Array laser emitting device

Abstract

The utility model discloses an array laser emitting device, which relates to the field of semiconductor lasers and comprises an emitting device body, laser emitting layers are arranged in the emitting device body in a layered manner along the vertical direction, laser emitting units are arranged on the laser emitting layers along the horizontal direction, and each laser emitting unit comprises a laser and a light beam reflecting part. The lasers are assembled in the transmitting device body in a stacked mode through the multiple layers of heat sinks, and the multiple light beam reflecting parts combine all lasers in the corresponding laser transmitting units into laminated beam combined lasers. The emitting device body is provided with a laser beam combining emitting port, and a layer laser beam combining part for combining all layer combined laser beams to form array combined laser beams which can be emitted from the laser beam combining emitting port is also arranged in the emitting device body. According to the array laser emitting device provided by the utility model, the space utilization rate is improved through multi-layer stacking and a three-dimensional beam combining light path; and a three-dimensional heat dissipation system is established by using multiple layers of heat sinks, so that the contradiction between heat dissipation and compact design of high-power equipment is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor lasers, specifically to an array laser emitting device. Background Technology

[0002] In the field of laser technology, multi-laser array devices face challenges such as large size, insufficient heat dissipation efficiency, and unstable beam combining quality due to increasing laser power requirements. Traditional devices typically employ a single-layer horizontal arrangement of lasers. While this enables multi-beam output, the lateral dimensions expand dramatically with the number of lasers, resulting in bulky equipment that is difficult to adapt to compact environments. Furthermore, single-layer heat dissipation structures rely on metal heat sinks or simple air-cooling systems, which are ineffective at dispersing the dense heat generated during high-power operation, easily leading to localized overheating and affecting laser lifespan and beam stability. In addition, the traditional horizontally extending optical path design further exacerbates the device's depth, significantly increasing the weight and maintenance costs of the heat dissipation device. These problems restrict the flexibility and reliability of high-power laser equipment in industrial applications. Therefore, an innovative solution that balances miniaturization, efficient heat dissipation, and high-quality beam combining is urgently needed. Utility Model Content

[0003] The purpose of this utility model is to address the aforementioned problems by providing an array laser emitting device. This device optimizes the planar layout of traditional laser emitting devices by adopting a vertically layered laser architecture, improves the space utilization of the device through multi-layer stacking and three-dimensional beam combining optical paths, and establishes a three-dimensional heat dissipation system using multi-layer heat sinks to achieve effective heat dissipation of the array laser emitting device under high-density integration, thus resolving the contradiction between heat dissipation of high-power devices and compact design.

[0004] The technical solution adopted in this utility model is as follows:

[0005] An array laser emitting device includes an emitting device body. Within the emitting device body, at least two laser emitting layers are arranged vertically. Each laser emitting layer has at least one laser emitting unit arranged horizontally. Each laser emitting unit includes a laser and a beam reflector that can change the transmission direction of the emitted laser. The laser is assembled within the emitting device body through multiple layers of heat sinks. Several beam reflectors cooperate to combine all lasers within the corresponding laser emitting unit to form a layered laser beam. The emitting device body has a laser beam combining emission port. The emitting device body also has a layered laser beam combining section. The layered laser beam combining section includes combining elements corresponding to each laser emitting layer. The combining elements matched with the laser beam combining emission port are main layer combining elements, and the combining elements not matched with the laser beam combining emission port are sub-layer combining elements. The sub-layer combining elements can act on the corresponding layered laser beam to redirect it towards the main layer combining element. The main layer combining element can combine all layered laser beams to form an arrayed laser beam that can be emitted from the laser beam combining emission port.

[0006] By adopting the above technical solution, the traditional single-layer horizontal arrangement is replaced by a vertically layered design, significantly reducing the planar size of the equipment while maintaining the same number of lasers. The three-dimensional beam combining structure significantly improves the utilization of vertical space, thereby increasing space efficiency and reducing the difficulty of transporting the equipment.

