Carrier plate temporary storage chamber

Abstract

The utility model discloses a support plate caching chamber, which comprises a caching chamber body, a plurality of supporting plates, a plurality of supporting plates, a plurality of supporting plates and a plurality of supporting plates, and is characterized in that a caching space is formed in the caching chamber body; the support plate caching position is arranged in the caching space, and the support plate caching position is used for caching a support plate; and the cleaning structure is installed in the temporary storage space, and the cleaning structure is used for cleaning dust and / or moisture on the carrier plate. According to the support plate temporary storage chamber, the cleaning structure is arranged in the support plate temporary storage chamber to clean dust and / or moisture on the support plate, so that a winding plating phenomenon can be prevented from occurring in a coating process of a battery piece borne on the support plate, meanwhile, the influence of moisture on a thin film of the battery piece is reduced, and the chemical stability of the thin film is ensured.

Description

Technical Field

[0001] This utility model relates to the field of carrier plate buffer technology, and in particular to a carrier plate buffer chamber. Background Technology

[0002] In related technologies, heterojunction photovoltaic (HJT) cells currently commonly use transparent oxide thin films (TCO) as charge collection layers. This facilitates current transmission, allowing electrons to be effectively collected from the cell surface. Furthermore, the high light transmittance of the transparent oxide film allows most incident light to pass through, enabling photons to reach the interior of the photovoltaic material and promoting the generation of photogenerated carriers. However, during transport, the carrier plate comes into contact with air, absorbing dust and moisture. Tiny dust particles can cause plating snagging during cell coating, leading to short circuits. Absorbed moisture can cause pores or defects within the film, reducing its density and smoothness. Hydroxide ions in the moisture can also react with the TCO material, especially at high temperatures, potentially altering the film's chemical composition and reducing its chemical stability and durability, indicating room for improvement. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a carrier plate buffer chamber, which, when buffering a carrier plate, can remove dust and moisture from the carrier plate to ensure the stability and reliability of the photovoltaic heterojunction cell and its transparent oxide film.

[0004] According to an embodiment of the present invention, a carrier plate buffer chamber includes: a buffer chamber body, wherein a buffer space is formed within the buffer chamber body; a carrier plate buffer position, wherein the carrier plate buffer position is disposed within the buffer space and is used to buffer a carrier plate; and a cleaning structure, wherein the cleaning structure is installed within the buffer space and is used to clean dust and / or moisture on the carrier plate.

[0005] According to the carrier plate buffer chamber of this utility model, by setting a cleaning structure in the carrier plate buffer chamber to clean the dust and / or moisture on the carrier plate, the phenomenon of swirling plating during the coating process of the battery cells carried on the carrier plate can be prevented. At the same time, the influence of moisture on the thin film of the battery cells is reduced, and the chemical stability of the thin film is guaranteed.

[0006] According to some embodiments of the present invention, the carrier plate buffer chamber includes a cleaning structure comprising a first cleaning structure and a second cleaning structure spaced apart. The first cleaning structure is used to clean dust on the carrier plate, and the second cleaning structure is used to clean dust and moisture on the carrier plate.

[0007] According to some embodiments of the present invention, in the carrier plate buffer chamber, the first cleaning structure is constructed as a compressed air purging structure, which has jet holes for blowing air toward the carrier plate.

[0008] According to some embodiments of the present invention, in the carrier plate buffer chamber, the compressed air purging structure is located above the conveying path of the carrier plate, and the jet hole is configured to open downwards.

[0009] According to some embodiments of the present invention, the carrier plate buffer chamber has multiple air jet holes, and the multiple air jet holes are configured to spray downwards in a radial pattern.

[0010] According to some embodiments of the present invention, in the carrier plate buffer chamber, the second cleaning structure is constructed as a rolling brush, which is used to perform rolling cleaning on the carrier plate.

[0011] According to some embodiments of the present invention, the carrier plate buffer chamber includes a rolling brush comprising a rolling body and absorbent bristles disposed on the rolling body. The rolling body is rotatably mounted in the buffer space, and the absorbent bristles are distributed on the peripheral wall of the rolling body.

