Probe device with dustproof function

Abstract

The utility model provides a probe device with a dustproof function, which is characterized in that a sample wafer is conveyed along a conveying path in a wafer conveying chamber, an adhesive pad is arranged below the conveying path, dust, particularly impurity particles falling in a wafer conveying process are adsorbed by utilizing the viscosity of the adhesive pad, and the adhesive pad is replaced regularly, so that the labor intensity of workers is reduced, and the working efficiency is improved. Therefore, impurity particles entering the detection chamber are reduced, so that the product quality risk is effectively reduced; besides, the outer edge of the maintenance window and the cover body are changed into a clamping mode from an original threaded connection mode, so that frequent screw disassembly and assembly are avoided, time is greatly saved, production efficiency is improved, the cover body translates along the guide rail, the opening degree of the maintenance window can be selected, the operation difficulty of equipment is reduced, and production cost is reduced. And the failure rate of equipment is reduced.

Description

Technical Field

[0001] This application relates to the field of wafer inspection, and more specifically, to a probe device with dustproof function. Background Technology

[0002] In the field of semiconductor manufacturing equipment, especially for probe platforms, the wafers to be tested need to be transferred into the feeding area before testing. The gaps in the doorway can introduce impurity particles from the external process environment, leading to increased frequency of periodic maintenance, repairs, and component replacements, thus impacting product quality. Furthermore, these impurity particles can also interfere with the normal operation of the equipment, increasing the failure rate and the number of repairs, thereby reducing production efficiency.

[0003] Currently, one of the main methods for addressing particulate contamination inside probe platforms is to periodically remove and install screws to clean the opening gaps in the feed area, preventing particles from entering the detection chamber. While this method effectively removes particles near the gaps, the process is cumbersome and requires significant time and manpower. Figure 1 This is a simplified diagram of a probe platform used for wafer electrical testing. Figure 2 Displayed as Figure 1 The diagram shows the maintenance window and cover assembly of the probe platform. Figures 1 to 2 As shown, the probe platform includes a wafer transport chamber 120 and an inspection chamber 130. A cover 141 is provided on one side of the inspection chamber 130. The cover 141 can be detachably installed on the outer edge of the maintenance window via a threaded connector 142. Furthermore, in practical applications, the process of removing and installing screws takes a considerable amount of time, which not only increases equipment downtime but also reduces production efficiency. Moreover, due to the complexity of the equipment, precise operations are required each time screws are removed or installed, increasing the operational difficulty and failure rate. In addition, due to structural design issues, even after multiple cleanings, it is still impossible to completely eliminate the introduction of impurity particles adhering to the wafer.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] The purpose of this application is to provide a probe device with a dustproof function, which solves the problem that the feed area of ​​the probe platform in the prior art is easily contaminated by particles, which significantly increases the failure rate of the equipment, increases the equipment maintenance cost, and affects the wafer processing yield.

[0006] This utility model provides a probe device with dustproof function, including:

[0007] A wafer transport chamber includes a loading section and a conveying mechanism. The loading section is disposed at the opening of the wafer transport chamber and is used to store multiple sample wafers. An adhesive pad is disposed in the wafer transport chamber and is located below a first conveying path. A robotic arm is configured to convey the sample wafers from the wafer transport chamber into a testing chamber.

[0008] The testing chamber includes a positioning mechanism, an imaging inspection module, and a probe card. The positioning mechanism includes a clamping part for holding the sample wafer. The positioning mechanism is configured to allow the sample wafer to move relative to the probe card in three dimensions while held in the fixed state. The imaging inspection module is configured to extract images of the sample wafer and its electrical connections. The probe card includes a probe holder and probes for detecting the electrical condition of the electrical connections of the sample wafer.

[0009] Optionally, the wafer transport chamber further includes an optical character recognition module, and the first transport path is to transport the wafer from the loading section to the optical character recognition module using the transport mechanism, and then into the detection chamber.

[0010] Optionally, the wafer transport chamber is further provided with a displacement frame to allow the loading section to move along the displacement frame, and the transport mechanism is configured as a robotic arm to pick up sample wafers one by one from the loading section in sequence.

[0011] Optionally, the adhesive pad is laid flat in the wafer transport chamber and attached to the underside of the displacement frame.

