven glue application. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a semiconductor chip coating device with a curing structure proposed in this utility model;

[0021] Figure 2 This is a cross-sectional view of the curing mechanism of a semiconductor chip coating apparatus with a curing structure proposed in this utility model;

[0022] Figure 3 This is a cross-sectional view of a semiconductor chip coating device with a curing structure proposed in this utility model;

[0023] Figure 4 This is a top view of a semiconductor chip coating device with a curing structure proposed in this utility model.

[0024] In the diagram: 1. Support frame; 2. First hydraulic telescopic rod; 3. Workbench; 4. Protective plate; 5. Connecting block; 6. Arc-shaped fixing plate; 7. Curing cover; 8. Ultraviolet lamp; 9. Control components; 10. Limiting plate; 11. Electric slide table; 12. Mounting block; 13. Second hydraulic telescopic rod; 14. Support platform; 15. Glue bucket; 16. Glue storage chamber; 17. Partition plate; 18. Pump body; 19. Glue outlet pipe; 20. Flow regulating valve. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] Example 1, referring to Figure 1-4 A semiconductor chip coating apparatus with a curing structure includes a support frame 1, on which a curing mechanism and an adjustable coating mechanism are mounted.

[0027] The curing mechanism includes a first hydraulic telescopic rod 2, a worktable 3, a protective plate 4, a connecting block 5, an arc-shaped fixing plate 6, a curing cover 7, ultraviolet lamps 8, and a control component 9. Two movable slots are formed on the surface of the worktable 3. The bottom ends of the curing cover 7 are slidably connected to the inner walls of the two movable slots. Multiple ultraviolet lamps 8 are installed on the top inner wall of the curing cover 7. The control component 9 includes a temperature sensor, a control switch, a heating element, and signal lines. The temperature sensor is connected to the input of the control switch via signal lines, and the output of the control switch is connected to the ultraviolet lamps 8 and the heating element via signal lines. The installation of the curing mechanism, including the first hydraulic telescopic rod 2, the worktable 3, the protective plate 4, the connecting block 5, the arc-shaped fixing plate 6, the curing cover 7, the ultraviolet lamps 8, and the control component 9, allows for timely curing after adhesive application, reducing the possibility of adhesive flow and poor adhesion, and improving the chip processing quality to a certain extent.

[0028] Example 2, refer to Figure 1 , Figure 2 and Figure 3 The adjustable glue application mechanism includes a limiting plate 10, an electric slide table 11, a mounting block 12, a second hydraulic telescopic rod 13, a support platform 14, a glue tank 15, a glue storage chamber 16, a partition 17, a pump body 18, a glue outlet pipe 19, and a flow regulating valve 20. The mounting block 12 is slidably connected to the surface of the electric slide table 11. The bottom end of the second hydraulic telescopic rod 13 is inserted into the top of the mounting block 12. The top ends of the two second hydraulic telescopic rods 13 are respectively fixedly connected to the two ends of the bottom surface of the support platform 14. The glue tank 15... 5 is placed on the top surface of the support platform 14 and an adjustable glue application mechanism is installed. The design and control of the limiting plate 10, electric slide table 11, mounting block 12, second hydraulic telescopic rod 13, support platform 14, glue bucket 15, glue storage chamber 16, partition 17, pump body 18, glue outlet pipe 19 and flow regulating valve 20 can, on the one hand, adjust the position of the glue application device as needed, and on the other hand, control the flow rate and flow volume of glue through the flow regulating valve 20 to avoid glue waste and uneven glue application.

[0029] Example 3, referring to Figure 2 , Figure 3 and Figure 4The glue tank 15 has a glue storage chamber 16 inside through a partition 17. The pump body 18 is fixedly placed on the bottom inner wall of the glue tank 15. The discharge port of the pump body 18 is fixedly connected to one end of the glue discharge pipe 19. The flow regulating valve 20 is installed on the outer wall of the other end of the glue discharge pipe 19. The bottom two ends of the workbench 3 are fixedly connected to the top of the two first hydraulic telescopic rods 2. The two protective plates 4 are respectively inserted into the top two sides of the workbench 3. The outer wall of one side of the arc-shaped fixing plate 6 is slidably connected to the inner surface of the protective plate 4 through the connecting block 5. The two first hydraulic telescopic rods 2 are respectively fixedly connected to the bottom two ends of the support frame 1. The two sides of the workbench 3 are slidably connected to the inner walls of the top two sides of the support frame 1. The two electric slides 11 are respectively fixedly connected to the outer walls of the two sides of the support frame 1. The two ends of the electric slides 11 are fixed with limit plates 10.

