Semiconductor substrate clamping jaw mechanism of LED die bonder
By designing a rotatable gripper finger and an elastically driven gripper mechanism, the problem of high accuracy requirements for semiconductor substrate width in existing technologies is solved, enabling reliable gripping of substrates of different widths and avoiding deformation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-03-03
AI Technical Summary
Existing gripper mechanisms have high requirements for the width accuracy of semiconductor substrates, which leads to problems such as inability to clamp tightly or easy deformation of the substrate.
A gripper mechanism was designed, which uses rotatable gripper fingers and elastic elements for driving. The inner side of the gripper fingers is inclined. Combined with a push block and gripper finger driver, it can adapt to substrates of different widths. The clamping is achieved by the elastic force of the elastic element to avoid deformation.
This reduces the requirements for substrate width accuracy, avoids substrate deformation during gripping, and improves the reliability and adaptability of gripping.
Smart Images
Figure CN223968158U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED light strip production technology, and in particular to a semiconductor substrate gripper mechanism for an LED die bonder. Background Technology
[0002] LED die bonders play a crucial role in the production of LED light strips. Die bonding is the process of attaching semiconductor chips to a packaging substrate or lead frame. Die bonders not only accelerate the LED light strip production process but also play a key role in improving product quality, reducing production costs, and promoting the development of LED technology.
[0003] In LED die bonding machines, a gripper mechanism is required to grip semiconductor substrates for loading, unloading, and sorting. However, existing gripper mechanisms generally have the following problems: the stroke of the gripping fingers used to grip the edge of the semiconductor needs to be precisely matched with the width of the semiconductor substrate to avoid deformation of the semiconductor substrate. With the stroke of the gripping fingers remaining constant, the width of the semiconductor substrate needs to be highly accurate. When the accuracy of the semiconductor substrate width is not high, problems such as insufficient gripping or easy deformation of the substrate may occur. Utility Model Content
[0004] Therefore, the purpose of this utility model is to provide a semiconductor substrate gripper mechanism for an LED die bonder, which has low requirements for the accuracy of substrate width and is not easy to deform the substrate.
[0005] The technical solution adopted by this utility model to solve its technical problem is as follows:
[0006] A semiconductor substrate gripper mechanism for an LED die bonder includes a base, a lifting seat that can move up and down relative to the base, and a lifting driver that can drive the lifting seat to move up and down. Two sets of gripper finger assemblies that can support the semiconductor substrate are arranged on the left and right sides of the lifting seat. Each gripper finger assembly includes a bracket fixed to the lifting seat and gripper fingers hinged to the bracket. The inner side of each gripper finger is provided with a groove into which the edge of the semiconductor substrate can be embedded. Each gripper finger is connected to an elastic member that can drive it to clamp inward. The bracket is also provided with a power mechanism that can drive the gripper fingers to open outward.
[0007] In a preferred embodiment of this utility model, the inner side of the clamping finger is an inclined surface, and the angle A between the inclined surface and the horizontal plane is 45-89 degrees. The groove is disposed at the lower part of the inner side of the clamping finger. The power mechanism includes a push block that abuts against the inner side of the clamping finger and a clamping finger driver that can drive the push block to move up and down. When the push block moves upward, it pushes the clamping finger to open outward.
[0008] In a preferred embodiment of this utility model, the elastic element is a tension spring, a first hanging rod is provided on the clamping finger, and a second hanging rod is provided on the bracket, with the first hanging rod and the second hanging rod respectively connected to the tension spring.
[0009] In a preferred embodiment of this utility model, a guide post mechanism for guiding the push block is provided between the bracket and the push block.
[0010] In a preferred embodiment of the present invention, two sets of finger clamping assemblies are disposed on the lower surface of the lifting seat, and a discharge assembly is disposed on the lifting seat between the two sets of finger clamping assemblies. The discharge assembly includes a top rod and a discharge driver capable of driving the top rod to move up and down.
[0011] In a preferred embodiment of this utility model, the unloading driver is a cylinder.
