Dehumidification module and dehumidifier comprising same

Abstract

The utility model discloses a dehumidification module and a dehumidifier comprising the same. The dehumidification module comprises a dehumidification assembly, a separator and a fastener; the dehumidification assembly comprises a condensation piece, a first heat conduction piece, a semiconductor refrigeration piece, a second heat conduction piece and a cooling piece which are sequentially stacked. The isolation piece is arranged on the side, away from the semiconductor refrigeration piece, of the condensation piece, and / or the isolation piece is arranged on the side, away from the semiconductor refrigeration piece, of the cooling fin; the fastener penetrates through the separator, the condensation sheet and the cooling sheet, so that the condensation sheet and the cooling sheet clamp and fix the first heat conducting sheet, the semiconductor chilling sheet and the second heat conducting sheet, and the end part of the fastener is propped against one side, far away from the semiconductor chilling sheet, of the separator. Therefore, abrasion of the semiconductor chilling plate caused by too tight clamping can be effectively avoided, the service life of the semiconductor chilling plate is prolonged, deformation of the condensation plate and the cooling plate caused by point contact is avoided, the surface flatness of the condensation plate and the cooling plate is guaranteed, and the dehumidification module can work more efficiently.

Description

Technical Field

[0001] This utility model relates to the field of dehumidification technology, and in particular to a dehumidification module and a dehumidifier including the same. Background Technology

[0002] With the booming economy, people are paying unprecedented attention to their health and the air quality of their living environment. Against this backdrop, the market demand for dehumidifiers and related accessories, especially multi-functional dehumidifiers, has shown a continuous growth trend, and the dehumidifier product industry has entered a period of rapid development.

[0003] A dehumidifier works by drawing in humid air, processing it internally, and then releasing fresh air suitable for breathing, effectively maintaining indoor air circulation and comfort. For this reason, more and more families are choosing to purchase a dehumidifier to improve their indoor environment.

[0004] Existing dehumidification modules typically consist of a condenser fin, a thermoelectric cooler, and a heat sink stacked sequentially. The thermoelectric cooler has a cold side and a hot side, with the cold side contacting the condenser fin and the hot side contacting the heat sink. Furthermore, to enhance thermal conductivity, thermally conductive adhesive is usually applied between the cold side and the condenser fin, and between the hot side and the heat sink. Additionally, fasteners are installed between the condenser fin and the heat sink; by tightening these fasteners, the condenser fin and the heat sink can clamp and secure the thermoelectric cooler, ensuring good thermal contact between the components and thus improving dehumidification efficiency.

[0005] However, the existing dehumidification modules mentioned above have the following prominent problems in practical applications:

[0006] 1. Semiconductor Cooler Component Wear: During the tightening process, the difficulty in controlling the clamping force can cause the semiconductor cooler component to wear due to excessive clamping. As a core component of the dehumidification module, the performance and lifespan of the semiconductor cooler component are directly affected by wear. Severe wear will not only reduce the dehumidification efficiency of the dehumidification module but may also cause the dehumidifier to malfunction.

[0007] 2. Deformation of the condenser fin or heat sink: The fastener cap directly abuts against the surface of the condenser fin or heat sink. Because the contact between the cap and the condenser fin or heat sink is point-like, this uneven localized stress can cause deformation of the condenser fin or heat sink. This deformation disrupts the surface flatness of the condenser fin and heat sink, affecting heat conduction with the thermoelectric cooler and hindering efficient heat transfer, thus reducing the dehumidification module's efficiency. Utility Model Content

[0008] In order to overcome at least one of the defects described in the prior art, the present invention provides a dehumidification module and a dehumidifier including the same, aiming to solve the problems of easy wear of semiconductor cooling chips, easy deformation of condenser plates or heat sinks, and easy loosening of fasteners in existing dehumidification modules, thereby improving the stability and dehumidification efficiency of the dehumidification module.

