Silicon wafer direction adjusting mechanism and conveying device

Abstract

The utility model provides a silicon wafer direction adjusting mechanism and a conveying device, and relates to the technical field of silicon wafer conveying. The silicon wafer direction adjusting mechanism comprises a linear module on which a sliding seat is arranged in a sliding manner; the steering assembly comprises a first motor and an adjusting shaft, the first motor is arranged on the sliding seat, and the adjusting shaft is coaxially connected with an output shaft of the first motor; the adsorption assembly is arranged below the adjusting shaft and comprises a plurality of suction cups; the linear module and the steering assembly can enable the silicon wafers adsorbed on the plurality of suckers to move and change directions at the same time. The silicon wafer conveying device comprises the silicon wafer direction adjusting mechanism. According to the utility model, the directions of a plurality of silicon wafers can be switched at the same time, and the efficiency and the automation degree are high.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer transportation technology, specifically a silicon wafer orientation adjustment mechanism and transportation device. Background Technology

[0002] Silicon wafers are thin sheets made of high-purity silicon and are the fundamental material for manufacturing semiconductor devices and integrated circuits. In the photovoltaic industry, after a silicon wafer is cut from a whole wafer into half wafers, the half wafers usually need to be rearranged and reoriented to fit the module design and improve performance.

[0003] On existing automated production lines, vision inspection systems are used to identify markings on silicon wafers and guide robots or robotic arms to place the wafers in the correct orientation, ensuring that the long and short sides of the wafers meet the requirements. However, this method can only change the orientation of each wafer individually, which is inefficient, and the equipment using vision inspection systems and robotic arms is complex and costly. Utility Model Content

[0004] To address the problems of low efficiency and complex equipment in existing technologies that use vision inspection systems and robotic arms for orientation adjustment, this invention provides a silicon wafer orientation adjustment mechanism and transport device with low structural complexity, capable of simultaneously switching the orientation of multiple silicon wafers, and with high efficiency and automation.

[0005] The technical solution adopted in this utility model is:

[0006] A silicon wafer orientation adjustment mechanism, comprising:

[0007] A linear module, on which a sliding base is slidably mounted;

[0008] A steering assembly includes a first motor and an adjusting shaft, the first motor being mounted on the slide, and the adjusting shaft being coaxially connected to the output shaft of the first motor; and

[0009] An adsorption assembly, located below the adjustment shaft, includes multiple suction cups;

[0010] The linear module and steering assembly enable the silicon wafers adsorbed on the multiple suction cups to move and change direction together.

[0011] Furthermore, the adjusting shaft is rotatably connected to the slide block via a linear bearing, and a limit structure is provided between the adjusting shaft and the slide block.

[0012] Furthermore, a fixed frame is provided on the slide block, and the steering assembly also includes a coupling disposed within the fixed frame. The coupling is sleeved between the output shaft and the adjusting shaft of the first motor for coaxial transmission between the two.

[0013] Furthermore, the adsorption assembly also includes a mounting base, which is disposed between the adjusting shaft and the plurality of suction cups; a plurality of fixing members are spaced apart below the mounting base along its extending direction, and each of the fixing members is connected to one of the suction cups on each side.

[0014] Furthermore, the lower end of the adjusting shaft is connected to the center position of the mounting base.

[0015] Furthermore, the suction cup is a Bernoulli suction cup, with an air inlet and an air outlet on its upper surface, and an airflow valve communicating with the air inlet is provided on the mounting base.

[0016] Furthermore, a sensor is installed inside the air outlet, and the sensor is signal-connected to both the linear module and the steering assembly.

[0017] A silicon wafer transport device includes a silicon wafer orientation adjustment mechanism as described above.

[0018] Furthermore, it also includes:

[0019] The first wire body mechanism includes the first wire body;

[0020] The second line body mechanism includes a second line body, which is disposed in the extension direction of the first line body and located below one end of the linear module of the silicon wafer orientation adjustment mechanism; and

[0021] The third line body mechanism includes multiple third lines, which are located below the other end of the linear module of the silicon wafer orientation adjustment mechanism;

[0022] The silicon wafer orientation adjustment mechanism can adsorb multiple half-silicon wafers on the second line and place them on multiple third lines after movement and orientation change.

[0023] Furthermore, the first line body includes a front section and a rear section, and a detection mechanism is provided at the interval between the front section and the rear section. The detection mechanism includes a scanning camera disposed above the interval and a scanning light source disposed below the interval.