[0007] Furthermore, the multi-layer heat sink includes a heat sink assembly plate arranged vertically and a heat sink base plate arranged horizontally. The heat sink assembly plate is located at one end of the heat sink base plate. The heat sink assembly plate has laser assembly parts arranged vertically, corresponding to each laser emitting layer. Each laser assembly part has several laser mounting holes arranged horizontally at intervals. The laser is assembled in the corresponding laser mounting hole. The multi-layer heat sink is also provided with a heat conducting unit. The heat conducting unit includes a heat absorption section, a heat conducting section, and a heat release section. The heat absorption section is arranged horizontally on the heat sink assembly plate. Each laser assembly part has at least one heat absorption section on its upper and / or lower side. The heat release section is located on the heat sink base plate. The two ends of the heat conducting section are connected to the heat absorption section and the heat release section, respectively.

[0008] Thanks to the aforementioned technical solution, the innovative multi-layer heat sink structure transforms traditional single-layer heat dissipation into a three-dimensional heat dissipation system. By using a heat sink assembly plate to achieve a layered laser layout, the three-dimensional heat dissipation path formed by the heat-conducting units effectively reduces heat flux density compared to traditional single-layer heat dissipation, resolving the contradiction between increased equipment size and power, and successfully reducing the size and weight of high-power equipment.

[0009] Furthermore, a heat dissipation component is provided below the heat sink base plate.

[0010] Thanks to the above technical solution, the bottom heat dissipation component and the multi-layer heat sink form a synergistic heat dissipation system, which effectively improves heat dissipation efficiency.

[0011] Furthermore, the heat-conducting unit includes a heat-conducting groove disposed on a multi-layer heat sink and a heat pipe that matches the heat-conducting groove, wherein the heat pipe is embedded in the heat-conducting groove.

[0012] By adopting the above technical solution, the embedded heat pipe design replaces the traditional integral metal heat conduction block. While achieving precise heat conduction, it reduces the thermal resistance during the heat conduction process. Under the premise of maintaining the same heat dissipation power, it reduces the volume of the heat conduction unit, significantly reduces the amount of materials used and production costs, and solves the problem of bulky equipment caused by the excessive reliance on metal materials in traditional solutions.

[0013] Furthermore, the heat absorption section has a closed end and a connected end at both ends along its length, and the closed ends and connected ends of adjacent heat absorption sections are arranged alternately; the heat conduction section located on the heat sink assembly plate is arranged vertically on the side of the heat sink assembly plate, and the connected end of each heat absorption section is connected to the corresponding heat conduction section; the heat absorption section and the heat conduction section on the heat sink assembly plate cooperate with each other to form a mounting plate heat dissipation structure that surrounds at least part of the laser assembly part.

[0014] Thanks to the above technical solution, the staggered heat conduction path increases the heat dissipation contact area and makes the heat conduction path of the multilayer laser assembly part more uniform, effectively reducing the temperature difference between different areas on the heat sink body and ensuring the improvement of heat dissipation effect.

[0015] Furthermore, there are two laser emitting layers, the length of the heat absorption section matches the laser assembly, the heat release section, the heat absorption section, and the laser assembly are parallel to each other, and the heat absorption section, the heat conduction section, and the heat release section cooperate to form a C-shaped or C-shaped laser heat dissipation structure.

[0016] Due to the adoption of the above technical solution, the heat conduction units corresponding to the double-layer laser assembly are mirrored, that is, one positive C and one negative C, and the two heat conduction units are nested with each other. The heat conduction units form a bidirectional fluid channel through the positive and negative nesting layout, which effectively improves the heat dissipation efficiency. At the same time, the temperature difference between the laser assembly parts of each layer is effectively reduced through the symmetrical heat flow distribution, and the optimal heat conduction path is achieved in a limited space.

[0017] Furthermore, the heat release section is located in the middle of the heat sink base plate, and the heat conduction section on the heat sink base plate is an inclined structure that is obliquely arranged from the edge to the middle. The heat conduction section and the heat release section on the heat sink base plate cooperate with each other to form a zigzag structure.