[0009] The technical solution adopted by this utility model to solve its problem is:

[0010] A dehumidification module includes: a dehumidification assembly comprising a condenser plate, a first heat-conducting plate, a thermoelectric cooler plate, a second heat-conducting plate, and a heat sink stacked sequentially; an isolator disposed on the side of the condenser plate away from the thermoelectric cooler plate, and / or, the isolator disposed on the side of the heat sink away from the thermoelectric cooler plate; and a fastener passing through the isolator, the condenser plate, and the heat sink, such that the condenser plate and the heat sink clamp and fix the first heat-conducting plate, the thermoelectric cooler plate, and the second heat-conducting plate, wherein the end of the fastener abuts against the side of the isolator away from the thermoelectric cooler plate.

[0011] According to some embodiments of the present invention, the isolation member is elongated and has a first side relatively close to the thermoelectric cooler; the first side abuts against the side of the condenser away from the thermoelectric cooler, and / or, the first side abuts against the side of the heat sink away from the thermoelectric cooler.

[0012] According to some embodiments of the present invention, the isolation member has at least two contact portions; an assembly portion is connected between two adjacent contact portions, and the fastener passes through the assembly portion; the contact portions of the same isolation member abut against the side of the condenser plate away from the semiconductor cooling plate, and / or, the contact portions of the same isolation member abut against the side of the heat sink away from the semiconductor cooling plate.

[0013] According to some embodiments of the present invention, the isolation member has a curved cross-section in the length direction, and the protrusion directions of the contact portion and the assembly portion are opposite.

[0014] According to some embodiments of the present invention, the assembly part has a connecting block protruding on the side relatively close to the semiconductor cooling chip, and the rod portion of the fastener passes through the connecting block.

[0015] According to some embodiments of the present invention, the assembly part has a connecting platform protruding on the side relatively away from the semiconductor cooling chip, and the end of the fastener abuts against the connecting platform.

[0016] According to some embodiments of the present invention, the first heat-conducting sheet and the second heat-conducting sheet are made of soft materials.

[0017] According to some embodiments of the present invention, the dehumidification assembly further includes condenser fins and heat dissipation fins. The condenser fins are disposed on the side of the condenser fins away from the first heat-conducting plate, and the heat dissipation fins are disposed on the side of the heat dissipation plate away from the second heat-conducting plate.

[0018] In addition, this utility model also provides a dehumidifier, including the dehumidification module as described above, and also including a main housing and a water collection tray. The main housing is provided with a receiving cavity, the dehumidification module is disposed in the receiving cavity, the water collection tray is disposed in the receiving cavity and located below the dehumidification module, the receiving cavity is provided with a guide wall, the guide wall is located above the water collection tray, and the guide wall at least partially covers the outer periphery of the water collection tray.

[0019] According to some embodiments of this utility model, the dehumidifier further includes a water tank and a drain pipe. The drain pipe is connected to the outside of the dehumidifier. Both the water tank and the drain pipe are detachably connected to the main housing. When the drain pipe is installed to the main housing, the drain pipe is connected to the water collection tray. When the drain pipe is detached from the main housing, the water tank is connected to the water collection tray.

[0020] In summary, the dehumidification module and dehumidifier including the present invention have at least the following technical effects:

[0021] On the one hand, the first heat-conducting plate is placed between the condenser plate and the thermoelectric cooler plate to provide heat conduction and buffering, and the second heat-conducting plate is placed between the heat sink and the thermoelectric cooler plate to provide heat conduction and buffering. This effectively prevents the thermoelectric cooler plate from wearing due to being clamped too tightly, extends the service life of the thermoelectric cooler plate, and improves the stability and reliability of the dehumidification module. On the other hand, due to the presence of the insulating components, the ends of the fasteners do not directly abut against the condenser plate and the heat sink, avoiding deformation of the condenser plate and the heat sink due to point contact, ensuring the surface flatness of the condenser plate and the heat sink, thereby improving the heat conduction effect and enabling the dehumidification module to work more efficiently. Furthermore, compared with the use of thermally conductive adhesive, the use of the first and second heat-conducting plates reduces the requirements of the production process and improves the production efficiency. Moreover, the placement of the first and second heat-conducting plates can accommodate the deformation tolerances and production tolerances of the condenser plate, the thermoelectric cooler plate, and the heat sink, and can always form good thermal contact under various conditions to ensure the dehumidification effect. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the assembly structure of the condenser fins, dehumidification assembly, and heat dissipation fins according to an embodiment of the present utility model;

[0023] Figure 2This is a top view of the assembled condenser fins, dehumidifier assembly, and heat dissipation fins according to an embodiment of the present invention.

