Polishing device for thinning processing of glass substrate

Abstract

The utility model discloses a polishing device for thinning processing of a glass substrate, which comprises a workbench, an isolation box fixedly connected with the upper end of the workbench, a cross-shaped mounting plate fixedly connected with the interior of the isolation box, an air cylinder fixedly connected with the upper surface of the cross-shaped mounting plate, and a mounting frame fixedly connected with the output end of the air cylinder. A placing plate is fixedly connected to the upper end of the mounting frame, a reinforcing assembly is arranged at the lower end of the mounting frame, a polishing mechanism and a sliding groove are arranged at the upper end of the isolation box, a T-shaped reinforcing block is slidably connected into the sliding groove, an upper baffle is slidably connected to the upper surface of the isolation box, and a connecting rod is fixedly connected between the lower surface of the upper baffle and the T-shaped reinforcing block. The upper surface of the upper baffle is fixedly connected with an air blower and a liquid supply box, the left surface of the isolation box is fixedly connected with a storage box, and the upper surface of the storage box is fixedly connected with an automatic telescopic rod. Through the structure, the influence of the polishing residues on the working environment is reduced, and the convenience of recycling the polishing residues is improved.

Description

Technical Field

[0001] This utility model relates to the field of glass substrate processing technology, and in particular to a polishing device for thinning glass substrates. Background Technology

[0002] During the thinning and polishing process of glass substrates, polishing residue remains on the surface. Conventional polishing devices typically use a blower to remove the residue after polishing. However, since conventional polishing devices lack measures to limit residue splashing, glass residue tends to scatter in the work area when the blower is used to remove it. A glass substrate polishing device disclosed on the China Patent Network, with application number "202222727911.7", uses a vacuum cleaner installed at the polishing wheel to handle polishing residue. However, because the vacuum cleaner is close to the polishing wheel, there is a risk of extracting polishing fluid, and there is also a risk that glass residue may damage the vacuum cleaner's air duct, reducing the comfort of using the device. Utility Model Content

[0003] The purpose of this utility model is to solve at least one of the technical problems existing in the prior art, and to provide a polishing device for glass substrate thinning processing, which avoids the situation where polishing residue is scattered everywhere when processing polishing residue, and avoids the device's own components affecting the polishing effect, while reducing the risk of glass residue damaging important components of the device.

[0004] This utility model also provides a polishing device for thinning glass substrates as described above, comprising: a worktable, an isolation box fixedly connected to the upper end of the worktable, a cross mounting plate fixedly connected inside the isolation box, a cylinder fixedly connected to the upper surface of the cross mounting plate, a mounting frame fixedly connected to the output end of the cylinder, a placement plate fixedly connected to the upper end of the mounting frame, a reinforcing component provided at the lower end of the mounting frame, the output end of the reinforcing component penetrating the placement plate and contacting the lower surface of the glass substrate, a polishing mechanism and a sliding groove provided at the upper end of the isolation box, and the front and rear ends of the polishing mechanism... Inside the chute, a T-shaped reinforcing block is slidably connected. The T-shaped reinforcing block is rotatably connected to the polishing mechanism. An upper baffle is slidably connected to the upper surface of the isolation box. A connecting rod is fixedly connected between the lower surface of the upper baffle and the T-shaped reinforcing block. A blower and a liquid supply box are fixedly connected to the upper surface of the upper baffle. The output ends of the blower and the liquid supply box are located on the left and right sides of the polishing mechanism, respectively. A storage box is fixedly connected to the left surface of the isolation box. An automatic telescopic rod is fixedly connected to the upper surface of the storage box. The output end of the automatic telescopic rod is fixedly connected to the left surface of the upper baffle.

[0005] According to the present invention, a polishing apparatus for thinning glass substrates includes an isolation box with a bucket-shaped lower end that extends through the upper end of the worktable. This ensures that polishing residue falls directionally.

[0006] According to the present invention, a polishing apparatus for thinning glass substrates includes a cross-shaped mounting plate that penetrates an isolation box, with the portion of the cross-shaped mounting plate penetrating the isolation box contacting the upper surface of the worktable. This improves the stability of the cross-shaped mounting plate.

[0007] According to the polishing apparatus for glass substrate thinning according to this utility model, the length and width of the placement plate are smaller than the length and width of the isolation box, and the placement plate does not contact the inner wall of the isolation box. Furthermore, the placement plate completely covers the power end of the cylinder and the reinforcing assembly. This reduces the risk of residue contacting the cylinder and the reinforcing assembly.