[0018] Thanks to the aforementioned technical solution, the zigzag heat conduction path design significantly increases the heat dissipation area and heat exchange efficiency. The obliquely positioned heat conduction section effectively guides heat towards the central area for concentrated discharge, forming a highly efficient heat diffusion center in conjunction with the central heat release section. This structure is particularly advantageous for handling the uniform heat dissipation requirements of high-density heat sources. When multiple multi-layer heat sinks are installed together, it effectively reduces the problem of mutual interference in heat dissipation at the edges of adjacent multi-layer heat sinks. Heat dissipation components can also be used at the base plate of the heat sink, significantly reducing the overall size and energy consumption of the device and solving the inherent edge heat dissipation lag problem of large-size single-layer heat sinks.

[0019] Furthermore, the laser can emit laser light along the Y-axis direction, the beam reflector can redirect the laser light in the Y-axis direction to the X-axis direction, the sub-layer beam combiner can redirect the incident laser light in the X-axis direction to the Z-axis and transmit the incident laser light in the Z-axis direction, and the main layer beam combiner can redirect the incident laser light in the Z-axis direction to the X-axis and transmit the incident laser light in the X-axis direction.

[0020] By employing the aforementioned technical solution, three-dimensional laser beam steering is achieved through the cooperation of the beam reflector and the layer laser beam combiner. Coordinated control along the XYZ axes ensures independent transmission paths for each layer of laser light while achieving coaxial beam combining in the final output. This spatial layout significantly improves the device's space utilization while maintaining beam transmission stability. It also substantially reduces the device's depth compared to traditional horizontal layouts, resolving the issue of increased device volume due to optical path extension.

[0021] Furthermore, the main layer beam combining element is matched with the uppermost or lowermost laser emitting layer.

[0022] Thanks to the aforementioned technical solution, the edge layout design of the main layer combining element optimizes the overall optical path structure. This arrangement reduces combining interference from other layers and facilitates optical path calibration and maintenance.

[0023] Furthermore, a beam shaping section for shaping the laser is provided between the laser and the beam reflecting section.

[0024] Thanks to the aforementioned technical solution, the added beam shaping section significantly improves the beam quality of the array-combined laser. By pre-shaping individual laser beams, it ensures that each laser has consistent parameter characteristics before combining. This hierarchical processing method not only improves combining efficiency but also reduces the design complexity of subsequent combining components.

[0025] In summary, due to the adoption of the above technical solutions, the beneficial effects of this utility model are as follows: by using a vertically layered layout of the laser emitting layer and a three-dimensional beam combining optical path design, the device size is significantly reduced and the space utilization rate is improved, breaking through the size limitations of the traditional single-layer layout; the innovative multi-layer heat sink system combined with a three-dimensional heat dissipation path greatly reduces the heat flux density and optimizes the heat dissipation efficiency, solving the contradiction between heat dissipation of high-power devices and compact design; at the same time, the use of pre-beam shaping technology effectively improves the stability of the device and the beam combining accuracy. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the array laser emitting device of this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the multi-layer heat sink and heat dissipation component used for heat dissipation in this utility model;

[0028] Figure 3 This is a front view of the multilayer heat sink of this utility model;

[0029] Figure 4 This utility model relates to Figure 2 A cross-sectional view along the BB direction;

[0030] Figure 5 This is a bottom view of the multi-layer heat sink of this utility model;

[0031] Figure 6 This is a schematic diagram of the optical path of the beam combining array laser of this utility model.

[0032] The diagram is labeled as follows: 1-Multi-layer heat sink, 101-Heat sink assembly plate, 102-Heat sink base plate, 2-Laser assembly section, 201-Laser mounting hole, 3-Heat conduction unit, 301-Heat absorption section, 302-Heat conduction section, 303-Heat release section, 4-First heat conduction unit, 5-Second heat conduction unit, 6-Mounting hole, 7-Heat pipe, 8-Heat conduction groove, 9-Laser, 10-Beam shaping section, 11-Beam reflecting section, 12-Layer laser beam combining section, 1201-Main layer beam combining element, 1202-Secondary layer beam combining element, 13-Heat dissipation assembly. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings.