[0024] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure in the CC direction;

[0025] Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure in the DD direction;

[0026] Figure 5 This is a schematic diagram of the structure of the isolation component according to an embodiment of the present utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the dehumidifier according to an embodiment of the present utility model;

[0028] Figure 7 This is a cross-sectional structural diagram of the dehumidifier according to an embodiment of the present invention;

[0029] Figure 8 for Figure 7 A magnified view of part A in the middle.

[0030] The meanings of the reference numerals in the attached figures are as follows:

[0031] 1. Dehumidification component; 11. Condenser fin; 12. First heat-conducting fin; 13. Semiconductor cooling chip; 14. Second heat-conducting fin; 15. Heat sink; 2. Isolator; 21. Contact part; 22. Assembly part; 221. Connecting block; 222. Connecting platform; 3. Fastener; 31. End; 32. Rod; 4. Condenser fin; 5. Heat sink fin; 6. Fan; 7. Main housing; 71. Receiving cavity; 72. Guide wall; 8. Water collection tray; 9. Drain pipe; 91. Drain outlet; 10. Water receiving tray; 20. Water tank. Detailed Implementation

[0032] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0033] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0035] The present invention will now be described in further detail with reference to the accompanying drawings.

[0036] Example 1

[0037] Please see Figures 1 to 5 This embodiment discloses a dehumidification module, which includes a dehumidification component 1, an isolation member 2, and a fastener 3. The dehumidification component 1 includes a condenser plate 11, a first heat-conducting plate 12, a thermoelectric cooler 13, a second heat-conducting plate 14, and a heat sink 15 stacked sequentially. The isolation member 2 is disposed on the side of the condenser plate 11 away from the thermoelectric cooler 13, and / or, the isolation member 2 is disposed on the side of the heat sink 15 away from the thermoelectric cooler 13. The fastener 3 passes through the isolation member 2, the condenser plate 11, and the heat sink 15 so that the condenser plate 11 and the heat sink 15 clamp and fix the first heat-conducting plate 12, the thermoelectric cooler 13, and the second heat-conducting plate 14. The end 31 of the fastener 3 abuts against the side of the isolation member 2 away from the thermoelectric cooler 13.

[0038] The dehumidification module disclosed in this embodiment has the following technical effects:

[0039] First, the first heat-conducting plate 12 is disposed between the condenser plate 11 and the thermoelectric cooler 13 to provide heat conduction and buffering. The second heat-conducting plate 14 is disposed between the heat sink 15 and the thermoelectric cooler 13 to provide heat conduction and buffering. This can effectively prevent the thermoelectric cooler 13 from being worn due to being clamped too tightly, extend the service life of the thermoelectric cooler 13, and improve the stability and reliability of the dehumidification module.

[0040] Secondly, due to the presence of the isolator 2, the end 31 of the fastener 3 does not directly abut against the condenser 11 and the heat sink 15, thus avoiding deformation of the condenser 11 and the heat sink 15 caused by point contact, ensuring the surface flatness of the condenser 11 and the heat sink 15, thereby improving the heat conduction effect and enabling the dehumidification module to work more efficiently.

[0041] Furthermore, the isolation component 2 can buffer the vibration generated by the operation of the internal fan 6 of the dehumidifier, reduce the vibration of the fastener 3, effectively prevent the fastener 3 from loosening, ensure the overall installation stability of the dehumidification module, and guarantee the normal operation of the dehumidification module.

[0042] In addition, compared with the use of thermally conductive adhesive, the use of the first thermally conductive sheet 12 and the second thermally conductive sheet 14 reduces the requirements of the production process and improves the production efficiency. Furthermore, the arrangement of the first thermally conductive sheet 12 and the second thermally conductive sheet 14 can accommodate the deformation tolerance and production tolerance of the condenser fin 11, the semiconductor cooling fin 13 and the heat sink 15, and can always form good thermal contact under various conditions to ensure the dehumidification effect.