[0008] According to the present invention, a polishing apparatus for thinning glass substrates includes a storage box, an isolation box, and a sliding groove that are interconnected. When the apparatus is not in use, the output end of the polishing mechanism is located inside the storage box. This reduces the impact of the polishing mechanism on glass addition operations.

[0009] According to the present invention, a polishing device for thinning glass substrates includes a reinforcement assembly consisting of a suction cup and an air pump. The suction cup is fixedly connected to the upper surface of a placement plate, and the lower end of the suction cup penetrates the placement plate and is fixedly connected to the air pump. This improves the ease of use of the reinforcement assembly.

[0010] According to the present invention, a polishing apparatus for thinning glass substrates includes a receiving groove on the upper surface of the placement plate, with the suction cup located inside the receiving groove, and the diameter of the receiving groove being larger than the diameter of the suction cup. This ensures that the suction cup has sufficient retraction space.

[0011] According to the present invention, a polishing device for thinning glass substrates comprises a servo motor, a rotating shaft, and a long polishing roller. The length of the T-shaped reinforcing block near the end of the long polishing roller is greater than the diameter of the long polishing roller, and the width of the T-shaped reinforcing block near the end of the long polishing roller is greater than the width of the groove. This reduces the likelihood of polishing residue passing through the groove.

[0012] Beneficial effects:

[0013] Compared with existing technologies, this polishing device for thinning glass substrates improves the shielding effect of the device on the glass substrate polishing area and reduces the impact of polishing residue on the working environment through the isolation box, chute, polishing mechanism, upper baffle, connecting rod, liquid supply box, blower, and automatic telescopic rod. The isolation box itself facilitates the collection of polishing residue, improving the convenience of polishing residue recovery. The important components of the device are all shielded, directly preventing residue from damaging the important components of the device. The cross mounting plate, cylinder, suction cup, and air pump facilitate the adjustment of the distance between the glass substrate and the polishing mechanism, expanding the applicability of the device. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a right-side structural view of a polishing apparatus for thinning glass substrates according to the present invention.

[0016] Figure 2 This is a left view of the polishing apparatus for thinning glass substrates according to the present invention.

[0017] Figure 3 This is a cross-sectional view of a polishing apparatus for thinning glass substrates according to the present invention.

[0018] Figure 4 This utility model relates to a polishing apparatus for thinning glass substrates. Figure 3 Enlarged structural diagram at point B;

[0019] Figure 5 This utility model relates to a polishing apparatus for thinning glass substrates. Figure 3 Enlarged structural diagram at point C.

[0020] Legend:

[0021] 1. Workbench; 2. Isolation box; 3. Placement plate; 4. Cross mounting plate; 5. Polishing mechanism; 6. T-shaped reinforcing block; 7. Slide groove; 8. Top baffle; 9. Storage box; 10. Automatic telescopic rod; 11. Liquid supply box; 12. Hair dryer; 13. Reinforcing components; 14. Storage groove; 15. Connecting rod; 16. Suction cup; 17. Air pump; 18. Mounting bracket; 19. Cylinder. Detailed Implementation

[0022] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0023] Reference Figure 1-5 This utility model discloses a polishing device for thinning glass substrates, comprising: a worktable 1, an isolation box 2 fixedly connected to the upper end of the worktable 1, the lower end of the isolation box 2 having a bucket-shaped structure and penetrating through the upper end of the worktable 1, the isolation box 2 having its own structure for providing directional sliding adjustment for polishing residue, wherein the isolation box 2 has no bottom wall, a cross mounting plate 4 fixedly connected inside the isolation box 2, the cross mounting plate 4 penetrating through the isolation box 2, and the part of the cross mounting plate 4 penetrating through the isolation box 2 contacting the upper surface of the worktable 1, a cylinder 19 fixedly connected to the upper surface of the cross mounting plate 4, a mounting frame 18 fixedly connected to the output end of the cylinder 19, a placement plate 3 fixedly connected to the upper end of the mounting frame 18, the length and width of the placement plate 3 being less than the length and width of the isolation box 2, and the placement plate 3 not contacting the inner wall of the isolation box 2, and the placement plate 3 completely blocking the power end of the cylinder 19 and the reinforcing component 13, the placement plate 3 being used to support the glass substrate to be polished.

[0024] Specifically, the cylinder 19 extends to raise the placement plate 3, and vice versa. The raised placement plate 3 brings the glass substrate closer to the polishing mechanism 5. The residue generated during the polishing process falls through the gap between the placement plate 3 and the isolation box 2. The placement plate 3 directly restricts the movement range of the residue after it falls, preventing the falling residue from contacting the cylinder 19 and the vacuum pump 17.