[0012] Optionally, the probe device further includes a maintenance window and a cover, wherein the maintenance window is provided with a guide rail around its periphery to allow the cover to be inserted into the guide rail in a snap-fit ​​manner, and the maintenance window can be partially or fully opened by translating the cover.

[0013] Optionally, the maintenance window is configured as a square or rectangular window, and a baffle is added at the fit gap between the cover and the guide rail.

[0014] Optionally, the positioning mechanism includes a rotating mechanism, and the clamping part is attached to the rotating mechanism to allow the sample wafer to rotate at any angle while in a fixed state.

[0015] The dustproof probe device provided by this utility model has the following advantages or beneficial effects:

[0016] This invention relates to a probe device that transports sample wafers along a conveying path within a wafer transport chamber. An adhesive pad is placed below the transport path to absorb dust, particularly impurities that fall during wafer transport. Regular replacement of the adhesive pad reduces the number of impurities entering the testing chamber, effectively lowering product quality risks. Furthermore, the connection between the outer edge of the maintenance window and the cover has been changed from a threaded connection to a snap-fit ​​mechanism, eliminating frequent screw removal and significantly saving time—for example, reducing the time required for each screw removal and installation from 5 minutes to 2 seconds—thus improving production efficiency. Moreover, by allowing the cover to slide along the guide rail, the opening degree of the maintenance window can be selected, reducing the difficulty of operation and lowering the equipment's failure rate. Therefore, this invention has broad market demand and promising application prospects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A simplified diagram of a probe platform for wafer electrical testing;

[0019] Figure 2 Assembly drawing of maintenance window and cover in existing probe platform;

[0020] Figure 3 The image shown is a top view of the dustproof probe device in an embodiment of this utility model.

[0021] Figure 4 This is a schematic diagram showing an adhesive pad disposed below the first transmission path in a probe device with dustproof function according to an embodiment of the present invention.

[0022] Figure 5 The diagram shows an assembly of the maintenance window and cover in a dustproof probe device according to an embodiment of this utility model.

[0023] The following are the labels in the diagram: 11 is the loading unit, 12 is the robotic arm, 121 is the secondary suction cup, 13 is the optical character recognition module, 14 is the adhesive pad, 15 is the fixed frame, 20 is the receiving port, 31 is the positioning mechanism, 32 is the imaging inspection module, 33 is the probe card, 21 is the guide rail, 40 is the maintenance window, 41 is the cover, 42 is the guide rail, 43 is the stop bar, 251 is the probe holder, 252 is the probe, 26 is the dustproof pad, T1 is the first conveying path, and T2 is the second conveying path. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application. The sources of microparticles can be broadly classified into two types. One type is related to the process, referred to simply as "process microparticles"; the other type is contamination that occurs during wafer transport within the equipment. These microparticles fall onto the wafer during the wafer transport path and may be generated by the equipment itself, such as dust generated from wear of equipment parts, or they may be externally input and adhere to the equipment. These types of microparticles are referred to here simply as "mechanical microparticles." Unless otherwise specified, the term "impurity particles" as used below includes the aforementioned microparticles.

[0026] like Figure 3 As shown, this embodiment provides a probe device with dustproof function, including a wafer transport chamber and a detection chamber. The wafer transport chamber includes a conveying mechanism and a loading part 11 for accommodating multiple sample wafers to be tested. The conveying mechanism is configured to convey the sample wafers from the wafer transport chamber into the detection chamber. The detection chamber includes a positioning mechanism 31, an imaging inspection module 32, and a probe card 33. The positioning mechanism is configured to move the sample wafer relative to the probe card in a three-dimensional axis while it is held in a fixed state. The imaging inspection module is configured to extract images of the sample wafer and its electrical connection terminals. The probe card includes a probe holder and probes for detecting the electrical condition of the electrical connection terminals of the sample wafer.

