LED structure
By setting up multi-layer pad groups and phosphor colloids in the LED structure, multi-color lighting effects are achieved, solving the manufacturing complexity and cost problems caused by the voltage and current differences of LED chips of different colors, and improving production stability and efficiency.
Patent Information
- Application Number
- CN202520182242.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-05
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-02-05
AI Technical Summary
Existing multi-color LED chip packaging technology complicates the manufacturing process and increases production costs due to the differences in voltage and current requirements of LED chips of different colors.
The system employs a bracket with first, second, and third pad groups to mount blue LED chips, and covers them with red and green phosphor colloids. Combined with a transparent encapsulating colloid layer, it achieves multi-color lighting effects, simplifying circuit design and manufacturing processes.
It simplifies circuit design, reduces production costs, improves production stability and efficiency, and avoids production error rates and complexity caused by different colored LED chips.
Smart Images
Figure CN223968163U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED structure. Background Technology
[0002] LEDs, as a new type of solid-state semiconductor device, have advantages such as small size, light weight, high luminous efficiency, and energy saving and environmental protection, and are now widely used in various industries. With people's increasing demands for quality of life and lighting environments, traditional lighting sources can no longer meet diverse needs. RGB tri-color LED beads can achieve different colors and brightness variations by adjusting the proportions of red, green, and blue, bringing more flexibility and creativity to the lighting field and driving the development of lighting technology from single-function to intelligent and diversified directions.
[0003] To achieve multi-color lighting effects, existing multi-color LED chip packaging technologies employ the following methods: one method involves separately packaging LED chips for different monochromatic lights and mounting them on the same PCB board for illumination; such as... Figure 1 As shown, another method involves setting three die-bonding regions within a single LED chip to respectively fix red LED chip 53, green LED chip 52, and blue LED chip 51, thereby achieving a multi-color lighting effect. However, different colored LED chips have different voltage requirements, especially the red LED chip, which requires a significantly different voltage compared to the blue and green LED chips. Furthermore, the three colors of LED chips also have different current requirements when achieving the same power output. This necessitates configuring different power supply circuits on the substrate, complicating the manufacturing process and increasing production costs. Utility Model Content
[0004] The technical problem solved by this utility model is to provide a novel LED structure with a simple manufacturing process.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: an LED structure, including a bracket, in which a first pad group, a second pad group, and a third pad group are sequentially arranged. The second pad group is located between the first pad group and the third pad group. The second pad group protrudes from the first pad group and the third pad group and separates the upper space of the first pad group from the upper space of the third pad group. Blue LED chips are respectively arranged on the first pad group, the second pad group, and the third pad group. A red phosphor colloid covering the blue LED chip is arranged above the first pad group, and a green phosphor colloid covering the blue LED chip is arranged above the third pad group. A transparent encapsulating colloid layer is also provided in the bracket, which covers the red phosphor colloid, the green phosphor colloid, and the blue LED chip on the second pad group.
[0006] In one embodiment, the top surface of the red phosphor colloid is flush with or lower than the top surface of the second pad group.
[0007] In one embodiment, the top surface of the green phosphor colloid is flush with or lower than the top surface of the second pad group.
[0008] In one embodiment, the top surface of the red phosphor colloid is flush with the top surface of the green phosphor colloid.
[0009] In one embodiment, the top surface of the transparent encapsulating colloid layer is flush with the top surface of the bracket.
[0010] In one embodiment, the blue LED chip is a standard chip or a flip chip.
[0011] The beneficial effects of this utility model are as follows: The LED structure is novel. The first, second, and third pad groups form a convex shape. Three blue LED chips with identical parameters are set on this convex structure. Red phosphor colloid and green phosphor colloid are respectively placed above the first and third pad groups. The blue LED chip on the first pad group emits red light after exciting the red phosphor, and the blue LED chip on the third pad group emits green light after exciting the green phosphor. A transparent encapsulating colloid layer is placed above the second pad group, effectively achieving multi-color lighting effects and avoiding the voltage inconsistency problem caused by using three different colored LED chips. This simplifies circuit design and manufacturing process, significantly saving production costs. Furthermore, the design of three blue LED chips with identical parameters not only simplifies the die bonding process, avoiding the increased error rate and low production efficiency caused by the need for three die bonding operations and the use of multiple materials in traditional methods, but also further improves production stability and reliability. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0013] Figure 1 This is a cross-sectional view of a prior art LED structure;
[0014] Figure 2 This is a cross-sectional view of the LED structure according to Embodiment 1 of this utility model.