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0035] Example 1

[0036] An array laser emitting device, such as Figure 1-6 As shown, establish as Figure 1 The coordinate system shown includes the main body of the transmitting device. Within the main body of the transmitting device, two laser emitting layers are arranged vertically. It can be understood that any number of laser emitting layers can be configured according to actual needs. Each laser emitting layer has at least one laser emitting unit arranged horizontally. Each laser emitting unit includes a laser 9 and a beam reflector 11 that can change the transmission direction of the laser emitted by the laser 9. The laser 9 is assembled within the main body of the transmitting device through multiple layers of heat sinks 1. Several beam reflectors 11 cooperate to combine all the laser beams within the corresponding laser emitting unit into a combined laser beam. The main body of the emitting device is provided with a laser beam combining emission port. The main body of the emitting device is also provided with a layer laser beam combining section 12. The layer laser beam combining section 12 includes beam combining elements that correspond one-to-one with the laser emitting layer. Among them, the beam combining element matched with the laser beam combining emission port is the main layer beam combining element 1201, and the beam combining element not matched with the laser beam combining emission port is the sub-layer beam combining element 1202. The sub-layer beam combining element 1202 can act on the corresponding layer beam combining laser to make it turn to the main layer beam combining element 1201. The main layer beam combining element 1201 can combine all the layer beam combining lasers to form an array beam combining laser that can be emitted from the laser beam combining emission port.

[0037] Specifically, by replacing the traditional single-layer horizontal arrangement with a vertically layered design, the planar size of the equipment is significantly reduced while maintaining the same number of lasers. The three-dimensional beam combining structure significantly improves the utilization of vertical space, thereby increasing space efficiency and reducing the difficulty of transporting the equipment.

[0038] The multi-layer heat sink 1 includes a heat sink assembly plate 101 arranged vertically and a heat sink base plate 102 arranged horizontally. The heat sink assembly plate 101 is located at one end of the heat sink base plate 102, forming an L-shaped structure. The heat sink assembly plate 101 has laser assembly parts 2 arranged vertically, corresponding to each laser emitting layer. Each laser assembly part 2 has a plurality of laser mounting holes 201 arranged horizontally in a straight line. The number of laser mounting holes 201 can be set arbitrarily as needed and is not limited here. The laser 9 is mounted in the corresponding laser mounting hole 201; the multi-layer heat sink 1 is also provided with a heat-conducting unit 3, which includes a heat absorption section 301, a heat-conducting section 302 and a heat release section 303. The heat absorption section 301 is arranged horizontally on the heat sink assembly plate 101, and a heat absorption section 301 is provided on the upper side of each laser assembly part 2. The heat release section 303 is arranged on the heat sink base plate 102, and the two ends of the heat-conducting section 302 are respectively connected to the heat absorption section 301 and the heat release section 303.

[0039] Specifically, the innovative multi-layer heat sink 1 structure transforms traditional single-layer heat dissipation into a three-dimensional heat dissipation system. The layered layout of the laser 9 is achieved through the heat sink assembly plate 101, and the three-dimensional heat dissipation path formed by the heat conduction unit 3 effectively reduces the heat flux density compared to traditional single-layer heat dissipation, resolving the contradiction between the increase in equipment size and power, and successfully reducing the size and weight of high-power equipment.

[0040] A heat dissipation component 13 is provided below the heat sink base plate 102.

[0041] Specifically, the bottom heat dissipation component 13 and the multi-layer heat sink 1 form a synergistic heat dissipation system, effectively improving heat dissipation efficiency. Preferably, the heat dissipation component includes, but is not limited to, metal heat sinks, heat pipes, thermal grease, graphene pads, phase change materials, etc. Any material capable of achieving thermal conductivity and heat dissipation should be considered within the scope of this application. The heat dissipation component can also be a combination of a fan and a heat sink, a liquid cooling system, a semiconductor refrigeration chip, or a microchannel heat sink. This embodiment uses a combination of a fan and a heat sink, such as... Figure 2 As shown, the direction of air cooling is indicated by arrows, and the fan is a conventional structure and is not shown in the figure.

