Electroplating hanger suitable for ultrathin fragile substrate

Abstract

The utility model discloses an electroplating hanger applicable to an ultrathin fragile substrate, which comprises a rectangular frame (1), an electroplating hanger (2), a plurality of electroplating hangers (3) and a plurality of electroplating hangers (4), and is characterized in that the rectangular frame is divided into a plurality of grids; the side clamping grooves (2) are formed in the left side frame and the right side frame of each grid; the lower supporting clamping grooves (3) are formed in the bottom frame of each grid; the conductive snap ring bolts (4) are mounted on the left side frame and the right side frame of each grid; and the conductive clamp (5) is connected with the conductive snap ring through a conductive connecting piece and is used for clamping the substrate (6). The utility model has the beneficial effects that the ultrathin fragile substrate can be uniformly stressed in the operation process of loading and unloading the substrate, and the damage caused by improper design or operation of the hanging tool is avoided, so that the rejection rate of the whole substrate is obviously reduced, and the waste of production cost is reduced.

Description

Technical Field

[0001] This utility model relates to electroplating after PVD process, and more particularly to an electroplating fixture suitable for ultra-thin and fragile substrates (thickness <0.15mm). Background Technology

[0002] PVD, or Physical Vapor Deposition, is a technology that uses physical methods under vacuum conditions to vaporize solid or liquid material sources into gaseous atoms, molecules, or partially ionized ions, and then deposits a thin film with specific functions onto a substrate surface using low-pressure gas or plasma. Electroplating is a crucial process in thin-film product manufacturing, and spring-loaded hangers are commonly used to suspend substrates in this process. However, spring-loaded hangers have revealed some significant drawbacks in practical applications. Especially when handling thin or brittle products, such as those less than 0.15mm thick, these products are highly susceptible to breakage during loading and unloading due to uneven stress or improper handling. Once a product breaks, not only is the entire board scrapped, increasing production costs, but the irreversible nature of the damage also prevents rework and reuse, severely hindering subsequent related processes.

[0003] For example, Chinese Utility Model Patent Publication No. CN217997374U discloses a DPC ceramic plate electroplating fixture, including: a fixture frame and a fixture, wherein the fixture includes an upper spring hook and a lower spring hook, the fixture frame includes a frame and a fixture mounting crossbar, the upper spring hook is disposed on the fixture mounting crossbar, the lower spring hook is disposed below the upper spring hook and connected to the fixture mounting crossbar, and the DPC ceramic plate is disposed between the upper spring hook and the lower spring hook; this electroplating fixture uses spring hooks to fix the DPC ceramic plate to be electroplated, and is not suitable for products that are thin or brittle. Utility Model Content

[0004] The technical problem to be solved by this utility model is that existing spring hook type hangers will cause product breakage when handling products that are thin or brittle. Therefore, an electroplating hanger suitable for ultra-thin and fragile substrates is provided.

[0005] This utility model provides the following technical solution: an electroplating fixture suitable for ultra-thin and fragile substrates, comprising: a rectangular frame divided into several grids; side slots disposed on the left and right side edges of each grid; a bottom support slot disposed on the bottom edge of each grid; conductive retaining rings installed on the left and right side edges of each grid; and a conductive clamp connected to the conductive retaining rings via a conductive connector for clamping the substrate.

[0006] In the above scheme, the conductive retaining ring is connected to the left and right side frames through the base.

[0007] The base described in the above scheme includes an integrally formed base and a limiting block, and the conductive retaining ring is sleeved on the base.

[0008] The side slot in the above solution has an I-shaped structure, and the end of the I-shaped structure facing the grid has an opening slot for clamping the substrate.

[0009] The lower tray groove in the above scheme has a Z-shaped structure, and the end of the Z-shaped structure facing the grid has an opening groove for clamping the substrate.

[0010] An improvement to the above solution is that a hook is provided at one end of the rectangular frame.

[0011] A further improvement to the above solution is that a bracket is provided at the other end of the rectangular frame.

