Water-cooled high-power semiconductor laser

Abstract

The utility model provides a water-cooled high-power semiconductor laser, relates to the technical field of laser processing, and solves the technical problem in the prior art that an air cooling mode formed by a fan and cooling fins cannot meet the heat dissipation requirement of a high-power laser. The device comprises a driving plate, a water cooling plate and a diode laser tube core, the driving plate and the diode laser tube core are located on the two sides of the water cooling plate respectively, the driving plate is connected with the water cooling plate, and the side face of the driving plate makes contact with the side face of the water cooling plate. The diode laser tube core is connected with the water cooling plate, and the side faces of the diode laser tube core and the water cooling plate are in contact.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a water-cooled high-power semiconductor laser. Background Technology

[0002] The mainstream heat dissipation method for semiconductor lasers is air cooling, mainly consisting of a fan and a heat sink. Its disadvantages include inability to meet the heat dissipation requirements of high-power lasers, leading to prolonged operation or power drop. Furthermore, the fan draws large amounts of oil fumes and dust into the laser, directly threatening its lifespan, and also causes significant noise pollution. Utility Model Content

[0003] The purpose of this invention is to provide a water-cooled high-power semiconductor laser to solve the technical problem that the existing air-cooling method consisting of a fan and heat sink cannot meet the heat dissipation requirements of high-power lasers. 。 The various technical effects of the preferred technical solutions among the many technical solutions provided by this utility model are described in detail below.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] This utility model provides a water-cooled high-power semiconductor laser, including a driver board, a water-cooling plate, and a diode laser die. The driver board and the diode laser die are respectively located on both sides of the water-cooling plate. The driver board is connected to the water-cooling plate and the sides of the driver board and the water-cooling plate are in contact. The diode laser die is connected to the water-cooling plate and the sides of the diode laser die are in contact with the sides of the water-cooling plate.

[0006] Optionally, the water-cooled plate is provided with vertical channels, a first horizontal channel, and a second horizontal channel. There are multiple vertical channels, all of which are arranged along the width direction of the water-cooled plate and have the same length as the water-cooled plate. The first horizontal channel is perpendicular to the vertical channels, and all vertical channels are connected to the first horizontal channel. The second horizontal channel is perpendicular to the vertical channels, and the last vertical channel is not connected to the second horizontal channel. The remaining vertical channels are all connected to the second horizontal channel. There is a gap between the first horizontal channel and the second horizontal channel, and the ports of both the first horizontal channel and the second horizontal channel are located on the same side of the water-cooled plate.

[0007] Optionally, it also includes an inlet connector, an outlet connector, and plugs. The upper port of the first vertical channel is connected to the inlet connector, and the upper port of the last vertical channel is connected to the outlet connector. There are multiple plugs, and the plugs are installed at the lower ports of the first vertical channel, the lower ports of the last vertical channel, the ports of the remaining vertical channels, the ports of the first horizontal channel, and the ports of the second horizontal channel.

[0008] Optionally, the water-cooled plate is provided with a first threaded hole and a second threaded hole. The first threaded hole is connected to the drive plate by screws, and the second threaded hole is connected to the diode laser die by screws.

[0009] Optionally, it also includes a U-shaped shell, the end of which is fixedly connected to the side of the water-cooled plate, and a placement space is formed between the U-shaped shell and the water-cooled plate, with the diode laser die located in the placement space.

[0010] Optionally, it also includes a mounting plate, which is fixedly connected to the end of the U-shaped shell. The mounting plate and the water-cooling plate are located at the two ends of the U-shaped shell, and the mounting plate is provided with a plurality of mounting holes.

[0011] Optionally, it also includes a housing, in which the drive board, the water-cooling plate, the diode laser die and the U-shaped shell are all located, the U-shaped shell is connected to the housing and the end face of the U-shaped shell covers the side opening of the housing, and the connector on the water-cooling plate passes through the upper end of the housing.

[0012] Optionally, it also includes a sealing plate, an air nozzle, and an air guide tube, wherein the sealing plate is connected to the housing and the sealing plate covers the lower opening of the housing, and the air nozzle is mounted on the laser head of the diode laser chip;

[0013] The sealing plate is provided with a large through hole and a small through hole. The air nozzle passes through the large through hole. The air guide tube is located inside the housing. The upper end of the air guide tube is connected to the air inlet at the upper end of the housing. The lower end of the air guide tube passes through the small through hole and is connected to the branch tube on the air nozzle.

