Chip guide mechanism

By combining the design of the alignment component and the stabilization component, the problem of the limit plate displacement caused by vibration during chip processing is solved, achieving high stability alignment and fixation of the chip and improving processing quality.

CN223968193UActive Publication Date: 2026-03-03SHANGHAI HUOXIN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202520399375.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-10
Publication Date
2026-03-03
Estimated Expiration
2035-03-10

AI Technical Summary

Technical Problem

In the current chip manufacturing process, vibration causes the screw to wobble, which in turn causes the limiting plate to shift, affecting the stability of chip alignment and reducing the quality of the process.

Method used

The design employs a combination of a guiding component and a stabilizing component. The guiding component fixes the chip position by adjusting the lead screw and the limiting plate, while the stabilizing component uses a vacuum chuck to pick up the chip, ensuring the stability of the chip during the processing.

Benefits of technology

This achieves highly stable alignment and fixation of the chip during the manufacturing process, thus improving the manufacturing quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a chip guide mechanism, relates to the technical field of chip processing, and provides the following scheme for solving the problems in the background technology: the chip guide mechanism comprises a processing table, the upper surface of the processing table is provided with a processing groove, and the front side, the back side, the left side and the right side of the processing table are fixedly connected with guide assemblies; the lower surface of the machining table is fixedly connected with a stabilizing assembly. According to the utility model, through the arrangement of the guide assembly, the maximum moving range of the movable plate can be changed by using the second threaded rod according to chips with different sizes during use, so that after the movable plate is in contact with the second limiting plate, the position of the limiting push plate can complete guide processing on the chips, and the movable plate cannot continue to move forwards; and at the moment, the position of the movable plate can be locked by utilizing a first threaded rod and a first limiting plate, so that the chip can be guided by utilizing four limiting push plates, the situation that the four limiting push plates do not shake or displace is ensured, and the stability is higher.
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Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a chip alignment mechanism. Background Technology

[0002] In electronics, a chip is a way to miniaturize circuits (primarily semiconductor devices, but also passive components), often fabricated on the surface of a semiconductor wafer. The most advanced integrated circuits are the core of microprocessors or multi-core processors, controlling everything from computers to mobile phones to digital microwave ovens. While designing and developing a complex integrated circuit is extremely expensive, the cost per integrated circuit is minimized when distributed across products typically numbering in the millions. Integrated circuits offer high performance because their small size allows for short paths, enabling low-power logic circuits to be used in high-speed switching applications. During chip manufacturing, alignment operations are typically required to ensure chip quality.

[0003] Currently, most methods for aligning chips involve using a screw to move a limiting plate to align the chip around its perimeter. However, during chip processing, the processing equipment generates vibrations of a certain magnitude. These vibrations can cause the screw to wobble slightly and the limiting plate to shift, resulting in an unstable alignment process and reduced chip processing quality. This indicates room for improvement. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip alignment mechanism.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A chip alignment mechanism includes a processing table, the upper surface of which has a processing groove, and alignment components are fixedly connected to the front, back and left and right sides of the processing table, and a stabilizing component is fixedly connected to the lower surface of the processing table.

[0007] The alignment component is used to align chips of different models, and the stabilization component is used to firmly attach the aligned chips.

[0008] Preferably, the guiding component includes a strip frame, a movable plate slidably connected to the inner wall of the strip frame, an adjusting screw rotatably connected to the side of the strip frame away from the processing table, the end of the adjusting screw near the processing table being rotatably connected to the inner wall of the strip frame, and the movable plate being threadedly connected to the adjusting screw.

[0009] Preferably, a top rod is fixedly connected to the side of the movable plate near the processing table, and the end of the top rod away from the movable plate extends into the interior of the processing groove and is fixedly connected to a limiting push plate, which is slidably connected to the inner bottom wall of the processing groove.

[0010] Preferably, a first limiting plate is slidably connected to the inner bottom wall of the strip frame, and a first threaded rod is threadedly connected to the side of the strip frame away from the processing table. The end of the first threaded rod near the processing table extends into the interior of the strip frame and is rotatably connected to the side of the first limiting plate away from the processing table.

[0011] Preferably, a fixed frame is fixedly connected to the upper surface of the strip frame, a second threaded rod is rotatably connected to the side of the fixed frame away from the processing table, a movable plate is slidably connected to the inner bottom wall of the fixed frame, the movable plate is threadedly connected to the second threaded rod, a connecting rod is fixedly connected to the lower surface of the movable plate, a second limiting plate is slidably connected to the inner top wall of the strip frame, and the bottom end of the connecting rod is fixedly connected to the upper surface of the second limiting plate.

