Modularized in-situ electrical and optical coupling testing device

Abstract

The utility model discloses a modularized in-situ electrical and optical coupling testing device, which comprises a shell, an upper cover, electrical joints, temperature control joints, electrical probes, a temperature control console and a cold table, a groove is arranged in the shell, the upper cover is covered on the top of the shell, the shell is provided with a plurality of electrical joints and temperature control joints, and the temperature control joints are arranged on the upper cover. The temperature console is detachably arranged on the shell and extends into the groove, a cold table is arranged at the top of the temperature console, one end of the electrical probe is connected with the electrical connector, the other end of the electrical probe is in contact with a sample on the cold table, and an optical window is arranged on the upper cover above the cold table; the temperature control table is a liquid nitrogen refrigeration table or a semiconductor electrical refrigeration table or an electric heating table. The temperature control device has the advantages that accurate temperature control at different temperature ends can be quickly realized by replacing different temperature control tables, so that in-situ testing of electrical properties and optical characterization functions of materials in different temperature environments can be met.

Description

Technical Field

[0001] This utility model relates to the field of in-situ testing technology, specifically to a modular in-situ electrical and optical coupling testing device. Background Technology

[0002] High and low temperature electrical testing has significant applications in materials science, electronic engineering, and physics research, especially in exploring the changes in the electrical properties of materials under different temperature environments. The electrical properties of many materials, such as conductivity, resistivity, dielectric constant, and charge carrier mobility, are significantly affected by temperature. By controlling the electrical characteristics of materials at specific temperatures, we can better understand their performance in practical applications. Particularly in semiconductors and insulators, temperature changes have a significant impact on their band gap width, carrier concentration, and migration behavior, thus affecting their application in optoelectronic devices, sensors, and electronic components. Furthermore, for the study of special materials such as superconductors and high-temperature superconductors, the effect of temperature on their conductivity is particularly significant. Low temperatures can reduce the resistance of some materials, even approaching zero. This superconducting effect depends on electrical testing of materials at extremely low temperatures; therefore, high and low temperature electrical testing has become an essential tool for studying superconducting materials. On the other hand, high-temperature electrical testing is also particularly important for the research of ceramic materials, composite materials, etc., especially since the stability and electrical reliability of these materials in high-temperature environments are the foundation for their long-term application in aerospace, energy, electronics and other industries.

[0003] While traditional high and low temperature (HLT) stations can provide a certain temperature control range to address these testing needs, they still face limitations in accuracy and adaptability for electrical testing. Traditional HLT stations typically use a single temperature source to control the entire system. This approach has limited temperature control accuracy and struggles to adapt to the response requirements of materials under rapid temperature changes or extreme temperature conditions. Especially during low-temperature testing, the complexity of the refrigeration system and the lag in temperature control feedback lead to significant temperature fluctuations, making it difficult to obtain stable electrical test signals in extremely low-temperature environments. For high-temperature electrical testing, the thermal expansion of the materials themselves and the significant impact of excessively high temperatures on the instruments make it difficult for traditional HLT stations to provide a continuous and stable high-temperature environment. This makes it challenging for traditional equipment to obtain high-precision and highly stable test data in high and low-temperature electrical testing.

[0004] In summary, most traditional equipment uses a single temperature source for overall control, making it difficult to precisely and independently regulate multiple temperature ranges. It also fails to achieve differentiated temperature control for multiple sample regions on the same device, thus failing to meet the multi-temperature experimental requirements of complex material systems. Currently, there is an urgent need for an in-situ testing device capable of performing electrical and optical characterization of materials under different temperature environments. Utility Model Content

[0005] The technical problem to be solved by this invention is how to provide an in-situ testing device that can perform electrical and optical characterization of materials under different temperature environments.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0007] A modular in-situ electrical and optical coupling testing device includes a housing, a top cover, electrical connectors, a temperature control connector, an electrical probe, a temperature control console, and a cold stage. The housing has a groove inside, and the top cover is placed on the top of the housing. Multiple electrical connectors and temperature control connectors are arranged on the housing. The temperature control console is detachably mounted on the housing and extends into the groove. A cold stage is arranged on the top of the temperature control console. One end of the electrical probe is connected to the electrical connector, and the other end contacts the sample on the cold stage. An optical window is provided on the top cover above the cold stage.

