IGBT (Insulated Gate Bipolar Translator) heat dissipation device

Abstract

The utility model relates to the technical field of IGBT modules, in particular to an IGBT heat dissipation device, which comprises an IGBT module mounting shell, a bottom cover is arranged at the bottom of the IGBT module mounting shell, the bottom cover is of a hollow structure, a plurality of heat dissipation holes are formed in the side wall of the bottom cover, a mounting frame is arranged in the bottom cover, a plurality of heat dissipation fans are mounted on the mounting frame, and the heat dissipation fans are connected with the IGBT module mounting shell. Side grooves are formed in the two sides of the IGBT module installation shell, and ash removal assemblies are arranged in the side grooves. According to the IGBT heat dissipation device provided by the utility model, the IGBT module is installed in the IGBT module installation shell, when the module works to generate a large amount of heat, the heat dissipation fan is started to accelerate air circulation, and external low-temperature air enters equipment from the side grooves, then passes through the air passing holes to enter the bottom cover and is discharged from the bottom cover to take away heat in the equipment, so that the heat dissipation efficiency is greatly improved, and the service life of the equipment is prolonged. Meanwhile, due to the arrangement of the dust removal assembly, dust accumulated at the air inlet can be removed, and the situation that air circulation is affected due to dust blockage is prevented.

Description

Technical Field

[0001] This utility model relates to the technical field of IGBT modules, specifically to an IGBT heat dissipation device. Background Technology

[0002] GBT (Insulated Gate Bipolar Transistor) is a fully controllable, voltage-driven power semiconductor device. It is a composite of a bipolar junction transistor (BJT) and a metal-oxide-semiconductor field-effect transistor (MOSFET), combining the advantages of both: high input impedance, low control power, ease of driving, high switching frequency, large conduction current, and low conduction loss. In current technology, IGBT modules generate significant heat during prolonged operation and frequent switching. Therefore, current IGBT module heat sinks on the market suffer from low heat dissipation efficiency and poor heat dissipation, thus affecting the normal operation of the equipment. Utility Model Content

[0003] The purpose of this invention is to provide an IGBT heat dissipation device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an IGBT heat dissipation device, comprising an IGBT module mounting shell, a bottom cover being provided at the bottom of the IGBT module mounting shell, the bottom cover being a hollow structure, having a plurality of heat dissipation holes on the side wall of the bottom cover, a mounting frame being provided inside the bottom cover, a plurality of cooling fans being mounted on the mounting frame, and side grooves being provided on both sides of the IGBT module mounting shell, with a dust removal component being provided in the side grooves.

[0005] Preferably, a number of vent holes are provided between the bottom surface of the IGBT module mounting housing and the bottom cover, and a dust filter is provided at the vent holes.

[0006] Preferably, the cooling fans are distributed at the edge of the bottom cover, with the fan blades facing the side wall of the bottom cover.

[0007] Preferably, a dustproof plate is provided between the middle part of the IGBT module mounting shell and the side groove.

[0008] Preferably, the dust removal assembly includes a cleaning block slidably disposed inside the side groove, a cleaning motor is installed on one side wall of the IGBT module mounting housing, the output end of the cleaning motor is connected to a lead screw, the lead screw extends into the side groove and passes through the cleaning block, and the lead screw and the cleaning block are connected by internal and external threads.

[0009] Preferably, one end of the side groove is provided with a dust collection hole.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] This utility model proposes an IGBT heat dissipation device. The IGBT module is installed in the IGBT module mounting shell. When the module is working, it generates a lot of heat. The cooling fan starts to accelerate the air circulation. The low temperature air from outside enters the device from the side slot, then passes through the air vent into the bottom cover and is discharged from the bottom cover, carrying away the heat in the device, which greatly improves the heat dissipation efficiency. At the same time, because a dust cleaning component is provided, the dust accumulated at the air inlet can be cleaned to prevent dust blockage from affecting the air circulation. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the device structure of this utility model.

[0013] Figure 2 This is a schematic diagram of the installation of the cooling fan of this utility model.

[0014] Figure 3 This is a schematic diagram of the structure of the dust removal component of this utility model.