[0012] According to some embodiments of the present invention, in the carrier plate buffer chamber, there are two rolling brushes, which are spaced apart and respectively located on both sides of the carrier plate buffer position.

[0013] According to some embodiments of the present invention, in the carrier plate buffer chamber, the two rolling brushes rotate in opposite directions.

[0014] According to some embodiments of the present invention, in the carrier plate buffer chamber, the first cleaning structure is configured to be at least one, and the second cleaning structure is configured to be at least one;

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the carrier plate buffer chamber according to an embodiment of the present invention.

[0018] Figure label:

[0019] Carrier plate buffer chamber 100,

[0020] Buffer chamber body 1, buffer space 11, carrier board buffer slot 12

[0021] Compressed air purging structure 2, jet port 21,

[0022] 3. Rolling brush; 31. Rolling element; 32. Absorbent soft bristles.

[0023] Carrier plate 4. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] In related technologies, heterojunction photovoltaic (HJT) cells currently commonly use transparent oxide thin films (TCO) as charge collection layers. This facilitates current transmission, allowing electrons to be effectively collected from the cell surface. Furthermore, the high light transmittance of the transparent oxide film allows most incident light to pass through, enabling photons to reach the interior of the photovoltaic material and promoting the generation of photogenerated carriers. However, during transport, the carrier plate comes into contact with air, absorbing dust and moisture. Tiny dust particles can cause plating snagging during cell coating, leading to short circuits. Absorbed moisture can cause pores or defects within the film, reducing its density and smoothness. Hydroxide ions in the moisture can also react with the TCO material, especially at high temperatures, potentially altering the film's chemical composition and reducing its chemical stability and durability.

[0028] This utility model proposes a carrier plate buffer chamber 100, which can not only be used to buffer the carrier plate 4, but also clean the dust and moisture on the carrier plate 4, thereby solving the above-mentioned technical problems.

[0029] The following is for reference. Figure 1 The carrier plate buffer chamber 100 according to an embodiment of the present utility model describes how, when the carrier plate 4 is stored in the carrier plate buffer chamber 100, dust and / or moisture on the carrier plate 4 can be cleaned, thereby reducing the risk of thin film winding and reducing the impact of moisture on the thin film performance, and improving production efficiency and quality.

[0030] like Figure 1 As shown, a carrier plate buffer chamber 100 according to an embodiment of the present invention includes: a buffer chamber body 1, a carrier plate buffer position 12, and a cleaning structure.

[0031] A buffer space 11 is formed within the buffer chamber body 1. The buffer space 11 is used to accommodate and buffer the carrier plate 4, which is used to support the battery cells of the heterojunction battery or other similar structures. A carrier plate buffer position 12 is located within the buffer space 11 and is used to buffer the carrier plate 4. The buffer space 11 has a carrier plate inlet / outlet, through which the carrier plate 4 can be transported into or out of the buffer space 11. It should be noted that the carrier plate buffer chamber 100 can be located in the loading area during the heterojunction battery processing. After the process is completed, the carrier plate 4 needs to be returned to the carrier plate buffer chamber 100 in the loading area for later use; that is, the carrier plate 4 can be returned to the carrier plate buffer position 12 to be buffered within the buffer space 11.

[0032] The cleaning structure is installed within the buffer space 11. The cleaning structure is used to clean dust and / or moisture on the carrier plate 4. In other words, the cleaning structure can be used to clean dust on the carrier plate 4 to reduce or remove dust on the carrier plate 4, thereby preventing the solar cells from coming into contact with dust when supported on the carrier plate 4. This effectively prevents the phenomenon of circumferential coating during PVD (Physical Vapor Deposition) coating. The cleaning structure can also clean moisture on the carrier plate 4, thereby preventing the formation of pores or defects inside the transparent oxide film (TCO) of the solar cells, improving the density and flatness of the film, and also preventing the film from reacting with hydroxide ions in the water vapor on the carrier plate 4, ensuring the stability of the chemical composition of the film, and improving the chemical stability and durability of the film.