[0008] The temperature control console is a liquid nitrogen cooling station, a semiconductor electrical cooling station, or an electric heating station.

[0009] By incorporating liquid nitrogen cooling, semiconductor electrical cooling, and electric heating stages, the temperature control console is designed as a modular component. By replacing different temperature control consoles, precise temperature control at different temperature points can be quickly achieved, thus meeting the in-situ testing requirements for the electrical properties and optical characterization of materials under various temperature environments.

[0010] Preferably, the outer casing is also provided with a vacuum connector that communicates with the groove.

[0011] Preferably, the optical window is a circular window with a diameter of not less than 10 mm.

[0012] Preferably, the distance between the optical window and the sample on the cold stage is no more than 10 mm.

[0013] Preferably, the electrical probe is positioned within the groove via a probe holder.

[0014] Preferably, it also includes a sliding component, which is disposed at the bottom of the groove, and the probe holder is slidably disposed at the sliding end of the sliding component.

[0015] Preferably, the electrical probe is a tungsten needle.

[0016] Preferably, an electric heating block is provided at the bottom of the liquid nitrogen cooling platform.

[0017] Preferably, the semiconductor electrical cooling stage includes a cold head and a cooling plate. The cold head is detachably mounted on the housing and extends into a groove. The cooling plate is mounted on the top of the cold head for placing the cooling stage.

[0018] Preferably, an electric heating element is provided at the bottom of the electric heating platform.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] By incorporating liquid nitrogen cooling, semiconductor electrical cooling, and electric heating stages, the temperature control console is designed as a modular component. By replacing different temperature control consoles, precise temperature control at different temperature points can be quickly achieved, thus meeting the in-situ testing requirements for the electrical properties and optical characterization of materials under various temperature environments. Attached Figure Description

[0021] Figure 1 This is a top view of an embodiment of the present utility model;

[0022] Figure 2 This is a front view of an embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the temperature control console, which is a liquid nitrogen refrigeration platform, according to an embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the structure of the temperature control console, which is a semiconductor electrical cooling stage, according to an embodiment of the present invention.

[0025] Figure 5 This is a schematic diagram of the structure of the temperature control console, which is an electric heating table, according to an embodiment of this utility model. Detailed Implementation

[0026] To facilitate understanding of the technical solution of this utility model by those skilled in the art, the technical solution of this utility model will now be further described in conjunction with the accompanying drawings.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically limited.

[0029] See Figures 1 to 5 This embodiment discloses a modular in-situ electrical and optical coupling testing device, including a housing 1, a top cover 2, an electrical connector 3, a temperature control connector 4, a vacuum connector 5, an electrical probe 6, a temperature control console 7, and a cold stage 8. The housing 1 has a groove 101 inside, and the top cover 5 is placed on top of the housing 4 to seal the groove 101. The housing 1 and the top cover 2 need to have rigid structure and easy processing characteristics. Therefore, in this embodiment, the material selection of the housing 1 and the top cover 2 includes, but is not limited to, various stainless steel or aluminum alloy materials.

[0030] Multiple electrical connectors 3, temperature control connectors 4, and vacuum connectors 5 are provided on the outer shell 1 and extend into the groove 101. In this in-situ testing device, the temperature control connectors 4 are connected to an external temperature control device for temperature control and monitoring. The vacuum connectors 5 are connected to an external vacuum pump to maintain a certain vacuum inside the groove 101 to prevent frost from forming inside. The electrical properties of the sample are tested by an external electrical testing instrument connected to the electrical connectors 4.

[0031] Furthermore, as an important component connecting the sample inside and outside the groove 101, the electrical connector 3 needs to be selected with a wiring method including but not limited to coaxial shielding functions such as BNC or SMA in order to prevent interference from external electric fields.