[0014] Optionally, it also includes a protective sleeve connected to the sealing plate.

[0015] Optionally, the surface of the diode laser die is coated with thermally conductive silicone.

[0016] This invention provides a water-cooled high-power semiconductor laser. A driver board and a diode laser die are located on opposite sides of a water-cooling plate. The driver board is connected to the water-cooling plate, and their sides are in contact. The diode laser die is also connected to the water-cooling plate, and their sides are in contact. Circulating water flows through the water-cooling plate, thus simultaneously cooling both the driver board and the diode laser die, and also dissipating heat from within the laser itself. This improves heat dissipation intensity and effectively meets the heat dissipation requirements of high-power lasers. It solves the technical problem that existing air-cooling methods consisting of fans and heat sinks cannot meet the heat dissipation needs of high-power lasers. 。 Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a water-cooled high-power semiconductor laser provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of a water-cooled high-power semiconductor laser provided in an embodiment of the present invention from another angle;

[0020] Figure 3 This is a schematic diagram of the structure of a water-cooled high-power semiconductor laser provided in an embodiment of the present invention from another angle;

[0021] Figure 4 This is a cross-sectional view of a water-cooled high-power semiconductor laser provided in an embodiment of this utility model;

[0022] Figure 5 This is a schematic diagram of a water-cooled high-power semiconductor laser without its housing, provided by an embodiment of this utility model.

[0023] Figure 6 This is a schematic diagram of a water-cooled high-power semiconductor laser with the casing, sealing plate, and protective sleeve removed, according to an embodiment of this utility model.

[0024] Figure 7 This is a schematic diagram of the connection between the water cooling plate and the U-shaped shell in a water-cooled high-power semiconductor laser according to an embodiment of the present invention.

[0025] 1. Driver board in the diagram;

[0026] 2. Water-cooled plate; 21. Vertical channel; 22. First horizontal channel; 23. Second horizontal channel;

[0027] 3. Diode laser chip;

[0028] 4. Water inlet connector;

[0029] 5. Water outlet connector;

[0030] 6. Plug;

[0031] 7. U-shaped shell;

[0032] 8. Mounting plate;

[0033] 9. Housing; 91. Gas inlet;

[0034] 10. Seal the plate;

[0035] 20. Air valve;

[0036] 30. Air delivery tube;

[0037] 40. Protective cover. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0039] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] This invention provides a water-cooled high-power semiconductor laser, comprising a driver board 1, a water-cooling plate 2, and a diode laser die 3. The driver board 1 and the diode laser die 3 are located on opposite sides of the water-cooling plate 2. The driver board 1 is connected to the water-cooling plate 2, and their sides are in contact. Similarly, the diode laser die 3 is also connected to the water-cooling plate 2, and their sides are in contact. This water-cooled high-power semiconductor laser utilizes circulating water within the water-cooling plate 2 to simultaneously dissipate heat from both the driver board 1 and the diode laser die 3, thus improving heat dissipation intensity and effectively meeting the heat dissipation requirements of high-power lasers. This solves the technical problem that existing air-cooling methods using fans and heat sinks cannot meet the heat dissipation needs of high-power lasers.

[0042] As an optional implementation, the water-cooled plate 2 is provided with vertical channels 21, a first horizontal channel 22, and a second horizontal channel 23. There are multiple vertical channels 21, all arranged along the width of the water-cooled plate 2, and the length of each vertical channel 21 is the same as the length of the water-cooled plate 2. The first horizontal channel 22 is perpendicular to the vertical channels 21, and all vertical channels 21 are connected to the first horizontal channel 22. The second horizontal channel 23 is perpendicular to the vertical channels 21, except that the last vertical channel 21 is not connected to the second horizontal channel 23. There is a gap between the first horizontal channel 22 and the second horizontal channel 23, and the ports of both are located on the same side of the water-cooled plate 2. This arrangement of the internal channels of the water-cooled plate 2 allows multiple vertical channels 21 to simultaneously receive water or coolant, thereby simultaneously dissipating heat from most areas of the driver board 1 and the diode laser chip 3, quickly and effectively removing a large amount of heat and preventing power loss in the laser due to heat accumulation.

