Control device, power supply and all-terrain vehicle adopting control device

Abstract

The utility model relates to a control device, a power supply and an all-terrain vehicle adopting the control device, the control device comprises a field-effect tube and a fixing part, the field-effect tube comprises an internal semiconductor circuit, a packaging main body and a plurality of pins, the internal semiconductor circuit is configured to utilize an electric field effect of a control input loop to control current of an output loop, and the packaging main body comprises a plurality of pins. The packaging main body is used for packaging an internal semiconductor circuit, the plurality of pins are electrically connected with the internal semiconductor circuit, the packaging main body is provided with an elastic part, and the elastic part protrudes out of the surface of the packaging main body in an unpressed state and moves towards the packaging main body in a pressed state; a containing groove is formed in the fixing piece, and when the field effect transistor is contained in the containing groove, the elastic part protrudes and is fixed in the containing groove. In the application, the field effect transistor is provided with the elastic part, so that the problems of inconvenient installation and cost increase caused by arranging an elastic body on a fixed object to assist in fixing can be reduced, and meanwhile, the field effect transistor also has relatively high stability.

Description

Technical Field

[0001] This application relates to the field of vehicle control technology, and in particular to a control device, a power supply, and an all-terrain vehicle using the control device. Background Technology

[0002] A field-effect transistor (FET) is a type of semiconductor device that uses majority carriers for conduction, also known as a unipolar transistor. It is a voltage-controlled semiconductor device commonly used in amplifier or switching circuits. For example, multiple FETs are needed in the power supply of an all-terrain vehicle to achieve power amplification or switching control. There are two main types of FETs: junction FETs (JFETs) and metal-oxide-semiconductor FETs (MOS-FETs). In circuit fabrication, the FET is typically first fixed to a mounting or heat sink, then its leads are passed through the circuit board, and finally soldered onto the board. This assembly process facilitates heat dissipation during use.

[0003] In related technologies, an elastomer is typically used to assist in fixing the device, such as by using a spring or other elastic structural component to press the surface of the MOSFET to complete the fixation. However, this method of using an elastomer to assist in fixing the device can easily increase the complexity of the device's structure, leading to inconvenience in installation and increased costs, and also reducing the stability of the MOSFET. Utility Model Content

[0004] In view of the above, a control device, a power supply, and an all-terrain vehicle using the control device are provided, wherein the field-effect transistor is easy to install and stable.

[0005] The first aspect of this application provides a control device, which includes a field-effect transistor (FET) and a fixing member. The FET includes an internal semiconductor circuit, a package body, and multiple pins. The internal semiconductor circuit is configured to control the output circuit current using the electric field effect of the control input circuit. The package body is used to encapsulate the internal semiconductor circuit. The multiple pins are electrically connected to the internal semiconductor circuit. The package body is provided with an elastic portion that protrudes from the surface of the package body when not under pressure and moves toward the surface of the package body when under pressure. The fixing member forms a receiving groove, in which the elastic portion protrudes and is fixed in the receiving groove when the FET is received.

[0006] In some embodiments, the encapsulation body has a first surface and a second surface opposite to each other, an elastic portion protruding from the first surface when not under pressure, and the encapsulation body is also provided with a heat dissipation portion that is in close contact with the second surface.

[0007] In some embodiments, the elastic portion includes an elastic element, which is at least one of a spring, a sheet, or an elastomer.

[0008] In some embodiments, the package body further has a plurality of sides adjacent to the first surface or the second surface, pins are disposed on one of the sides, and at least one of the sides is provided with a foolproof feature.

[0009] In some embodiments, one sidewall of the receiving groove has a locking portion that matches the elastic portion, and when the field-effect transistor is received in the receiving groove, it is fixed in the receiving groove by the cooperation of the elastic portion and the locking portion.

