Refrigeration sheet structure of refrigeration equipment

Abstract

The utility model relates to the technical field of refrigeration sheets, in particular to a refrigeration sheet structure of refrigeration equipment, which comprises a semiconductor refrigeration plate, and a heat conduction patch is assembled at the top end of the semiconductor refrigeration plate. After the semiconductor refrigeration plate is installed in a target area through the installation holes in the two sides, the threaded connection sleeve fixed to the surface of the heat dissipation water tank is aligned to the second threaded connection hole, and the threaded fixing piece is screwed into the threaded connection sleeve to fix the semiconductor refrigeration plate and the heat dissipation water tank; signals are transmitted to a connecting plate through an external wire to control a semiconductor refrigeration plate to conduct refrigeration, one side generating heat conducts the heat to a heat dissipation water tank through a heat conduction patch, the heat is absorbed by water, and the water in the heat dissipation water tank absorbs the heat through an internal contact plate and is conducted to heat dissipation fins through a conduction plate to be dissipated to be controlled. The connecting position of the conduction plate and the through inserting hole is processed through a sealing piece, and water in the heat dissipation water tank is overhauled or replaced through the overhauling hole.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, specifically to a refrigeration chip structure for a refrigeration device. Background Technology

[0002] A thermoelectric cooler, also known as a semiconductor refrigeration chip, is a type of heat pump. Its advantage is that it has no sliding parts, making it suitable for applications where space is limited, reliability is critical, and refrigerant contamination is undesirable. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a coupler composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the coupler, achieving the purpose of cooling. It is a cooling technology that generates negative thermal resistance. Its characteristics include no moving parts and relatively high reliability. It requires not only N-type and P-type semiconductor characteristics but also the addition of impurities to alter the thermoelectric potential, electrical conductivity, and thermal conductivity of the semiconductor, ensuring that this special semiconductor meets the requirements for cooling.

[0003] Publication number CN219572325U discloses a cooling chip structure for a refrigeration device, which uses a lower pressure plate slidably mounted on a fixed base to fix and dissipate heat from a semiconductor cooling chip, allowing for individual replacement of the cooling chip and heat dissipation components. However, this structure is relatively large and complex during use, and the excessive structure after installation can reduce the contact efficiency between the heat dissipation chip and the air, thus affecting the heat dissipation efficiency. Therefore, we propose a cooling chip structure for a refrigeration device. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a cooling plate structure for a refrigeration device.

[0005] The technical solution adopted by this utility model to solve its technical problem is a cooling chip structure for a refrigeration device, including a semiconductor refrigeration plate. A thermally conductive patch is assembled on the top of the semiconductor refrigeration plate. A second threaded connection hole is centrally located on the top surface of the semiconductor refrigeration plate and the thermally conductive patch. A heat dissipation tank is arranged above the second threaded connection hole. A threaded connection sleeve is centrally connected to the top of the heat dissipation tank. A threaded fastener is threadedly connected inside the threaded connection sleeve. The semiconductor refrigeration plate, the thermally conductive patch, and the heat dissipation tank are connected and fixed by the threaded fastener.

[0006] By adopting the above technical solution, after the semiconductor cooling plate is installed in the target area through the mounting holes on both sides, the threaded connecting sleeve fixed on the surface of the heat sink is aligned with the second threaded connecting hole and screwed in the threaded fastener to fix the semiconductor cooling plate and the heat sink. Then, through the operation control panel, the signal is transmitted to the connecting plate through the external wire to control the semiconductor cooling plate to cool. The side that generates heat conducts the heat to the heat sink through the thermal pad and is absorbed by the water. The water in the heat sink absorbs heat through the internal contact plate and conducts it through the conduction plate to the heat sink to dissipate to the control. The connection between the conduction plate and the through hole is treated with a seal. The water in the heat sink can be inspected or replaced through the inspection hole.

[0007] Specifically, the top of the heat dissipation tank has multiple through holes on both sides of the threaded connecting sleeve, and a conductive plate is inserted through the through holes. A heat sink is fixedly connected to the top of the conductive plate.

