Component or assembly with reduced diffusion of migrated material

Abstract

The utility model relates to a part or an assembly for reducing diffusion of migrated materials, which is configured to have a surface, the surface has surface roughness, and the surface roughness is operably used for reducing diffusion of materials migrated from a compound along the surface under the condition that the materials migrated from the compound exist. The present invention relates to a surface roughness of a composite for managing heat and / or electromagnetic interference (EMI) without having to change the formulation of the composite, the surface roughness being characterized by at least one or both of the following: an arithmetic mean height (Sa) of no greater than about 1.25 microns; and a root mean square height (Sq) of not greater than about 1.5 microns, the component or assembly comprising one or more of: a heat removal / dissipation structure; a heat source for the electronic device; a component of the solid state drive; and / or a board-level shield.

Description

Technical Field

[0001] This disclosure relates to a component or assembly for reducing the diffusion of migrating materials. More specifically, it relates to reducing the diffusion of materials migrating from thermal management and / or electromagnetic interference (EMI) mitigation materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally conductive EMI absorbers, conductive elastomers (ECEs), conductive composites, combinations thereof, etc.) and other polymer-inorganic composite materials for other purposes (e.g., reducing the diffusion of oil exudates, etc.). Background Technology

[0002] This section provides background information related to this disclosure, which is not necessarily prior art.

[0003] Electrical components such as semiconductors, integrated circuit packages, and transistors typically have a pre-designed temperature for optimal operation. Ideally, this pre-designed temperature is close to the ambient air temperature. However, the operation of electrical components generates heat. If this heat is not removed, the electrical components can operate at temperatures significantly higher than their normal or expected operating temperature. This excessive temperature can adversely affect the operating characteristics of the electrical components and the operation of associated devices.

[0004] To avoid or at least reduce adverse operating characteristics caused by heat generation, heat should be removed, for example, by conducting heat from the operating electrical components to the radiator. The radiator can then be cooled by conventional convection and / or radiation techniques. During convection, heat can be transferred from the operating electrical components to the radiator through direct surface contact between the electrical components and the radiator and / or through contact between the electrical components and the radiator surfaces via an intermediate medium or thermal interface material (TIM). Thermal interface materials can be used to fill gaps between heat transfer surfaces to improve heat transfer efficiency compared to gaps filled with air (which is a relatively poor thermal conductor).

[0005] Another common problem in the operation of electronic devices is the generation of electromagnetic radiation within the device's electronic circuitry. This radiation can lead to electromagnetic interference (EMI) or radio frequency interference (RFI), which can interfere with the operation of other electronic devices within a certain proximity. Without sufficient shielding, EMI / RFI interference can cause the degradation or complete loss of critical signals, rendering electronic devices inefficient or inoperable.

[0006] A common solution to improve EMI / RFI effects is to use shielding that can absorb and / or reflect and / or redirect EMI energy. These shields are typically used to localize the EMI / RFI source and insulate other devices near the EMI / RFI source. These shields can be made of metals, polymer-inorganic composites, filled foams, or foam materials wrapped with absorbing and / or reflecting materials.

[0007] As used herein, the term “EMI” should be considered to generally include and refer to both EMI emissions and RFI emissions, and the term “electromagnetic” should be considered to generally include and refer to both electromagnetic and radio frequency emissions from external and internal sources. Therefore, the term “shielding” (as used herein) broadly includes and refers to mitigating (or limiting) EMI and / or RFI, such as by absorbing, reflecting, blocking, and / or redirecting energy, or some combination thereof, so that it no longer interferes with, for example, the internal functions of government compliance and / or electronic component systems.

[0008] The aforementioned mitigation / management materials (if not composed of metal) are typically composed of inorganic-polymer composites or metal-polymer composites. To achieve the desired management of thermal and / or EMI issues, the concentration of inorganic materials, typically particulate, within the polymer matrix is ​​usually high.

[0009] In some cases, composites are used in applications where compression occurs between two parts of a device that requires management of thermal and / or EMI issues. This compression can occur during device assembly or during use of the device in cycles of compression and expansion. Consequently, the composites must be “soft” so that they can readily deflect and absorb the forces of compression without transmitting those forces to the device being protected from the associated risk of physical damage. As is known to those skilled in the art, in some cases, methods used to prepare such soft composites produce materials of various organic substances that can migrate over time, particularly after repeated cycles of compression and expansion. These organic substances can consist of polymers, monomers, additives used to form the composite or enhance its performance during use, composites of organic and inorganic materials, etc. The term “oil exudation” is commonly used in industry to describe this phenomenon and will be used in this document; “oil” is understood to refer primarily to the range of organic substances, and “exudation” refers to the movement of material from within the composite to a location outside the composite. Utility Model Content

[0010] One aspect of this invention relates to a component or assembly for reducing the diffusion of migrating material, configured to have a surface having a surface roughness operatively used to reduce the diffusion of material migrating from a composite along the surface in the presence of material migrating from a composite, without having to change the formulation of the composite, wherein the composite is used to manage thermal and / or electromagnetic interference (EMI), wherein the surface roughness is characterized by at least one or both of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers; and a root mean square height (Sq) not greater than about 1.5 micrometers, wherein the component or assembly comprises one or more of the following: a heat dissipation / heat removal structure; a heat source for an electronic device; a component of a solid-state driver; and / or a board-level shield.

[0011] Another aspect of this invention relates to a method for reducing the diffusion of material migrating from a composite without altering the formulation of the composite in the presence of such material, the method comprising: positioning the composite relative to a surface having a surface roughness configured to reduce the diffusion of material migrating from the composite along the surface in the presence of such material; and / or configuring the surface to have a surface roughness for reducing the diffusion of material migrating from the composite along the surface in the presence of such material.

[0012] In one embodiment, the surface roughness is characterized by at least one or both of the following: an arithmetic mean height (Sa) of not more than about 1.25 micrometers; and a root mean square height (Sq) of not more than about 1.5 micrometers.

[0013] In one embodiment, the surface roughness is characterized in that the extended interface area ratio (Sdr) is not greater than about 250%.

[0014] In one embodiment, the surface roughness is characterized by at least one or both of an arithmetic mean height (Sa) of about 0.01 micrometers (μm) to about 1.25 micrometers (μm) and a root mean square height (Sq) of about 0.01 micrometers to about 1.5 micrometers; and the surface roughness is further characterized by an extended interface area ratio (Sdr) of about 0.1% to about 250%.

[0015] In one embodiment, the method includes: configuring the surface to have a surface roughness for reducing the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite; and, after configuration, positioning the composite relative to the surface having the surface roughness to reduce the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite without altering the formulation of the composite.

[0016] In one embodiment, the method includes: smoothing and / or glossing the surface to have a surface roughness for reducing the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite; and positioning the composite on and / or near the already smoothed and / or glossed surface to reduce the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite without altering the formulation of the composite.

[0017] In one embodiment, the composite is used to manage thermal and / or electromagnetic interference (EMI); and the method includes reducing the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite without altering the formulation of the composite used to manage thermal and / or electromagnetic interference (EMI).

[0018] In one embodiment, the method includes reducing the surface roughness of the base component to at least one or both of an arithmetic mean height (Sa) of no more than about 1.25 micrometers and a root mean square height (Sq) of no more than about 1.5 micrometers; and / or configuring the surface to have a minimum thickness sufficient to reduce the surface roughness of the base component to at least one or both of an arithmetic mean height (Sa) of no more than about 1.25 micrometers and a root mean square height (Sq) of no more than about 1.5 micrometers.

