Multilayer circuit board solder mask developing machine
By introducing a reaction chamber limiting structure and a wastewater collection system into the multilayer circuit board solder resist developing machine, the problems of scale accumulation and circuit board displacement were solved, achieving a stable spraying process and efficient wastewater treatment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-03-03
AI Technical Summary
During the solder resist development process of multilayer circuit boards, scale easily forms in the reaction chamber, making it difficult to clean. Furthermore, the circuit boards are prone to displacement during the spray cleaning process, affecting the cleaning effect.
A multi-layer circuit board solder resist developing machine was designed, which adopts a combination structure of reaction box, slider, slide groove, matching screw, limit nut, groove, adjusting screw and limit plate. The circuit board is fixed by the limit plate, and wastewater is collected by the guide plate and liquid collection tank plate to ensure the stability and efficiency of the spray washing process.
It effectively prevents the circuit board from shifting during the spraying process, improves the cleaning effect, facilitates the centralized treatment of wastewater, and enhances operational efficiency.
Smart Images

Figure CN223968053U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board processing technology, and in particular relates to a multilayer circuit board solder resist developing machine. Background Technology
[0002] As electronic products become increasingly miniaturized and sophisticated, the precision requirements for circuit boards are also rising. Multilayer circuit board solder mask developing machines can meet this demand and are suitable for the fabrication of fine circuits.
[0003] When developing multilayer circuit boards, solder resist developing machines mostly involve manually placing the circuit boards, spraying developing powder onto them, and then directly spraying and cleaning them with a water spray structure. The reaction chamber is mostly fixed inside the machine casing. After repeated operations, scale easily accumulates in the reaction chamber, making it inconvenient to clean. Furthermore, the multilayer circuit boards are not restrained when placed inside the reaction chamber, making them prone to displacement during the spraying process, which affects the cleaning effect. Utility Model Content
[0004] The purpose of this invention is to provide a multilayer circuit board solder resist developing machine to solve the problems mentioned in the background art.
[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:
[0006] This utility model relates to a multilayer circuit board solder resist developing machine, comprising a chassis, a spray assembly, and a liquid collection tank. One end of the chassis is open, and both sides of the inner wall of the chassis have sliding grooves. A matching screw is fixedly connected inside the sliding groove, and a slider is provided around the circumference of the matching screw. The slider slides in contact with the matching screw, with one end of the slider located inside the sliding groove and slidingly engaging with it. The other end of the slider is fixedly connected to a reaction box, which is located inside the chassis. A limit nut is threadedly connected to the circumference of one end of the matching screw, with one end of the limit nut abutting the slider and located outside the sliding groove. Both sides of the upper surface of the reaction box have grooves, and an adjusting screw is rotatably connected inside the grooves. A threaded block is threadedly connected to the circumference of the adjusting screw, with one end of the threaded block located inside the groove and slidingly engaging with it. The other end of the threaded block is fixedly connected to a limit plate, which is located inside the reaction box and slides in contact with it.
[0007] The spray assembly includes a water storage tank located on one side of the chassis. A water pump is installed inside the water storage tank. A mounting plate is fixedly connected to the top of the chassis. A spray box is fixedly connected inside the mounting plate. A connecting pipe is installed at one end of the water storage tank and is fixedly connected to the spray box at one end.
[0008] Multiple sets of nozzles are fixedly connected to the bottom surface of the water spray box, and the nozzles are positioned above the reaction box.
[0009] The internal structure of the chassis is fixedly connected to a flow guide plate, which is inclined and positioned below the reaction chamber.
[0010] A slot is provided at one end of the chassis, and mating slots are provided on both sides of the chassis. The mating slots are located on one side of the slot, and the liquid collection tank plate is located in the slot and is inserted into the slot. Both ends of the liquid collection tank plate are fixedly connected to mating blocks, which are located in the mating slots and are slidably engaged with the mating slots. The liquid collection tank plate is located on one side of the guide plate. By setting the guide plate and the liquid collection tank plate, when the nozzle sprays and washes the multi-layer circuit board of the reaction box, the splashed water flows into the liquid collection tank plate through the guide plate. The liquid collection tank plate is inserted into the chassis, which facilitates the centralized collection and treatment of wastewater.