[0033] Therefore, according to the carrier plate buffer chamber 100 of this utility model embodiment, by setting a cleaning structure in the carrier plate buffer chamber 100 to clean the dust and / or moisture on the carrier plate 4, the phenomenon of swirling plating during the coating process of the battery cells carried on the carrier plate 4 can be prevented. At the same time, the influence of moisture on the thin film of the battery cells is reduced, and the chemical stability of the thin film is guaranteed.

[0034] In some embodiments, the cleaning structure includes a first cleaning structure and a second cleaning structure spaced apart. The first cleaning structure is used to clean dust on the carrier plate 4, and the second cleaning structure is used to clean dust and moisture on the carrier plate 4. Thus, when the carrier plate 4 is buffered in the carrier plate buffer chamber 100, the dust on the carrier plate 4 can be cleaned by the first cleaning structure, and the dust and moisture on the carrier plate 4 can be cleaned by the second cleaning structure, thereby facilitating a greater reduction in dust and moisture on the carrier plate 4 and improving the cleaning effect on the carrier plate 4.

[0035] The first cleaning structure and the second cleaning structure can clean the carrier plate 4 separately. That is, the cleaning process of the first cleaning structure and the second cleaning structure on the carrier plate 4 does not interfere with each other, so the carrier plate 4 can be cleaned twice. Two different cleaning methods can be used to clean the carrier plate 4, so as to achieve the cleaning effect to a greater extent.

[0036] In some embodiments, the first cleaning structure is configured as a compressed air blowing structure 2, which has a jet hole 21 for blowing air toward the carrier plate 4. That is, by setting the compressed air blowing structure 2, air can be blown toward the carrier plate 4 through the jet hole 21 to blow away the dust attached to the carrier plate 4, thereby reducing the amount of dust attached to the carrier plate 4 and preventing the phenomenon of coating around the battery cells during the coating process after the battery cells are carried on the carrier plate 4, thus ensuring the safety of the coating process.

[0037] In other words, the first cleaning structure can be configured to have an air source or be connected to an air source. The air source is connected to the jet hole 21 through an air passage, so that the air source can be controlled to deliver gas to the jet hole 21. The first cleaning structure can be equipped with an air compressor, which can generate high-pressure gas. The high-pressure gas can be blown from the jet hole 21 toward the carrier plate 4 to enhance the blowing effect on the carrier plate 4 and reduce dust residue on the carrier plate 4.

[0038] In some embodiments, the compressed air purging structure 2 is located above the conveying path of the carrier plate 4, and the jet nozzle 21 is configured to open downwards. In other words, the jet nozzle 21 blows air from top to bottom toward the upper surface of the carrier plate 4 to blow away the dust on the upper surface of the carrier plate 4.

[0039] It should be noted that in actual use, the battery cells can be placed on top of the carrier plate 4, meaning the battery cells can contact the upper surface of the carrier plate 4, and dust easily accumulates on the upper surface of the carrier plate 4. Therefore, by setting the compressed air blowing structure 2 to blow air from top to bottom, the airflow can be directed directly at the upper surface of the carrier plate 4, cleaning the dust on the upper surface of the carrier plate 4 to a greater extent, and making the dust cleaning more targeted, which helps to effectively reduce the dust accumulation on the carrier plate 4.

[0040] Specifically, such as Figure 1 As shown, the carrier plate 4 can be input to or output to the carrier plate buffer chamber 100 in a horizontal direction. The compressed air purging structure 2 is disposed in the upper region within the carrier plate buffer chamber 100, such as... Figure 1 The compressed air purging structure 2 is located in the upper right area inside the carrier plate buffer chamber 100. Thus, during the process of the carrier plate 4 being transported from left to right to the outside of the carrier plate buffer chamber 100 or from right to left to the inside of the carrier plate buffer chamber 100, the compressed air purging structure 2 can blow away the dust on the carrier plate 4, thereby enhancing the dust removal effect.