[0019] In one embodiment, the method includes configuring the surface to have a surface roughness for reducing the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite by one or more of the following: glossing the surface; deforming the surface to have a glossy, mirror-like, shiny, and / or polished appearance; polishing the surface; painting the surface; coating the surface; sandblasting the surface; plasma etching the surface; electroplating the surface; and / or converting the surface to a surface roughness having at least one or both of an arithmetic mean height (Sa) of not more than about 1.25 micrometers and a root mean square height (Sq) of not more than about 1.5 micrometers.

[0020] In one embodiment, the method includes: positioning the composite directly on the surface such that the surface is directly below and in contact with the composite; or positioning the composite relative to the surface such that the surface is disposed substantially around the composite; or positioning the composite within a perimeter defined by the surface such that the composite is completely disposed within and / or surrounded by the surface; or positioning the composite along a second surface opposite to the surface, whereby the surface is operable to reduce diffusion along the second surface of any material migrating from the composite along the surface.

[0021] In one embodiment, the surface has a minimum width of at least about 5 micrometers; and / or the surface is operable to reduce the diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite, such that the composite is substantially or fully usable, while ensuring that the migration of material along the surface does not exceed the limits of the composite.

[0022] In one embodiment, the surface is operable to reduce the diffusion of silicone oil exudate from the composite along the surface, thereby making the composite substantially or fully usable while preventing silicone migration beyond the limits of the composite.

[0023] In one embodiment, the surface is operable to reduce the diffusion of non-silicone oil exudates and / or hydrocarbon oil exudates from the composite along the surface, thereby making the composite substantially or fully usable while preventing the migration of non-silicone oil exudates and / or hydrocarbon oil exudates from exceeding the limits of the composite.

[0024] In one embodiment, the method includes distributing the composite on the surface, adjacent to the surface, and / or on a second surface opposite to the surface after configuring the surface to have a surface roughness characterized by at least one or two of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers; and a root mean square height (Sq) not greater than about 1.5 micrometers.

[0025] In one embodiment, the method includes: configuring a component of an electronic device such that the surface has a surface roughness for reducing the diffusion of material migrating from the composite along the surface of the component of the electronic device in the presence of material migrating from the composite; and / or positioning the composite on the surface of the component of the electronic device, adjacent to the surface, and / or on a second surface opposite to the surface, the second surface being configured to have a surface roughness for reducing the diffusion of material migrating from the composite along the surface of the component of the electronic device in the presence of material migrating from the composite.

[0026] In one embodiment, the heat sink or other component includes a bottom surface having a surface roughness for reducing the diffusion of material migrating from the compound along the bottom surface of the heat sink or other component in the presence of material migrating from the compound, and the method includes positioning the compound on a top surface of the heat sink or other component such that the bottom surface is operable to reduce the diffusion of any material migrating from the compound to the bottom surface along the top surface; or the heat sink or other component includes a top surface having a surface roughness for reducing the diffusion of material migrating from the compound along the top surface of the heat sink or other component in the presence of material migrating from the compound, and the method includes positioning the compound on a bottom surface of the heat sink or other component such that the top surface is operable to reduce the diffusion of any material migrating from the compound to the top surface along the bottom surface along the top surface.

[0027] In one embodiment, the method includes smoothing and / or glossing surfaces at locations where typical exudation may occur, such that the smoothed and / or glossy surfaces at those locations have surface roughness for reducing the diffusion of material migrating from the compound along the smoothed and / or glossy surfaces in the presence of material migrating from the compound.

[0028] In one embodiment, the method includes smoothing, glossing, and / or configuring a surface of a substrate having a hole extending between a top surface and a bottom surface of the substrate, such that the smoothed, glossing, and / or configured surface is operable to reduce the diffusion of material migrating from the composite through the hole in the presence of material migrating from the composite, and wherein: the smoothed, glossing, and / or configured surface defines a periphery around the hole along the top or bottom surface of the substrate; and / or the smoothed, glossing, and / or configured surface extends along one or more vertical inner walls of the hole and / or defines one or more vertical inner walls of the hole.

[0029] In one embodiment, the composite comprises one or more of the following: thermally conductive filler, conductive filler, electromagnetic wave absorbing filler, dielectric absorbing filler, and filler having two or more of the following properties: thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption; and / or the composite is a thermal phase change material, thermal putty, thermally conductive grease, dispensable thermal interface material, and / or thermal gap filler; and / or the composite is a silicone-based thermally conductive grease or a single-component ceramic-filled silicone dispensable material; and / or the composite is a thermal interface material, EMI absorber, thermally conductive absorber, conductive elastomer, conductive composite, or a combination of two or more thereof. Attached Figure Description

[0030] The accompanying drawings described herein are for illustrative purposes only, and not for all possible embodiments, and are not intended to limit the scope of this disclosure.

[0031] Figure 1 This is a line graph showing the percentage of oil seepage diffusion relative to surface roughness for low-diffusion and high-diffusion materials. (Example) Figure 1 As shown and as recognized in this paper, the percentage of oil seepage diffusion decreases for both low-diffusion and high-diffusion materials as surface roughness decreases.

[0032] Figures 2 to 9 Includes color photographs showing oil-permeable diffusion thermal interface materials along different surface finishes with varying surface roughness. Figures 2 to 9 It also includes experimental results of the average and standard deviation of surface roughness for different surface finishes, specifically: the arithmetic mean height (Sa) in micrometers (μm), the root mean square height (Sq) in micrometers, the maximum height of surface roughness (Sz) in micrometers, and the developed interfacial area ratio (Sdr) expressed as a percentage (%).

[0033] Figure 10 Including mergers Figures 2 to 9 The table shows the experimental results for the average and standard deviation of the surface roughness of different surface finishes. Detailed Implementation

[0034] Exemplary embodiments will now be described more fully with reference to the accompanying drawings.

[0035] Consumer electronics devices often exhibit oil seepage (extensively, material migration) from thermal interface composites. This oil seepage can sometimes interfere with the operation of electronic packages or devices and / or cause aesthetic problems. While conventional methods exist to reduce seepage from thermal management and / or electromagnetic interference (EMI) mitigating materials (e.g., TIMs, etc.) by modifying their formulations, such conventional methods have generally been found to significantly increase hardness, making it difficult for harder materials to deflect easily under low levels of applied force.

[0036] As this article recognizes and Figure 1 As shown, the percentage of oil seepage decreases as surface roughness decreases. Therefore, the inventors herein have developed and / or disclosed exemplary methods for reducing the diffusion of material migrating from a composite (e.g., reducing oil seepage, etc.) without having to change the formulation of the composite. The reduction in oil seepage advantageously allows for the continued use of materials with current thermal management and / or electromagnetic interference (EMI) mitigation properties that may interfere with the operation of electronic packages or devices and / or cause aesthetic problems.

[0037] As disclosed herein, exemplary methods include configuring or providing a surface with a surface roughness for a component (e.g., an electronic component, etc.), the surface roughness being characterized by at least one or both of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers and a root mean square height (Sq) not greater than about 1.5 micrometers. A surface with this surface roughness can be used to reduce the diffusion of material, if any, migrating from the composite along the surface.

[0038] Exemplary methods for reducing the diffusion of material migrating from a composite (e.g., reducing oil seepage, etc.) by directly positioning the composite on and / or near a surface with a surface roughness characterized by at least one or two of the following: an arithmetic mean height (Sa) of not more than about 1.25 micrometers and a root mean square height (Sq) of not more than about 1.5 micrometers.

