Wafer position mapping sensor, manipulator and wafer loading port

Abstract

A wafer position mapping sensor comprises a sensor body, a transmitting device, a receiving device, an amplifying device, a first wire and a second wire. The sensor body is connected with a manipulator or a wafer loading port, and the transmitting device and the receiving device are arranged on the sensor body; the amplifying device is arranged in the sensor body, the transmitting device and the receiving device are electrically connected with the amplifying device, the amplifying device is used for amplifying transmitting signals received by the receiving device, and the amplifying device is electrically connected with an external power source through a second wire. A transmitting device, a receiving device and an amplifying device are integrated in a sensor body, the transmitting device and the receiving device are arranged on the two sides of the interior of the sensor body respectively, the transmitting device and the receiving device are connected through a first wire, and the amplifying device is connected with an external power source through a second wire. Most of the wires are integrated in the sensor body, so that the space occupied by the wires is reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensors, and more specifically, to a wafer position mapping sensor, a robotic arm, and a wafer loading port. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. The main wafer processing methods are wafer fabrication and batch processing, which involve processing one or more wafers simultaneously. During wafer fabrication, wafers are often transferred. Commonly used wafer transfer devices include robotic arms or wafer loading ports. These devices hold the wafer and then move it to the target location by manipulating the robotic arm or wafer loading port, thus achieving wafer transfer.

[0003] When a robotic arm or wafer loading port is transporting a wafer, misalignment may occur, resulting in insufficient friction and causing the wafer to fall off. A common practice is to install fiber optic sensors on the robotic arm or wafer loading port to detect the wafer's position.

[0004] However, current fiber optic sensors mainly use optical fibers for signal transmission. Optical fiber cables have problems such as high rigidity, small bending radius, and easy breakage. In addition, amplification devices are required, which take up a lot of space. Utility Model Content

[0005] The purpose of this invention is to provide a wafer position mapping sensor, a robotic arm, and a wafer loading port, which greatly reduces the space occupied by the sensor by integrating the transmitting device, receiving device, and amplification device together.

[0006] The embodiments of this utility model are implemented as follows:

[0007] In a first aspect, an embodiment of this application provides a wafer position mapping sensor, which is installed on a robotic arm or a wafer loading port and used to detect the position of a wafer during transport. The sensor includes a sensor body, a transmitting device, a receiving device, an amplifying device, a first wire, and a second wire. The sensor body is connected to the robotic arm or the wafer loading port. The transmitting device and the receiving device are respectively disposed on opposite sides inside the sensor body. The transmitting device is used to emit a transmission signal toward the side of the wafer clamped by the robotic arm or the wafer loading port, and the receiving device is used to receive the transmission signal. The amplifying device is disposed inside the sensor body. The transmitting device and the receiving device are electrically connected to the amplifying device through the first wire. The amplifying device is used to amplify and receive the transmission signal received by the receiving device. The amplifying device is electrically connected to an external power supply through the second wire.

[0008] In a possible implementation, the sensor further includes a housing cover whose shape and size are matched to the sensor body and are used to cover the sensor body.

[0009] In a possible implementation, the sensor body includes a housing body and two first extension arms; the two first extension arms are respectively disposed opposite to each other at both ends of the same side of the housing body, the side of the wafer is located between the two first extension arms, the amplification device is disposed inside the housing body, and the transmitting device and the receiving device are respectively disposed opposite to each other inside the two first extension arms.

[0010] In a possible implementation, the housing cover includes a housing body and two second extension arms; the shape and size of the housing cover match the housing body, and the shape and size of the two second extension arms match the two first extension arms.

[0011] In a possible implementation, the inner sides of the two first extension arms are respectively provided with a first transmitting hole and a first receiving hole; the transmitting device is opposite to the first transmitting hole, and the receiving device is opposite to the first receiving hole.

[0012] In one possible implementation, the housing body is provided with potting compound, and the amplification device is fixedly mounted in the sensor body by the potting compound.