[0043] Finally, the first heat-conducting sheet 12 and the second heat-conducting sheet 14 are closely attached to the thermoelectric cooler 13, forming an efficient heat conduction path. This path can quickly transfer the heat absorbed by the condenser sheet 11 to the cold surface of the thermoelectric cooler 13 and transfer the heat from the hot surface of the thermoelectric cooler 13 to the heat sink 15. The presence of the insulating member 2 ensures the flatness of the condenser sheet 11 and the heat sink 15, making the contact between the first heat-conducting sheet 12 and the second heat-conducting sheet 14 and them more compact and stable.

[0044] Preferably, in this embodiment, the fastener 3 may be, but is not limited to, a screw, bolt, or clip, etc., and can be selected according to actual needs, without being limited to a single type.

[0045] It should be noted that the isolation element 2 can be installed only on the condenser 11 or only on the heat sink 15, or it can be installed on both the condenser 11 and the heat sink 15. The choice can be made according to the actual needs.

[0046] like Figure 4 and Figure 5 As shown, preferably, in this embodiment, the isolator 2 has at least two contact portions 21; an assembly portion 22 connects adjacent contact portions 21, and a fastener 3 passes through the assembly portion 22; each contact portion 21 of the same isolator 2 abuts against the side of the condenser 11 away from the thermoelectric cooler 13, and / or, each contact portion 21 of the same isolator 2 abuts against the side of the heat sink 15 away from the thermoelectric cooler 13. This achieves the following technical effects:

[0047] On one hand, the isolator 2 has at least two contact portions 21. When the fastener 3 fixes the isolator 2 in the dehumidification module through the assembly portion 22, each contact portion 21 abuts against the side of the condenser fin 11 or heat sink 15 away from the semiconductor cooling chip 13. Compared with the traditional single-point contact structure, multiple contact portions 21 can distribute the pressure applied by the fastener 3 over a larger area. For example, if the isolator 2 has three contact portions 21, the pressure originally concentrated at one point will be evenly distributed to the areas corresponding to the three contact portions 21. This avoids local dents or deformations of the condenser fin 11 or heat sink 15 due to excessive local pressure, ensuring the overall flatness of the condenser fin 11 and heat sink 15.

[0048] On the other hand, during actual installation, the tightening force of fastener 3 may vary due to differences in manual operation or tools. The design of the multi-contact part 21 can better adapt to such variations in installation force. Even if the tightening force of fastener 3 is large, the multiple contact parts 21 can share the pressure, preventing damage to the condenser fin 11 or heat sink 15 due to excessive local force. Conversely, if a single-point contact structure is used, the pressure borne by a single point will increase sharply under a large tightening force, which can easily lead to deformation of the condenser fin 11 or heat sink 15.

[0049] On the other hand, the isolation component 2 has at least two contact portions 21. Compared with the traditional single-point contact isolation structure, multiple contact portions 21 can make contact with the condenser fins 11 or heat sinks 15 more extensively. When the internal fan 6 of the dehumidifier vibrates during operation, or when it is subjected to external impact, the multiple contact portions 21 can work together to disperse the impact force generated by the vibration over a larger area. For example, if the isolation component 2 has three contact portions 21, the impact force that was originally concentrated at one point will be dispersed to the area corresponding to the three contact portions 21, thereby greatly reducing the pressure borne by a single contact portion 21. This effectively avoids deformation of the condenser fins 11 or heat sinks 15 due to excessive local pressure, further ensuring good thermal contact between the components and improving the stability and working efficiency of the dehumidification module.

[0050] It should be noted that in some other embodiments, the spacer 2 may also be, but is not limited to, elongated strip shape, and the spacer 2 has a first side relatively close to the thermoelectric cooler 13; the first side abuts against the side of the condenser 11 away from the thermoelectric cooler 13, and / or, the first side abuts against the side of the heat sink 15 away from the thermoelectric cooler 13. The choice can be made according to actual needs, and no single limitation is made here.