[0039] Surfaces with surface roughness for reducing oil seepage diffusion can be defined or provided along a part of a component, assembly, and / or electronic device (e.g., solid-state device, etc.). For example, a surface can be defined or provided along a heat dissipation / cooling structure, such as a radiator, heat conductor, heat pipe, vapor chamber, device housing, enclosure, or chassis. Alternatively, for example, a surface can be defined or provided along a heat source of an electronic device (such as an integrated circuit or other component of the electronic device). As yet another example, a surface can be defined or provided along a board-level shield. Surfaces with surface roughness for reducing oil seepage diffusion can include shiny / smooth / glossy areas or materials, glossy painted surfaces, mirror surfaces, sandblasted surfaces, plasma-etched surfaces, electroplated surfaces, combinations thereof, etc.

[0040] As recognized herein, a problem to be addressed is that when a mobile phase effluxes from a thermal interface material (TIM) (broadly, a composite) within an assembly, the mobile material can flow along surfaces until it reaches a physical edge. The mobile phase can flow to the edge of a substrate that is part of the assembly and around that edge onto an opposing surface. An example is the physical edge of a heat sink. In the case of a heat sink with its bottom surface in contact with the TIM, the mobile phase can flow along the underside of the heat sink, around the edge, and eventually cover the top surface of the heat sink, possibly including fins. In this exemplary embodiment, having a smooth surface (e.g., a smoothed and / or glossy metallic surface, etc.) on the underside of the heat sink will prevent the transport of the mobile phase.

[0041] In another exemplary embodiment, the lower side of the heat sink may be patterned with a smooth finish around the perimeter, while the proscribed region may have a matte finish. In another exemplary embodiment, the side surface of the heat sink may be manufactured with a smooth finish. The moving phase then travels to the edge of the heat sink, but not upwards to the side surface.

[0042] The second type of physical edge is an opening in the middle of the substrate. In this case, the mobile phase begins on one side of the multi-component assembly and appears on the opposite side of the assembly by percolating through the opening. If the periphery of the opening has a smooth finish on the surface of the substrate, the mobile phase will not pass through the opening. This periphery can be on the surface of the substrate. Alternatively, the periphery can be defined as a vertical inner wall of the opening adjacent to the top and bottom surfaces. If the vertical inner wall has a smooth finish, the mobile phase will not be able to transfer from the top to the bottom surface.

[0043] Figures 2 to 9Includes color photographs showing the diffusion of oil seeping from two materials along different smooth finishes with varying surface roughness. Figures 2 to 9 It also includes experimental results for the average and standard deviation of surface roughness for different surface finishes, specifically: the arithmetic mean height (Sa) in micrometers (μm), the root mean square height (Sq) in micrometers, the maximum height of surface roughness (Sz) in micrometers, and the extended interface area ratio (Sdr) expressed as a percentage (%). For example, in... Figures 2 to 9 Experiments have shown that as surface roughness decreases, oil seepage and diffusion decrease.

[0044] As background, the arithmetic mean height (Sa) is the average of the absolute values ​​of the heights of points within a defined area. The arithmetic mean height (Sa) is used for overall evaluation of surface roughness.

[0045]

[0046] The root mean square height (Sq) represents the root mean square value of the ordinate values ​​within a defined region. The root mean square height (Sq) is equal to the standard deviation of the height.

[0047]

[0048] The extended interface area ratio (Sdr) is expressed as the percentage of additional surface area of ​​the bounded region contributed by the texture compared to the planar bounded region.

[0049] Figure 2 Includes color photographs illustrating oil oozing and diffusion from the first thermal interface material along matte surface finishes (e.g., ultra-flat black painted surfaces) and along glossy surface finishes (e.g., glossy black painted surfaces). Figure 2 As shown, compared to a glossy surface finish, oil seepage from the first thermal interface material is significantly higher and worse when the first thermal interface material is along a matte surface finish.

[0050] Figure 3 Includes color photographs showing the oil seepage diffusion from the first and second thermal interface materials along a gloss finish (e.g., a glossy black painted surface) after 12 days. Figure 4 Includes color photographs showing oil seepage diffusion from the first and second thermal interface materials along a matte finish (e.g., an ultra-flat black painted surface) after 12 days. Figure 3 and Figure 4 The comparison shows that, compared with the matte finish ( Figure 4 Compared to oil seepage diffusion from the first and second thermal interface materials, along the gloss finish ( Figure 3 Oil seepage and diffusion from the first and second thermal interface materials are significantly reduced and improved.

[0051] Figure 5 Includes color photographs showing oil exudation and diffusion from the first and second thermal interface materials along a 3-matte + 2-gloss surface finish after 12 days. In this example, the surface initially comprises three matte coating layers, followed by two gloss coating layers on top of the matte coating.

[0052] Figure 6 Includes color photographs showing oil exudation and diffusion from the first and second thermal interface materials along a 3-matte + 3-gloss surface finish after 12 days. In this example, the surface first comprises three matte coating layers, followed by three gloss coating layers on top of the matte coating.

[0053] Figure 7 Includes color photographs showing oil exudation and diffusion from the first and second thermal interface materials along a 3-matte + 4-gloss surface finish after 12 days. In this example, the surface initially comprises three matte coating layers, followed by four gloss coating layers on top of the matte coating.

[0054] Figure 8 Includes color photographs showing the oil seepage diffusion from the first and second thermal interface materials along the sandblasted surface (e.g., with an arithmetic mean height (Sa) of less than 1 micrometer) after 12 days.

[0055] Figure 9 Includes color photographs showing the oil seepage and diffusion along the mirror finish from the first and second thermal interface materials after 12 days.

[0056] Figure 10 Including combinations Figures 2 to 9 The table shows the experimental results for the average and standard deviation of the surface roughness of different surface finishes.

[0057] exist Figures 2 to 9 In the diagram, the first thermal interface material is the blue material in the lower left corner, and the second thermal interface material is the gray material in the upper right corner. By way of example only, the second thermal interface material is a silicone-based thermal paste, and the first thermal interface material is a single-part ceramic-filled silicone-dispensable hot putty. However, these specific first and second thermal interface materials are merely examples, as aspects of this disclosure are applicable to other thermal management and / or electromagnetic interference (EMI) mitigation materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally conductive EMI absorbers, conductive elastomers (ECEs), conductive composites, combinations thereof, etc.) and other polymer-inorganic composites for other purposes.

[0058] Similar benefits of reducing oil seepage diffusion are anticipated for other thermal interface materials (TIMs), thermal management and / or electromagnetic interference (EMI) mitigation materials, and other polymer-inorganic composites for other purposes (which have the potential for seepage). Therefore, this invention will be widely applicable to a broad range of thermal interface materials (TIMs), thermal management and / or EMI mitigation materials, and other polymer-inorganic composites for other purposes, wherein reduced diffusion of materials (e.g., migration of organic matter, oil seepage, etc.) from the composite to the outside of the composite is desired. Furthermore, the exemplary embodiments disclosed herein can be used in a wide range of industries (e.g., automotive, consumer, industrial, data communications / telecommunications, aerospace / defense, etc.) and a wide range of applications (e.g., automotive electronics, advanced driver assistance systems (ADAS), automotive powertrains / electronic control units (ECUs), automotive infotainment, industrial power, routers, wireless infrastructure, drones / satellites, gaming systems, smart home devices, laptops / tablets / portable devices, etc.).