[0015] Explanation of icon numbers:
[0016] 1. Bracket;
[0017] 2. First pad group;
[0018] 3. Second pad group;
[0019] 4. Third pad group;
[0020] 51. Blue LED chip; 52. Green LED chip; 53. Red LED chip;
[0021] 6. Red fluorescent powder colloid;
[0022] 7. Green fluorescent powder colloid;
[0023] 8. Transparent encapsulating colloid layer. Detailed Implementation
[0024] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.
[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0028] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] Example 1
[0031] Please refer to Figure 2 One embodiment of this utility model is as follows: An LED structure includes a support 1. A first pad group 2, a second pad group 3, and a third pad group 4 are sequentially arranged inside the support 1. The second pad group 3 is located between the first pad group 2 and the third pad group 4. The second pad group 3 protrudes from the first pad group 2 and the third pad group 4 and separates the upper space of the first pad group 2 from the upper space of the third pad group 4. Blue LED chips 51 are respectively arranged on the first pad group 2, the second pad group 3, and the third pad group 4. A red phosphor colloid 6 covering the blue LED chips 51 is arranged above the first pad group 2. A green phosphor colloid 7 covering the blue LED chips 51 is arranged above the third pad group 4. A transparent encapsulating colloid layer 8 is also provided inside the support 1. The transparent encapsulating colloid layer 8 covers the red phosphor colloid 6, the green phosphor colloid 7, and the blue LED chips 51 on the second pad group 3.
[0032] It should be noted that the red phosphor colloid 6 is formed by solidifying encapsulating adhesive doped with red phosphor, and the green phosphor colloid 7 is formed by solidifying encapsulating adhesive doped with green phosphor.
[0033] Specifically, the first pad group 2 has a positive pad and a negative pad; similarly, the second pad group 3 has a positive pad and a negative pad, and the third pad group 4 has a positive pad and a negative pad. The blue LED chip 51 is electrically connected to the positive pad and the negative pad, respectively.
[0034] The top surface of the red phosphor colloid 6 is flush with or lower than the top surface of the second pad group 3; the top surface of the green phosphor colloid 7 is flush with or lower than the top surface of the second pad group 3.
[0035] In this embodiment, the top surface of the red phosphor colloid 6 is flush with the top surface of the green phosphor colloid 7. In other embodiments, a height difference between the top surface of the red phosphor colloid 6 and the top surface of the green phosphor colloid 7 is also possible.
[0036] The top surface of the transparent encapsulating colloid layer 8 is flush with the top surface of the bracket 1.
[0037] The blue LED chip 51 can be a standard chip or a flip chip.
[0038] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. An LED structure, characterized in that: The device includes a support frame, within which a first pad group, a second pad group, and a third pad group are sequentially arranged. The second pad group is located between the first and third pad groups and protrudes from the first and third pad groups, separating the upper space of the first pad group from the upper space of the third pad group. Blue LED chips are respectively disposed on the first, second, and third pad groups. A red phosphor colloid covering the blue LED chips is disposed above the first pad group, and a green phosphor colloid covering the blue LED chips is disposed above the third pad group. A transparent encapsulating colloid layer is also disposed within the support frame, covering the red phosphor colloid, the green phosphor colloid, and the blue LED chips on the second pad group.
2. The LED structure according to claim 1, characterized in that: The top surface of the red phosphor colloid is flush with or lower than the top surface of the second pad group.
3. The LED structure according to claim 1, characterized in that: The top surface of the green phosphor colloid is flush with or lower than the top surface of the second pad group.
4. The LED structure according to claim 1, characterized in that: The top surface of the red phosphor colloid is flush with the top surface of the green phosphor colloid.
5. The LED structure according to claim 1, characterized in that: The top surface of the transparent encapsulating colloid layer is flush with the top surface of the bracket.
6. The LED structure according to claim 1, characterized in that: The blue LED chip can be a standard chip or a flip chip.