[0013] In a possible implementation, the two first extension arms are connected to the robotic arm or the wafer loading port via connectors.

[0014] Secondly, an embodiment of this application provides a robotic arm for transporting wafers, wherein the robotic arm is equipped with sensors according to any of the above embodiments.

[0015] Thirdly, an embodiment of this application provides a wafer loading port, which is used to open a wafer cassette and scan the wafer position. The wafer loading port is equipped with a sensor from any of the above embodiments.

[0016] The beneficial effects of this embodiment are as follows: By integrating the transmitting device, receiving device, and amplifying device into a single sensor body, with the transmitting and receiving devices respectively located on opposite sides of the sensor body and at corresponding transport positions, the integration of these components within the sensor body, along with the connection between the transmitting and receiving devices via a first wire and the connection between the amplifying device and an external power source via a second wire, minimizes the space occupied by the wires and avoids the problems associated with high wire rigidity, small bending radius, and easy breakage.

[0017] When no wafer is being fed onto the robotic arm or wafer loading port, or when the wafer is not in the correct position, the receiving device, positioned opposite the transmitting device, receives the transmitted signal. When a wafer is being fed onto the robotic arm or wafer loading port, the side of the wafer blocks the transmitted signal from the transmitting device, preventing the receiving device from receiving the signal. Therefore, the presence, thickness, and offset of the wafer are detected by checking whether the transmitted signal is blocked. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a structural diagram of a wafer position mapping sensor according to an embodiment of the present invention;

[0020] Figure 2 This is a positional relationship diagram of a wafer position mapping sensor according to an embodiment of the present invention, which can be used for in-situ detection and thickness detection.

[0021] Icons: 1. Sensor; 2. Sensor body; 21. Housing body; 211. Wire exit hole; 22. First extension arm; 3. Transmitting device; 4. Receiving device; 5. Amplifying device; 6. Housing cover; 61. Cover body; 62. Second extension arm; 7. First wire; 8. Second wire; 9. Encapsulating resin; 10. Connecting hole; 11. Wafer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] like Figure 1 and Figure 2 As shown in the figure, a wafer position mapping sensor according to an embodiment of this application is installed on a robot arm or wafer loading port and is used to detect the position of a wafer 11 clamped on the robot arm or wafer loading port. The sensor 1 includes a sensor body 2, a transmitting device 3, a receiving device 4, an amplifying device 5, a first wire 7, and a second wire 8. The sensor body 2 is connected to the robot arm or wafer loading port. The transmitting device 3 and the receiving device 4 are respectively disposed on opposite sides inside the sensor body 2. The transmitting device 3 is used to emit a transmission signal toward the side of the wafer clamped on the robot arm or wafer loading port, and the receiving device 4 is used to receive the transmission signal. The amplifying device 5 is disposed inside the sensor body 2. The transmitting device 3 and the receiving device 4 are electrically connected to the amplifying device 5 through the first wire 7. The amplifying device 5 is used to amplify the transmission signal received by the receiving device 4. The amplifying device 5 is electrically connected to an external power supply through the second wire 8.

[0029] In conjunction with the above embodiments, by integrating the transmitting device 3, the receiving device 4, and the amplifying device 5 into a single sensor body 2, the transmitting device 3 and the receiving device 4 are respectively disposed on opposite sides inside the sensor body 2 and located at their respective transmission positions. The amplifying device 5 can be a circuit board, which amplifies and processes the signal received by the receiving device. The transmitting device 3, the receiving device 4, and the amplifying device 5 are integrated inside the sensor body 2, with the transmitting device 3 and the receiving device 4 connected via a first wire 7, and the amplifying device 5 connected to an external power source via a second wire 8. Most of the wiring is integrated inside the sensor body 2, which reduces the space occupied by the wires and avoids problems caused by high wire rigidity, small bending radius, and easy breakage.