[0012] In a preferred embodiment of this utility model, a vertical guide rail is provided on the base, a slide block is slidably mounted on the guide rail, and the lifting seat is fixed to the slide block.
[0013] The beneficial effects of this invention are as follows: When the gripper mechanism grasps a semiconductor substrate, the two side edges of the semiconductor substrate are respectively embedded in the grooves of the two gripping fingers. Since the gripping fingers are rotatable, and the inward clamping force is the elastic force of the elastic element, when the width of the semiconductor substrate is slightly lower than the reference value, there will be a small gap between the edge of the semiconductor substrate and the bottom surface of the clamping groove, but this will not affect the gripper mechanism's ability to grasp the semiconductor substrate. When the width of the semiconductor substrate is slightly higher than the reference value, the edge of the semiconductor substrate is only inserted into the deepest part of the clamping groove, without significant deformation. Therefore, this gripper mechanism has low requirements for the accuracy of the substrate width and is less likely to deform the substrate. Attached Figure Description
[0014] Figure 1 It is a 3D view of the gripper mechanism in operation;
[0015] Figure 2 This is the main view of the gripper mechanism in operation.
[0016] Figure 3 This is an exploded view of the finger gripper component. Detailed Implementation
[0017] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings.
[0018] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicator will also change accordingly. Furthermore, descriptions involving "preferred," "second-preferred," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "preferred" or "second-preferred" may explicitly or implicitly include at least one of those features.
[0019] Reference Figures 1 to 3 This utility model proposes a semiconductor substrate gripper mechanism for an LED die bonder, including a base 1, a lifting seat 2 that can move up and down relative to the base 1, and a lifting driver 3 that can drive the lifting seat 2 to move up and down. Two sets of gripper finger assemblies are arranged on the left and right sides of the lifting seat 2 to support the semiconductor substrate 7. Each gripper finger assembly includes a bracket 41 fixed to the lifting seat 2 and gripper fingers 42 hinged to the bracket 41. The inner side of each gripper finger 42 has a groove 421 into which the edge of the semiconductor substrate 7 can be inserted. Each gripper finger 42 is connected to an elastic element 43 that can drive it to clamp inward. The bracket 41 is also provided with a power mechanism that can drive the gripper fingers 42 to open outward. Preferably, a vertical guide rail 61 is provided on the base 1, and a slide block 62 is slidably mounted on the guide rail 61. The lifting seat 2 is fixed to the slide block 62.
[0020] Reference Figure 1 and Figure 2 When the gripper mechanism grasps the semiconductor substrate 7, the two side edges of the semiconductor substrate 7 are respectively embedded in the clamping grooves of the two gripping fingers 42. Since the gripping fingers 42 are rotatable, and the force for inward clamping is the elastic force of the elastic element 43, when the width of the semiconductor substrate 7 is slightly lower than the reference value, there will be a small gap between the edge of the semiconductor substrate 7 and the bottom surface of the clamping groove, but this will not affect the gripper mechanism's ability to grasp the semiconductor substrate 7. When the width of the semiconductor substrate 7 is slightly higher than the reference value, the edge of the semiconductor substrate 7 is only inserted into the deepest part of the clamping groove, without significant deformation. Therefore, this gripper mechanism has low requirements for the accuracy of the substrate width and is less likely to deform the substrate.
[0021] Furthermore, the inner surface of the gripper 42 is a slope 425, and the angle A between the slope 425 and the horizontal plane is 45-89 degrees, such as 50 degrees, 60 degrees, 70 degrees, and 80 degrees, with 60-80 degrees being optimal. The slot 421 is located at the lower part of the inner surface of the gripper 42. The power mechanism includes a push block 44 that abuts against the inner surface of the gripper 42, and a gripper driver 45 that drives the push block 44 to move up and down. When the push block 44 moves upward, it pushes the gripper 42 to open outward. This structure of the power mechanism has several advantages: First, when the push block 44 rises to its highest point, the gripper 42 is fully open, allowing the semiconductor substrate 7 between the two grippers 42 to be lowered. Second, when the push block 44 descends to different heights, the distance between the two slots is different, making it suitable for gripping semiconductor substrates 7 of different widths. Third, since the angle A between the inner side of the clamping finger 42 and the horizontal plane is 60-80 degrees, the stroke of the clamping finger 42 will be less than the stroke of the push block 44. When replacing semiconductor substrates 7 of different widths, it is beneficial to accurately control the stroke of the clamping finger 42, so that the distance between the two clamping slots is adapted to the width of the semiconductor substrate 7.
