Gluing tool for TO packaging device

Abstract

The utility model discloses a gluing tool for a TO packaging device, which comprises a bottom plate, the top of the bottom plate is provided with a groove, the center of the groove is provided with a through hole, the top of the bottom plate is provided with a limiting square frame, and the limiting square frame surrounds the outer edge of the top of the groove; the device limiting seat is installed in the groove and limited by the groove and the limiting square frame, and a containing groove used for containing a device is formed in the device limiting seat; and the clamping mechanism is used for clamping the pressing piece, the clamping mechanism is installed at the top of the bottom plate and located on the outer side of the limiting square frame, the pressing piece is located above the device limiting base, and a gluing opening corresponding to the containing groove is formed in the pressing piece. By arranging the device limiting seat, the pressing sheet and the clamping mechanism, a plurality of devices can be coated, and the consistency of the thickness, the amount and the shape of a glue solution on the plurality of devices can be ensured; and meanwhile, a large amount of device glue solution smearing work can be completed in a short time, and the production efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of component packaging technology, specifically to a coating tooling for TO packaged devices. Background Technology

[0002] TO-packaged devices are a type of semiconductor device widely used in electronic devices, typically for power transistors, diodes, and other types of discrete devices. This type of package is known for its robustness and durability, offering excellent thermal and electrical characteristics, making it suitable for high-current and high-voltage applications, and thus widely used in aerospace products. Most TO-packaged devices have a metal casing and are generally assembled with a printed circuit board, metal frame, or heat sink to ensure better heat dissipation. Reliable heat dissipation of the TO-packaged device itself after soldering is a critical factor in achieving high-quality board-level soldering and meeting high reliability requirements.

[0003] The traditional method of applying adhesive involves placing the adhesive in a syringe and using compressed air to apply it to the area where it needs to be applied. However, this method is prone to problems such as insufficient adhesive precision, uneven adhesive thickness, and low consistency. Utility Model Content

[0004] The purpose of this invention is to provide a coating tool for TO packaged devices to solve the problems mentioned in the background art.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0006] A coating tooling for TO packaged devices, comprising:

[0007] The base plate has a groove on its top, a through hole in the center of the groove, and a limiting frame on the top of the base plate, which surrounds the outer edge of the top of the groove.

[0008] The device limiting seat is installed in the groove and limited by the groove and the limiting frame. The top of the device limiting seat is flush with the top of the limiting frame. The device limiting seat has a receiving groove for placing the device.

[0009] The clamping mechanism and the pressing plate are used to clamp the pressing plate. The clamping mechanism is installed on the top of the base plate and is located outside the limiting frame. The pressing plate is located above the device limiting seat, and the pressing plate has a glue application port corresponding to the receiving groove.

[0010] Furthermore, the aforementioned clamping mechanism includes a first clamping frame located outside the limiting frame and flush with the top of the limiting frame, a second clamping frame located at the top of the first clamping frame, and a plurality of fixing members passing through the second clamping frame and locked to the first clamping frame. The pressure plate is located between the first clamping frame and the second clamping frame and is limited by the fixing members.

[0011] Furthermore, the first clamping frame and the second clamping frame have the same shape and size. The size of the pressure plate is smaller than that of the first clamping frame. Limiting through holes corresponding to the fixing members are opened on both sides of the pressure plate. The fixing members pass through the second clamping frame and the limiting through holes from top to bottom and are connected to the first clamping frame.

[0012] Furthermore, the outer edges of both the first clamping frame and the second clamping frame are flush with the outer edge of the base plate.

[0013] Furthermore, the aforementioned receiving groove includes a positioning groove formed at the top center of the device limiting seat and a placement groove formed at the top of the device limiting seat and extending along one side. The positioning groove and the placement groove correspond to and communicate with each other, and the depth of the placement groove is greater than the depth of the positioning groove, and the width of the positioning groove is equal to the width of the placement groove.

[0014] Furthermore, the bottom wall of the aforementioned positioning groove is provided with a column that is flush with the top of the device limiting seat;

[0015] The inner wall of the glue applicator is equipped with a connecting frame corresponding to the positioning groove, and the connecting frame is equipped with a baffle plate that contacts the top of the column.