[0024] The beneficial effects of this utility model are:

[0025] 1. The direction adjustment mechanism of this utility model sets up a steering component between the linear module and the adsorption component. The linear module enables the adsorption component and the steering component to move horizontally together. At the same time, the first motor and the adjustment shaft drive the adsorption component to rotate horizontally. This allows the half-silicon wafer to complete the conversion of the long and short side transmission direction while changing the transfer line. This meets the design requirements of the process, equipment and components after the silicon wafer is cut from a whole wafer into half wafers. It solves the problem of low efficiency and complex equipment in the prior art of using a vision inspection system and a robotic arm for direction adjustment.

[0026] 2. The transmission device of this utility model relies on a direction adjustment mechanism between the second and third line mechanisms. By relying on the direction adjustment function of the direction adjustment mechanism, the long and short side transmission directions of the half-silicon wafer are simultaneously converted during the transfer of the changing line. This satisfies the design requirements of the process, equipment and components after the silicon wafer is cut from a whole wafer into half wafers. It solves the problems of low efficiency and complex equipment in the prior art that use vision inspection system and robotic arm for direction adjustment. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a three-dimensional schematic diagram of the adjustment mechanism according to an embodiment of the present utility model;

[0029] Figure 2 This is a three-dimensional schematic diagram of another state of the adjustment mechanism according to an embodiment of the present utility model;

[0030] Figure 3 for Figure 2 Enlarged view of point A;

[0031] Figure 4 This is a schematic diagram of the steering assembly according to an embodiment of the present invention;

[0032] Figure 5 This is a three-dimensional schematic diagram of the outer frame of an embodiment of the present utility model;

[0033] Figure 6 This is a perspective view of the transportation device according to an embodiment of the present utility model;

[0034] Figure 7 This is a three-dimensional schematic diagram of another state of the transportation device according to an embodiment of the present utility model;

[0035] Figure 8 This is a front view of the transportation device according to an embodiment of the present utility model.

[0036] Reference numerals: 100-First line mechanism, 120-First line, 122-Front section line, 124-Rear section line, 140-First support member, 142-Second motor;

[0037] 200 - Second production line mechanism, 220 - Second production line, 240 - Second support component, 242 - Third motor, 260 - Silicon wafer recycling box;

[0038] 300 - Third line mechanism, 320 - Third line, 340 - Third support component, 342 - Fourth motor;

[0039] 400 - Testing agency; 420 - Scanning camera; 440 - Scanning light source;

[0040] 520-Linear module, 524-Slide block, 525-Fixing frame, 540-Steering assembly, 542-First motor, 544-Coupling, 546-Adjusting shaft, 547-Limiting structure, 548-Linear bearing, 560-Adsorption assembly, 566-Mounting base, 567-Fixing component, 568-Suction cup, 5681-Air inlet, 5682-Air outlet, 569-Airflow valve;

[0041] 600 - Outer frame. Detailed Implementation

[0042] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0043] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this invention.

[0044] The embodiments of the utility model will now be described in detail with reference to the accompanying drawings.

[0045] Example 1

[0046] Please see Figures 1-5 This embodiment provides a silicon wafer orientation adjustment mechanism for adjusting the orientation of diced silicon wafers on a transport line to adapt to the design requirements of processes, equipment, and components. This silicon wafer orientation adjustment mechanism has low structural complexity and can simultaneously switch the orientation of multiple silicon wafers, exhibiting high efficiency and automation. The silicon wafer orientation adjustment mechanism mainly includes: a linear module 520, a steering assembly 540, and an adsorption assembly 560, etc.

[0047] The linear module 520 is mounted on the outer frame 600 of the silicon wafer transport system's wiring configuration, such as... Figure 5 As shown, this is used to move the position of a half-silicon wafer from the line of the previous process to the line of the next process. For example... Figures 1-3 As shown, the linear module 520 has a built-in drive circuit, a drive motor at one end, and a linear slide rail. Three connecting plates are located at the bottom of the linear module 520, near its two ends and the middle, respectively, for fixing the linear module 520 to the outer frame 600 of the silicon wafer transport system wiring configuration. In this embodiment, the linear module 520 has connecting grooves along both sides of the linear slide rail near its top. The lower part of the slide block 524 is roughly rectangular in cross-section and is fitted onto the linear module 520 via the connecting grooves on both sides. The slide block 524 can be driven to slide by the linear module 520. Furthermore, one side of the upper part of the slide block 524 extends outward along the linear slide rail perpendicular to the linear module 520, and a roughly rectangular fixing frame 525 is provided above the outer extension.