[0042] The heat-conducting unit 3 includes a heat-conducting groove 8 disposed on a multi-layer heat sink 1, and a heat pipe 7 that matches the heat-conducting groove 8. The heat pipe 7 is embedded in the heat-conducting groove 8.

[0043] Specifically, the embedded heat pipe 7 design replaces the traditional integral metal heat pipe, which reduces the thermal resistance during the heat conduction process while achieving precise heat conduction. Under the premise of maintaining the same heat dissipation power, the volume of the heat conduction unit 3 is reduced, which greatly reduces the amount of materials used and the production cost, and solves the problem of bulky equipment caused by the over-reliance on metal materials in traditional solutions.

[0044] The heat absorption section 301 has a closed end and a connected end at its two ends along its length, and the closed ends and connected ends of adjacent heat absorption sections 301 are arranged alternately. The heat conduction section 302 located on the heat sink assembly plate 101 is arranged vertically on the side of the heat sink assembly plate 101, and the connected end of each heat absorption section 301 is connected to the corresponding heat conduction section 302. The heat absorption section 301 and the heat conduction section 302 on the heat sink assembly plate 101 cooperate with each other to form a mounting plate heat dissipation structure that surrounds at least part of the laser assembly part 2.

[0045] Specifically, the staggered heat conduction path increases the heat dissipation contact area and makes the heat conduction path of the multilayer laser assembly part 2 uniformly distributed, effectively reducing the temperature difference between different areas on the heat sink body and ensuring the improvement of heat dissipation effect.

[0046] The number of laser emitting layers is two. The length of the heat absorption section 301 matches that of the laser assembly part 2. The heat release section 303, the heat absorption section 301, and the laser assembly part 2 are parallel to each other. The heat absorption section 301, the heat conduction section 302, and the heat release section 303 cooperate with each other to form a C-shaped heat dissipation structure for the laser 9.

[0047] Specifically, the heat conduction units 3 corresponding to the double-layer laser assembly 2 are mirrored, that is, one positive C and one negative C, and the two heat conduction units 3 are nested with each other. The heat conduction units 3 form a bidirectional fluid channel through the positive and negative nesting layout, which effectively improves the heat dissipation efficiency. At the same time, the symmetrical heat flow distribution effectively reduces the temperature difference between each layer of the laser assembly 2, and achieves the optimal heat conduction path in a limited space.

[0048] The heat release section 303 is located in the middle of the heat sink base plate 102. The heat conduction section 302 on the heat sink base plate 102 is an inclined structure that is obliquely arranged from the edge to the middle. The inclination angle of the inclined structure is preferably between 30 and 60 degrees, and the optimal angle is 45 degrees. The heat conduction section 302 and the heat release section 303 on the heat sink base plate 102 cooperate with each other to form a zigzag structure.

[0049] Specifically, the zigzag heat conduction path design significantly increases the heat dissipation area and heat exchange efficiency. The obliquely arranged heat conduction section 302 effectively guides heat to concentrate and dissipate towards the central area, forming a highly efficient heat diffusion center in conjunction with the central heat release section 303. This structure is particularly advantageous for handling the uniform heat dissipation requirements of high-density heat sources. When multiple multi-layer heat sinks 1 are installed together, the problem of mutual interference in heat dissipation at the edges of adjacent multi-layer heat sinks 1 is effectively reduced. Heat dissipation components 13 can also be used at the heat sink base plate 102, significantly reducing the overall size and energy consumption of the device and solving the inherent edge heat dissipation lag problem of large-size single-layer heat sinks.

[0050] The heat-conducting unit 3 includes a first heat-conducting unit 4 corresponding to the upper laser emitting layer and a second heat-conducting unit 5 corresponding to the lower laser emitting layer.