[0059] The preparation of high-load polymer composites for use as thermal management and / or EMI mitigation materials is challenging, as these materials must be able to meet desired thermal management and / or EMI mitigation requirements and other requirements while also being readily deflectable under low levels of applied force. In these materials, oil seepage can occur for a variety of reasons. For example, conventional thermal management and / or EMI mitigation materials are often based on the use of silicone polymers. Silicone polymers typically contain polymers with a wide molecular weight (MW) distribution. It is generally assumed that some of the polymers with low molecular weights can migrate within the matrix to such an extent that the migrating polymer material becomes significantly and obviously exceeds the boundaries of the composite, resulting in an undesirable aesthetic. Besides silicone polymers, other additives in the composite, such as dispersants, stabilizers (e.g., UV stabilizers, heat stabilizers, etc.), can also migrate. Composites using polymers not based on silicone materials also contain substances capable of migration and face similar challenges as described above for representative silicone-based systems.

[0060] However, as disclosed herein, the diffusion of materials migrating from the composite (e.g., reducing oil seepage diffusion, etc.) can be reduced without altering the composite formulation. This is important because oil seepage is a concern for aesthetic reasons and due to potential contamination of optics in electronic applications (e.g., optical transceivers, camera lenses, etc.) (such as high-speed signal lines that might otherwise be affected by oil seepage). Exemplary embodiments can advantageously stop or suppress oil seepage diffusion along the device housing or enclosure, which may be aesthetically unappealing.

[0061] Exemplary methods for reducing the diffusion of material (if any) migrating from a composite without altering the formulation of the composite are disclosed. The exemplary method involves positioning the composite relative to a surface having a surface roughness configured to reduce the diffusion of material (if any) migrating from the composite along the surface. The surface roughness is characterized by at least one or both of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers and a root mean square height (Sq) not greater than about 1.5 micrometers.

[0062] Exemplary methods for reducing the diffusion of material (if any) migrating from a composite without altering the formulation of the composite are also disclosed. The exemplary method includes configuring a surface to have a surface roughness characterized by at least one or both of an arithmetic mean height (Sa) not greater than about 1.25 micrometers and a root mean square height (Sq) not greater than about 1.5 micrometers. A surface with this surface roughness can be used to reduce the diffusion of material (if any) migrating from the composite along the surface.

[0063] An exemplary method includes positioning a composite on and / or near a surface that has been smoothed and / or glossy to have a surface roughness, said surface roughness being used to reduce the diffusion of material (if any) migrating from the composite along the surface.

[0064] Exemplary methods include smoothing and / or glossing the surface to have surface roughness for reducing the diffusion of material (if any) migrating from the composite along the surface.

[0065] In the exemplary method, the surface roughness is characterized by an arithmetic mean height (Sa) of no more than about 1.25 micrometers and a root mean square height (Sq) of no more than about 1.5 micrometers.

[0066] In the exemplary method, the surface roughness is further characterized by an extended interface area ratio (Sdr) of no more than about 250%.

[0067] In an exemplary method, the surface roughness is characterized by at least one or both of an arithmetic mean height (Sa) of about 0.01 micrometers (μm) to about 1.25 micrometers (μm) and a root mean square height (Sq) of about 0.01 micrometers to about 1.5 micrometers.

[0068] In the exemplary method, the surface roughness is further characterized by an extended interface area ratio (Sdr) of about 0.1% to about 250%.

[0069] In an exemplary method, the method includes reducing the diffusion of material (if any) migrating from the composite along the surface without changing the formulation of the composite.

[0070] In an exemplary method, the composite can be used for the management of thermal and / or electromagnetic interference (EMI).

[0071] In an exemplary method, the surface is configured to have a minimum thickness sufficient to reduce the surface roughness of the base component to at least one or both of an arithmetic mean height (Sa) of no more than about 1.25 micrometers and a root mean square height (Sq) of no more than about 1.5 micrometers. The surface may have the minimum thickness required to reduce the surface roughness (Sa) to no more than 1.25 micrometers. For example, if the heat sink has a surface roughness of 1.75 micrometers, a coating thickness of only 0.5 micrometers may be needed to reduce the surface roughness (Sa) to 1.25 micrometers. The base component may include one or more of the following: heat dissipation / heat removal structures, such as heat sinks, heat conductors, heat pipes, vapor chambers, device housings, enclosures, or chassis; heat sources for electronic devices, such as integrated circuits or other components of electronic devices; components of solid-state drives; and / or board-level shielding.

[0072] In an exemplary method, the method includes configuring the surface to have a diffusion effect for reducing the diffusion of material (if any) migrating from the composite along the surface by one or more of the following: glossing the surface; deforming the surface to have a glossy, mirror-like, shiny, and / or polished appearance; polishing the surface; painting the surface; coating the surface; sandblasting the surface; plasma etching the surface; electroplating the surface; and / or converting the surface to a surface roughness characterized by at least one or both of an arithmetic mean height (Sa) of not more than about 1.25 micrometers and a root mean square height (Sq) of not more than about 1.5 micrometers.

[0073] In an exemplary method, the method includes configuring a surface with a surface roughness for reducing the diffusion of material (if any) migrating from the composite along the surface. After configuring the surface, the method includes: positioning the composite directly on the surface such that the surface is operable to reduce the diffusion of material (if any) migrating from the composite along the surface; positioning the composite adjacent to the surface such that the surface is operable to reduce the diffusion of material (if any) migrating from the composite along the surface; and / or positioning the composite along a second surface opposite the surface such that the surface is operable to reduce the diffusion of any material migrating from the composite along the surface along the second surface.

[0074] In the exemplary method, the surface has a minimum width of at least about 5 micrometers.

[0075] In an exemplary method, the method includes positioning the composite directly on the surface such that the surface is directly below and in contact with the composite.

[0076] In an exemplary method, the method includes positioning the composite relative to the surface such that the surface is disposed approximately around the composite.

[0077] In an exemplary method, the method includes positioning the composite within a periphery defined by the surface, such that the composite is completely disposed within and / or surrounded by the surface.

[0078] In an exemplary method, the method includes positioning the composite along a second surface opposite to the said surface, whereby the surface is operable to reduce the diffusion of any material migrating from the composite along the said surface along the second surface.

[0079] In an exemplary method, a first surface has a surface roughness for reducing material diffusion. The method includes positioning a composite along a second surface opposite the first surface, whereby the first surface is operatively used to reduce diffusion along the first surface of any material migrating from the composite to the first surface along the second surface. For example, a heat sink (generally, a component) may include a bottom surface (generally, the first surface) and an opposing top surface (generally, the second surface). The bottom surface of the heat sink may be configured to have a surface roughness for reducing material diffusion (e.g., an arithmetic mean height (Sa) not greater than about 1.25 micrometers and / or a root mean square height (Sq) not greater than about 1.5 micrometers, etc.). A composite (e.g., a TIM 1.5 package on top of a chip, etc.) may be positioned along the top surface of the heat sink. In this example, the bottom surface of the heat sink may be operatively used to prevent (or at least reduce) the diffusion along the bottom surface of material migrating from the composite along the top surface. For example, material migrating from the composite along the second surface may migrate around the sides of the heat sink and / or through openings in the heat sink (e.g., screw holes, vents, etc.). In this case, the bottom surface of the radiator can reduce or stop the diffusion of material that migrates around the sides of the radiator and / or through the openings of the radiator along the bottom surface.