[0015] In the diagram: 1. IGBT module mounting housing; 2. bottom cover; 3. heat dissipation hole; 4. mounting frame; 5. cooling fan; 6. vent hole; 7. side groove; 8. dustproof plate; 9. dust collection hole; 10. cleaning block; 11. cleaning motor; 12. lead screw. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1 to 3This utility model provides a technical solution: an IGBT heat dissipation device, including an IGBT module mounting shell 1, which is used to install IGBT modules. A sealing cover is installed on the top surface of the IGBT module mounting shell 1. A bottom cover 2 is provided at the bottom of the IGBT module mounting shell 1. The bottom cover 2 has a hollow structure, and several heat dissipation holes 3 are opened on the side wall of the bottom cover 2. An installation frame 4 is provided inside the bottom cover 2, and several cooling fans 5 are installed on the installation frame 4. Several vent holes 6 are opened between the bottom surface of the IGBT module mounting shell 1 and the bottom cover 2. A dust filter is provided at the vent holes 6, allowing air inside the IGBT module mounting shell 1 to enter below. The cooling fans 5 are distributed at the edge of the bottom cover 2, with the fan blades facing the side wall of the bottom cover 2. The rotation of the cooling fans 5 blows air outwards and exhausts it through the heat dissipation holes 3, thereby dissipating heat.

[0018] Side grooves 7 are provided on both sides of the IGBT module mounting housing 1. A dustproof plate 8 is provided between the middle part of the IGBT module mounting housing 1 and the side grooves 7 to block dust when the wind passes through. A dust cleaning component is provided in the side grooves 7. The dust cleaning component includes a cleaning block 10 that is slidably disposed inside the side grooves 7. A cleaning brush is provided on one side of the cleaning block 10 and is in close contact with the surface of the dustproof plate 8. One side of the cleaning block 10 protrudes. A cleaning motor 11 is installed on one side wall of the IGBT module mounting housing 1. The output end of the motor 11 is connected to a lead screw 12, which extends into the side groove 7 and passes through the cleaning block 10. The lead screw 12 and the cleaning block 10 are connected by internal and external threads. One end of the side groove 7 is provided with a dust collection hole 9. After the equipment has been working for a period of time, dust in the outside air will adhere to the outer wall of the dustproof plate 8 and block the air from entering. The cleaning motor 11 is started to drive the lead screw 12 to rotate, which in turn causes the cleaning block 10 to move and clean the outer wall of the dustproof plate 8. The cleaned dust falls out from the dust collection hole 9.

[0019] In actual use, the IGBT module is installed inside the IGBT module mounting housing 1. When the module is working, it generates a lot of heat. The cooling fan 5 starts to accelerate air circulation. The low-temperature air from outside enters the equipment from the side slot 7, then passes through the air vent 6 into the bottom cover 2 and is discharged from the bottom cover 2, carrying away the heat in the equipment, which greatly improves the heat dissipation efficiency. At the same time, because a dust cleaning component is provided, the dust accumulated at the air inlet can be cleaned to prevent dust blockage from affecting air circulation.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An IGBT heat sink device comprising an IGBT module mounting case (1), characterized by: The bottom of the IGBT module mounting shell (1) is provided with a bottom cover (2), the bottom cover (2) is a hollow structure, a plurality of heat dissipation holes (3) are formed in the side wall of the bottom cover (2), the inside of the bottom cover (2) is provided with a mounting frame (4), a plurality of heat dissipation fans (5) are mounted on the mounting frame (4), side grooves (7) are arranged on both sides of the IGBT module mounting shell (1), and ash removal assemblies are arranged in the side grooves (7).

2. The IGBT heat sink device of claim 1, wherein: A plurality of air passing holes (6) are formed between the bottom surface of the IGBT module mounting shell (1) and the bottom cover (2), and dustproof screens are arranged at the air passing holes (6).

3. The IGBT heat sink device of claim 1, wherein: The heat dissipation fans (5) are distributed at the edges of the bottom cover (2), and the fan blades of the heat dissipation fans (5) face the side wall of the bottom cover (2).

4. The IGBT heat sink device of claim 1, wherein: A dustproof plate (8) is arranged between the middle part of the IGBT module mounting shell (1) and the side groove (7).

5. The IGBT heat sink device of claim 1, wherein: The ash removal assembly comprises a cleaning block (10) slidingly arranged in the side groove (7), a cleaning motor (11) is mounted on one end side wall of the IGBT module mounting shell (1), an output end of the cleaning motor (11) is connected with a lead screw (12), the lead screw (12) extends into the side groove (7) and passes through the cleaning block (10), and the lead screw (12) and the cleaning block (10) are connected through internal and external thread cooperation.

6. The IGBT heat sink device of claim 1, wherein: One end of the side groove (7) is provided with an ash falling hole (9).

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