[0048] The steering assembly 540 is mounted on the linear module 520 and can be driven by the linear module 520 to move from above the line of the previous process to above the line of the next process. The steering assembly 540 is used to change the transport direction of the long and short sides of the silicon wafer during the movement to adapt to the design requirements of subsequent processes, equipment, and components. The steering assembly 540 mainly includes a first motor 542, a coupling 544, and an adjusting shaft 546, etc. Figure 4As shown, the first motor 542 is mounted above the fixed frame 525 of the slide 524, and the output shaft of the first motor 542 passes through the top wall of the fixed frame 525. The coupling 544 is located inside the fixed frame 525, with its upper end sleeved on the output shaft of the first motor 542 for transmission. Simultaneously, the lower end of the coupling 544 is sleeved on the upper end of the adjusting shaft 546. The adjusting shaft 546 is rotatably mounted on the outer extension of the slide 524 at the bottom of the fixed frame 525 via a linear bearing 548, and its lower end passes through the outer extension to connect with the adsorption assembly 560 below, thereby transmitting torque to the adsorption assembly 560, allowing the adsorption assembly 560 to rotate under the control of the first motor 542 and adjust its direction. In this embodiment, a limiting structure 547 is provided between the adjusting shaft 546 and the upper surface of the extended portion of the slide block 524. The limiting structure 547 mainly consists of a rotating component extending radially outward from the adjusting shaft 546 and two limiting blocks fixed to the upper surface of the slide block 524. The angle between the two limiting blocks and the line connecting the axis of the adjusting shaft 546 is 90°, thereby preventing the adjusting shaft 546 from rotating beyond the required 90° and ensuring that the long and short sides of the silicon wafer are transported in accordance with the requirements of subsequent processes. In one or more other embodiments, the first motor 542 can also be a stepper motor for precise control of the rotation angle to ensure that the long and short sides of the silicon wafer are transported in accordance with the requirements of subsequent processes. In this case, the limiting structure 547 may not be provided.

[0049] The adsorption component 560 is used to adsorb and fix the silicon wafers, and can drive the silicon wafers to rise and fall vertically. The adsorption component 560 is located below the steering component 540 and can change direction under the control of the steering component 540, thereby changing the transmission direction of the long and short sides of the adsorbed silicon wafers. The adsorption component 560 mainly includes a mounting base 566 and multiple suction cups 568. The mounting base 566 is located at the lower end of the adjusting shaft 546 and extends to both sides from its connection with the adjusting shaft 546. It is made of six-channel steel. Multiple fixing members 567 are spaced apart below the mounting base 566 along its extending direction. A suction cup 568 is located on each side of each fixing member 567. The two silicon wafers adsorbed by the suction cups 568 on both sides are cut from a single whole silicon wafer, so the spacing between the two silicon wafers can be matched with the spacing between the suction cups 568 on both sides. The suction cup 568 is a Bernoulli suction cup, and an airflow valve 569 is also provided on the side of the mounting base 566 above it. The air inlet 5681 of the suction cup 568 is connected to the airflow valve 569. The airflow valve 569 can adjust and control the gas flow rate on the suction surface of the suction cup 568, thereby using the Bernoulli principle to adsorb and fix the silicon wafers on the wire body, so that the silicon wafers maintain a reasonable spacing before being set during movement and change direction synchronously. In addition, in this embodiment, the lower end of the adjusting shaft 546 is connected to the center position of the mounting base 566, thereby making the torque transmission between the output shaft of the first motor 542, the adjusting shaft 546, and the mounting base 566 more stable.

[0050] One specific working method of this embodiment is as follows: Before adsorbing the silicon wafers, the position and arrangement direction of the multiple suction cups 568 on the adsorption component 560 are aligned with the direction of the line of the previous process by adjusting the position of the linear module 520 and the direction of the steering component 540; then, the multiple suction cups 568 adsorb and fix the multiple silicon wafers on the line of the previous process; then, through the linear module 520, the silicon wafers move together with the adsorption component 560 to the position of the line of the next process. At the same time, the steering component 540 rotates the adsorption component 560, causing the multiple silicon wafers to rotate 90° together, so that the long and short side directions of the multiple silicon wafers are reversed when transported on the line of the next process; when the silicon wafers move above the line of the next process, the adsorption force of the multiple suction cups 568 is adjusted to release the adsorption and fixation state, so that they can be transported on the line of the next process. At this time, the long and short side transport directions of the silicon wafers have been reversed, thereby saving the complicated steps of adjusting the direction of each silicon wafer in subsequent processes.