[0080] In an exemplary embodiment, the second surface of a component from which material can migrate from a component on an opposing first surface can be configured (e.g., smoothed and / or glossy, etc.) to have a surface roughness (e.g., an arithmetic mean height (Sa) not greater than about 1.25 micrometers and / or a root mean square height (Sq) not greater than about 1.5 micrometers, etc.), said surface roughness being used to reduce the diffusion of material migrating from the composite along the first surface along the second surface.

[0081] In an exemplary embodiment, the radiator may be provided or configured to have a polished, smoothed and / or glossy peripheral surface that is disposed or extends around the periphery of the composite (e.g., TIM 1.5, etc.) to prevent seepage around the radiator to the underside of the radiator.

[0082] In an exemplary embodiment, a surface having the aforementioned surface roughness (e.g., an arithmetic mean height (Sa) not greater than about 1.25 micrometers and / or a root mean square height (Sq) not greater than about 1.5 micrometers, etc.) can be one, any combination of, or all of the following:

[0083] • A surface directly beneath the complex on which the complex is placed / dispensed; and / or

[0084] • Surfaces adjacent to, surrounding, and / or defining the periphery of the complex; and / or

[0085] • A second surface (e.g., the surface of a heat sink, other component, etc.) opposite to the surface to which the composite is placed and / or to which the material / exudate can migrate, thereby the opposite second surface being operable to reduce the diffusion of material migrating from the composite along the first surface opposite to the second surface along the opposite second surface.

[0086] In an exemplary method, the surface is operably used to reduce the diffusion of material (if any) migrating from the composite along the surface, such that the composite is substantially or fully available without allowing material to migrate along the surface beyond the limits of the composite.

[0087] In an exemplary method, a surface is operably configured to reduce the diffusion of silicone oil exudate from the composite along the surface. In this case, the composite is then substantially or fully usable, while preventing the migration of silicone oil exudate beyond the limits of the composite.

[0088] In an exemplary method, the surface is operable to reduce the diffusion of non-silicone oil exudates and / or hydrocarbon oil exudates from the composite along the surface. In this case, the composite is substantially or fully usable while ensuring that the migration of non-silicone oil exudates and / or hydrocarbon oil exudates does not exceed the limits of the composite.

[0089] In an exemplary method, the method includes distributing a complex on the surface, adjacent to the surface, and / or on a second surface opposite to the surface after configuring the surface to have a surface roughness characterized by at least one or two of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers and a root mean square height (Sq) not greater than about 1.5 micrometers.

[0090] In an exemplary method, the method includes configuring a component of an electronic device to have a surface roughness that reduces the diffusion of material (if any) migrating from the composite along the surface of the component of the electronic device.

[0091] In an exemplary method, a component or assembly of an electronic device includes a surface with surface roughness to reduce the diffusion of material (if any) migrating from the composite along the surface. The method includes positioning a composite on a surface of the component or assembly of the electronic device, adjacent to that surface, and / or on a second surface opposite to that surface, which have been configured to have surface roughness to reduce the diffusion of material (if any) migrating from the composite along the surface of the component or assembly of the electronic device. The component or assembly of the electronic device may include one or more of the following: heat dissipation / heat removal structures, such as heat sinks, heat conductors, heat pipes, vapor chambers, device housings, enclosures, or chassis; heat sources of the electronic device, such as integrated circuits or other components of the electronic device; components of a solid-state driver; and / or board-level shielding.

[0092] In an exemplary method, the heat sink or other component includes a bottom surface with a surface roughness designed to reduce the diffusion of any material (if any) migrating from the composite along the bottom surface of the heat sink or other component. The method also includes positioning the composite on a top surface of the heat sink or other component such that the bottom surface is operatively configured to reduce the diffusion of any material (if any) migrating from the composite along the top surface to the bottom surface along the bottom surface.

[0093] In an exemplary method, the heat sink or other component includes a top surface with a surface roughness designed to reduce the diffusion of any material (if any) migrating from the composite along the top surface of the heat sink or other component. The method also includes positioning the composite on a bottom surface of the heat sink or other component such that the top surface is operatively configured to reduce the diffusion of any material (if any) migrating from the composite to the top surface along the bottom surface along the top surface.

[0094] In an exemplary method, the composite includes one or more of the following: thermally conductive filler; electrically conductive filler; electromagnetic wave absorbing filler; dielectric absorbing filler; and filler having two or more properties of thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption.

[0095] In an exemplary method, the composite is a thermal phase change material, thermal putty, thermal grease, dispensable thermal interface material, and / or thermal gap filler.

[0096] In an exemplary method, the composite is a silicone-based thermal paste or a single-component ceramic-filled silicone-dispensable material.

[0097] In the exemplary method, the composite is a thermal interface material, an EMI absorber, a thermally conductive absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof.

[0098] In an exemplary method, the method includes smoothing and / or glossing surfaces at locations where typical exudation may occur, such that the smoothed and / or glossy surfaces at those locations have properties for reducing the diffusion of material (if any) migrating from the composite along the smoothed and / or glossy surfaces.

[0099] In an exemplary method, the method includes smoothing and / or glossing a surface of a substrate having a hole extending between a top surface and a bottom surface of the substrate, such that the smoothed and / or glossy surface is operatively used to reduce the diffusion of material migrating from the composite through the hole. The smoothed and / or glossy surface may define a periphery around the hole along the top or bottom surface of the substrate. Additionally or alternatively, the smoothed and / or glossy surface may be along one or more vertical inner walls of the hole and / or define one or more vertical inner walls of the hole.

[0100] In an exemplary method, a surface having surface roughness for reducing the diffusion of material (if any) migrating from the composite includes at least one of the following: a surface defining the periphery of a hole extending between a top surface and a bottom surface; and / or a surface defining one or more vertical inner walls of the hole. The surface with surface roughness is operably used to reduce the diffusion of material migrating from the composite through the hole.

[0101] Exemplary embodiments are also disclosed, wherein a component or assembly is configured as a surface with a surface roughness operable to reduce the diffusion of material (if any) migrating from a composite along the surface, wherein the composite may be used for thermal and / or electromagnetic interference (EMI) management.

[0102] In an exemplary embodiment, the surface roughness is characterized by at least one or both of the following: an arithmetic mean height (Sa) not greater than about 1.25 micrometers and a root mean square height (Sq) not greater than about 1.5 micrometers. The surface roughness may also be characterized by an extended interface area ratio (Sdr) not greater than about 250%.

[0103] In an exemplary embodiment, the surface roughness is characterized by an arithmetic mean height (Sa) of about 0.01 micrometers (μm) to about 1.25 micrometers (μm) and a root mean square height (Sq) of about 0.01 micrometers to about 1.5 micrometers. The surface roughness may also be characterized by an extended interface area ratio (Sdr) of about 0.1% to about 250%.

[0104] In an exemplary embodiment, the surface is configured to have a surface roughness that is operable to reduce the diffusion of material (if any) migrating from the composite along the surface without altering the formulation of the composite.

[0105] In an exemplary embodiment, the component or assembly includes one or more of the following: heat dissipation / heat removal structures, including heat sinks, heat conductors, heat pipes, vapor chambers, device housings, enclosures, or chassis; heat sources for electronic devices, such as integrated circuits or other components of electronic devices; components of solid-state drives; and / or board-level shielding.

[0106] In an exemplary embodiment, the surface includes one or more of the following: a glossy surface; a surface having a glossy, mirror-like, shiny, and / or polished appearance; a polished surface; a painted surface; a coated surface; a sandblasted surface; a plasma-etched surface; and an electroplated surface.