[0043] As an optional implementation, the system also includes an inlet connector 4, an outlet connector 5, and plugs 6. The upper port of the first vertical channel 21 is connected to the inlet connector 4, and the upper port of the last vertical channel 21 is connected to the outlet connector 5. Multiple plugs 6 are installed at the lower ports of the first vertical channel 21, the last vertical channel 21, the remaining vertical channels 21, the first horizontal channel 22, and the second horizontal channel 23. The plugs 6 are threaded into the ports of the internal channels and then sealed with sealant. The inlet connector 4 is connected to the outlet of the tank via a pipe, and the outlet connector 5 is connected to the inlet of the tank via a pipe. The tank can contain water or coolant. The water or coolant first enters the first vertical channel 21 through the inlet connector 4, then flows through the second horizontal channel 23 into multiple vertical channels 21 (excluding the last vertical channel 21), then enters the first horizontal channel 22 to converge, then flows from the last vertical channel 21 to the outlet connector 5, and finally flows back into the tank.

[0044] As an optional implementation, the water-cooled plate 2 is provided with a first threaded hole and a second threaded hole, each having multiple first and second threaded holes. These first and second threaded holes are not connected to the internal channels of the water-cooled plate 2. The first threaded hole is connected to the drive plate 1 by screws, and the second threaded hole is connected to the diode laser chip 3 by screws. The water-cooled plate 2 is manufactured using a 6063 extrusion profile process to obtain its external cross-section and multiple vertical channels 21. Then, CNC machining is used to process the external assembly dimensions, the first horizontal channel 22, and the second horizontal channel 23. Finally, the inlet connector 4, the outlet connector 5, and the plug 6 are installed at the ports of the internal channels.

[0045] As an optional implementation, a U-shaped shell 7 is also included. The end of the U-shaped shell 7 is fixedly connected to the side of the water-cooled plate 2, and a placement space is formed between the U-shaped shell 7 and the water-cooled plate 2. The diode laser chip 3 is located in the placement space. The U-shaped shell 7 is used to protect the diode laser chip 3 and to allow the drive board 1, the water-cooled plate 2 and the diode laser chip 3 to be connected together as a whole, which facilitates disassembly and assembly from the housing 9.

[0046] As an optional implementation, a mounting plate 8 is also included. The mounting plate 8 is fixedly connected to the end of the U-shaped shell 7. The mounting plate 8 and the water-cooled plate 2 are located at the two ends of the U-shaped shell 7, respectively. The mounting plate 8 is provided with a plurality of mounting holes. The mounting plate 8 can install the water-cooled high-power semiconductor laser on other equipment, and other equipment can be connected through the mounting holes.

[0047] As an optional implementation, the system also includes a housing 9, within which the drive plate 1, water-cooled plate 2, diode laser die 3, and U-shaped shell 7 are all located. The U-shaped shell 7 is connected to the housing 9, and its end face covers the side opening of the housing 9. The connector on the water-cooled plate 2 passes through the upper end of the housing 9. The housing 9, U-shaped shell 7, and sealing plate 10 form a closed cavity, which can effectively isolate the internal structure of the water-cooled high-power semiconductor laser from the external environment, preventing dust generated during machine operation from entering the laser and reducing the frequency of cleaning and maintenance.

[0048] As an optional implementation, it also includes a sealing plate 10, an air nozzle 20 and an air guide tube 30. The sealing plate 10 is connected to the housing 9 and the sealing plate 10 covers the lower opening of the housing 9. The air nozzle 20 is installed on the laser head of the diode laser chip 3.

[0049] The sealing plate 10 is provided with a large through hole and a small through hole. The air nozzle 20 passes through the large through hole, and the air guide tube 30 is located inside the housing 9. The air guide tube 30 is located in the placement space. The upper end of the air guide tube 30 is connected to the air inlet 91 at the upper end of the housing 9. The lower end of the air guide tube 30 passes through the small through hole and is connected to the branch pipe on the air nozzle 20. The air inlet 91 is connected to the air pump through the pipe. The high-pressure gas generated by the air pump enters the air nozzle 20 through the air inlet 91 and the air guide tube 30. Then, the high-pressure gas is ejected from the air nozzle 20 to assist the diode laser chip 3.

[0050] As an optional implementation, a protective sleeve 40 is also included, which is connected to the sealing plate 10, and the lower part of the air nozzle 20 and a part of the laser head are located in the protective sleeve 40.

[0051] As an optional implementation, the surface of the diode laser die 3 is coated with thermally conductive silicone to further enhance the heat dissipation efficiency of the diode laser die 3.