[0012] Preferably, the stabilizing component includes a positioning frame, a collector box is fixedly connected to the inner bottom wall of the positioning frame, two vacuum suction cups are fixedly connected to the upper surface of the collector box, and both vacuum suction cups extend to the inner bottom wall of the processing groove. A vacuum pump is fixedly connected to the inner wall of the positioning frame, and an air inlet pipe and an air outlet pipe are respectively connected to the input end and the output end of the vacuum pump. The end of the air inlet pipe away from the vacuum pump is connected to the inside of the collector box, and the end of the air outlet pipe away from the vacuum pump extends to the outside of the positioning frame.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. By setting up the guiding component, during use, the maximum movement range of the movable plate can be changed by the second threaded rod according to the different sizes of the chips. After the movable plate contacts the second limit plate, the position of the limit push plate can complete the guiding process of the chip, and the movable plate can no longer move forward. At this time, the position of the movable plate can be locked by the first threaded rod and the first limit plate. Thus, the chip guiding operation can be completed by using four limit push plates, and it is ensured that the four limit push plates will not wobble or shift, resulting in higher stability.

[0015] 2. By setting up a stabilizing component, during use, a vacuum pump can be used to extract the air from the vacuum suction cup, and the chip can be fixed in the processing tank by negative pressure adsorption, thereby ensuring the stability of the chip during the processing. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a chip alignment mechanism proposed in this utility model;

[0017] Figure 2This is a front cross-sectional view of a chip alignment mechanism proposed in this utility model;

[0018] Figure 3 This utility model proposes a chip alignment mechanism. Figure 2 Enlarged schematic diagram of the structure at point A in the middle.

[0019] In the diagram: 1. Processing table; 2. Strip frame; 3. Movable plate; 4. Adjusting screw; 5. Push rod; 6. Limiting push plate; 7. First limiting plate; 8. First threaded rod; 9. Fixed frame; 10. Second threaded rod; 11. Moving plate; 12. Connecting rod; 13. Second limiting plate; 14. Positioning frame; 15. Collector box; 16. Vacuum suction cup; 17. Vacuum pump; 18. Inlet pipe; 19. Exhaust pipe. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example 1, referring to Figure 1 and Figure 2 A chip alignment mechanism includes a processing table 1, a processing groove is formed on the upper surface of the processing table 1, alignment components are fixedly connected to the front, back and left and right sides of the processing table 1, and a stabilizing component is fixedly connected to the lower surface of the processing table 1.

[0022] The alignment component is used to align chips of different models, and the stabilization component is used to firmly attach the aligned chips.

[0023] The guiding component includes a strip frame 2, a movable plate 3 is slidably connected to the inner wall of the strip frame 2, an adjusting screw 4 is rotatably connected to the side of the strip frame 2 away from the processing table 1, the end of the adjusting screw 4 close to the processing table 1 is rotatably connected to the inner wall of the strip frame 2, and the movable plate 3 is threadedly connected to the adjusting screw 4.

[0024] A push rod 5 is fixedly connected to the side of the movable plate 3 near the processing table 1. The end of the push rod 5 away from the movable plate 3 extends into the interior of the processing groove and is fixedly connected to a limiting push plate 6. The limiting push plate 6 is slidably connected to the inner bottom wall of the processing groove. By rotating the adjusting screw 4, the movable plate 3 can be moved within the strip frame 2, thereby changing the position of the limiting push plate 6 within the processing groove through the push rod 5, thus performing a guiding operation on the chip.

[0025] The inner bottom wall of the strip frame 2 is slidably connected to a first limiting plate 7. The side of the strip frame 2 away from the processing table 1 is threadedly connected to a first threaded rod 8. The end of the first threaded rod 8 near the processing table 1 extends into the interior of the strip frame 2 and is rotatably connected to the side of the first limiting plate 7 away from the processing table 1. Rotating the first threaded rod 8 can drive the first limiting plate 7 to move within the strip frame 2, thereby limiting the farthest movement range of the movable plate 3 and ensuring that the movable plate 3 will not move continuously to the side.

[0026] A fixed frame 9 is fixedly connected to the upper surface of the strip frame 2. A second threaded rod 10 is rotatably connected to the side of the fixed frame 9 away from the processing table 1. A movable plate 11 is slidably connected to the inner bottom wall of the fixed frame 9. The movable plate 11 is threadedly connected to the second threaded rod 10. A connecting rod 12 is fixedly connected to the lower surface of the movable plate 11. A second limiting plate 13 is slidably connected to the inner top wall of the strip frame 2. The bottom end of the connecting rod 12 is fixedly connected to the upper surface of the second limiting plate 13. Depending on the size of different chips, the second threaded rod 10 is rotated, thereby driving the movable plate 11 to move within the fixed frame 9. This changes the position of the second limiting plate 13 within the strip frame 2 through the connecting rod 12, thereby limiting the maximum displacement range of the movable plate 3. When the movable plate 3 contacts the second limiting plate 13, the movable plate 3 can no longer move forward. Therefore, the positions of the four limiting push plates 6 can complete the chip alignment operation.