[0030] Working principle: The setup of the first hydraulic telescopic rod 2, worktable 3, protective plate 4, connecting block 5, arc-shaped fixing plate 6, curing cover 7, ultraviolet lamp 8, and control component 9 enables timely curing after glue application. The cooperation of ultraviolet lamp 8 and control component 9 cures the coated semiconductor chip, reducing the possibility of glue flow problems and poor adhesion, thus improving the chip processing quality to a certain extent. The adjustable glue application mechanism, including the design and control of the limiting plate 10, electric slide 11, mounting block 12, second hydraulic telescopic rod 13, support platform 14, glue bucket 15, glue storage chamber 16, partition 17, pump body 18, glue outlet pipe 19, and flow regulating valve 20, allows for adjustment of the glue application device position as needed. Furthermore, the flow regulating valve 20 controls the glue flow rate and volume, preventing glue waste and uneven application.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip gluing apparatus having a curing structure, comprising a support frame (1), characterized in that, The support frame (1) is provided with a curing mechanism and an adjustable glue applying mechanism; The curing mechanism comprises a first hydraulic telescopic rod (2), a workbench (3), a protective plate (4), a connecting block (5), an arc-shaped fixing plate (6), a curing cover (7), ultraviolet lamps (8) and a control assembly (9). Two moving grooves are formed in the surface of the workbench (3), the curing cover (7) is slidably connected to the inner walls of the two moving grooves at both ends of the bottom, a plurality of the ultraviolet lamps (8) are installed on the inner wall of the top of the curing cover (7), the control assembly (9) comprises a temperature sensor, a control switch, a heating sheet and signal lines, the temperature sensor is connected to the input end of the control switch through the signal lines, and the output end of the control switch is connected to the ultraviolet lamps (8) and the heating sheet through signal lines.

2. The apparatus according to claim 1, wherein the apparatus is characterized by: The adjustable glue applying mechanism comprises a limiting plate (10), an electric sliding table (11), a mounting block (12), a second hydraulic telescopic rod (13), a supporting table (14), a glue barrel (15), a glue storage cavity (16), a partition plate (17), a pump body (18), a glue outlet pipe (19) and a flow regulating valve (20). The mounting block (12) is slidably connected to the surface of the electric sliding table (11), the bottom end of the second hydraulic telescopic rod (13) is inserted into the top of the mounting block (12), the top ends of the two second hydraulic telescopic rods (13) are fixedly connected to the bottom surface of the supporting table (14), and the glue barrel (15) is placed on the top surface of the supporting table (14).

3. The apparatus according to claim 2, wherein the apparatus is characterized by: The inside of the glue barrel (15) is provided with the glue storage cavity (16) through the partition plate (17), the pump body (18) is fixedly placed on the inner wall of the bottom of the glue barrel (15), the discharge port of the pump body (18) is fixedly connected to one end of the glue outlet pipe (19), and the flow regulating valve (20) is installed on the outer wall of the other end of the glue outlet pipe (19).

4. The apparatus according to claim 1, wherein the apparatus is characterized by: The bottom surface of the workbench (3) is fixedly connected to the top of the two first hydraulic telescopic rods (2), the two protective plates (4) are respectively inserted into the top surface of the workbench (3) on the two sides, and one side of the arc-shaped fixing plate (6) is slidably connected to the inner side surface of the protective plate (4) through the connecting block (5).

5. The apparatus according to claim 1, wherein the apparatus is characterized by: The two first hydraulic telescopic rods (2) are respectively fixedly connected to the bottom surface of the support frame (1), and the two sides of the workbench (3) are slidably connected to the top two side inner walls of the support frame (1).

6. The apparatus according to claim 2, wherein the apparatus is characterized by: The two electric sliding tables (11) are respectively fixedly connected to the two side outer walls of the support frame (1), and the two ends of the electric sliding table (11) are fixedly provided with the limiting plates (10).

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