[0008] By adopting the above technical solution, the heat in the water is conducted to the surface of the heat sink through the contact plate inserted into the heat sink tank and in contact with the water, thus completing the heat dissipation operation.

[0009] Specifically, mounting holes are fixed and connected to both sides of the top of the semiconductor cooling plate.

[0010] By adopting the above technical solution, the cooling plate is installed in the heat dissipation area through mounting holes.

[0011] Specifically, a connecting plate is fixedly connected to one side of the semiconductor cooling plate, and an external wire is assembled on the side wall of the connecting plate.

[0012] By adopting the above technical solution, the operation of the semiconductor cooling plate is controlled by connecting the board and wires.

[0013] Specifically, a contact plate for increasing the contact area is fixedly connected to the bottom end of the conductive plate.

[0014] By adopting the above technical solution, heat is absorbed and dissipated through the contact plate contacting the water in the cooling tank.

[0015] Specifically, the side wall of the radiator is connected to an inspection hole.

[0016] By adopting the above technical solution, the water inside the radiator can be replaced through the inspection hole.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The technical solution of this application involves installing the semiconductor cooling plate in the target area through mounting holes on both sides, then aligning the threaded connecting sleeve fixed on the surface of the heat sink with the second threaded connecting hole and screwing in the threaded fastener to fix the semiconductor cooling plate and the heat sink. Subsequently, through the operation control panel, the signal is transmitted to the connecting plate through the external wire to control the semiconductor cooling plate to perform cooling. The side that generates heat conducts the heat to the heat sink through the thermal pad and is absorbed by the water. The water in the heat sink absorbs heat through the internal contact plate and conducts it through the conduction plate to the heat sink to dissipate to the control. The connection between the conduction plate and the through-hole is treated with a seal. The water in the heat sink can be inspected or replaced through the inspection hole. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is an isometric view of the present invention;

[0021] Figure 2 This is a structural breakdown diagram of the semiconductor cooling plate and the heat dissipation tank of this utility model;

[0022] Figure 3 This is a structural breakdown diagram of the heat dissipation tank and heat sink of this utility model;

[0023] In the diagram: 1. Semiconductor cooling plate; 2. Thermal pad; 3. Cooling tank; 4. Second threaded connection hole; 5. Threaded connection sleeve; 6. Threaded fastener; 7. Mounting hole; 8. Connecting plate; 9. External wire; 10. Through-hole; 11. Inspection hole; 12. Heat sink; 13. Conductive plate; 14. Contact plate. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] Please see Figure 1-3 This utility model provides a technical solution: a cooling chip structure for a refrigeration device, including a semiconductor refrigeration plate 1, a thermally conductive patch 2 mounted on the top of the semiconductor refrigeration plate 1, a second threaded connection hole 4 centrally located on the top surfaces of the semiconductor refrigeration plate 1 and the thermally conductive patch 2, a heat dissipation tank 3 disposed above the second threaded connection hole 4, a threaded connection sleeve 5 centrally and fixedly connected to the top of the heat dissipation tank 3, a threaded fastener 6 threadedly connected inside the threaded connection sleeve 5, and the semiconductor refrigeration plate 1, the thermally conductive patch 2 and the heat dissipation tank 3 connected and fixed by the threaded fastener 6.

[0026] In use, after installing the semiconductor cooling plate 1 in the target area through the mounting holes 7 on both sides, the threaded connecting sleeve 5 fixed on the surface of the heat sink 3 is aligned with the second threaded connecting hole 4 and screwed into the threaded fastener 6 to fix the semiconductor cooling plate 1 and the heat sink 3. Then, through the operation control panel, the signal is transmitted to the connecting plate 8 through the external wire 9 to control the semiconductor cooling plate 1 to cool. The side that generates heat conducts the heat to the heat sink 3 through the thermal conductive patch 2 and the heat is absorbed by the water. The water in the heat sink 3 absorbs heat through the internal contact plate 14 and conducts it through the conduction plate 13 to the heat sink 12 to dissipate to the control. The connection between the conduction plate 13 and the through-hole 10 is treated with a seal. The water in the heat sink 3 can be inspected or replaced through the inspection hole 11.