[0030] When the robotic arm is not transporting a wafer or the wafer is not in the correct position, the receiving device 4, which is positioned opposite the transmitting device 3, receives the transmitted signal. When the robotic arm is transporting a wafer 11, the side of the wafer 11 blocks the transmitted signal emitted by the transmitting device 3, and the receiving device 4 cannot receive the transmitted signal. Therefore, the presence, thickness, and displacement of the wafer 11 can be detected by whether the transmitted signal is blocked.

[0031] The wafer position mapping sensor of this application embodiment further includes a housing cover 6. The shape and size of the housing cover 6 match the sensor body 2 and are used to cover the sensor body 2. The shape of the housing cover 6 is the same as that of the sensor body 2, and the size of the housing cover 6 is slightly larger than that of the sensor body 2, so that the housing cover 6 can be covered on the sensor body 2, thereby protecting the sensor body 2 and its internal components.

[0032] The wafer position mapping sensor of this application embodiment includes a sensor body 2 comprising a housing body 21 and two first extension arms 22. The two first extension arms 22 are respectively disposed opposite each other at both ends of the same side of the housing body 21, with the side of the wafer 11 located between the two first extension arms 22. An amplification device 5 is disposed inside the housing body 21, and a transmitting device 3 and a receiving device 4 are respectively disposed opposite each other inside the two first extension arms 22. Correspondingly, the housing cover 6 includes a cover body 61 and two second extension arms 62. The shape and size of the cover body 61 match the housing body 21, and the shape and size of the two second extension arms 62 match the two first extension arms 22. The sensor body 2 and the housing cover 6 are generally U-shaped. The concave surfaces of the sensor body 2 and the housing cover 6 provide a space for the wafer 11 to avoid interference, allowing the side of the wafer 11 to extend into the concave surface, thereby blocking the transmission signal emitted by the transmitting device 3 and realizing multiple detections of the wafer 11's thickness, whether it is in place, and whether it is offset.

[0033] In the wafer position mapping sensor of this application embodiment, the inner sides of the two first extension arms 22 are respectively provided with a first emission aperture and a first receiving aperture. The emitting device 3 is opposite to the first emission aperture, and the receiving device 4 is opposite to the first receiving aperture, so that the emitted light emitted by the emitting device 3 can be emitted from the corresponding first emission aperture and input into the receiving device 4 through the first receiving aperture. Furthermore, the number of emitting devices 3 and receiving devices 4 can be single or multiple, that is, the emitting device 3 and receiving device 4 can have a one-to-one transmission-reception relationship, or a many-to-one or many-to-many transmission-reception relationship. For example, the number of emitting devices 3 and receiving devices 4 can be the same, such as one emitting device 3 and one receiving device 4, realizing a one-to-one transmission and reception relationship; the number of emitting devices 3 and receiving devices 4 can be multiple and the same, realizing a many-to-many transmission and reception relationship; the number of emitting devices 3 and receiving devices 4 can also be different, such as one emitting device 3 and multiple receiving devices 4, realizing a one-to-many transmission and reception relationship.

[0034] In this embodiment of the wafer position mapping sensor, the housing body 21 and the interiors of the two first extension arms 22 are both impregnated with potting compound 9. The amplification device 5 is fixed inside the sensor body 2 by the potting compound 9. The potted sensor can be placed in a vacuum device to remove air bubbles from the potting compound 9, and then the potted sensor can be cured by natural curing, heat drying, or other curing methods. Before potting, the amplification device 5 is fixed inside the sensor body 2 by adhesive, and the signal lines (first wire 7 and second wire 8) are fixed inside the sensor body 2 by dispensing. The wire outlet holes 211 of the sensor body 2 are temporarily sealed using putty, wax, plugs, or dispensing. Finally, the sensor body 2 is potted with potting compound 9, ensuring that the amplifier is immersed in the potting compound 9. After curing, the potting compound 9 can provide waterproofing, moisture resistance, dustproofing, insulation, thermal conductivity, confidentiality, corrosion resistance, temperature resistance, and shock resistance, thus protecting the internal components of the sensor.