[0010] In some embodiments, the receiving groove has a first sidewall and a second sidewall, the first sidewall and the second sidewall are disposed opposite to each other, the engaging portion is disposed on the first sidewall of the receiving groove, and the thickness of the second sidewall is greater than the thickness of the first sidewall.

[0011] In some embodiments, the elastic portion further includes a locking block disposed on the elastic element, the locking block protruding from the surface of the encapsulation body under the elastic force of the elastic element.

[0012] In some embodiments, the surface of the card block is a slope, the portion of the card block near the opening of the receiving groove is the top of the slope, and the portion of the card block near the bottom of the receiving groove is the bottom of the slope. When the field-effect transistor is received in the receiving groove, the top of the slope is closer to the engaging portion than the bottom of the slope.

[0013] A second aspect of this application provides a power supply suitable for all-terrain vehicles. The power supply includes at least the control device of any embodiment of this application, and the power supply achieves power amplification or switching function through a field-effect transistor.

[0014] A third aspect of this application provides an all-terrain vehicle, comprising: a frame including a front frame and a rear frame, with a driving area for passengers disposed between the front frame and the rear frame; a suspension system connected to the frame; a running gear connected to the underside of the frame via the suspension system; and a power supply disposed on the front frame or the rear frame, the power supply including at least the control device of any embodiment of this application, and the power supply performing power amplification or switching functions through a field-effect transistor.

[0015] In the control device, power supply, and all-terrain vehicle using the control device of this application, the field-effect transistor (FET) is provided with an elastic portion. When the FET with the elastic portion is accommodated in the receiving groove of the fixing component, it can be fixed by the cooperation between the elastic portion of the FET and the receiving groove. In this case, the cost problem of additional elastic devices on the fixing component can be reduced, and the consistency and instability problems of additional elastic devices on the fixing component can also be reduced. In other words, the FET of this application has a built-in elastic portion, which can reduce the installation inconvenience and cost increase caused by using elastomers on the fixing or heat dissipation components to assist in fixing, and at the same time improve the stability of the fixing process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a field-effect transistor according to an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of a scenario in which a field-effect transistor is housed in a fixture, according to an embodiment of this application.

[0018] Figure 3 This is a structural schematic diagram of an all-terrain vehicle according to an embodiment of this application.

[0019] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0020] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It should be understood that, unless otherwise stated, " / " in this application means "or".

[0022] It should also be noted that the terms "first" and "second" in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0023] A field-effect transistor (FET) is a type of semiconductor device that uses majority carriers for conduction, also known as a unipolar transistor. It is a voltage-controlled semiconductor device commonly used in amplifier or switching circuits. For example, multiple FETs are needed in the power supply of an all-terrain vehicle to achieve power amplification or switching control. There are two main types of FETs: junction FETs (JFETs) and metal-oxide-semiconductor FETs (MOSFETs).

[0024] In circuit fabrication, it is typically necessary to first fix the MOSFET to a fixed object or heat dissipation device, then pass its pins through the circuit board, and finally solder it onto the circuit board. This completes the assembly and facilitates heat dissipation during use. For example, Chinese patent CN205454350U discloses a MOSFET fixing structure for a high-power electric vehicle controller. This structure includes a circuit board with two rows of MOSFETs spaced apart. A thermally conductive profile is provided on the circuit board to accommodate the two rows of MOSFETs. The thermally conductive profile includes a heat-conducting plate connected to the heat sink housing of the high-power electric vehicle controller. At least one mounting plate extends from one side of the heat-conducting plate for mounting the two rows of MOSFETs. The two rows of MOSFETs are tightly mounted to both sides of the mounting plate by spring clips. An insulating film is provided between the two rows of MOSFETs and the outer wall of the mounting plate. This high-power electric vehicle controller MOSFET fixing structure is not only simple in structure and easy to process and assemble, but also provides reliable and stable fixing, improving the heat dissipation effect of the MOSFETs to a certain extent and ensuring the stable operation of the electric vehicle controller.