[0051] In summary, in this embodiment, the silicon wafer orientation adjustment mechanism uses a steering component 540 between the linear module 520 and the adsorption component 560. The linear module 520 drives the adsorption component 560 and the steering component 540 to move horizontally together. The first motor 542 and the adjustment shaft 546 drive the adsorption component 560 to rotate horizontally. This allows the half-wafer to complete the conversion of the long and short side transmission directions while changing the transfer line, thereby meeting the design requirements of the process, equipment, and components after the silicon wafer is cut from a whole wafer into half wafers. This solves the problems of low efficiency and complex equipment in the prior art when using a vision inspection system and a robotic arm for orientation adjustment.

[0052] like Figure 3 As shown in the figure, in this embodiment, a sensor (not shown) is also provided in the air outlet 5682 on the upper surface of each suction cup 568. The sensor detects the flow rate, sends a feedback signal, and determines whether a silicon wafer has been adsorbed on each suction cup 568. Furthermore, the sensor is signal-connected to both the linear module 520 and the steering assembly 540. Once it is determined that a silicon wafer has been adsorbed, the subsequent transportation and direction adjustment procedures can be initiated.

[0053] Example 2

[0054] The silicon wafer orientation adjustment mechanism in the above embodiments can also be directly applied to a complete silicon wafer transport device. Therefore, based on the first embodiment, the second embodiment provides a silicon wafer transport device.

[0055] Please see Figures 6-8 The silicon wafer transport device in the second embodiment mainly includes: a first line mechanism 100, a second line mechanism 200, a third line mechanism 300, a detection mechanism 400, and the silicon wafer orientation adjustment mechanism in the first embodiment.

[0056] The first wire assembly 100 is mainly used to transport the silicon wafers through the inspection assembly 400 and then into the second wire assembly 200. For example... Figures 6-8 As shown, the first line mechanism 100 mainly includes a first line 120 at the top and first support members 140 arranged on both sides below the first line 120. A second motor 142 is arranged on the side of the first support member 140 for driving the first line 120. Furthermore, the first line 120 is divided into a front section 122 and a rear section 124 that rotate synchronously, with the space between the two sections used to house the detection mechanism 400.

[0057] The inspection mechanism 400 is positioned vertically between the front section 122 and the rear section 124 of the first wire mechanism 100, and includes a scanning camera 420 positioned above the interval and a scanning light source 440 positioned below the interval. The scanning camera 420 scans the silicon wafer passing over the lower first wire 120, while the scanning light source 440 illuminates it from below for auxiliary imaging, thereby detecting quality problems such as microcracks on the silicon wafer.

[0058] The second wire mechanism 200 is located in the extension direction of the rear section 124 of the first wire mechanism 100. It is mainly used to transport the semi-silicon wafers to a position below the wafer orientation adjustment mechanism, facilitating adsorption by the adsorption component 560 of the wafer orientation adjustment mechanism. The second wire mechanism 200 mainly includes an upper second wire 220, second support members 240 arranged on both sides below the second wire 220, and a wafer recycling box 260 located at the end of the second wire 220 in the transmission direction. A third motor 242 is arranged on the side of the second support member 240 to drive the second wire 220. The wafer recycling box 260 is used to collect semi-silicon wafers with quality problems detected by the detection mechanism 400.

[0059] The third line mechanism 300 is used to transport the semi-silicon wafers after their orientation has been adjusted by the silicon wafer orientation adjustment mechanism, allowing them to enter subsequent processes. The third line mechanism 300 mainly includes multiple third lines 320 parallel to the second line 220, and multiple third support members 340 arranged on both sides below the third lines 320. Multiple fourth motors 342 are arranged on the sides of the third support members 340 for driving the third lines 320.

[0060] In this embodiment, the silicon wafer orientation adjustment mechanism is positioned between the second wire mechanism 200 and the third wire mechanism 300. The second wire mechanism 200 is located below one end of the linear module 520 of the silicon wafer orientation adjustment mechanism, and the second wire 220 is perpendicular to the linear module 520. The third wire mechanism 300 is located below the other end of the linear module 520, and the third wire 320 is also perpendicular to the linear module 520. The silicon wafer orientation adjustment mechanism is used to adsorb multiple half-silicon wafers on the second wire 220, and after movement and orientation change, they are placed on multiple third wires 320 for transportation.