[0041] The jet nozzle 21 is located at the lower end of the compressed air purging structure 2, that is, the jet nozzle 21 is located closer to the carrier plate 4 in the compressed air purging structure 2, so that the airflow blown out by the jet nozzle 21 can act on the carrier plate 4 with the shortest path, shorten the flow path of the airflow, and enhance the cleaning effect on the carrier plate 4.

[0042] In some embodiments, there are multiple air jet holes 21, that is, multiple air jet holes 21 can simultaneously spray air onto the carrier plate 4, so that the airflow at multiple air jet holes 21 can act on the dust on the carrier plate 4, thereby enhancing the cleaning effect on the carrier plate 4.

[0043] The multiple jet holes 21 are designed to spray downwards radially, meaning that the downward spray range of the multiple jet holes 21 is a circular area. This helps to increase the range of the jet area, such as the width of the jet area being greater than the width of the carrier plate 4. In this way, as the carrier plate 4 passes through the jet area, the jet area can fully cover the upper surface of the carrier plate 4, avoiding the situation where some areas are not blown during the air cleaning process, thus improving the dust removal effect.

[0044] In some embodiments, the second cleaning structure is configured as a rolling brush 3, which is used to clean the carrier plate 4 by rolling. Thus, during the contact process, the rolling brush 3 can brush up the dust or water on the carrier plate 4, so that the dust or water can be removed from the carrier plate 4, thereby achieving the cleaning effect.

[0045] The rolling brush 3 rotates continuously, and during the rotation, the rolling brush 3 cleans the carrier plate 4 in different areas. This not only enhances the cleaning effect, but also reduces wear and tear on the rolling brush 3 and extends its service life due to the different positions of the rolling brush 3 in contact with the carrier plate 4.

[0046] In some embodiments, the rolling brush 3 includes a rolling body 31 and absorbent bristles 32 disposed on the rolling body 31. The rolling body 31 is rotatably mounted in the buffer space 11, such as by rotating the rolling body 31 above the carrier plate buffer position 12 via a rotating shaft. Meanwhile, the absorbent bristles 32 are distributed on the peripheral wall of the rolling body 31.

[0047] Therefore, during the rotation of the rolling body 31 relative to the carrier plate 4, the absorbent bristles 32 are thrown outward under the rotation of the rolling body 31, thereby achieving contact between the absorbent bristles 32 and the carrier plate 4, so that the absorbent bristles 32 can clean the dust and moisture on the carrier plate 4, which helps to improve the cleaning effect.

[0048] Among them, water-absorbing soft bristles 32 are provided on the outer peripheral wall of the rolling body 31. The water-absorbing soft bristles 32 can not only shake the dust on the carrier plate 4, but also have a strong water absorption effect, which can effectively remove water molecules adsorbed on the surface of the carrier plate 4, improve process stability and film quality.

[0049] This design not only reduces dust on the carrier plate 4 and prevents the solar cells from coming into contact with dust when supported on the carrier plate 4, effectively preventing PVD coating from causing swirl coating and ensuring the safety and reliability of the coating process, but also allows the absorbent soft bristles 32 to clean the moisture on the carrier plate 4. This prevents the transparent oxide film of the solar cells from getting wet, which could lead to the formation of holes or defects inside, improving the density and smoothness of the film. It also prevents the film from reacting with hydroxide ions in the water vapor on the carrier plate 4, ensuring the stability of the film's chemical composition and improving its chemical stability and durability.

[0050] In some embodiments, two rolling brushes 3 are provided, and the two rolling brushes 3 are spaced apart and respectively located on both sides of the carrier plate buffer position 12. In this way, the two rolling brushes 3 can clean the carrier plate 4 of dust and moisture from both sides of the carrier plate 4, thereby avoiding the situation where the edges of the carrier plate 4 are missed and improving the comprehensiveness of the cleaning process.