[0016] Furthermore, a first notch corresponding to and communicating with the placement groove is provided on one side of the aforementioned limiting frame, and a second notch corresponding to and communicating with the first notch is provided on one side of the first clamping frame, and the depth of the placement groove is greater than the height of the limiting frame.

[0017] Furthermore, the widths of both the first and second notches are equal to the width of the placement groove.

[0018] Furthermore, all the inner corners of the aforementioned limiting frame, as well as the connection between the positioning groove and the placement groove, are provided with rounded corners.

[0019] Furthermore, pads are provided at the four corners of the bottom of the base plate, and positioning pins for positioning the first clamping frame are provided on the base plate.

[0020] This utility model has the following beneficial effects:

[0021] 1. This utility model uses a groove and a limiting frame to limit the positioning of a device limiting seat. The device limiting seat is used to place the device to be coated with adhesive. A clamping mechanism is used to clamp the pressure plate, which is located outside the limiting frame. The pressure plate is located above the device limiting seat, and the adhesive application port on the pressure plate corresponds to the receiving groove. In use, adjust the position of each component, place the adhesive on the top of the pressure plate, and manually apply the adhesive from the adhesive application port to the part of the device to be coated using an external scraper, thereby coating the surface of the device with adhesive. After coating, remove the clamping mechanism and the pressure plate together, take out the device from the device limiting seat, and then put the next device to be coated into the receiving groove of the device limiting seat. Install the clamping mechanism and the pressure plate, and repeat the above adhesive application steps. This process can be repeated to coat multiple devices, and it can also ensure the consistency of adhesive thickness, amount, and shape on multiple devices, which helps to achieve a good bonding effect and reduce the occurrence of bonding defects.

[0022] 2. The present invention provides a gluing fixture for TO packaged devices. Through the setting of device limiting seat, pressing sheet and clamping mechanism, it can avoid the bonding quality being affected by insufficient glue or the glue flowing out and contaminating the product when there is too much glue. Moreover, it can complete a large number of device glue application tasks in a short time, which greatly improves production efficiency.

[0023] 3. The pressing plate and device limiting seat of this utility model can be individually designed according to the shape of the device so that the same base plate can match multiple device limiting seats, thereby coating multiple devices and being applicable to coating devices with different shapes. When it is necessary to replace the device limiting seat, the device limiting seat can be pushed upward by using the through hole in the center of the groove of the base plate, and then a new device limiting seat can be inserted to realize the replacement operation.

[0024] 4. This utility model provides a first notch on one side of the limiting frame and a corresponding second notch on one side of the first clamping frame to facilitate the placement of devices with long leads.

[0025] 5. This utility model facilitates the placement of perforated devices by setting a column on the positioning groove of the device limiting seat, and by setting a connecting frame and a shielding plate on the pressing plate to shield the column, thereby shielding and protecting the parts that do not require adhesive. Attached Figure Description

[0026] Figure 1 A schematic diagram of the overall structure of a coating tooling for TO-packaged devices;

[0027] Figure 2 An exploded view of the adhesive coating fixture for TO packaged devices;

[0028] Figure 3 This is a schematic diagram of the base plate structure;

[0029] Figure 4 This is a schematic diagram of the bottom structure of the base plate;

[0030] Figure 5 This is a schematic diagram of the structure of the device limiting seat;

[0031] Figure 6 This is a schematic diagram of the tablet compression structure.