[0025] The lower end of the mounting bracket 18 is provided with a reinforcing component 13. The output end of the reinforcing component 13 passes through the placement plate 3 and contacts the lower surface of the glass substrate. The reinforcing component 13 consists of a suction cup 16 and an air pump 17. The suction cup 16 is fixedly connected to the upper surface of the placement plate 3, and the lower end of the suction cup 16 passes through the placement plate 3 and is fixedly connected to the air pump 17. The reinforcing component 13 is used to increase the stability of the glass substrate after placement and to prevent the glass substrate from sliding during the polishing process. The upper surface of the placement plate 3 is provided with a storage groove 14. The suction cup 16 is located inside the storage groove 14, and the diameter of the storage groove 14 is larger than the diameter of the suction cup 16. The storage groove 14 is used to provide retraction space for the suction cup 16.

[0026] Specifically, after the glass substrate is placed, it directly covers the suction cup 16. The air pump 17 extracts the air between the suction cup 16 and the glass substrate to increase the suction force of the suction cup 16. The suction cup 16 shrinks during the air extraction process, and the shrinking part of the suction cup 16 enters the storage groove 14 to ensure that the glass substrate is in flat contact with the surface of the placement plate 3.

[0027] The upper end of the isolation box 2 is equipped with a polishing mechanism 5 and a sliding groove 7. The front and rear ends of the polishing mechanism 5 are located inside the sliding groove 7. The polishing mechanism 5 consists of a servo motor, a rotating shaft, and a long grinding roller. The sliding groove 7 is used to provide the polishing mechanism 5 with the conditions for left and right sliding. A T-shaped reinforcing block 6 is slidably connected inside the sliding groove 7. The T-shaped reinforcing block 6 is rotatably connected to the polishing mechanism 5. The length of the end of the T-shaped reinforcing block 6 near the long grinding roller is greater than the diameter of the long grinding roller, and the width of the end of the T-shaped reinforcing block 6 near the long grinding roller is greater than the width of the sliding groove 7. The T-shaped reinforcing block 6 is used to improve the stability of the polishing mechanism 5 during the sliding process.

[0028] Specifically, the T-shaped reinforcing block 6 increases the contact area between the rotating shaft and the inner wall of the slide groove 7 in the polishing mechanism 5, thereby improving the stability of the polishing mechanism 5 during the sliding process. Since the rotating shaft and the T-shaped reinforcing block 6 are rotatably connected, the T-shaped reinforcing block 6 is used to avoid affecting the smoothness of the rotating shaft. The residue that splashes into the area of ​​the slide groove 7 is blocked by the T-shaped reinforcing block 6, thereby preventing the residue from passing through the slide groove 7.

[0029] An upper baffle 8 is slidably connected to the upper surface of the isolation box 2. The upper baffle 8 is used to shield the upward splashing residue. A connecting rod 15 is fixedly connected between the lower surface of the upper baffle 8 and the T-shaped reinforcing block 6. A blower 12 and a liquid supply box 11 are fixedly connected to the upper surface of the upper baffle 8. The output ends of the blower 12 and the liquid supply box 11 are located on the left and right sides of the polishing mechanism 5, respectively. The blower 12 is used to treat the residue on the surface of the glass substrate, and the liquid supply box 11 is used to provide polishing liquid to the polishing mechanism 5. A storage box 9 is fixedly connected to the left surface of the isolation box 2. The storage box 9 is interconnected with the isolation box 2 and the slide 7. When the device is not in use, the output end of the polishing mechanism 5 is located inside the storage box 9. The storage box 9 is used to temporarily store the polishing mechanism 5. An automatic telescopic rod 10 is fixedly connected to the upper surface of the storage box 9. The output end of the automatic telescopic rod 10 is fixedly connected to the left surface of the upper baffle 8. The automatic telescopic rod 10 is used to increase the stability of the polishing mechanism 5 during operation.

[0030] Specifically, the liquid outlet of the liquid supply box 11 corresponds to the forward direction of the polishing mechanism 5, providing polishing liquid to the polishing mechanism 5. The automatic telescopic rod 10 extends and pushes the upper baffle 8 to slide to the right. The upper baffle 8 is integrated with the polishing mechanism 5 through the connecting rod 15, thereby driving the polishing mechanism 5 to slide to the right synchronously. After the glass substrate is polished, the automatic telescopic rod 10 retracts and drives the upper baffle 8 and the polishing mechanism 5 to slide to the left. During the process of sliding to the left, the blower 12 blows away the residue on the surface of the glass substrate.