[0032] The temperature control console 7 is detachably mounted on the housing 1 and extends into the groove 101. Specifically, the temperature control console 7 can be installed on the housing 1 in a plug-in manner. The temperature control console 7 is a liquid nitrogen cooling stage 10, a semiconductor electrical cooling stage 9, or an electric heating stage 11. A cold stage 8 for placing samples is provided on the top of the temperature control console 7.

[0033] See Figure 4 The liquid nitrogen cooling stage 10 is used for testing in ultra-low temperature environments. The stage 10 is equipped with liquid nitrogen inlet and outlet ports, and an electric heating block 12 is located at its bottom. The liquid nitrogen inlet and outlet ports connect to an external liquid nitrogen supply device to cool the stage 10, enabling testing of samples in low-temperature environments. The electric heating block 12 works in conjunction with the stage 10 to ensure precise temperature control. Furthermore, the liquid nitrogen cooling stage 10 may be made of materials with excellent thermal conductivity, including but not limited to metallic silver and copper, for precise temperature control of the liquid nitrogen.

[0034] See Figure 3The semiconductor electrical cooling stage 9 is used for testing in temperature environments between -40℃ and 100℃. The semiconductor electrical cooling stage 9 includes a cold head 91 and a cooling plate 92. The cold head 91 is detachably mounted on the outer shell 1 and extends into a groove 101. The cooling plate 92 is mounted on the top of the cold head 91 for placing the cooling stage 8. A connector on the cold head 91 connects to an external water-cooling circulation device. The internal low-temperature circulating water keeps the cold head 91 within the -40℃ to 100℃ range, ensuring the cooling plate 9 can operate efficiently. Furthermore, the cold head 91 and the cooling plate 92 are made of copper or silver.

[0035] See Figure 5 The electric heating stage 11 is used for testing in high-temperature environments. The material of the electric heating stage 11 can be selected from different metal materials according to the needs of different temperature ranges, including but not limited to materials such as silver and high-temperature alloys. The bottom of the electric heating stage 11 is designed with an electric heating plate 13 made of heating resistance wire winding, which is used for precise temperature control in the high-temperature range.

[0036] By setting up the liquid nitrogen cooling stage 10, the semiconductor electrical cooling stage 9, and the electric heating stage 11, the temperature control console 7 is designed as a modular component. By replacing different temperature control consoles 7, precise temperature control at different temperature ends can be quickly achieved to meet the in-situ testing of the electrical properties and optical characterization functions of materials under different temperature environments.

[0037] Furthermore, the modular temperature control design significantly improves temperature control accuracy and response speed, enabling the in-situ testing device to maintain temperature stability during rapid changes in high and low temperatures. This effectively reduces the interference of temperature fluctuations on electrical and optical signal acquisition, making it particularly suitable for high-precision measurements of weak signals. For low-temperature testing, the modular temperature control reduces delays in cooling feedback regulation, maintaining long-term temperature stability in the low-temperature range, thereby improving the testing accuracy for materials with ultra-low conductivity and high resistivity. In high-temperature testing, this design, through zoned independent temperature control and thermal isolation technology, reduces the impact of thermal expansion and temperature non-uniformity on the equipment and samples, making electrical and optical testing of samples in high-temperature environments more reliable and obtaining more accurate signal data.

[0038] In summary, the in-situ testing device in this embodiment not only meets the multi-temperature end testing requirements that are difficult to achieve with existing equipment, but also enhances the flexibility of the temperature control process and the reliability of the test. It provides a more efficient and accurate experimental platform for analyzing the optical and electrical properties of materials under different temperature conditions, and significantly improves the testing effect and data repeatability of complex material systems.

[0039] One end of the electrical probe 3 is connected to the electrical connector 3, and the other end is in contact with the sample on the cold stage 8. In this embodiment, the electrical probe 3 is made of a low-resistance material, such as a tungsten needle.

[0040] Specifically, the electrical probe 3 is disposed in the groove 101 via the probe holder 14.