[0052] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A water-cooled high-power semiconductor laser, characterized in that, Including drive board (1), water cooling board (2) and diode laser tube core (3), wherein, The drive board (1) and the diode laser tube core (3) are respectively located on the two sides of the water cooling board (2), the drive board (1) is connected with the water cooling board (2) and the side surface of the drive board (1) and the water cooling board (2) is contacted, the diode laser tube core (3) is connected with the water cooling board (2) and the side surface of the diode laser tube core (3) and the water cooling board (2) is contacted.

2. The water-cooled high-power semiconductor laser according to claim 1, characterized in that The water cooling board (2) is provided with vertical channels (21), first horizontal channels (22) and second horizontal channels (23), the number of the vertical channels (21) is multiple, all the vertical channels (21) are arranged along the width direction of the water cooling board (2) and the length of the vertical channel (21) is consistent with the length of the water cooling board (2), the first horizontal channel (22) is vertically arranged with the vertical channel (21) and all the vertical channels (21) are communicated with the first horizontal channel (22), the second horizontal channel (23) is vertically arranged with the vertical channel (21), the last vertical channel (21) is not communicated with the second horizontal channel (23), the remaining vertical channels (21) are communicated with the second horizontal channel (23), there is a spacing between the first horizontal channel (22) and the second horizontal channel (23) and the ports of the first horizontal channel (22) and the second horizontal channel (23) are located on the same side of the water cooling board (2).

3. The water-cooled high-power semiconductor laser according to claim 2, characterized in that It also includes water inlet joint (4), water outlet joint (5) and plug (6), the upper port of the first vertical channel (21) is connected with the water inlet joint (4), the upper port of the last vertical channel (21) is connected with the water outlet joint (5), the number of the plug (6) is multiple, the lower port of the first vertical channel (21), the lower port of the last vertical channel (21), the port of the remaining vertical channels (21), the port of the first horizontal channel (22) and the port of the second horizontal channel (23) are all installed with the plug (6).

4. The water-cooled high-power semiconductor laser according to claim 2, characterized in that The water cooling board (2) is provided with first threaded hole and second threaded hole, the first threaded hole is connected with the drive board (1) through screw, the second threaded hole is connected with the diode laser tube core (3) through screw.

5. The water-cooled high-power semiconductor laser according to claim 1, characterized in that It also includes U-shaped shell (7), the end of the U-shaped shell (7) is fixedly connected with the side surface of the water cooling board (2), the placing space is formed between the U-shaped shell (7) and the water cooling board (2), the diode laser tube core (3) is located in the placing space.

6. The water-cooled high-power semiconductor laser according to claim 5, characterized in that It also includes mounting plate (8), the mounting plate (8) is fixedly connected with the end of the U-shaped shell (7), the mounting plate (8) and the water cooling board (2) are respectively located on the two ends of the U-shaped shell (7), a plurality of mounting holes are arranged on the mounting plate (8).

7. The water-cooled high-power semiconductor laser according to claim 5, characterized in that The shell (9) is further provided with the driving plate (1), the water-cooling plate (2), the diode laser tube core (3) and the U-shaped shell (7), the U-shaped shell (7) is connected with the shell (9), the end surface of the U-shaped shell (7) covers the side opening of the shell (9), and the joint on the water-cooling plate (2) penetrates the upper end of the shell (9).

8. The water-cooled high-power semiconductor laser according to claim 7, characterized in that The sealing plate (10), the air nozzle (20) and the air guide pipe (30) are further provided, the sealing plate (10) is connected with the shell (9) and covers the lower opening of the shell (9), and the air nozzle (20) is installed on the laser head of the diode laser tube core (3). The large hole and the small hole are arranged on the sealing plate (10), the air nozzle (20) penetrates the large hole, the air guide pipe (30) is arranged in the shell (9), the upper end of the air guide pipe (30) is connected with the air joint (91) of the upper end of the shell (9), the lower end of the air guide pipe (30) penetrates the small hole and is connected with the branch pipe of the air nozzle (20).

9. The water-cooled high-power semiconductor laser according to claim 8, characterized in that The protective sleeve (40) is further provided, and the protective sleeve (40) is connected with the sealing plate (10).

10. The water-cooled high-power semiconductor laser according to claim 1, characterized in that The surface of the diode laser tube core (3) is coated with the heat-conducting silica gel.

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