[0051] like Figure 4 and Figure 5 As shown, preferably, in this embodiment, the separator 2 has a curved cross-section in the length direction, and the protrusion directions of the contact portion 21 and the assembly portion 22 are opposite. Thus, this design has the following technical effects:

[0052] On the one hand, the isolation component 2 has a curved cross-section along its length, and the protrusion directions of the contact portion 21 and the assembly portion 22 are opposite. This unique design gives it bidirectional buffering capability. During the operation of the dehumidifier, the vibration direction generated by the internal components is often complex and variable. When the vibration is transmitted to the isolation component 2, whether the vibration is along the protrusion direction of the contact portion 21 or the protrusion direction of the assembly portion 22, the curved cross-section can absorb and disperse the vibration energy through its own elastic deformation. For example, when the fan 6 operates and generates horizontal vibration, if the vibration direction is consistent with the protrusion direction of the contact portion 21, the contact portion 21 will first undergo elastic deformation to buffer the vibration. If the vibration direction is biased towards the protrusion direction of the assembly portion 22, the assembly portion 22 can also play a buffering role, effectively reducing the impact of vibration on the condenser fins 11 and the heat sink 15, and reducing the possibility of them deforming due to vibration.

[0053] On the other hand, the curved cross-sectional design helps the isolator 2 maintain good contact with the condenser 11 and the heat sink 15 after installation. The reasonable layout of the contact portion 21 and the assembly portion 22 allows the isolator 2 to better fit the surfaces of the condenser 11 and the heat sink 15, ensuring a large contact area. At the same time, because the isolator 2 can effectively buffer vibration and disperse stress, it reduces the deformation of the condenser 11 and the heat sink 15 caused by uneven stress, thereby maintaining the flatness of their surfaces. Good contact and flatness are beneficial to the heat conduction between the condenser 11, the first heat-conducting plate 12, the semiconductor cooling plate 13, the second heat-conducting plate 14, and the heat sink 15, improving the heat conduction efficiency and reducing local overheating or underheating caused by poor heat conduction, indirectly reducing the possibility of deformation caused by temperature differences.

[0054] On the other hand, during the operation of the dehumidifier, the temperature of the condenser 11 and the heat sink 15 will change, resulting in thermal expansion. The curved isolation component 2 can better adapt to this thermal expansion. Its elastic deformation ability can absorb the dimensional changes caused by thermal expansion to a certain extent, avoiding stress concentration and deformation of the condenser 11 and the heat sink 15 due to the obstruction of thermal expansion.

[0055] Preferably, in this embodiment, the separator 2 is made of cold-resistant nylon soft plastic or heat-resistant nylon soft plastic; such as Figure 4 and Figure 5 As shown, preferably, in this embodiment, the assembly part 22 has a connecting block 221 protruding on the side closer to the semiconductor cooling chip 13. When the fastener 3 is tightened, the assembly part 2 will be pressed against the condenser chip 11 or the heat sink 15. At this time, the connecting block 221 can play a limiting role with the condenser chip 11 or the heat sink 15, and can also prevent the isolator 2 from being damaged due to excessive extension deformation.

[0056] It should be noted that in some other embodiments, the spacer 2 may also be made of cold-resistant soft rubber or heat-resistant soft rubber, depending on the actual needs, and is not limited to one.

[0057] like Figure 4 and Figure 5 As shown, preferably, in this embodiment, the assembly part 22 has a connecting platform 222 protruding from the side of the thermoelectric cooler 13 away from the assembly part 22, and the end 31 of the fastener 3 abuts against the connecting platform 222. Thus, the connecting platform 222 provides a clear and stable support point for the fastener 3. Compared to directly applying the fastener 3 to the plane of the assembly part 22, the connecting platform 222 can more effectively distribute the pressure applied by the fastener 3. When the fastener 3 is tightened, its end 31 is in close contact with the connecting platform 222, preventing the fastener 3 from sliding or displacing on the surface of the assembly part 22. This ensures that the isolator 2 can be firmly fixed in the dehumidification module, thereby ensuring the stability of the condenser fin 11 and the heat sink 15 during long-term use and reducing the risk of deformation due to insecure fixing.

[0058] Preferably, in this embodiment, the first heat-conducting sheet 12 and the second heat-conducting sheet 14 are made of soft material.