[0031] Working principle: When using the device, first lower the height of the placement plate 3 and move the polishing mechanism 5 inside the storage box 9. Then, place the glass substrate on the surface of the placement plate 3 and fix the glass substrate after placement using the reinforcing component 13. Then, adjust the height of the placement plate 3 so that the glass substrate contacts the polishing wheel of the polishing mechanism 5 to perform the polishing work on the glass substrate. Therefore, after the polishing work is completed, the polishing mechanism 5 is at the rightmost end of the isolation box 2. At this time, use the automatic telescopic rod 10 to pull the polishing mechanism 5 back into the storage box 9. During this process, turn on the blower 12 to blow away the residue on the surface of the glass substrate. The blown-off residue falls through the gap between the placement plate 3 and the isolation box 2 to the lower end of the workbench 1. During the use of the device, a miscellaneous box can be placed below the isolation box 2 to receive the fallen polishing residue.

[0032] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A polishing apparatus for thinning processing of a glass substrate, characterized by comprising: Include: Workbench (1), the upper end of the workbench (1) is fixedly connected with an isolation box (2), the inside of the isolation box (2) is fixedly connected with a cross mounting plate (4), the upper surface of the cross mounting plate (4) is fixedly connected with a pneumatic cylinder (19), the output end of the pneumatic cylinder (19) is fixedly connected with a mounting bracket (18), the upper end of the mounting bracket (18) is fixedly connected with a placing plate (3), the lower end of the mounting bracket (18) is provided with a reinforcing assembly (13), the output end of the reinforcing assembly (13) penetrates the placing plate (3) and is in contact with the lower surface of the glass substrate. The upper end of the isolation box (2) is provided with a polishing mechanism (5) and a chute (7), the front and rear ends of the polishing mechanism (5) are located inside the chute (7), the inside of the chute (7) is slidably connected with a T-shaped reinforcing block (6), the T-shaped reinforcing block (6) is rotatably connected with the polishing mechanism (5), the upper surface of the isolation box (2) is slidably connected with an upper baffle (8), the lower surface of the upper baffle (8) is fixedly connected with a connecting rod (15) between the T-shaped reinforcing block (6), the upper surface of the upper baffle (8) is fixedly connected with a hair dryer (12) and a liquid supply box (11), the output ends of the hair dryer (12) and the liquid supply box (11) are located on the left and right sides of the polishing mechanism (5) respectively. The left surface of the isolation box (2) is fixedly connected with a storage box (9), the upper surface of the storage box (9) is fixedly connected with an automatic telescopic rod (10), the output end of the automatic telescopic rod (10) is fixedly connected with the left surface of the upper baffle (8).

2. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The lower end of the isolation box (2) is a bucket-shaped structure, and the lower end of the isolation box (2) penetrates the upper end of the workbench (1).

3. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The cross mounting plate (4) penetrates the isolation box (2), and the part of the cross mounting plate (4) penetrating the isolation box (2) is in contact with the upper surface of the workbench (1).

4. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The length and width of the placing plate (3) are smaller than the length and width of the isolation box (2), and the placing plate (3) is not in contact with the inner wall of the isolation box (2), and the placing plate (3) completely shields the power end of the pneumatic cylinder (19) and the reinforcing assembly (13).

5. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The storage box (9) penetrates the isolation box (2) and the chute (7), when the device is not used, the output end of the polishing mechanism (5) is located inside the storage box (9).

6. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The reinforcing assembly (13) is composed of a suction cup (16) and a suction pump (17), the upper surface of the placing plate (3) is fixedly connected with the suction cup (16), the lower end of the suction cup (16) penetrates the placing plate (3) and is fixedly connected with the suction pump (17).

7. The polishing apparatus for thinning a glass substrate according to claim 6, wherein The upper surface of the placing plate (3) is provided with a receiving groove (14), the suction cup (16) is located inside the receiving groove (14), and the diameter of the receiving groove (14) is greater than the diameter of the suction cup (16).

8. The polishing apparatus for thinning a glass substrate according to claim 1, wherein The polishing mechanism (5) is composed of a servo motor, a rotating shaft and a polishing long roller, the length of the T-shaped reinforcing block (6) close to one end of the polishing long roller is greater than the diameter of the polishing long roller, and the width of the T-shaped reinforcing block (6) close to one end of the polishing long roller is greater than the width of the chute (7).

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