[0012] The beneficial effects of this invention are as follows: During the loading and unloading process, the ultra-thin and fragile substrate can be evenly stressed, avoiding damage caused by improper fixture design or operation, thereby significantly reducing the overall scrap rate and minimizing production cost waste. Simultaneously, this invention possesses excellent adaptability and flexibility, meeting the hanging requirements of film products of different sizes, shapes, and materials, ensuring the smooth progress of the electroplating metal process, and not hindering subsequent assembly, testing, and other processes, ultimately improving overall production efficiency and product quality. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 yes Figure 1 The main view;

[0015] Figure 3 This is a schematic diagram of the utility model in use;

[0016] In the diagram: 1. Rectangular frame, 2. Side slot, 3. Lower support slot, 4. Conductive retaining ring, 5. Conductive clip, 6. Base plate, 7. Hook, 8. Bracket. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] like Figures 1-3As shown, an electroplating fixture suitable for ultra-thin and fragile substrates includes: a rectangular frame 1, which is divided into several grids; side slots 2, which are provided on the left and right sides of each grid, and can be referred to as left slots and right slots; a bottom support slot 3, which is provided on the bottom side of each grid; conductive retaining rings 4, which are installed on the left and right sides of each grid; and a conductive clamp 5, which is connected to the conductive retaining rings through a conductive connector and is used to clamp the substrate 6.

[0019] Specifically, there can be one or two left slots, and correspondingly one or two right slots. There can also be one or two lower support slots. These slots constrain the substrate, preventing it from breaking during electroplating due to shaking or external forces. This provides stable substrate fixation without damage, enhancing its stability and protection, and improving the quality and yield of the electroplated product. The conductive retaining ring plays a crucial role in conductivity. Current is transmitted through the connection of conductive connectors, such as copper wires, to the retaining ring. The other end is secured by a conductive clamp, ensuring the stability and reliability of the conductive connection and providing the necessary current support for the electroplating process.

[0020] The conductive retaining ring is connected to the left and right side frames via a base. The base includes a base and a limiting block. The conductive retaining ring is sleeved on the base. The base and the limiting block can be integrally formed or processed separately and then fixedly connected together. The limiting block prevents the conductive retaining ring from detaching.

[0021] The side slot has an I-shaped structure, and the end of the I-shaped structure facing inwards from the grid has an opening for clamping the substrate. The lower support slot has a Z-shaped structure, and the end of the Z-shaped structure facing inwards from the grid has an opening for clamping the substrate.

[0022] To facilitate the placement of this electroplating fixture, a hook 7 is provided at one end of the rectangular frame, and a bracket 8 is provided at the other end of the rectangular frame.

Claims

1. An electroplating fixture suitable for ultra-thin and fragile substrates, characterized in that: include: A rectangular frame (1) is divided into several grids; Side slot (2), the side slot is set on the left and right side edges of each grid; bottom slot (3), the bottom slot is set on the bottom edge of each grid; conductive ring bolt (4), the conductive ring bolt is installed on the left and right side edges of each grid; conductive clamp (5), the conductive clamp is connected to the conductive ring through a conductive connector, and is used to clamp the substrate (6).

2. The electroplating fixture for ultra-thin, fragile substrates as described in claim 1, characterized in that: The conductive retaining ring is connected to the left and right side frames via a base.

3. The electroplating fixture for ultra-thin, fragile substrates as described in claim 2, characterized in that: The base includes an integrally formed base and a limiting block, and the conductive retaining ring is sleeved on the base.

4. The electroplating fixture for ultra-thin, fragile substrates as described in claim 1, characterized in that: The side slot has an I-shaped structure, and the end of the I-shaped structure facing the grid has an opening slot for holding the substrate.

5. The electroplating fixture for ultra-thin, fragile substrates as described in claim 1, characterized in that: The lower tray has a Z-shaped structure, and the end of the Z-shaped structure facing the grid has an opening groove for holding the substrate.

6. The electroplating fixture for ultra-thin, fragile substrates as described in claim 1, characterized in that: One end of the rectangular frame is provided with a hook (7).

7. The electroplating fixture for ultra-thin, fragile substrates as described in claim 6, characterized in that: The other end of the rectangular frame is provided with a bracket (8).

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