[0059] Thus, on the one hand, soft materials possess excellent flexibility and plasticity. When the first heat-conducting sheet 12 and the second heat-conducting sheet 14 are made of soft materials, they can fit more closely to the surfaces of the condenser fin 11 and the heat sink 15. During actual installation, even if the surfaces of the condenser fin 11 and the heat sink 15 have some unevenness or slight dimensional deviations, the soft heat-conducting sheet can adapt to these irregularities through its own deformation, ensuring a larger contact area with the condenser fin 11 and the heat sink 15. For example, when there are small protrusions or depressions on the surface of the condenser fin 11, the soft first heat-conducting sheet... 12 can fill these gaps, making the contact between the two closer, thereby effectively reducing contact thermal resistance and improving heat conduction efficiency. On the other hand, during long-term use, the dehumidification module may undergo slight structural deformation due to various reasons. The soft first heat-conducting sheet 12 and the second heat-conducting sheet 14 can adapt to these structural deformations and will not generate additional stress on the condenser fin 11 and the heat sink 15 due to their own rigidity. They can deform with the deformation of the condenser fin 11 and the heat sink 15, maintaining good contact with them, thereby reducing the risk of component damage and deformation caused by structural deformation.

[0060] Specifically, in this embodiment, the first heat-conducting sheet 12 and the second heat-conducting sheet 14 may be, but are not limited to, made of soft copper or block-shaped thermal grease.

[0061] like Figure 1 and Figure 2 As shown, specifically in this embodiment, the dehumidification component 1 further includes condensing fins 4 and heat dissipation fins 5. The condensing fins 4 are disposed on the side of the condensing fin 11 away from the first heat-conducting fin 12, and the heat dissipation fins 5 are disposed on the side of the heat dissipation fin 15 away from the second heat-conducting fin 14. Thus, the presence of the condensing fins 4 and heat dissipation fins 5 significantly increases the surface area for condensation and heat dissipation. With the condensing fins 4 disposed on the side of the condensing fin 11 away from the first heat-conducting fin 12, and the heat dissipation fins 5 disposed on the side of the heat dissipation fin 15 away from the second heat-conducting fin 14, both condensing fins 4 and heat dissipation fins 5 can fully contact the airflow, providing more space for heat exchange. Taking the condensation process as an example, when hot and humid air flows through the condensing fins 4, more air comes into contact with the fin surface, and water vapor in the hot and humid air is more likely to condense into liquid water on the fin surface, thereby accelerating the condensation rate. Similarly, during the heat dissipation process, the heat dissipation fins 5 increase the contact area with the surrounding air, so that the heat absorbed by the semiconductor cooling chip 13 from the condenser 11 can be dissipated into the air more quickly and effectively, thereby improving the heat dissipation efficiency of the entire dehumidification assembly 1.

[0062] like Figure 7 As shown, specifically in this embodiment, the dehumidification module also includes a fan 6, which is arranged opposite to the heat dissipation fins 5. The fan 6 can cause airflow to be discharged from the heat dissipation fins 5 to the outside atmosphere.

[0063] In addition, such as Figure 6 and Figure 7 As shown, this embodiment also provides a dehumidifier, including the dehumidification module described above. This dehumidifier has all the advantages of the aforementioned dehumidification module, which will not be repeated here. In addition, the dehumidifier also includes a main housing 7 and a water collection tray 8. A receiving cavity 71 is provided inside the main housing 7. The fan 6 is located inside the receiving cavity 71, the dehumidification module is located inside the receiving cavity 71, and the water collection tray 8 is located in the receiving cavity 71 and below the dehumidification module. A guide wall 72 is provided inside the receiving cavity 71, and the guide wall 72 is located above the water collection tray 8. The guide wall 72 at least partially covers the outer periphery of the water collection tray 8. For details, please refer to [reference needed]. Figure 7 and Figure 8Thus, on the one hand, this design ensures that when water enters the receiving cavity 71, whether it drips from the dehumidification module or enters the cavity 71 for other reasons, it can be effectively guided to the water collection tray 8 by the guide wall 72. This avoids various problems caused by water flowing to other areas, reduces corrosion and damage to components due to water accumulation, and thus lowers the maintenance difficulty and cost of the dehumidifier. On the other hand, since all water is guided to the water collection tray 8, cleaning personnel only need to clean the water collection tray 8 periodically, without the need for complex cleaning of the entire receiving cavity 71. The water collection tray 8 is usually designed as a detachable structure, making it easy to pour out the accumulated water and clean it. This design greatly simplifies the cleaning work inside the dehumidifier, reduces cleaning time and workload, and improves maintenance efficiency.