[0051] The heat sink base plate 102 is provided with mounting holes 6 for matching connectors.

[0052] The laser 9 can emit laser light along the Y-axis direction, the beam reflector 11 can redirect the laser light in the Y-axis direction to the X-axis direction, the sub-layer beam combiner 1202 can redirect the incident laser light in the X-axis direction to the Z-axis and transmit the incident laser light in the Z-axis direction, and the main layer beam combiner 1201 can redirect the incident laser light in the Z-axis direction to the X-axis and transmit the incident laser light in the X-axis direction.

[0053] Specifically, the three-dimensional laser beam steering is achieved through the cooperation of the beam reflecting unit 11 and the layer laser beam combining unit 12. Coordinated control along the XYZ axes ensures independent transmission paths for each layer of laser light while achieving coaxial beam combining in the final output. This spatial layout significantly improves the space utilization of the device while ensuring the stability of beam transmission. It also greatly reduces the device's depth compared to traditional horizontal layouts, solving the problem of device volume expansion caused by optical path extension.

[0054] The main layer beam combining element 1201 is matched with the bottommost laser emitting layer.

[0055] Specifically, the edge layout design of the main layer combining element 1201 optimizes the overall optical path structure. This arrangement reduces combining interference from other layers and facilitates optical path calibration and maintenance.

[0056] A beam shaping section 10 for shaping the laser is provided between the laser 9 and the beam reflecting section 11.

[0057] Specifically, the added beam shaping section 10 significantly improves the beam quality of the array-combined laser. By pre-shaping individual laser beams, it ensures that each laser has consistent parameter characteristics before beam combining. This hierarchical processing method not only improves beam combining efficiency but also reduces the design difficulty of subsequent beam combining elements. The beam shaping section 10 consists of several cylindrical mirrors, which can be configured as convex or concave mirrors according to specific needs. For example, in this embodiment, a concave mirror and two convex mirrors are arranged sequentially from the laser 9 to the beam reflecting section 11. The concave mirror compresses the divergence angle of the original beam output by the laser 9 to avoid energy crosstalk caused by the divergence overlap of adjacent lasers 9; the first convex mirror corrects the beam spot to eliminate the beam spot asymmetry caused by the manufacturing tolerance of the laser 9; the second convex mirror converges the curvature radius of each beam to ensure phase consistency during subsequent beam combining.

[0058] When the array laser emitting device is running, each laser 9 is started according to a preset timing sequence. The Y-direction laser beam generated by the laser 9 is shaped by the beam shaping part 10 and then turned by the beam reflecting part 11 to be transmitted in the X-axis direction, forming a layered laser beam transmitted in the X-axis direction. The sub-layer beam combining element 1202 turns the upper layer beam to be transmitted in the Z-axis direction, so that the upper layer beam is transmitted to the lower main layer beam combining element 1201. The main layer beam combining element 1201 turns the beam to be transmitted in the X-axis direction. The lower layer beam transmits through the main layer beam combining element 1201 and is combined with the turned upper layer beam to form an array beam combining laser, completing the coaxial superposition of multiple beams. Finally, the array beam combining laser is output through the laser beam combining emission port. The heat dissipation system absorbs the heat from each layer of laser 9 through the heat absorption section 301 on the heat sink assembly plate 101, and conducts it directionally to the heat release section 303 of the heat sink base plate 102 through the heat conduction section 302, so as to achieve centralized release. At the same time, the heat dissipation component 13 below the heat sink base plate 102 works together to dissipate heat, ensuring the thermal stability of the device under continuous high power operation.