[0035] The wafer position mapping sensor of this embodiment has two first extension arms 22, which are connected to a robot or wafer loading port via connectors. The connectors can be bolts or pins, and the corresponding connection holes 10 are threaded holes or blind holes with smooth interiors, thereby enabling the sensor to be mounted on the robot or wafer loading port.

[0036] Based on the same inventive concept, this application also provides a robotic arm. Since the implementation principle of the robotic arm in this application is the same as or similar to that of the wafer position mapping sensor in this application, the specific implementation of the robotic arm in this application can refer to any of the above-described implementations of the wafer position mapping sensor in this application, and the repeated parts will not be described again.

[0037] This application provides an embodiment of a robotic arm for transporting wafers, and the robotic arm is equipped with sensors from any of the above embodiments.

[0038] Based on the same inventive concept, this application also provides a wafer loading port. Since the implementation principle of the wafer loading port of this application is the same as or similar to that of the wafer position mapping sensor of this application, the specific implementation of the wafer loading port of this application can refer to any of the above-described implementations of the wafer position mapping sensor of this application, and the repeated parts will not be described again.

[0039] One embodiment of this application provides a wafer loading port, which is used to open a wafer cassette and scan the wafer position. The wafer loading port is equipped with a sensor from any of the above embodiments.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer position mapping sensor, comprising: The sensor is installed on a mechanical hand or a wafer loading port and used for detecting the position of wafer conveying, and comprises a sensor body, a transmitting device, a receiving device, an amplifying device, a first wire and a second wire; the sensor body is connected with the mechanical hand or the wafer loading port, the transmitting device and the receiving device are oppositely arranged at two sides inside the sensor body respectively, the transmitting device is used for transmitting a transmitting signal towards the side of the wafer clamped on the mechanical hand or the wafer loading end, and the receiving device is used for receiving the transmitting signal; the amplifying device is arranged inside the sensor body, the transmitting device and the receiving device are electrically connected with the amplifying device through the first wire respectively, the amplifying device is used for amplifying and receiving the transmitting signal received by the receiving device, and the amplifying device is electrically connected with an external power supply through the second wire.

2. The wafer position mapping sensor of claim 1, wherein, The sensor further comprises a shell cover which is matched with the sensor body in shape and size and used for covering the sensor body.

3. The wafer position mapping sensor of claim 2, wherein, The sensor body comprises a shell main body and two first extension arms; the two first extension arms are oppositely arranged at two ends of the same side of the shell main body respectively, the side of the wafer is located between the two first extension arms, the amplifying device is arranged inside the shell main body, and the transmitting device and the receiving device are oppositely arranged inside the two first extension arms respectively.

4. The wafer position mapping sensor of claim 3, wherein, The shell cover comprises a cover main body and two second extension arms; the shell cover is matched with the shell main body in shape and size, and the two second extension arms are matched with the two first extension arms in shape and size.

5. The wafer position mapping sensor of claim 4, wherein, The inner sides of the two first extension arms are oppositely provided with a first transmitting hole and a first receiving hole respectively; the transmitting device is opposite to the first transmitting hole, and the receiving device is opposite to the first receiving hole.

6. The wafer position mapping sensor of claim 3, wherein, The shell main body is provided with potting glue inside, and the amplifying device is fixedly arranged inside the sensor body through the potting glue.

7. The wafer position mapping sensor of claim 3, wherein, The two first extension arms are connected with the mechanical hand or the wafer loading port through a connecting piece.

8. A robot, characterized in that The mechanical hand is used for conveying wafers, and the sensor as claimed in any one of claims 1 to 7 is installed on the mechanical hand.

9. A wafer load port, characterized by, The wafer loading port is used for conveying wafers, and the sensor as claimed in any one of claims 1 to 7 is installed on the wafer loading port.

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