[0025] In related technologies, such as the aforementioned Chinese patent with publication number CN205454350U, an elastomer is typically used to assist in fixing the device, such as by using a spring or other elastic structural component to press the surface of the MOSFET to complete the fixation. However, this method of using an elastomer to assist in fixing the device can easily increase the complexity of the device's structure, leading to inconvenience in installation and increased costs. Furthermore, when installing a large number of MOSFETs, this method requires a high degree of dimensional consistency in the elastomer; insufficient consistency can easily lead to reduced stability during the MOSFET fixing process.

[0026] Therefore, this application provides a control device, a power supply, and an all-terrain vehicle. The field-effect transistor (FET) in the control device has a built-in elastic component, which reduces the inconvenience and increased cost associated with using elastomers on fixed or heat-dissipating objects for fixation. Simultaneously, the built-in elastic component of the FET in the control device also improves the stability of the fixation. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] Please see Figure 1 The embodiments of this application first provide a field-effect transistor 11, which can be used as... Figure 3 In the power supply 201 of the all-terrain vehicle 200 and other electric vehicles shown, for example, it can be used for power amplification or switching of the power supply 201. That is, the field-effect transistor 11 in the embodiments of this application can be used as a power transistor or a switching transistor, or for a power circuit or a switching circuit.

[0028] The field-effect transistor 11 in this embodiment may include an internal semiconductor circuit (not shown), a package body 111, and multiple pins 112. The internal semiconductor circuit is configured to control the output circuit current using the electric field effect of the control input circuit. The package body 111 is used to encapsulate the internal semiconductor circuit, and the multiple pins 112 are electrically connected to the internal semiconductor circuit. The internal semiconductor circuit can be any circuit that enables the operation of the field-effect transistor 11 in any related art. For example, the internal semiconductor circuit may include a gate, source, drain, and various connections.

[0029] In the field-effect transistor 11 of this application embodiment, please refer to Figure 1 The encapsulation body 111 may be provided with an elastic portion 113, which protrudes from the surface of the encapsulation body 111 when not under pressure. The field-effect transistor 11 is provided with the elastic portion 113. When the field-effect transistor 11 with the elastic portion 113 is accommodated in the receiving groove 123 of the fixing member 12 as described in the embodiment of this application (i.e.... Figure 2 As shown, the field-effect transistor 11 can be fixed by the engagement between the elastic part 113 of the field-effect transistor 11 and the engaging part (not shown) of the receiving groove 123. In this case, the cost of additional elastic devices on the fixing member 12 can be reduced, and the inconsistency and instability problems caused by additional elastic devices on the fixing member 12 can also be reduced. In other words, the field-effect transistor 11 of this embodiment has a built-in elastic part 113, which can reduce the installation inconvenience and cost increase caused by setting an elastomer on the fixing object or heat dissipation object to assist in fixing. At the same time, it also has high consistency and can improve the stability of the fixing process.

[0030] The uncompressed state of the elastic portion 113 refers to the state in which the elastic portion 113 is in its natural state when it possesses a certain elasticity and the field-effect transistor 11 is not yet assembled into the receiving groove 123 of the fixing member 12 as described in this embodiment. Specifically, the encapsulation body 111 may have opposing first and second surfaces. The elastic portion 113 protrudes from the first surface in the uncompressed state. Therefore, when the field-effect transistor 11 is assembled into the receiving groove 123 of the fixing member 12 as described in this embodiment, the elastic portion 113 can be compressed under the action of the first surface, thereby being fixed in the receiving groove 123. The compressed state of the elastic portion 133 refers to the deformation that occurs when the elastic portion 113 is being installed into the receiving groove 123 of the fixing member 12.