[0059] This document uses specific embodiments to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

[0060] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0061] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. An array laser emitting device comprising an emitting device body, characterized in that, The emitting device body is configured with not less than two laser emitting layers in a vertical direction, each laser emitting layer is provided with not less than one laser emitting unit in a horizontal direction, each laser emitting unit comprises a laser and a beam reflecting part capable of changing the transmission direction of the laser, the laser is assembled in the emitting device body through a multilayer heat sink, and a plurality of beam reflecting parts cooperate to form a laminated beam laser by combining all the lasers in the corresponding laser emitting unit; the emitting device body is provided with a laser beam combining and emitting port, and the emitting device body is further provided with a layer laser beam combining part, the layer laser beam combining part comprises a beam combining element corresponding to each laser emitting layer, wherein the beam combining element matched with the laser beam combining and emitting port is a main laminated beam element, and the beam combining element not matched with the laser beam combining and emitting port is a secondary laminated beam element, the secondary laminated beam element can act on the corresponding laminated beam laser to make it turn to the main laminated beam element, and the main laminated beam element can combine all the laminated beam lasers to form an array laminated beam laser which can be emitted from the laser beam combining and emitting port.

2. The array laser emission device of claim 1, wherein, The multilayer heat sink comprises a heat sink assembly plate arranged in a vertical direction and a heat sink bottom plate arranged in a horizontal direction, the heat sink assembly plate is arranged at one end of the heat sink bottom plate, the heat sink assembly plate is provided with a laser assembly part corresponding to each laser emitting layer in a vertical direction, each laser assembly part is provided with a plurality of laser mounting holes arranged in a horizontal direction in a one-dimensional interval, and the laser is mounted in the corresponding laser mounting hole; the multilayer heat sink is further provided with a heat conducting unit, the heat conducting unit comprises a heat absorbing section, a heat conducting section and a heat releasing section, the heat absorbing section is arranged on the heat sink assembly plate in a horizontal direction, and at least one heat absorbing section is arranged on the upper side and / or the lower side of each laser assembly part, the heat releasing section is arranged on the heat sink bottom plate, and the two ends of the heat conducting section are in communication with the heat absorbing section and the heat releasing section respectively.

3. The array laser emission device of claim 2, wherein, A heat dissipation assembly is arranged below the heat sink bottom plate.

4. The array laser emitting device of claim 2, wherein, The heat conducting unit comprises a heat conducting groove arranged on the multilayer heat sink and a heat pipe matched with the heat conducting groove, and the heat pipe is embedded in the heat conducting groove.

5. The array laser emitting device of claim 2, wherein, The two ends of the heat absorbing section along the length direction are respectively a closed end and a communication end, and the closed ends and the communication ends of adjacent heat absorbing sections are arranged alternately; the heat conducting section located on the heat sink assembly plate is arranged on the side edge of the heat sink assembly plate in a vertical direction, and the communication end of each heat absorbing section is in communication with the corresponding heat conducting section; the heat absorbing section and the heat conducting section on the heat sink assembly plate cooperate to form an at least partially surrounding mounting plate heat dissipation structure around the laser assembly part.

6. The array laser emitting device of claim 5, wherein, The number of the laser emitting layers is two, the length of the heat absorbing section matches the laser assembly part, the heat releasing section, the heat absorbing section and the laser assembly part are parallel to each other, and the heat absorbing section, the heat conducting section and the heat releasing section cooperate to form a C-shaped or C-shaped laser heat dissipation structure.

7. The array laser emitting device of claim 2, wherein, The heat releasing section is arranged in the middle part of the heat sink bottom plate, the heat conducting section on the heat sink bottom plate is an inclined structure arranged from the edge to the middle part, and the heat conducting section on the heat sink bottom plate cooperates with the heat releasing section to form a broken line structure.

8. The array laser emitting device of claim 1, wherein, The laser can emit laser light in a Y-axis direction, the light beam reflection part can turn the Y-axis direction laser to an X-axis direction, the sub-laminated beam element can turn the X-axis direction incident laser to a Z-axis and transmit the Z-axis direction incident laser, and the main laminated beam element can turn the Z-axis direction incident laser to the X-axis and transmit the X-axis direction incident laser.

9. The array laser emitting device of claim 1, wherein, The main laminated beam element matches the uppermost layer or the lowermost layer laser emitting layer.

10. The array laser emitting device of claim 1, wherein, A light beam shaping part for shaping the laser is arranged between the laser and the light beam reflection part.

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