[0041] Furthermore, the in-situ testing device also includes a sliding component 15, which is disposed at the bottom of the groove 101, and the probe holder 14 is slidably disposed at the sliding end of the sliding component 15. It should be noted that the sliding component 15 is commercially available, and by setting the sliding component 15, the position of the electrical probe 3 can be changed to correspond to the testing of samples of different sizes.

[0042] See Figure 1 An optical window 201 is provided on the upper cover 2 above the cold stage 8 for visible light optical imaging, Raman or infrared spectral characterization, etc. The material of the optical window 201 includes, but is not limited to, optical quartz, single crystal diamond, single crystal alumina, potassium bromide, calcium fluoride, barium fluoride, etc. In this embodiment, the optical window 201 is a circular window with a diameter of not less than 10 mm, and the distance between the optical window and the sample on the cold stage 8 is not greater than 10 mm.

[0043] The working principle of this embodiment is as follows: According to the temperature environment to be tested, select one of the temperature control modules among liquid nitrogen cooling stage 10, semiconductor electrical cooling stage 9, and electric heating stage 11. In this embodiment, semiconductor electrical cooling stage 9 is used as an example. First, remove the top cover 2, place the sample on the cold stage 8, adjust the position of the electrical probe 6 through the sliding component 15, then fasten the top cover 2 to the outer shell 1, and then evacuate the groove 101 through the vacuum connector 5. Connect an external water chiller through the water cooling interface on the cold head 91 to make the cooling chip 92 work efficiently, thereby accurately controlling the temperature of the cold stage 8 on the cooling chip 92. At the same time, it is also connected to an external temperature controller through the temperature control connector 4 to test the electrical signal and perform spectroscopic characterization of the sample under different temperature environments.

[0044] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0045] The above-described embodiments are merely examples of implementation methods of the utility model. The scope of protection of this utility model is not limited to the above-described embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model, and these all fall within the scope of protection of this utility model.

Claims

1. A modular in situ electrical and optical coupling test device, characterized by: The application relates to a temperature control device for a sample, which comprises a shell, an upper cover, electrical connectors, temperature control connectors, an electrical probe, a temperature control console and a cold table, wherein a recess is arranged in the shell, the upper cover is arranged on the top of the shell, a plurality of electrical connectors and temperature control connectors are arranged on the shell, the temperature control console is detachably arranged on the shell and extends into the recess, a cold table is arranged on the top of the temperature control console, one end of the electrical probe is connected with the electrical connector, and the other end of the electrical probe is in contact with a sample on the cold table, and an optical window is arranged on the upper cover above the cold table. The temperature control console is a liquid nitrogen cooling table, a semiconductor electrical cooling table or an electric heating table.

2. A modular in situ electrical and optical coupling test device according to claim 1, wherein: A vacuum connector is further arranged on the shell and communicates with the recess.

3. The modular in situ electrical and optical coupling test device of claim 1, wherein: The optical window is a circular window with a diameter not less than 10 mm.

4. The modular in situ electrical and optical coupling test device of claim 1, wherein: The distance between the optical window and the sample on the cold table is not greater than 10 mm.

5. The modular in situ electrical and optical coupling test device of claim 1, wherein: The electrical probe is arranged in the recess through a probe fixing base.

6. A modular in situ electrical and optical coupling test device according to claim 5, wherein: A sliding assembly is further arranged at the bottom of the recess, and the probe fixing base is slidably arranged at the sliding end of the sliding assembly.

7. The modular in situ electrical and optical coupling testing apparatus of claim 1, wherein: The electrical probe is a tungsten needle.

8. The modular in situ electrical and optical coupling testing apparatus of claim 1, wherein: An electric heating block is arranged at the bottom of the liquid nitrogen cooling table.

9. The modular in situ electrical and optical coupling testing apparatus of claim 1, wherein: The semiconductor electrical cooling table comprises a cold head and a cooling piece, the cold head is detachably arranged on the shell and extends into the recess, and the cooling piece is arranged on the top of the cold head and used for placing the cold table.

10. The modular in situ electrical and optical coupling testing apparatus of claim 1, wherein: An electric heating piece is arranged at the bottom of the electric heating table.

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