[0027] The wafer transport chamber is also provided with a displacement frame to allow the loading section to move along the displacement frame, so that the transport mechanism can pick up sample wafers one by one from the loading section in sequence. Figure 4 This diagram illustrates an adhesive pad positioned below the first conveying path. Figures 3 to 4As shown, the loading unit 11 is disposed at the opening of the wafer transport chamber. The transport mechanism can be configured as a robotic arm 12, with a secondary suction cup mounted at the end (i.e., the free end) of the robotic arm 12 for picking up sample wafers. In some examples, the wafer transport chamber further includes an optical character recognition module 13, located at the end of the wafer transport chamber away from the opening; the sample wafers in the wafer transport chamber are transported along a first transport path T1 as follows: Figure 3 (Indicated by the dashed arrow) Transport: The robotic arm 12 picks up the sample wafer from the loading unit 11 and transports it to the optical character recognition module 13 to identify the coded symbols on the sample wafer and record the positioning notch of the sample wafer, after which it enters the detection chamber. In this embodiment, the wafer transport chamber is provided with an adhesive pad, which is located below the first transport path; preferably, as shown... Figure 4 As shown, the displacement frame can be sleeved on the fixed frame, and the adhesive pad can be laid flat in the wafer transport chamber and located below the displacement frame, as shown. Figure 5 As shown, the adhesive pad can be fixed to the fixed frame 15 to separate the circuit structure below it from the mechanical mechanism. For example, the adhesive pad can be Kimberly-Clark's dust-absorbing paper, which has a size of 50cm*100cm and a thickness of 0.3mm. By laying the adhesive pad under the conveying path in the wafer transport chamber, the adhesive properties of the pad attract dust, and the pad is replaced regularly, thereby reducing the number of impurity particles entering the inspection chamber and effectively reducing product quality risks.

[0028] The sample wafer can be transferred into and out of the testing chamber through the receiving port 20, which connects the testing chamber and the wafer transport chamber. The testing chamber can be separated from the wafer transport chamber and its external environment by an airtight shell. A maintenance window is provided on one side of the testing chamber. The maintenance window can be configured to provide a window for the inspection, handling, and removal of internal components of the testing chamber. A cover is provided on the maintenance window, and guide rails are provided around the perimeter of the maintenance window to allow the cover to be inserted into the guide rails in a snap-fit ​​manner, and to partially or completely open the maintenance window by translating the cover, thereby avoiding the maintenance window from being fully opened and reducing the risk of introducing impurity particles. The shape and size of the guide rails can be adjusted according to the geometry of the cover and are not particularly limited here. Figure 5 This is an assembly drawing of the maintenance window and cover for a dustproof probe device. Figure 5 As shown, the maintenance window 40 is located on one side of the testing chamber and is square or rectangular. A guide rail 42 is provided on the outer edge of the opposite side of the maintenance window. For example, the cover 41 has a geometric shape with a length of 49cm and a width of 9.5cm, the guide rail has a length of 50±0.5cm and a width of 10±0.5cm, and the cover is made of stainless steel to ensure its stability and durability.

[0029] Furthermore, a retaining strip (not shown) is added at the fitting gap between the cover 41 and the guide rail 42. The retaining strip can be fixed to the outer edge of the cover or to the periphery of the guide rail away from the maintenance window. Preferably, the retaining strip is made of a metal with strong plasticity and corrosion resistance, thereby ensuring that the cover 41 and the guide rail 42 fit tightly with the retaining strip without any gaps. This ensures a blocking effect, further reducing the risk of introducing impurities or other contaminants into the detection chamber, shortening downtime, and increasing production capacity. For example, the retaining strip can be a one-piece molded strip made of aluminum alloy, and has sufficient height to ensure that there are no gaps between the cover and the guide rail and the retaining strip when the cover is inserted into the guide rail.

[0030] The detection chamber includes a positioning mechanism 32 and a probe card 33. The probe card 33 includes a probe holder and a probe, which can electrically contact an electrical connection terminal on a wafer (or chip) so that the tip of the probe presses against the electrical connection terminal of the wafer. The electrical connection terminal can be a contact pad or a bump. In some examples, the positioning mechanism includes a rotation mechanism with a clamping part attached to hold the sample wafer and drive the sample wafer to rotate; that is, the sample wafer can be rotated at any angle. The probe card is provided with a lifting mechanism to position the sample wafer so that its electrical connection terminal contacts the tip of the probe after the electrical connection terminal of the sample wafer is vertically aligned with the probe, thereby electrically connecting the probe to the electrical connection terminal of the sample wafer.

[0031] Alternatively, as an alternative implementation, the positioning mechanism includes a rotating branch mechanism and a lifting branch mechanism. The rotating branch mechanism is attached to a clamping portion to allow the sample wafer to rotate at any angle while held in a fixed state. The lifting branch mechanism can move the clamping portion and the sample wafer it carries in a longitudinal direction substantially perpendicular to its bearing surface, positioning the sample wafer so that its electrical connection ends contact the tip of the probe. In a specific example, the clamping portion includes a chuck and a connecting arm. The chuck is preferably a vacuum chuck. The chuck and the rotating branch mechanism are respectively pivotally connected to opposite ends of the connecting arm to achieve two-dimensional axial movement of the carried sample wafer substantially parallel to its bearing surface while held in a fixed state.