[0107] In an exemplary embodiment, the surface has a minimum width of at least about 5 micrometers.

[0108] In an exemplary embodiment, the surface is configured to have a surface roughness that is operable to reduce the diffusion of material (if any) migrating from the composite along the surface, such that the composite is substantially or fully usable, while preventing the migration of material along the surface from exceeding the limits of the composite.

[0109] In an exemplary embodiment, the surface is configured to have a surface roughness that operatively acts to reduce the diffusion of silicone oil exudates from the composite along the surface. In this case, the composite is substantially or fully usable, while preventing silicone migration beyond the limits of the composite.

[0110] In an exemplary embodiment, the surface is configured to have a surface roughness that is operatively used to reduce the diffusion of non-silicone oil exudates and / or hydrocarbon oil exudates from the composite along the surface. In this case, the composite is substantially or fully usable without causing the migration of non-silicone oil exudates and / or hydrocarbon oil exudates beyond the limits of the composite.

[0111] In an exemplary embodiment, the component or assembly includes a bottom surface and a top surface opposite the bottom surface. The bottom surface is configured to have a surface roughness that is operable to reduce the diffusion of any material migrating from the composite to the bottom surface along the top surface.

[0112] In an exemplary embodiment, the component or assembly includes a bottom surface and a top surface opposite the bottom surface. The top surface is configured to have a surface roughness that is operable to reduce the diffusion of any material migrating from the composite to the top surface along the bottom surface.

[0113] In an exemplary embodiment, the component or assembly includes a heat sink, which includes a bottom surface and a top surface opposite the bottom surface. The bottom surface is configured to have a surface roughness that is operable to reduce the diffusion of any material migrating from the composite to the bottom surface along the top surface.

[0114] In an exemplary embodiment, the component or assembly includes a heat sink, which includes a bottom surface and a top surface opposite the bottom surface. The top surface is configured to have a surface roughness that is operable to reduce the diffusion of any material migrating from the composite to the top surface along the bottom surface.

[0115] In an exemplary embodiment, the component or assembly includes a top surface, a bottom surface, and a hole extending between the top and bottom surfaces. The surface having surface roughness is configured to operatively reduce the diffusion of material migrating from the compound through the hole. The surface having surface roughness for reducing the diffusion of material migrating from the compound through the hole may include at least one of the following: a surface defining a periphery around the hole; and / or a surface defining one or more vertical inner walls of the hole.

[0116] In an exemplary embodiment, the component or assembly includes a composite that can be used for thermal and / or electromagnetic interference (EMI) management. The surface is operable to reduce the diffusion of material, if any, migrating from the composite along the surface.

[0117] In an exemplary embodiment, the complex is directly on the surface, such that the surface is directly below and in contact with the complex.

[0118] In an exemplary embodiment, the surface is generally arranged around the composite.

[0119] In an exemplary embodiment, the composite is located within a perimeter defined by the surface, such that the composite is completely disposed within and / or surrounded by the surface.

[0120] In an exemplary embodiment, the composite travels along a second surface opposite the primary surface. This surface is operable to reduce the diffusion of any material migrating from the composite along the primary surface along the secondary surface.

[0121] In an exemplary embodiment, the composite includes one or more of the following: thermally conductive filler; conductive filler; electromagnetic wave absorbing filler; dielectric absorbing filler; and filler having two or more properties of thermal conductivity, electrical conductivity, dielectric absorption and electromagnetic wave absorption.

[0122] In an exemplary embodiment, the composite is a thermal phase change material, thermal putty, thermal grease, dispensable thermal interface material, and / or thermal gap filler.

[0123] In an exemplary embodiment, the composite is a silicone-based thermal paste or a single-component ceramic-filled silicone dispensable material.

[0124] In an exemplary embodiment, the composite is a thermal interface material, an EMI absorber, a thermal absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof.

[0125] In an exemplary embodiment, the component or assembly includes one or more of the following: heat dissipation / heat removal structures, such as heat sinks, heat conductors, heat pipes, vapor chambers, device housings, enclosures, or chassis; heat sources for electronic devices, such as integrated circuits or other components of electronic devices; components of solid-state drives; and / or board-level shielding.

[0126] In an exemplary embodiment, the electronic device includes a heat source and a thermally conductive compound (e.g., thermal paste, hot putty, other thermal interface materials, etc.). The thermally conductive compound is positioned relative to the heat source to establish at least a portion of a thermally conductive path from the heat source through the compound. The thermally conductive compound is also positioned relative to a surface of the electronic device and / or a surface defined thereon (e.g., on its perimeter, in contact with the surface, within the surface, etc.), which has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the image). Figures 1 to 10 Any one or more of the following can be used to reduce the diffusion of material (if any) migrating from the thermally conductive compound along the surface. The surface roughness can be characterized by having one or more of the following: an arithmetic mean height (Sa) not greater than about 1.25 (μm) (e.g., an arithmetic mean height (Sa) from about 0.01 μm to about 1.25 (μm), etc.); a root mean square height (Sq) not greater than about 1.5 μm (e.g., a root mean square height (Sq) from about 0.01 μm to about 1.5 μm), etc.; and an extended interface area ratio (Sdr) not greater than about 250% (e.g., an extended interface area ratio (Sdr) from about 0.1% to about 250%, etc.). In such exemplary embodiments, the thermally conductive compound can also be configured to absorb and / or conduct electricity, such that the compound is also operable to mitigate and / or manage EMI within electronic devices.

[0127] In an exemplary embodiment, the electronic device includes a heat source, a heat dissipation / cooling structure, and a thermally conductive compound (e.g., thermal paste, hot putty, other thermal interface materials, etc.). The thermally conductive compound is positioned relative to the heat source and the heat dissipation / cooling structure to establish at least a portion of a thermally conductive path between the heat source and the heat dissipation / cooling structure. The thermally conductive compound is also positioned relative to a surface along the electronic device and / or the heat dissipation / cooling structure or a surface of the electronic device and / or the heat dissipation / cooling structure (e.g., on its defined periphery, in contact with the surface, within the surface, etc.), wherein the surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the image). Figures 1 to 10 Any one or more of the following can be used to reduce the diffusion of material (if any) migrating from the thermally conductive composite along the surface. The surface roughness can be characterized by having one or more of the following: an arithmetic mean height (Sa) not greater than about 1.25 (μm) (e.g., an arithmetic mean height (Sa) from about 0.01 μm to about 1.25 (μm), etc.); a root mean square height (Sq) not greater than about 1.5 μm (e.g., a root mean square height (Sq) from about 0.01 μm to about 1.5 μm), etc.; and an extended interface area ratio (Sdr) not greater than about 250% (e.g., an extended interface area ratio (Sdr) from about 0.1% to about 250%, etc.). The thermally conductive composite can be configured to absorb and / or conduct electricity, such that the composite is also operable to mitigate and / or manage EMI within electronic devices.