[0061] One specific working method of this embodiment is as follows: First, the silicon wafers are transported from the first line 120 to the second line 220; at the same time, the scanning camera 420 of the detection mechanism 400 performs quality inspection; then, the silicon wafers on the second line 220 are transported to below the silicon wafer orientation adjustment mechanism; next, the silicon wafer orientation adjustment mechanism adjusts the position and arrangement direction of the multiple suction cups 568 on the adsorption assembly 560 to coincide with the direction of the second line 220; then, the silicon wafer orientation adjustment mechanism adsorbs and fixes the multiple silicon wafers and moves them to the transportation start position of the multiple third lines 320. At the same time, the long and short side directions of the multiple silicon wafers are reversed. After the multiple silicon wafers are released and placed on the third line 320, they can be transported in the direction rotated by 90°, thereby meeting the process and equipment requirements and saving the complicated steps of adjusting the orientation of each silicon wafer in subsequent processes. The silicon wafers with quality problems detected by the detection mechanism 400 are transported to the silicon wafer recycling box 260 through the second line 220.

[0062] In summary, in this embodiment, the silicon wafer transport device, by setting a silicon wafer orientation adjustment mechanism between the second line mechanism 200 and the third line mechanism 300, relies on the orientation adjustment function of the silicon wafer orientation adjustment mechanism to enable the half-wafer to simultaneously complete the conversion of the long and short side transport directions during the transfer process of the changing line. This satisfies the design requirements of the process, equipment, and components after the silicon wafer is cut from a whole wafer into half wafers, and solves the problems of low efficiency and complex equipment in the prior art that use vision inspection systems and robotic arms for orientation adjustment.

[0063] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer orientation adjustment mechanism, characterized in that, Include: A linear module (520) on which a slide block (524) is slidably disposed; A steering assembly (540) includes a first motor (542) and an adjusting shaft (546), wherein the first motor (542) is mounted on the slide (524), and the adjusting shaft (546) is coaxially connected to the output shaft of the first motor (542); and An adsorption assembly (560) is disposed below the adjustment shaft (546) and includes a plurality of suction cups (568). The linear module (520) and the steering assembly (540) enable the silicon wafers adsorbed on the plurality of suction cups (568) to move and change direction together.

2. The silicon wafer orientation adjustment mechanism as described in claim 1, characterized in that, The adjusting shaft (546) is rotatably connected to the slide (524) via a linear bearing (548), and a limit structure (547) is provided between the adjusting shaft (546) and the slide (524).

3. The silicon wafer orientation adjustment mechanism as described in claim 1, characterized in that, The slide (524) is provided with a fixed frame (525), and the steering assembly (540) also includes a coupling (544) disposed in the fixed frame (525). The coupling (544) is sleeved between the output shaft and the adjusting shaft (546) of the first motor (542) for coaxial transmission between the two.

4. The silicon wafer orientation adjustment mechanism as described in claim 1, characterized in that, The adsorption assembly (560) further includes a mounting base (566), which is disposed between the adjusting shaft (546) and a plurality of suction cups (568); a plurality of fasteners (567) are provided at intervals below the mounting base (566) along its extending direction, and each of the fasteners (567) is connected to a suction cup (568) on both sides.

5. The silicon wafer orientation adjustment mechanism as described in claim 4, characterized in that, The lower end of the adjusting shaft (546) is connected to the center of the mounting base (566).

6. The silicon wafer orientation adjustment mechanism as described in claim 4, characterized in that, The suction cup (568) is a Bernoulli suction cup, with an air inlet (5681) and an air outlet (5682) on its upper surface. The mounting base (566) is provided with an airflow valve (569) that communicates with the air inlet (5681).

7. The silicon wafer orientation adjustment mechanism as described in claim 6, characterized in that, A sensor is installed inside the air outlet (5682), and the sensor is signal connected to the linear module (520) and the steering assembly (540).

8. A silicon wafer transport device, characterized in that, It includes the silicon wafer orientation adjustment mechanism as described in any one of claims 1-7.

9. The silicon wafer transport device as described in claim 8, characterized in that, Also includes: The first wire body mechanism (100) includes a first wire body (120); The second wire body mechanism (200) includes a second wire body (220), which is disposed in the extension direction of the first wire body (120) and located below one end of the linear module (520) of the silicon wafer orientation adjustment mechanism; and The third line body mechanism (300) includes multiple third lines (320) disposed below the other end of the linear module (520) of the silicon wafer orientation adjustment mechanism; The silicon wafer orientation adjustment mechanism can adsorb multiple half-silicon wafers on the second line (220) and place them on multiple third lines (320) after movement and orientation change.

10. The silicon wafer transport device as described in claim 9, characterized in that, The first line body (120) includes a front section line body (122) and a rear section line body (124). A detection mechanism (400) is provided at the interval between the front section line body (122) and the rear section line body (124). The detection mechanism (400) includes a scanning camera (420) disposed above the interval and a scanning light source (440) disposed below the interval.

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