[0031] In some embodiments, please refer to Figure 1 The encapsulation body 111 may also be provided with a heat dissipation part 114, which can be closely attached to the second surface. That is, the first surface of the encapsulation body 111 is fixed by the elastic part 113 against the inner wall of the receiving groove 123, while the second surface is fixed by the heat dissipation part 114 closely attached to the second surface. When the field effect transistor 11 is fixed in the receiving groove 123, the heat dissipation part 114 also abuts against the inner wall of the receiving groove 123. In this way, the heat generated by the field effect transistor 11 during operation can be conducted to the fixing member 12 to complete the heat dissipation.

[0032] In some embodiments, the elastic portion 113 may include at least one elastic element selected from springs, sheet springs, or elastomers. For example, the elastic portion 113 may be a spring or sheet spring at least partially disposed inside the encapsulation body 111, or an elastomer (such as elastic plastic) disposed on the first surface of the encapsulation body 111. The portion of the spring, sheet spring, or elastomer abutting the receiving groove 123 may be a pressure block, which may have an arc surface or a guide surface. This allows for guidance when the field-effect transistor 11 is assembled into the receiving groove 123 of the fixing member 12, facilitating quick assembly. Furthermore, the guidance also makes it easier to remove the field-effect transistor 11 during disassembly.

[0033] In embodiments of this application, the elastic portion 113 is disposed on the encapsulation body 111 by at least one of the following methods: threaded connection, end bonding, or partial embedding. For example, the encapsulation body 111 may have a mounting groove for disposing of the elastic portion 113, and the elastic portion 113 may be threadedly connected to or bonded to the mounting groove, or may be partially embedded in the mounting groove. The heat dissipation portion 114 may be tightly bonded to the second surface of the encapsulation body 111 by thermally conductive adhesive.

[0034] In some embodiments, the package body 111 may also have a plurality of sides adjacent to the first surface or the second surface, and the pin 112 is disposed on one of the sides, for example, the pin 112 may be disposed on the side of the package body 111 facing the opening of the retainer 12 receiving groove 123.

[0035] In some embodiments, please refer to Figure 1 At least one of the multiple sides may be provided with a foolproof part 1111. The foolproof part 1111 can thus prevent mistakes and reduce the problem of incorrectly assembling the field-effect transistor 11 into the receiving groove 123 of the fixture 12.

[0036] In some embodiments, the foolproof portion 1111 may be a notch formed in the package body 111. In other embodiments, the foolproof portion 1111 may also be a bump formed in the package body 111.

[0037] Embodiments of this application also provide a fixing member 12 for the field-effect transistor 11. Please refer to [link to relevant documentation]. Figure 2 The fastener 12 may be formed with a receiving groove 123 for accommodating the field-effect transistor 11 of any embodiment of the present application. One side wall of the receiving groove 123 has a locking portion (not shown in the figure) that matches the elastic portion 113. When the field-effect transistor 11 is accommodated in the receiving groove 123, it is fixed in the receiving groove 123 by the cooperation of the elastic portion 113 and the locking portion.

[0038] In some embodiments, the engaging portion may be a recess formed on one sidewall of the receiving groove 123, and its shape may match the elastic portion 113 of the encapsulation body 111 of this application embodiment. Thus, when the field-effect transistor 11 of this application embodiment is assembled or received in the receiving groove 123 of the fixing member 12, the elastic portion 113 can engage in the engaging portion, thereby improving the stability of the fixing member 12 in assembling or receiving the field-effect transistor 11.

[0039] In other embodiments, the engaging portion may be a protrusion formed on one sidewall of the receiving groove 123, and the protrusion may be strip-shaped. Thus, when the field-effect transistor 11 of this embodiment is assembled or received in the receiving groove 123 of the fastener 12, the elastic portion 113 can engage behind the protrusion of the engaging portion, thereby improving the stability of the fastener 12 in assembling or receiving the field-effect transistor 11.

[0040] In some embodiments, the engaging portion may be disposed on the first sidewall 121 of the receiving groove 123, and the second sidewall 122 of the receiving groove 123 may be opposite to the first sidewall 121, with the thickness of the second sidewall 122 being greater than the thickness of the first sidewall 121. In this case, the heat dissipation portion 114 may abut against the thicker second sidewall 122, thereby improving the efficiency of heat conduction.