[0051] Specifically, such as Figure 1 As shown, two rolling brushes 3 are spaced apart above the carrier plate 4, such as one rolling brush 3 located on the upper left of the carrier plate 4 and the other rolling brush 3 located on the upper right of the carrier plate 4. This allows the two rolling brushes 3 to clean from both sides above the carrier plate 4, enhancing the cleaning effect.

[0052] In some embodiments, the two rotating brushes 3 rotate in opposite directions, meaning the two rotating brushes 3 can clean the carrier plate 4 from two different directions to effectively remove dust and moisture from the carrier plate 4. Specifically, as... Figure 1 As shown, the upper left rolling brush 3 can be set to rotate clockwise, while the upper right rolling brush 3 can be set to rotate counterclockwise. This allows both rolling brushes 3 to brush the dust and moisture on the carrier plate 4 downwards to the bottom of the carrier plate 4, preventing the rolling brushes 3 from stirring up the dust and moisture, thus effectively cleaning the carrier plate 4 and more effectively cleaning the tiny particles on the surface of the carrier plate 4.

[0053] In some embodiments, at least one first cleaning structure is provided, that is, one, two or more first cleaning structures can be provided, and the number of first cleaning structures can be flexibly set according to actual needs; at the same time, at least one second cleaning structure is provided, that is, one, two or more second cleaning structures can be provided, that is, the number of second cleaning structures can also be flexibly set according to actual needs, which helps to improve the flexibility of the cleaning structure settings.

[0054] In this configuration, at least one first cleaning structure and at least one second cleaning structure are both electrically driven, meaning that a drive motor can be set to drive the first and second cleaning structures to achieve automatic cleaning of the carrier plate 4 without manual operation, thus reducing labor costs.

[0055] In the specific design, the first cleaning structure can be constructed as a compressed air blowing structure 2, which can be set to be driven by a motor to realize electric blowing, enhance the blowing force, and improve the cleaning effect; and the second cleaning structure can be constructed as a rolling brush 3, which can be driven by a motor to continuously drive the rolling brush 3 during the process of the motor outputting power, thereby realizing the function of electric brushing of dust and water, and realizing the automated cleaning of the carrier plate 4.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0057] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A carrier board buffer chamber, characterized by, The application relates to a wafer cache device, which comprises: a cache chamber body, wherein a cache space is formed in the cache chamber body; a wafer cache site arranged in the cache space, which is used for caching wafers; a cleaning structure arranged in the cache space, which is used for cleaning dust and / or moisture on the wafer.

2. The carrier buffer chamber of claim 1, wherein, The cleaning structure comprises first cleaning structures and second cleaning structures which are arranged at intervals, the first cleaning structures are used for cleaning dust on the wafer, and the second cleaning structures are used for cleaning dust and moisture on the wafer.

3. The carrier cache chamber of claim 2, wherein, The first cleaning structure is configured as a compressed air blowing structure, and the compressed air blowing structure is provided with air jet holes which blow air towards the wafer.

4. The carrier buffer chamber of claim 3, wherein, The compressed air blowing structure is arranged above a conveying path of the wafer, and the air jet holes are configured to be open downward.

5. The carrier cache chamber of claim 4, wherein, The air jet holes are multiple, and the multiple air jet holes are configured to be radially downwardly jetted.

6. The carrier buffer chamber of claim 2, wherein, The second cleaning structure is configured as a rolling brush which is used for rolling cleaning of the wafer.

7. The carrier cache chamber of claim 6, wherein, The rolling brush comprises a rolling body and water-absorbing soft hair arranged on the rolling body, the rolling body is rotatably arranged in the cache space, and the water-absorbing soft hair is arranged on the peripheral wall of the rolling body.

8. The carrier cache chamber of claim 6, wherein, The rolling brush is arranged in two, and the two rolling brushes are arranged at intervals and are arranged on two sides of the wafer cache site respectively.

9. The carrier cache chamber of claim 8, wherein, The rotating directions of the two rolling brushes are opposite.

10. The carrier buffer chamber of claim 2, wherein, At least one first cleaning structure and at least one second cleaning structure are arranged. At least one first cleaning structure and at least one second cleaning structure are arranged to be electrically driven.

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