[0022] In a preferred embodiment of this utility model, the elastic element 43 is a tension spring, a first hanging rod 401 is provided on the clamping finger 42, and a second hanging rod 402 is provided on the bracket 41. The first hanging rod 401 and the second hanging rod 402 are respectively connected to the tension spring.
[0023] In some embodiments of this utility model, the elastic element 43 described above can also adopt other structural forms, such as using elastic rope or rubber band instead of the tension spring, or using torsion spring or other devices.
[0024] Preferably, a guide post mechanism is provided between the bracket 41 and the push block 44 to guide the push block 44. The finger clamping actuator 45 is preferably an electric cylinder to facilitate adjustment of the lifting stroke of the push block 44.
[0025] Furthermore, both sets of gripper finger assemblies are disposed on the lower surface of the lifting base 2. The lifting base 2 is equipped with a unloading assembly located between the two sets of gripper finger assemblies. The unloading assembly includes a push rod 51 and an unloading actuator 52 capable of driving the push rod 51 to move up and down. The unloading actuator 52 can be a pneumatic cylinder, an electric cylinder, a hydraulic cylinder, etc., with a pneumatic cylinder being the most suitable. When it is necessary to remove the semiconductor substrate 7, the two gripper fingers 42 open, and then the push rod 51 pushes the semiconductor substrate 7 downwards, thus ensuring the smooth removal of the semiconductor substrate 7.
[0026] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A semiconductor substrate gripper mechanism for an LED die bonder, characterized in that, The device includes a base (1), a lifting seat (2) that can move up and down relative to the base (1), and a lifting driver (3) that can drive the lifting seat (2) to move up and down. The lifting seat (2) is provided with two sets of gripper assemblies that can support the semiconductor substrate (7) on the left and right sides. The gripper assembly includes a bracket (41) fixed to the lifting seat (2) and gripper fingers (42) hinged to the bracket (41). The inner side of the gripper fingers (42) is provided with a groove (421) into which the edge of the semiconductor substrate (7) can be embedded. The gripper fingers (42) are connected to an elastic element (43) that can drive them to clamp inward. The bracket (41) is also provided with a power mechanism that can drive the gripper fingers (42) to open outward.
2. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 1, characterized in that, The inner side of the clamping finger (42) is a slope (425), and the angle A between the slope (425) and the horizontal plane is 45-89 degrees. The slot (421) is provided at the lower part of the inner side of the clamping finger (42). The power mechanism includes a push block (44) that abuts against the inner side of the clamping finger (42) and a clamping finger driver (45) that can drive the push block (44) to move up and down. When the push block (44) moves upward, it pushes the clamping finger (42) to open outward.
3. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 2, characterized in that, The elastic element (43) is a tension spring. A first hanging rod (401) is provided on the clamping finger (42), and a second hanging rod (402) is provided on the bracket (41). The first hanging rod (401) and the second hanging rod (402) are respectively connected to the tension spring.
4. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 2, characterized in that, A guide post mechanism is provided between the bracket (41) and the push block (44) to guide the push block (44).
5. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 1, characterized in that, Both sets of finger clamping assemblies are disposed on the lower surface of the lifting seat (2). The lifting seat (2) is provided with a discharge assembly located between the two sets of finger clamping assemblies. The discharge assembly includes a top rod (51) and a discharge driver (52) capable of driving the top rod (51) to move up and down.
6. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 5, characterized in that, The unloading actuator (52) is a cylinder.
7. The semiconductor substrate gripper mechanism of an LED die bonder according to claim 1, characterized in that, The base (1) is provided with a vertical guide rail (61), and a slide block (62) is slidably installed on the guide rail (61). The lifting seat (2) is fixed to the slide block (62).