[0027] Example 2: Refer to Figure 2 and Figure 3 The stabilizing component includes a positioning frame 14, with a current collector 15 fixedly connected to the inner bottom wall of the positioning frame 14. Two vacuum suction cups 16 are fixedly connected to the upper surface of the current collector 15, and both vacuum suction cups 16 extend to the inner bottom wall of the processing tank. A vacuum pump 17 is fixedly connected to the inner wall of the positioning frame 14. The input and output ends of the vacuum pump 17 are respectively connected to an air inlet pipe 18 and an exhaust pipe 19. The end of the air inlet pipe 18 away from the vacuum pump 17 is connected to the interior of the current collector 15, and the end of the exhaust pipe 19 away from the vacuum pump 17 extends to the outside of the positioning frame 14. The chip is in the processing tank, and its bottom is in contact with the two vacuum suction cups 16. During the processing, the vacuum pump 17 uses the air inlet pipe 18 and the current collector 15 to extract the air from the two vacuum suction cups 16, thereby using the principle of negative pressure adsorption to firmly fix the chip in the processing tank, thus ensuring the stability of the chip during the processing.

[0028] Working principle: First, the chip is placed on the processing table 1. Depending on the different positions of the chips in the processing groove, the second threaded rod 10 is rotated first. The second threaded rod 10 drives the moving plate 11 to move within the fixed frame 9, thereby driving the second limiting plate 13 to move within the inner wall of the strip frame 2 via the connecting rod 12, thus limiting the maximum movement range of the movable plate 3. Then, the four adjusting screws 4 are rotated, driving the movable plate 3 to move within the strip frame 2, thereby driving the limiting push plate 6 to move within the processing groove via the top rod 5, changing the position of the four limiting push plates 6 within the processing groove. At this time, since the four second limiting plates 13 have determined the maximum position of the four limiting push plates 6, the movable plate 3 is blocked by the second limiting plates 13 within the strip frame 2. The effect prevents the limiting push plate 6 from moving further within the processing groove. At this point, the first threaded rod 8 is rotated, causing the first threaded rod 8 to move the first limiting plate 7 within the strip frame 2 until the first limiting plate 7 presses the movable plate 3 away from the other side of the second limiting plate 13, thereby locking the movable plate 3 and locking the position of the four limiting push plates 6. The four limiting push plates 6 can be used to guide the position of the chip, ensuring that the position of the chip will not shift or change. After the guidance is completed, the vacuum pump 17 is turned on. The vacuum pump 17 extracts the air from the two vacuum suction cups 16 through the collector box 15, thereby using the two vacuum suction cups 16 to firmly hold the chip in the processing groove, thus ensuring the stability of the chip during the processing.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A chip alignment mechanism, comprising a processing stage (1), characterized in that, The upper surface of the processing table (1) is provided with a processing groove, and the front, back and left and right sides of the processing table (1) are fixedly connected with a guiding component, and the lower surface of the processing table (1) is fixedly connected with a stabilizing component. The alignment component is used to align chips of different models, and the stabilization component is used to firmly attach the aligned chips.

2. The chip alignment mechanism according to claim 1, characterized in that, The guiding component includes a strip frame (2), a movable plate (3) is slidably connected to the inner wall of the strip frame (2), an adjusting screw (4) is rotatably connected to the side of the strip frame (2) away from the processing table (1), the end of the adjusting screw (4) close to the processing table (1) is rotatably connected to the inner wall of the strip frame (2), and the movable plate (3) is threadedly connected to the adjusting screw (4).

3. The chip alignment mechanism according to claim 2, characterized in that, The movable plate (3) is fixedly connected to a top rod (5) on the side near the processing table (1). The end of the top rod (5) away from the movable plate (3) extends into the interior of the processing groove and is fixedly connected to a limiting push plate (6). The limiting push plate (6) is slidably connected to the inner bottom wall of the processing groove.

4. A chip alignment mechanism according to claim 2, characterized in that, The inner bottom wall of the strip frame (2) is slidably connected to a first limiting plate (7), and the side of the strip frame (2) away from the processing table (1) is threadedly connected to a first threaded rod (8). The end of the first threaded rod (8) near the processing table (1) extends into the interior of the strip frame (2) and is rotatably connected to the side of the first limiting plate (7) away from the processing table (1).

5. A chip alignment mechanism according to claim 2, characterized in that, A fixed frame (9) is fixedly connected to the upper surface of the strip frame (2). A second threaded rod (10) is rotatably connected to the side of the fixed frame (9) away from the processing table (1). A movable plate (11) is slidably connected to the inner bottom wall of the fixed frame (9). The movable plate (11) is threadedly connected to the second threaded rod (10). A connecting rod (12) is fixedly connected to the lower surface of the movable plate (11). A second limiting plate (13) is slidably connected to the inner top wall of the strip frame (2). The bottom end of the connecting rod (12) is fixedly connected to the upper surface of the second limiting plate (13).

6. A chip alignment mechanism according to claim 1, characterized in that, The stabilizing component includes a positioning frame (14), a collection box (15) is fixedly connected to the inner bottom wall of the positioning frame (14), two vacuum suction cups (16) are fixedly connected to the upper surface of the collection box (15), and both vacuum suction cups (16) extend to the inner bottom wall of the processing tank. A vacuum pump (17) is fixedly connected to the inner wall of the positioning frame (14). The input end and output end of the vacuum pump (17) are respectively connected to an air inlet pipe (18) and an exhaust pipe (19). The end of the air inlet pipe (18) away from the vacuum pump (17) is connected to the inside of the collection box (15), and the end of the exhaust pipe (19) away from the vacuum pump (17) extends to the outside of the positioning frame (14).