[0041] In some embodiments, the sidewall of the receiving groove 123 may also be provided with a foolproof protrusion or a foolproof groove that matches the shape of the foolproof part 1111 of the field effect transistor 11.

[0042] In some embodiments, such as Figure 2 As shown, the elastic part 113 also includes a locking block 1132 disposed on the elastic material 1131. The locking block 1132 protrudes from the surface of the encapsulation body 111 under the elastic force of the elastic material 1131.

[0043] In some embodiments, such as Figure 2 As shown, the surface of the locking block 1132 is a sloped surface. The portion of the locking block 1132 near the opening of the receiving groove 123 is the top of the sloped surface, and the portion of the locking block 1132 near the bottom of the receiving groove 123 is the bottom of the sloped surface. When the field-effect transistor 11 is received in the receiving groove 123, the top of the sloped surface is closer to the engaging part than the bottom of the sloped surface. Therefore, before the field-effect transistor 11 is received in the receiving groove 123, the sloped surface can guide the field-effect transistor 11 to be easily inserted into the receiving groove 123, and when the field-effect transistor 11 is received in the receiving groove 123, the top of the sloped surface can more firmly lock the field-effect transistor 11 into the engaging part of the receiving groove 123.

[0044] Embodiments of this application also provide a control device 100 for the field-effect transistor 11. Please refer to [link to relevant documentation]. Figure 2 The control device 100 may include the field-effect transistor 11 of any of the above embodiments and the fixing member 12 of any of the above embodiments. Specifically, the field-effect transistor 11 includes a package body 111, and the package body 111 is provided with an elastic part 113. The elastic part 113 protrudes from the surface of the package body 111 when not under pressure. The fixing member 12 forms a receiving groove 123 for accommodating the field-effect transistor 11. One side wall of the receiving groove 123 has a locking part that matches the elastic part 113. When the field-effect transistor 11 is accommodated in the receiving groove 123, it is fixed in the receiving groove 123 by the cooperation of the elastic part 113 and the locking part. In this case, the field-effect transistor 11 has its own elastic part 113, which can reduce the problems of installation inconvenience and increased cost caused by setting an elastomer on the fixing object or heat dissipation object to assist in fixing. At the same time, it also has high consistency, which can improve the stability of the fixing process. The field-effect transistor 11 has a built-in elastic part 113, which can reduce the installation inconvenience and cost increase caused by setting an elastomer on the fixed object or heat dissipation object to assist in fixation. At the same time, it also has high consistency, which can improve the stability of the fixation process.

[0045] In some embodiments, the encapsulation body 111 has a first surface and a second surface opposite to each other, the elastic part 113 protrudes from the first surface when not under pressure, the encapsulation body 111 is also provided with a heat dissipation part 114, the heat dissipation part 114 is in close contact with the second surface; the engaging part is provided on the first sidewall 121 of the receiving groove 123, the second sidewall 122 of the receiving groove 123 is opposite to the first sidewall 121 and the thickness of the second sidewall 122 is greater than the thickness of the first sidewall 121.

[0046] Figure 3 This is a structural schematic diagram of an all-terrain vehicle 200 according to an embodiment of this application.

[0047] Please see Figure 3 The embodiments of this application also provide a power supply 201 for an all-terrain vehicle 200. The power supply 201 may include at least the control device 100 of the field-effect transistor 11 in any embodiment of this application, and the power supply 201 may perform power amplification or switching functions through the field-effect transistor 11.

[0048] Please see Figure 3 The embodiments of this application also provide an all-terrain vehicle 200, including: a frame including a front frame 211 and a rear frame 212, with a driving area for riding provided between the front frame 211 and the rear frame 212; a suspension system 213 connected to the frame; and a running system 214 connected to the underside of the frame via the suspension system 213.