[0128] In an exemplary embodiment, the electronic device includes a heat source, a board-level shield, and a thermally conductive compound (e.g., thermal paste, hot putty, other thermal interface materials, etc.). The thermally conductive compound is positioned relative to the heat source and the board-level shield to establish at least a portion of a thermally conductive path between the heat source and the board-level shield. The thermally conductive compound is also positioned relative to the surface of the electronic device and / or the board-level shield (e.g., on its defined perimeter, in contact with the surface, within the surface, etc.), wherein the surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the image). Figures 1 to 10Any one or more of the following can be used to reduce the diffusion of material (if any) migrating from the thermally conductive composite along the surface. The surface roughness can be characterized by having one or more of the following: an arithmetic mean height (Sa) not greater than about 1.25 (μm) (e.g., an arithmetic mean height (Sa) from about 0.01 μm to about 1.25 (μm), etc.); a root mean square height (Sq) not greater than about 1.5 μm (e.g., a root mean square height (Sq) from about 0.01 μm to about 1.5 μm), etc.; and an extended interface area ratio (Sdr) not greater than about 250% (e.g., an extended interface area ratio (Sdr) from about 0.1% to about 250%, etc.). The thermally conductive composite can be configured to absorb and / or conduct electricity, such that the composite is also operable to mitigate and / or manage EMI within electronic devices.

[0129] In an exemplary embodiment, the electronic device includes a heat source, a board-level shield, a heat dissipation / cooling structure, and a first thermally conductive compound and a second thermally conductive compound (e.g., thermal paste, hot putty, other thermal interface materials, etc.). The first thermally conductive compound is positioned relative to the heat source and the board-level shield to establish at least a portion of a thermally conductive path between the heat source and the board-level shield. The second thermally conductive compound is positioned relative to the board-level shield and the heat dissipation / cooling structure to establish at least a portion of a second thermally conductive path between the board-level shield and the heat dissipation / cooling structure. The first thermally conductive compound is also positioned relative to a first surface of the electronic device and / or the board-level shield (e.g., on its defined perimeter, in contact with the surface, within the surface, etc.), wherein the first surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the image). Figures 1 to 10 Any one or more of the above are shown) to reduce the diffusion of material (if any) migrating from the first thermally conductive compound along the first surface. The second thermally conductive compound is also positioned relative to the second surface of the plate-level shield and the heat dissipation / cooling structure and / or the second surface of the plate-level shield and the heat dissipation / cooling structure (e.g., on the periphery defined thereby, in contact with that surface, within that surface, etc.), wherein the second surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown). Figures 1 to 10The first and / or second thermally conductive composites (as shown in any one or more) are used to reduce the diffusion of material (if any) migrating from the second thermally conductive composite along the second surface. The surface roughness of the first and second surfaces can be characterized by having one or more of the following: an arithmetic mean height (Sa) not greater than about 1.25 μm (e.g., an arithmetic mean height (Sa) from about 0.01 μm to about 1.25 μm); a root mean square height (Sq) not greater than about 1.5 μm (e.g., a root mean square height (Sq) from about 0.01 μm to about 1.5 μm); and an extended interface area ratio (Sdr) not greater than about 250% (e.g., an extended interface area ratio (Sdr) from about 0.1% to about 250%). The first and / or second thermally conductive composites can be configured to absorb and / or conduct electricity, such that the first and / or second thermally conductive composites are also operable to mitigate and / or manage EMI within electronic devices.

[0130] In an exemplary embodiment, the electronic device includes an integrated circuit, a board-level shield, a heat sink, and a first thermally conductive compound and a second thermally conductive compound (e.g., thermal paste, hot putty, other thermal interface materials, etc.). The first thermally conductive compound is positioned relative to the integrated circuit and the board-level shield to establish at least a portion of a first thermally conductive path between the integrated circuit and the board-level shield. The second thermally conductive compound is positioned relative to the board-level shield and the heat sink to establish at least a portion of a second thermally conductive path between the board-level shield and the heat sink. The first thermally conductive compound is also positioned relative to a first surface of the integrated circuit and / or the board-level shield (e.g., on the periphery defined thereby, in contact with the surface, within the surface, etc.), wherein the first surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the image). Figures 1 to 10 Any one or more of the above are used to reduce the diffusion of material (if any) migrating from the first thermally conductive compound along the first surface. The second thermally conductive compound is also positioned relative to the second surface of the plate-level shield and heat sink and / or the second surface of the plate-level shield and heat sink (e.g., on the periphery defined thereby, in contact with that surface, within that surface, etc.), wherein the second surface has been configured (e.g., painted, coated, sandblasted, etc.) to have a surface roughness (e.g., as shown in the diagram). Figures 1 to 10The first and / or second thermally conductive composites (as shown in any one or more) are used to reduce the diffusion of material (if any) migrating from the second thermally conductive composite along the second surface. The surface roughness of the first and second surfaces can be characterized by having one or more of the following: an arithmetic mean height (Sa) not greater than about 1.25 μm (e.g., an arithmetic mean height (Sa) from about 0.01 μm to about 1.25 μm); a root mean square height (Sq) not greater than about 1.5 μm (e.g., a root mean square height (Sq) from about 0.01 μm to about 1.5 μm); and an extended interface area ratio (Sdr) not greater than about 250% (e.g., an extended interface area ratio (Sdr) from about 0.1% to about 250%). The first and / or second thermally conductive composites can be configured to absorb and / or conduct electricity, such that the first and / or second thermally conductive composites are also operable to mitigate and / or manage EMI within electronic devices.

[0131] In exemplary embodiments, the composite is a thermal interface material (TIM), such as a thermally conductive pad, a thermally conductive gap filler, a dispensable material, a thermally conductive paste, a bulk putty, a phase change TIM, etc. In exemplary embodiments, the composite is a thermal management and / or EMI mitigation material having a relatively high thermal conductivity (e.g., 1 W / mK, 1.1 W / mK, 1.2 W / mK, 2.8 W / mK, 3 W / mK, 3.1 W / mK, 3.8 W / mK, 4 W / mK, 4.7 W / mK, 5 W / mK, 5.4 W / mK, 6 W / mK, 8 W / mK, greater than 8 W / mK, etc.), depending on the specific materials used to manufacture the thermal management and / or EMI mitigation material and the loading percentage (if any) of the thermally conductive filler. These thermal conductivity values ​​are merely examples, as other implementations may include thermal management and / or EMI mitigation materials with thermal conductivity values ​​higher than 8 W / mK, less than 1 W / mK (e.g., at least about 0.3 W / mK, etc.), or in the range of 1 W / mK to 8 W / mK.

[0132] The exemplary embodiments disclosed herein can be used for a wide range of heat sources, electronic devices, and / or heat dissipation / cooling structures or components (e.g., heat conductors, radiators, heat pipes, vapor chambers, device housings, enclosures, or chassis, etc.). For example, a heat source may include one or more heat-generating components or devices, such as high-power integrated circuits (ICs), optical transceivers, 5G infrastructure equipment (e.g., base stations, small cells, smart poles, etc.), solid-state drives (SSDs), memory in video cards, set-top boxes, televisions, gaming systems, automotive electronics for autonomous driving (ADAS) (e.g., radar, multi-domain controllers, cameras, etc.), CPUs, dies within underfill, semiconductor devices, flip-chip devices, graphics processing units (GPUs), digital signal processors (DSPs), multiprocessor systems, integrated circuits (ICs), multi-core processors, etc. Generally, a heat source may include any component or device having a temperature higher than that of thermal management and / or EMI mitigation materials or otherwise providing or transferring heat to or via thermal management and / or EMI mitigation materials, regardless of whether the heat is generated by the heat source or transferred solely through or via the heat source. Therefore, the aspects of this disclosure should not be limited to use with any single type of heat source, electronic device, heat dissipation / heat removal structure, etc.

[0133] Exemplary embodiments are provided to make this disclosure thorough and to fully convey the scope to those skilled in the art. Numerous specific details, such as examples of particular components, devices, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not required, that exemplary embodiments may be embodied in many different forms, and should not be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Furthermore, advantages and improvements that may be achieved through one or more exemplary embodiments of this disclosure are provided for illustrative purposes only and do not limit the scope of this disclosure, as the exemplary embodiments disclosed herein may provide all or none of the foregoing advantages and improvements and still fall within the scope of this disclosure.