[0064] like Figure 6 and Figure 7 As shown, preferably, in this embodiment, the dehumidifier also includes a water tank 20 and a drain pipe 9. The drain outlet 91 of the drain pipe 9 is connected to the outside of the dehumidifier. Both the water tank 20 and the drain pipe 9 are detachably connected to the main housing 7. Both the water tank 20 and the drain pipe 9 are located below the water collection tray 8. When the drain pipe 9 is installed to the main housing 7, the drain pipe 9 and the water collection tray 8 are connected. When the drain pipe 9 is removed from the main housing 7, the water tank 20 and the water collection tray 8 are connected. Thus, on the one hand, the additional drain pipe 9, when connected to the water collection tray 8, can directly guide the water collected in the water collection tray 8 to the outside of the dehumidifier. This design effectively avoids the problem of the water tank 20 becoming full due to prolonged neglect, triggering the safety protection mechanism and causing the dehumidifier to stop dehumidifying. For example, in some office spaces or spaces that are unattended for extended periods, if the dehumidifier's water tank 20 is full and the machine stops, the indoor humidity will continue to rise, affecting the storage of items and the comfort of people. The design of the drain pipe 9 ensures that the dehumidifier continues to operate stably and maintains a suitable indoor humidity environment. On the other hand, both the water tank 20 and the drain pipe 9 are detachably connected to the main casing 7, allowing users to flexibly choose the drainage method according to their actual needs. When someone regularly cleans the water tank 20, the drain pipe 9 can be removed to connect the water tank 20 to the water collection tray 8 for easy collection of condensate. When unattended or requiring continuous dehumidification for extended periods, the drain pipe 9 can be installed to directly drain the water out of the dehumidifier. This flexibility allows the dehumidifier to adapt to various usage scenarios such as homes, offices, and warehouses.

[0065] like Figure 7 As shown, specifically, the dehumidifier also includes a water tray 10, which is detachably connected to the main housing 7. The water tray 10 is connected to a drain pipe 9. When the water tray 10 is installed on the main housing 7, it is located directly below and connected to the water collection tray 8. The drain pipe 9 is connected to the water tray 10 to drain water to the outside. More specifically, when the water tray 10 is removed from the main housing 7, the drain pipe 9 is also removed.

[0066] In summary, the dehumidification module and dehumidifier including the present invention disclosed herein can bring at least the following beneficial technical effects:

[0067] 1) It can effectively prevent the semiconductor cooling chip 13 from wearing out due to being clamped too tightly, extend the service life of the semiconductor cooling chip 13, and improve the stability and reliability of the dehumidification module;

[0068] 2) It avoids deformation of the condenser 11 and heat sink 15 due to point contact, ensuring the surface flatness of the condenser 11 and heat sink 15, thereby improving the heat conduction effect and enabling the dehumidification module to work more efficiently.

[0069] 3) The isolation component 2 can buffer the vibration generated by the operation of the internal fan 6 of the dehumidifier, reduce the vibration of the fastener 3, effectively prevent the fastener 3 from loosening, ensure the overall installation stability of the dehumidification module, and ensure the normal operation of the dehumidification module.

[0070] 4) Compared with the use of thermal conductive adhesive, the use of the first thermal conductive sheet 12 and the second thermal conductive sheet 14 reduces the requirements of the production process and improves the production effect. Furthermore, the arrangement of the first thermal conductive sheet 12 and the second thermal conductive sheet 14 can accommodate the deformation tolerance and production tolerance of the condenser plate 11, the semiconductor cooling plate 13 and the heat sink 15, and can always form good thermal contact under various conditions to ensure the dehumidification effect.