[0049] The all-terrain vehicle 200 may also include a power supply 201, which is disposed on the front frame or the rear frame. The power supply 201 includes at least the control device 100 of the field-effect transistor 11 in any embodiment of the present application, and the power supply 201 realizes power amplification or switching function through the field-effect transistor 11.

[0050] In the field-effect transistor 11, the fixing member 12, the control device 100, the power supply 201, and the all-terrain vehicle 200 of this application, the field-effect transistor 11 is provided with an elastic part 113. When the field-effect transistor 11 with the elastic part 113 is accommodated in the receiving groove 123 of the fixing member 12, it can be fixed by the cooperation between the elastic part 113 of the field-effect transistor 11 and the engaging part of the receiving groove 123. In this case, the cost problem of additionally providing elastic devices in the fixing member 12 can be reduced, and the inconsistency and instability problems of additionally providing elastic devices in the fixing member 12 can also be reduced. In other words, the field-effect transistor 11 of this application has an integrated elastic part 113, which can reduce the installation inconvenience and cost increase caused by providing elastomers on the fixing object or heat dissipation object to assist in fixing. At the same time, it also has high consistency and can improve the stability of the fixing process.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A control device, comprising a field effect tube and a fixing member, the field effect tube comprising an internal semiconductor circuit configured to control an output circuit current by utilizing an electric field effect of a control input circuit, a packaging body for packaging the internal semiconductor circuit, and a plurality of pins electrically connected with the internal semiconductor circuit, the packaging body being provided with an elastic part protruding from a surface of the packaging body in an uncompressed state and moving towards the surface of the packaging body in a compressed state, the fixing member being formed with a receiving groove, the elastic part protruding and being fixed in the receiving groove when the field effect tube is received in the receiving groove. characterized in that The packaging body has opposite first and second surfaces, the elastic part protruding from the first surface in the uncompressed state, the packaging body being further provided with a heat dissipation part abutting the second surface.

2. The control device according to claim 1, characterized by The elastic part comprises an elastic object, which is at least one of a spring, a spring sheet, or an elastic body.

3. The control device of claim 1, wherein The packaging body further has a plurality of side surfaces adjacent to the first or second surface, the pins being arranged on one of the side surfaces, at least one of the side surfaces being provided with a fool-proof part.

4. The control device of claim 2, wherein One side wall of the receiving groove has a matching engaging part with the elastic part, the field effect tube being fixed in the receiving groove by the elastic part and the engaging part when the field effect tube is received in the receiving groove.

5. The control device of claim 3, wherein The receiving groove has first and second side walls arranged opposite to each other, the engaging part being arranged on the first side wall of the receiving groove, the second side wall having a thickness greater than that of the first side wall.

6. The control device of claim 5, wherein The elastic part further comprises a clamping block arranged on the elastic object, the clamping block protruding from the surface of the packaging body under the elastic force of the elastic object.

7. The control device of claim 6, wherein A surface of the clamping block is a ramp surface, a portion of the clamping block close to an opening of the receiving groove being a top of the ramp surface, a portion of the clamping block close to a bottom of the receiving groove being a bottom of the ramp surface, the top of the ramp surface being closer to the engaging part than the bottom of the ramp surface when the field effect tube is received in the receiving groove.

8. The control device of claim 7, wherein The power supply at least comprises the control device according to any one of claims 1 to 8, and the power supply realizes power amplification or switching action through the field effect tube.

9. A power source adapted for use in an all-terrain vehicle, characterized in that 10. An all-terrain vehicle, comprising: a frame comprising a front frame and a rear frame, a driving area for sitting being arranged between the front frame and the rear frame; a suspension system connected to the frame; a walking system connected below the frame through the suspension system; characterized in that the all-terrain vehicle further comprises a power supply arranged on the front frame or the rear frame, the power supply at least comprising the control device according to any one of claims 1 to 8, and the power supply realizes power amplification or switching action through the field effect tube. ​

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