[0032] In the diagram: 1. Base plate; 11. Groove; 12. Through hole; 13. Limiting frame; 14. First notch; 15. Positioning pin; 2. Component limiting seat; 21. Receiving groove; 211. Positioning groove; 212. Placement groove; 213. Column; 3. Clamping mechanism; 31. First clamping frame; 311. Second notch; 32. Second clamping frame; 33. Fixing component; 4. Pressing plate; 41. Glue application port; 42. Limiting through hole; 43. Connecting frame; 44. Baffle plate; 5. Rounded corner; 6. Pad plate. Detailed Implementation

[0033] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0034] like Figures 1 to 5 As shown, an embodiment of this utility model provides a coating fixture for TO packaging devices, including: a base plate 1, a groove 11 on the top of the base plate 1, a through hole 12 in the center of the groove 11, a limiting frame 13 on the top of the base plate 1, the limiting frame 13 surrounding the top outer edge of the groove 11, and the inner sidewall of the limiting frame 13 being flush with the inner wall of the groove 11; in this embodiment, in order to support the base plate 1 and reduce the frictional contact between the bottom of the base plate 1 and the outside, pads 6 are respectively provided at the four corners of the bottom of the base plate 1.

[0035] The device positioning seat 2 is installed in the groove 11 and is limited by the groove 11 and the limiting frame 13. The top of the device positioning seat 2 is flush with the top of the limiting frame 13. The device positioning seat 2 is provided with a receiving groove 21 for placing the device. In this embodiment, the receiving groove 21 includes a positioning groove 211 opened at the top center of the device positioning seat 2 and a placement groove 212 opened at the top of the device positioning seat 2 and extending along one side. The positioning groove 211 corresponds to and communicates with the placement groove 212, and the depth of the placement groove 212 is greater than the depth of the positioning groove 211. The width of the positioning groove 211 is equal to the width of the placement groove 212.

[0036] The device includes a clamping mechanism 3 and a pressure plate 4. The clamping mechanism 3 is used to clamp the pressure plate 4. The clamping mechanism 3 is installed on the top of the base plate 1 and located outside the limiting frame 13. The pressure plate 4 is located above the device limiting seat 2, and the pressure plate 4 has a glue-applying port 41 corresponding to the receiving groove 21. The receiving groove 21 is used to place the device, and the glue-applying port 41 facilitates the use of an external scraper to scrape the glue along the pressure plate 4 and uniformly coat the device in the receiving groove 21 below the glue-applying port 41. In other embodiments of this utility model, the receiving groove 21 on the device limiting seat 2 and the glue-applying port 41 on the pressure plate 4 can be designed to be the shape of different devices, thereby limiting and fixing devices of different models and shapes, and thus being applicable to the coating of devices with different shapes.

[0037] In use, the clamping mechanism 3 clamps the pressure plate 4, the device limiting seat 2 is placed into the groove 11 on the base plate 1, and the device to be coated is placed into the receiving groove 21. The positions of the device limiting seat 2, the clamping mechanism 3, and the pressure plate 4 are adjusted, and the adhesive is placed on the top of the pressure plate 4. The adhesive is then manually applied from the coating port 41 to the device to be coated using an external scraper, thus coating the surface of the device. After coating, the clamping mechanism 3 and the pressure plate 4 are removed together, the device on the device limiting seat 2 is taken out, and the next device to be coated is placed into the receiving groove 21 of the device limiting seat 2. The clamping mechanism 3 and the pressure plate 4 are installed, and the above coating steps are repeated. This process can be repeated to coat multiple devices, thereby ensuring the consistency of adhesive thickness, amount, and shape on all devices of the same model. This helps to achieve a good bonding effect and reduce the incidence of bonding defects.

[0038] like Figure 2As shown, the clamping mechanism 3 includes a first clamping frame 31 located outside the limiting frame 13 and flush with the top of the limiting frame 13, a second clamping frame 32 located at the top of the first clamping frame 31, and a plurality of fasteners 33 passing through the second clamping frame 32 and locked to the first clamping frame 31. In this embodiment, the fasteners 33 are existing countersunk screws; and the pressure plate 4 is located between the first clamping frame 31 and the second clamping frame 32 and is limited by the fasteners 33. In this embodiment, the first clamping frame 31 and the second clamping frame 32 have the same shape and size, and the size of the pressure plate 4 is smaller than that of the first clamping frame 31. Furthermore, the pressure plate 4 has limiting through holes 42 on both sides corresponding to the fixing member 33. The second clamping frame 32 has countersunk holes matching countersunk screws, and the first clamping frame 31 has threaded holes corresponding to the countersunk holes on the second clamping frame 32. The fixing member 33 passes through the second clamping frame 32 and the limiting through holes 42 sequentially from top to bottom and connects to the first clamping frame 31. In this embodiment, four fixing members 33 are provided, each corresponding to one side of the first clamping frame 31 and the second clamping frame 32. The outer edges of both the first clamping frame 31 and the second clamping frame 32 are flush with the outer edges of the base plate 1.