[0027] As shown in the figure, the top of the heat dissipation tank 3 has multiple through holes 10 on both sides of the threaded connecting sleeve 5. A conductive plate 13 is inserted through the through hole 10, and a heat sink 12 is fixedly connected to the top of the conductive plate 13.

[0028] In use, the heat transfer plate 13 is inserted into the heat dissipation tank 3 and comes into contact with the water, so that the heat in the water is transferred to the surface of the heat sink 12 through the contact plate 14 to complete the heat dissipation operation.

[0029] As shown in the figure, mounting holes 7 are fixed and connected to both sides of the top end of the semiconductor cooling plate 1.

[0030] When in use, the cooling plate is installed in the heat dissipation area through mounting hole 7.

[0031] As shown in the figure, a connecting plate 8 is fixedly connected to one side of the semiconductor cooling plate 1, and an external wire 9 is assembled on the side wall of the connecting plate 8.

[0032] In use, the operation of the semiconductor cooling plate 1 is controlled by connecting plate 8 and wires.

[0033] As shown in the figure, a contact plate 14 for increasing the contact area is fixedly connected to the bottom end of the conductive plate 13.

[0034] During use, heat is absorbed and dissipated by the contact plate 14 coming into contact with the water in the heat dissipation tank 3.

[0035] As shown in the figure, the side wall of the heat dissipation tank 3 is connected to an inspection hole 11.

[0036] During use, the water inside the radiator tank 3 can be replaced through the inspection hole 11.

[0037] The working principle and usage process of this utility model are as follows: After the semiconductor cooling plate 1 is installed in the target area through the mounting holes 7 on both sides, the threaded connecting sleeve 5 fixed on the surface of the heat sink 3 is aligned with the second threaded connecting hole 4 and screwed into the threaded fastener 6 to fix the semiconductor cooling plate 1 and the heat sink 3. Then, through the operation control panel, the signal is transmitted to the connecting plate 8 through the external wire 9 to control the semiconductor cooling plate 1 to cool. The side that generates heat conducts the heat to the heat sink 3 through the heat-conducting patch 2 and the heat is absorbed by the water. The water in the heat sink 3 absorbs heat through the internal contact plate 14 and conducts it through the conduction plate 13 to the heat sink 12 to dissipate to the control. The connection between the conduction plate 13 and the through-hole 10 is treated with a seal. The water in the heat sink 3 can be inspected or replaced through the inspection hole 11.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A fin structure of a refrigeration device, characterized by, Including semiconductor refrigeration plate (1), the top end of semiconductor refrigeration plate (1) is equipped with heat conduction patch (2), the top end surface of semiconductor refrigeration plate (1) and heat conduction patch (2) is centrally provided with second threaded connection hole (4), the upper side of second threaded connection hole (4) is provided with heat dissipation water tank (3), the top end of heat dissipation water tank (3) is through and fixedly connected with threaded connection sleeve (5), the inside of threaded connection sleeve (5) is screw-connected with threaded fixing part (6), and semiconductor refrigeration plate (1), heat conduction patch (2) and heat dissipation water tank (3) are connected and fixed by threaded fixing part (6).

2. A fin structure of a refrigerating device according to claim 1, wherein The top end of the heat dissipation water tank (3) is provided with a plurality of through insertion holes (10) on both sides of the threaded connection sleeve (5), the through insertion holes (10) are internally inserted with a conductive plate (13), and the top end of the conductive plate (13) is fixedly connected with a heat dissipation fin (12).

3. A fin structure of a refrigerating device according to claim 1, wherein The top end of the semiconductor refrigeration plate (1) is fixedly and throughly connected with a mounting hole (7).

4. A fin structure of a refrigerating device according to claim 1, wherein One side of the semiconductor refrigeration plate (1) is fixedly connected with a connecting plate (8), and the side wall of the connecting plate (8) is equipped with an external lead (9).

5. A fin structure for a refrigeration device according to claim 2, wherein The bottom end of the conductive plate (13) is fixedly connected with a contact plate (14) for increasing the contact area.

6. A fin structure for a refrigeration device according to claim 1, wherein The side wall of the heat dissipation water tank (3) is throughly connected with an access hole (11).

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