Vacuum drying and curing device
By combining branch pipes and flow equalization plates, the problems of substrate shift and vibration caused by uneven airflow in vacuum drying equipment are solved, achieving uniform airflow distribution and equipment compactness, and improving operation convenience and maintenance efficiency.
CN223965732UActive Publication Date: 2026-03-03BRAUN PRECISION MANUFACTURING (JIAXING) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-07
- Publication Date
- 2026-03-03
AI Technical Summary
Technical Problem
In existing vacuum drying and curing devices, uneven airflow distribution leads to substrate shifting or vibration, resulting in complex structures, high maintenance costs, and a lack of systematic flow uniformity design.
Method used
The design employs a combination of branch pipes and flow equalization plates. The branch pipes disperse the suction force, while the flow equalization plates homogenize the airflow. Combined with auxiliary vacuum pipes and heating devices, multi-stage airflow control is achieved.
Benefits of technology
It achieves stable positioning of the substrate, avoiding offset and vibration. The equipment has a compact structure, is easy to operate, and reduces maintenance costs.
✦ Generated by Eureka AI based on patent content.
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Figure CN223965732U_ABST
Abstract
The utility model relates to the technical field of vacuum drying, in particular to a vacuum drying and curing device which comprises a vacuum chamber and a vacuumizing assembly. The vacuum chamber is internally provided with a drawing type sliding disc for placing a substrate; the vacuumizing assembly comprises a vacuum pump and a main vacuum pipeline communicated with the vacuum pump, the input end of the main vacuum pipeline is branched to form a plurality of branch pipelines, and the branch pipelines are arranged above the vacuum cavity in a communicated mode; a flow equalizing plate is arranged on the upper portion of the vacuum cavity, a plurality of holes are evenly distributed in the flow equalizing plate, and the flow equalizing plate is located above the sliding disc. Through cooperative use of the branch pipelines and the flow equalizing plate, airflow in the vacuum chamber is equalized, and the substrate is prevented from being sucked to cause deviation or vibration of the substrate.
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