[0071] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. Dehumidification module, characterized in that, The application relates to a dehumidifying assembly. The dehumidifying assembly (1) comprises a condensing sheet (11), a first heat-conducting sheet (12), a semiconductor refrigeration sheet (13), a second heat-conducting sheet (14) and a heat-dissipating sheet (15) which are sequentially stacked; An isolating piece (2) is arranged on the side of the condensing sheet (11) away from the semiconductor refrigeration sheet (13) and / or on the side of the heat-dissipating sheet (15) away from the semiconductor refrigeration sheet (13); A fastener (3) is arranged through the isolating piece (2), the condensing sheet (11) and the heat-dissipating sheet (15) so that the condensing sheet (11) and the heat-dissipating sheet (15) are clamped and fixed to the first heat-conducting sheet (12), the semiconductor refrigeration sheet (13) and the second heat-conducting sheet (14), and the end (31) of the fastener (3) is arranged on the side of the isolating piece (2) away from the semiconductor refrigeration sheet (13).

2. The dehumidification module of claim 1, wherein, The isolating piece (2) is in the shape of a long strip, and the isolating piece (2) has a first side close to the semiconductor refrigeration sheet (13); The first side is arranged on the side of the condensing sheet (11) away from the semiconductor refrigeration sheet (13) and / or on the side of the heat-dissipating sheet (15) away from the semiconductor refrigeration sheet (13).

3. The dehumidification module of claim 1, wherein, The isolating piece (2) has at least two contact portions (21), and an assembling portion (22) is arranged between two adjacent contact portions (21), and the fastener (3) is arranged through the assembling portion (22); The contact portions (21) of the same isolating piece (2) are arranged on the side of the condensing sheet (11) away from the semiconductor refrigeration sheet (13) and / or on the side of the heat-dissipating sheet (15) away from the semiconductor refrigeration sheet (13).

4. The dehumidification module of claim 3, wherein, The cross section of the isolating piece (2) in the length direction is in the shape of a curve, and the convex directions of the contact portions (21) and the assembling portion (22) are opposite.

5. The dehumidification module of claim 4, wherein, The assembling portion (22) is convex on one side close to the semiconductor refrigeration sheet (13) and has a connecting block (221), and the rod portion (32) of the fastener (3) passes through the connecting block (221).

6. The dehumidification module of claim 4, wherein, The assembling portion (22) is convex on one side away from the semiconductor refrigeration sheet (13) and has a connecting table (222), and the end (31) of the fastener (3) is arranged on the connecting table (222).

7. The dehumidification module according to any one of claims 1-6, wherein, The first heat-conducting sheet (12) and the second heat-conducting sheet (14) are made of soft material.

8. The dehumidification module according to any one of claims 1-6, wherein, The dehumidifying assembly (1) further comprises a condensing fin (4) and a heat-dissipating fin (5), the condensing fin (4) is arranged on the side of the condensing sheet (11) away from the first heat-conducting sheet (12), and the heat-dissipating fin (5) is arranged on the side of the heat-dissipating sheet (15) away from the second heat-conducting sheet (14).

9. A dehumidifier characterised in that, The dehumidification module as claimed in any one of claims 1-8, further comprising a main housing (7) and a water collecting tray (8), the main housing (7) is provided with a receiving cavity (71) therein, the dehumidification module is arranged in the receiving cavity (71), the water collecting tray (8) is arranged in the receiving cavity (71) and below the dehumidification module, the receiving cavity (71) is provided with a flow guide wall (72) therein, the flow guide wall (72) is above the water collecting tray (8), and the flow guide wall (72) at least partially covers the outer periphery of the water collecting tray (8).

10. The dehumidifier of claim 9, wherein, Further comprising a water tank (20) and a drain pipe (9), the drain pipe (9) is connected with the outside of the dehumidifier, the water tank (20) and the drain pipe (9) are detachably connected with the main housing (7); when the drain pipe (9) is installed to the main housing (7), the drain pipe (9) is connected with the water collecting tray (8); when the drain pipe (9) is detached from the main housing (7), the water tank (20) is connected with the water collecting tray (8).

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