[0011] This utility model has the following beneficial effects:
[0012] This invention utilizes a reaction box, slider, slide groove, mating screw, limiting nut, groove, adjusting screw, threaded block, and limiting plate. A multi-layer circuit board is placed inside the reaction box, below the limiting plate. Rotating the adjusting screw causes the threaded block to slide within the groove, which in turn moves the limiting plate to fix the multi-layer circuit board in place, preventing displacement during subsequent water spraying and improving efficiency. The sliders at both ends of the reaction box are then slid into the slide groove along the mating screw, with one end of the slider against the inner wall of the groove. The reaction box is then placed inside the housing, below the nozzle. Finally, the limiting nut is screwed onto the mating screw, with one end against the slider, thus fixing the slider in place and securing the reaction box for subsequent operations.
[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the three-dimensional assembly structure of this utility model;
[0016] Figure 2 for Figure 1 Enlarged view of region A in the middle;
[0017] Figure 3 for Figure 1 Enlarged view of region B in the middle;
[0018] Figure 4 This is a front view of the assembly structure of this utility model.
[0019] The attached diagram lists the components represented by each number as follows:
[0020] 1. Chassis; 101. Guide plate; 102. Reaction box; 103. Mounting plate; 104. Slider; 105. Slide groove; 106. Mating screw; 107. Limit nut; 108. Groove; 109. Adjusting screw; 110. Threaded block; 111. Limiting plate; 2. Spray assembly; 201. Water storage tank; 202. Connecting pipe; 203. Spray box; 204. Nozzle; 3. Liquid collection tank plate; 301. Mating block. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] In the description of this utility model, it should be understood that the terms "upper", "middle", "outer", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0024] Please see Figures 1-4As shown, this utility model is a multilayer circuit board solder resist developing machine, including a chassis 1, a spray assembly 2, and a liquid collection tank 3. One end of the chassis 1 is open, and both sides of the inner wall of the chassis 1 are provided with sliding grooves 105. A mating screw 106 is fixedly connected inside the sliding groove 105. A slider 104 is provided around the mating screw 106, and the slider 104 slides with the mating screw 106. One end of the slider 104 is located in the sliding groove 105 and slides with the sliding groove 105. The other end of the slider 104 is fixedly connected to a reaction box 102, which is located inside the chassis 1. One end of the mating screw 106... The peripheral threaded connection of the reaction box 102 is a limiting nut 107. One end of the limiting nut 107 is in contact with the slider 104. The limiting nut 107 is located on the outside of the slide groove 105. Grooves 108 are provided on both sides of the upper surface of the reaction box 102. An adjusting screw 109 is rotatably connected inside the groove 108. A threaded block 110 is threadedly connected to the peripheral threaded connection of the adjusting screw 109. One end of the threaded block 110 is located in the groove 108 and slides with the groove 108. The other end of the threaded block 110 is fixedly connected to a limiting plate 111. The limiting plate 111 is located in the reaction box 102 and slides with the reaction box 102.
[0025] The spray assembly 2 includes a water storage tank 201, which is located on one side of the housing 1. A water pump is installed inside the water storage tank 201. A mounting plate 103 is fixedly connected to the top of the housing 1. A spray box 203 is fixedly connected inside the mounting plate 103. A connecting pipe 202 is installed at one end of the water storage tank 201, and one end of the connecting pipe 202 is fixedly connected to the spray box 203.
[0026] Multiple sets of nozzles 204 are fixedly connected to the bottom surface of the water spray box 203, and the nozzles 204 are positioned above the reaction box 102.
[0027] A flow guide plate 101 is fixedly connected inside the casing 1. The flow guide plate 101 is inclined and is located below the reaction box 102.
[0028] A slot is provided at one end of the casing 1, and mating slots are provided on both sides of the casing 1. The mating slots are located on one side of the slot, and the liquid collection tank plate 3 is located in the slot and is inserted into the slot. Both ends of the liquid collection tank plate 3 are fixedly connected to mating blocks 301, which are located in the mating slots and are slidably engaged with the mating slots. The liquid collection tank plate 3 is located on one side of the guide plate 101. By setting the guide plate 101 and the liquid collection tank plate 3, when the nozzle 204 sprays and washes the multilayer circuit board of the reaction box 102, the splashed water flows into the liquid collection tank plate 3 through the guide plate 101. The liquid collection tank plate 3 is inserted into the casing 1, which facilitates the centralized collection and treatment of wastewater.