[0134] The specific dimensions, materials, and / or shapes disclosed herein are exemplary in nature and do not limit the scope of this disclosure. The disclosure herein of specific values ​​and ranges of values ​​for a given parameter does not exclude other values ​​and ranges of values ​​that may be useful in one or more instances disclosed herein. Furthermore, it is contemplated that any two specific values ​​of a particular parameter described herein can define endpoints of a range of values ​​applicable to the given parameter (i.e., the disclosure of a first and second value of a given parameter can be interpreted as disclosing that any value between the first and second values ​​can also be used for the given parameter). For example, if parameter X is exemplified herein as having a value A and also exemplified herein as having a value Z, it is contemplated that parameter X can have a range of values ​​from about A to about Z. For example, if parameter X is exemplified herein as having a value in the range of 1-10, or 2-9, or 3-8, it is also contemplated that parameter X can have other ranges of values, including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0135] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. For example, when licensed phrases such as “may include” or “may contain” are used herein, at least one embodiment includes or contains the stated feature. As used herein, the singular forms “a,” “an,” and “the” may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms “comprising,” “including,” “containing,” and “having” are inclusive and thus specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein should not be construed as requiring their performance in the specific order discussed or shown, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be employed.

[0136] When an element or layer is referred to as “on,” “joined to,” “connected to,” or “coupled to” another element or layer, it may be directly on, joined to, connected to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on,” “directly joined to,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0137] When applied to values, the term “about” indicates some slight inaccuracy in the calculation or measurement of a permissible value (accurate to the value in some methods; approximately or reasonably close to the value; almost). For some reason, if the inaccuracy provided by “about” is not otherwise understood in the art, “about” as used herein at least indicates a variation that can be caused by common methods of measuring or using such parameters. For example, the terms “approximately,” “about,” and “substantially” can be used herein to indicate within manufacturing tolerances. Or, for example, when modifying the amount or use of the components or reactants of this invention, the term “about” as used herein refers to a variation in a value that can occur through typical measurement and processing procedures used, such as when concentrates or solutions are manufactured in the real world by unintentional errors in these processes; by differences in the manufacture, source, or purity of the components used to prepare the composition or carry out the method; and so on. The term “about” also includes amounts that differ due to different equilibrium conditions of the composition produced from a particular initial mixture. Whether or not modified by the term “about,” equivalents of said amounts are included.

[0138] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as “first” and “second” as used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.

[0139] Spatial relative terms, such as “inside,” “outside,” “below,” “lower,” “lower,” “above,” “upper,” etc., may be used herein for ease of description to describe the relationship of one element or feature to another, as illustrated in the figures. In addition to the orientations shown in the figures, spatial relative terms may be intended to cover different orientations of the device being used or operated. For example, if the device in the figures were flipped, an element described as “below” or “lower” would then be oriented as “above” to the other element or feature. Thus, the example term “below” can cover both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0140] The foregoing description of embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or limiting of this disclosure. Various elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in chosen embodiments, even if not specifically shown or described. Variations are also possible in various ways. Such variations are not considered to depart from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. A component or assembly of reduced migration of material that is configured to have a surface having a surface roughness operable to reduce migration of material from a compound along the surface with material migrating from the compound without having to change a formulation of the compound, wherein the compound is used to manage heat and / or electromagnetic interference (EMI), wherein the surface roughness is characterized by at least one or both of: an arithmetic average height Sa of no more than about 1.25 microns; and a root mean square height Sq of no more than about 1.5 microns, wherein the component or assembly includes one or more of: a heat rejection / dissipation structure; a heat source of an electronic device; a component of a solid state drive; and / or a board level shield.

2. The part or assembly of claim 1 wherein, the component or assembly includes a heat rejection / dissipation structure including a heat sink, a heat conductor, a heat pipe, a vapor chamber, a device enclosure, a housing, or a chassis.

3. The part or assembly of claim 1 wherein, the component or assembly includes a heat source of an electronic device including an integrated circuit of an electronic device.

4. The part or assembly of claim 1 wherein, the surface roughness is characterized by an extended interface area ratio Sdr of no more than about 250%.

5. The component or assembly of claim 1, wherein: the surface roughness is characterized by at least one or both of an arithmetic average height Sa of about 0.01 microns to about 1.25 microns and a root mean square height Sq of about 0.01 microns to about 1.5 microns; and the surface roughness is further characterized by an extended interface area ratio Sdr of about 0.1% to about 250%.

6. The part or assembly of claim 1 wherein, the surface includes one or more of: a glossy surface; a surface having a glossy, mirror, shiny, and / or polished appearance; a polished surface; a painted surface; a coated surface; a sandblasted surface; a plasma etched surface; a plated surface.

7. The component or assembly of claim 1, wherein, the surface has a minimum width of at least about 5 microns.

8. The part or assembly of claim 1, wherein, the surface is configured to have a surface roughness operable to reduce migration of material from a compound along the surface with material migrating from the compound such that the compound is substantially or completely usable without the migration of material along the surface exceeding a limit of the compound.

9. The part or assembly of claim 1, wherein, the surface is configured to have a surface roughness operable to reduce migration of silicone oil exudates along the surface with the exudates migrating from the compound such that the compound is substantially or completely usable without the migration of silicone oil exceeding a limit of the compound.

10. The part or assembly of claim 1, wherein, the surface is configured to have a surface roughness operable to reduce migration of non-silicone oil exudates and / or hydrocarbon oil exudates along the surface with the exudates migrating from the compound such that the compound is substantially or completely usable without the migration of non-silicone oil exudates and / or hydrocarbon oil exudates exceeding a limit of the compound.

11. The part or assembly of claim 1, wherein, the component or assembly includes a bottom surface and a top surface opposite the bottom surface, and wherein: the bottom surface is configured to have a surface roughness operable to reduce diffusion along the bottom surface of any material migrating from the composite along the top surface; or the top surface is configured to have a surface roughness operable to reduce diffusion along the top surface of any material migrating from the composite along the bottom surface.

12. The component or assembly of claim 1, wherein: the component or assembly includes a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface; the surface having a surface roughness is configured to be operable to reduce diffusion of material migrating from the composite through the hole in the presence of material migrating from the composite; and the surface having a surface roughness includes at least one of: a surface defining a perimeter around the hole; and / or a surface defining one or more vertical interior walls of the hole.

13. The component or assembly of any of claims 1-12, further comprising a composite operable to manage heat and / or electromagnetic interference (EMI), the surface being operable to reduce diffusion of material migrating from the composite along the surface in the presence of material migrating from the composite.

14. The part or assembly of claim 1, wherein, the composite is directly on the surface, such that the surface is directly under and in contact with the composite; or the surface is disposed substantially around the composite; or the composite is within a perimeter defined by the surface, such that the composite is disposed entirely within and / or surrounded by the surface; or the composite is along a second surface opposite the surface, such that the surface is operable to reduce diffusion along the second surface of any material migrating from the composite along the surface.

15. The part or assembly of claim 13, wherein, the composite is a thermal phase change material, a thermal grease, a thermal paste, a dispensable thermal interface material, and / or a thermal gap filler pad.

16. The component or assembly of claim 13, wherein, the composite is a silicone-based thermal paste or a one-component ceramic-filled silicone dispensable material.

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