[0039] like Figure 2 As shown, in order to facilitate the placement of devices with long leads, a first notch 14 corresponding to and communicating with the placement slot 212 is provided on one side of the limiting frame 13, and a second notch 311 corresponding to and communicating with the first notch 14 is provided on one side of the first clamping frame 31. The width of the first notch 14 and the second notch 311 are both equal to the width of the placement slot 212. The depth of the placement slot 212 is greater than the height of the limiting frame 13. When the device is placed in the placement slot 212, the device can be limited.

[0040] like Figure 5 and Figure 6 As shown, the bottom wall of the positioning groove 211 is provided with a column 213 that is flush with the top of the device limiting seat 2; the inner wall of the glue application port 41 is provided with a connecting frame 43 corresponding to the positioning groove 211, and a baffle plate 44 that contacts the top of the column 213 is provided on the connecting frame 43. The column 213 facilitates the placement of devices with holes. By providing the connecting frame 43 and the baffle plate 44 on the pressure plate 4 to shield the column 213, the holes on the device that do not require glue can be shielded and protected.

[0041] To facilitate the assembly of components, all the inner corners of the limiting frame 13, as well as the connection between the positioning groove 211 and the placement groove 212, are provided with rounded corners 5.

[0042] To facilitate the positioning of the first clamping frame 31, the base plate 1 is provided with positioning pins 15 for positioning the first clamping frame 31. In this embodiment, the positioning pins 15 are fixed at the top of the base plate 1 and near the side. The bottom of the first clamping frame 31 is provided with positioning holes corresponding to the positioning pins 15. At least two positioning pins 15 are provided. When there are two positioning pins, the two positioning pins 15 are located on adjacent sides of the base plate 1. When there are four positioning pins 15, one positioning pin 15 corresponds to one side wall of the base plate 1.

[0043] The following are the steps for using the adhesive coating fixture for TO-packaged devices of this invention:

[0044] (1) Place the pressure plate 4 between the first clamping frame 31 and the second clamping frame 32, and use the fastener 33 to tighten the first clamping frame 31 and the second clamping frame 32 to fix the pressure plate 4;

[0045] (2) Place the device limiting seat 2 into the groove 11 on the base plate 1, and make the placement groove 212 correspond to the first notch 14 of the upper limit frame 13 of the base plate 1, so as to facilitate the placement of long lead devices.

[0046] (3) Place the device that needs to be coated with glue into the receiving groove 21 of the device limiting seat 2, and make the surface of the device to be coated with glue facing upwards;

[0047] (4) Install the first clamping frame 31, the second clamping frame 32 and the pressure plate 4 on the base plate 1, and position the first clamping frame 31 with the positioning pin 15, thereby ensuring the vertical insertion of the clamping mechanism 3 and the pressure plate 4.

[0048] If the first clamping frame 31 and the second clamping frame 32 are not completely aligned, such as being skewed or misaligned, the fastener 33 can be loosened for adjustment.

[0049] (5) After the device and the pressure plate 4 are adjusted, place the adhesive on the pressure plate 4, and then use an external scraper to scrape the adhesive onto the surface of the device.

[0050] (6) After the adhesive is applied, remove the clamping mechanism 3 and the pressing sheet 4 together, and take out the coated device from the device limiting seat 2.

[0051] (7) If multiple devices need to be coated with adhesive, repeat steps (3) to (6);

[0052] (8) When replacing the device limit seat 2, the device limit seat 2 can be pushed upward by using the through hole 12 in the center of the groove 11 on the base plate 1, and then a new device limit seat 2 can be placed in to realize the tooling replacement operation.