[0029] It should be further explained that, in actual use, the multilayer circuit board is placed inside the reaction box 102, below the limiting plate 111. Then, the adjusting screw 109 is rotated, causing the threaded block 110 to slide within the groove 108, thereby limiting and fixing the multilayer circuit board with the limiting plate 111, thus preventing displacement of the multilayer circuit board during subsequent water spraying. Developer powder is then sprinkled onto the multilayer circuit board, and the sliders 104 at both ends of the reaction box 102 are slid into the slide groove 105 along the mating screw 106, with one end of the slider 104 adhering to the inner wall of the slide groove 105, thereby adjusting the reaction box... 102 is placed inside the housing 1 and below the nozzle 204. The limiting nut 107 is then screwed onto the mating screw 106, and one end of the limiting nut 107 is brought into contact with the slider 104, thereby limiting the slider 104 and fixing the position of the reaction box 102 for easy subsequent operation. The water pump in the water storage tank 201 is started, and water flows through the connecting pipe 202 into the water spray box 203. Then, multiple sets of nozzles 204 spray and wash the multi-layer circuit board in the reaction box 102, and the splashed water flows into the liquid collection tank plate 3 through the guide plate 101 for easy integration processing.
[0030] It should be further noted that the screw 106, the limit nut 107, and the adjusting screw 109 are all made of plastic to avoid the influence of water flow and improve practicality.
[0031] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0032] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A multilayer circuit board solder resist developing machine, comprising a chassis (1), a spray assembly (2), and a liquid collection tank (3), characterized in that: One end of the casing (1) is open. Slide grooves (105) are provided on both sides of the inner wall of the casing (1). A matching screw (106) is fixedly connected inside the slide groove (105). A slider (104) is provided around the matching screw (106). The slider (104) slides with the matching screw (106). One end of the slider (104) is located inside the slide groove (105) and slides with it. The other end of the slider (104) is fixedly connected to a reaction box (102), which is located inside the casing (1). A limit nut (107) is threaded onto the circumference of one end of the matching screw (106). One end of the limiting nut (107) is in contact with the slider (104). The limiting nut (107) is located on the outside of the slide groove (105). Grooves (108) are provided on both sides of the upper surface of the reaction box (102). An adjusting screw (109) is rotatably connected inside the groove (108). A threaded block (110) is threadedly connected to the circumference of the adjusting screw (109). One end of the threaded block (110) is located in the groove (108) and slides with the groove (108). The other end of the threaded block (110) is fixedly connected to a limiting plate (111). The limiting plate (111) is located in the reaction box (102) and slides with the reaction box (102).
2. The multilayer circuit board solder resist developing machine according to claim 1, characterized in that, The spray assembly (2) includes a water storage tank (201), which is located on one side of the housing (1). A water pump is installed inside the water storage tank (201). A mounting plate (103) is fixedly connected to the top of the housing (1). A spray box (203) is fixedly connected inside the mounting plate (103). A connecting pipe (202) is installed at one end of the water storage tank (201), and one end of the connecting pipe (202) is fixedly connected to the spray box (203).
3. The multilayer circuit board solder resist developing machine according to claim 2, characterized in that, The bottom surface of the water spray box (203) is fixedly connected to multiple sets of nozzles (204), and the nozzles (204) are positioned above the reaction box (102).
4. The multilayer circuit board solder resist developing machine according to claim 3, characterized in that, The internal connection of the chassis (1) is a flow guide plate (101), which is inclined and located below the reaction box (102).
5. A multilayer circuit board solder resist developing machine according to claim 4, characterized in that, A slot is provided at one end of the chassis (1), and mating slots are provided on both sides of the chassis (1). The mating slot is located on one side of the slot. The liquid collection tank plate (3) is located in the slot and is inserted into the slot. Both ends of the liquid collection tank plate (3) are fixedly connected with mating blocks (301). The mating blocks (301) are located in the mating slot and are slidably engaged with the mating slot. The liquid collection tank plate (3) is located on one side of the guide plate (101).