[0032] The wafer transport chamber can be selectively opened or closed to the inspection chamber via the receiving port 20. The area adjacent to the receiving port and the inspection chamber serves as a feeding area. In some examples, the receiving port 20 is provided with at least one door, and a dustproof pad is affixed near the opening gap of the receiving port. The dustproof pad reduces the opening gap and has appropriate adhesiveness to adsorb impurity particles, preventing impurity particles from accumulating in the space and thus avoiding impurity particles introduced from the feeding area from falling onto the wafer and probe card. For example, the dustproof pad from 3M is 30cm*50cm in size and 0.5mm thick.

[0033] The testing chamber also includes an imaging inspection module, such as a charge-coupled device (CCD). This imaging inspection module can communicate with a computer, which calculates and analyzes images of the electrical connection terminals to perform coordinate transformations and alignment or control the positioning mechanism based on the computer's analysis results. The sample wafer within the testing chamber travels along a second transport path T2 as follows: Figure 3 (Indicated by the solid arrow in the middle) Transport: The probe is picked up from the receiving port by the clamping part and transported to the imaging inspection module. Then it moves in three dimensions to position the probe against the electrical connection end of the sample wafer. After completing the electrical detection of the required electrical connection end, it is transported through the receiving window and leaves the detection chamber.

[0034] In some examples, the imaging inspection module can be used to acquire images of the sample wafer and its electrical connections.

[0035] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A probe device with dustproof function, characterized in that, The application relates to a wafer conveying chamber, a detection chamber and a probe device. The wafer conveying chamber comprises a loading part and a conveying mechanism, the loading part is arranged at an opening of the wafer conveying chamber and is used for storing a plurality of sample wafers, a viscous pad is arranged below a first conveying path in the wafer conveying chamber, and the conveying mechanism is configured to convey the sample wafers from the wafer conveying chamber into the detection chamber. The detection chamber comprises a positioning mechanism, an imaging inspection module and a probe card, the positioning mechanism comprises a clamping part used for holding the sample wafers, the positioning mechanism is arranged to move the sample wafers in a holding state in three-dimensional axial directions relative to the probe card, the imaging inspection module is configured to extract images of the sample wafers and electrical connection ends thereof, and the probe card comprises a probe seat and probes used for detecting electrical conditions of the electrical connection ends of the sample wafers.

2. The probe device having a dustproof function according to claim 1, characterized by: The wafer conveying chamber further comprises an optical character recognition module, the first conveying path is used for conveying the sample wafers from the loading part to the optical character recognition module by the conveying mechanism, and then into the detection chamber.

3. The probe device having a dustproof function according to claim 1, characterized by: The wafer conveying chamber further comprises a displacement frame, the loading part is arranged to move along the displacement frame, and the conveying mechanism is arranged as a mechanical arm used for sequentially picking up the sample wafers from the loading part one by one.

4. The probe device having a dustproof function according to claim 3, characterized by: The viscous pad is laid in the wafer conveying chamber and is attached below the displacement frame.

5. The probe device having a dustproof function according to claim 1, characterized by: The wafer conveying chamber further comprises an access port, the wafer conveying chamber is selectively opened or closed to the detection chamber through the access port.

6. The probe device having a dustproof function according to claim 5, characterized by: The access port is provided with at least one door leaf, and a dustproof pad is attached near a door opening gap of the access port.

7. The probe device having a dustproof function according to claim 1, wherein The probe device further comprises a maintenance window and a cover, a periphery of the maintenance window is provided with a guide rail to allow the cover to be inserted into the guide rail in a clamping manner, and the maintenance window is partially or completely opened by translating the cover.

8. The probe device having a dustproof function according to claim 7, characterized by: The maintenance window is arranged as a square or rectangular window, and a stop strip is arranged at a matching gap between the cover and the guide rail.

9. The probe device having a dustproof function according to claim 1, characterized by: The positioning mechanism comprises a rotating mechanism, and the clamping part is attached to the rotating mechanism to rotate the sample wafers by any angle in the holding state.

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