[0053] With the adoption of specialized tooling, this utility model can ensure that the amount, shape, and thickness of adhesive for each device of the same model are consistent. Furthermore, the pressing plate 4 and the device limiting seat 2 can be individually designed according to the shape of the device, so that the same base plate 1 can be matched with multiple device limiting seats 2, thereby enabling the coating of multiple devices and making it suitable for coating devices of different shapes. Moreover, it can complete a large number of device adhesive coating operations in a short time, greatly improving production efficiency.

[0054] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A coating fixture for TO packaged devices, characterized in that, The utility model provides a device limiting seat (2) is installed in the recess (11) and is limited by the recess (11) and limiting square (13), the top of device limiting seat (2) is flush with the top of limiting square (13), and the device limiting seat (2) is set up with the containing groove (21) for placing device on it. The clamping mechanism (3) is used for clamping the pressing sheet (4), and the clamping mechanism (3) is installed on the top of the bottom plate (1) and located outside the limiting square (13). The pressing sheet (4) is located above the device limiting seat (2), and the pressing sheet (4) is provided with a glue applying opening (41) corresponding to the containing groove (21). The clamping mechanism (3) includes a first clamping frame (31) located outside the limiting square (13) and flush with the top of the limiting square (13), a second clamping frame (32) located on the top of the first clamping frame (31), and a plurality of fixing members (33) penetrating through the second clamping frame (32) and locked with the first clamping frame (31). The pressing sheet (4) is located between the first clamping frame (31) and the second clamping frame (32) and is limited by the fixing members (33). The first clamping frame (31) and the second clamping frame (32) have the same shape and size, the size of the pressing sheet (4) is smaller than the size of the first clamping frame (31), and the two sides of the pressing sheet (4) are respectively provided with a limiting through hole (42) corresponding to the fixing member (33). The fixing member (33) sequentially passes through the second clamping frame (32), the limiting through hole (42) from top to bottom and is connected with the first clamping frame (31).

2. The TO package device gluing tooling according to claim 1, wherein, The outer side of the first clamping frame (31) and the outer side of the second clamping frame (32) are flush with the outer side of the bottom plate (1).

3. The TO package device gluing tooling according to claim 2, wherein, The containing groove (21) includes a positioning groove (211) provided on the top center of the device limiting seat (2) and a placing groove (212) provided on the top of the device limiting seat (2) and extending along one side. The positioning groove (211) corresponds to and communicates with the placing groove (212), and the depth of the placing groove (212) is greater than the depth of the positioning groove (211). The width of the positioning groove (211) is equal to the width of the placing groove (212).

4. The TO package device gluing tooling according to claim 2, wherein, The bottom wall of the positioning groove (211) is provided with a stand (213) flush with the top of the device limiting seat (2).

5. The TO package device gluing tooling according to any one of claims 2 to 4, wherein, The inner wall of the glue applying opening (41) is provided with a connecting frame (43) corresponding to the positioning groove (211), and the connecting frame (43) is provided with a shielding plate (44) in contact with the top of the stand (213).

6. The TO package device gluing tooling according to claim 5, wherein, ​ ​ 7. The TO package device gluing tooling of claim 5, wherein, One side of the limiting square frame (13) is provided with a first notch (14) corresponding to and communicating with the placing groove (212), one side of the first clamping frame (31) is provided with a second notch (311) corresponding to and communicating with the first notch (14), and the depth of the placing groove (212) is greater than the height of the limiting square frame (13).

8. The TO package device gluing tooling according to claim 7, wherein, The widths of the first notch (14) and the second notch (311) are equal to the width of the placing groove (212).

9. The TO package device gluing tooling of claim 5, wherein, All inner corners of the limiting square frame (13) and the junctions of the positioning groove (211) and the placing groove (212) are respectively provided with round corners (5).

10. The TO package device gluing tool according to claim 2, wherein, The bottom plate (1) is provided with a base plate (6) at each of the four corner positions of the bottom, and the bottom plate (1) is provided with a positioning pin (15) for positioning the first clamping frame (31).

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