Gluing system for wallboard frame

Abstract

The utility model discloses a gluing system for a wallboard frame. The gluing system comprises a truss, a gluing assembly and a processor. The truss is provided with a containing space, a wallboard frame to be glued is placed in the containing space, the gluing assembly is arranged on the truss, the processor is connected with the gluing assembly and used for adjusting the gluing position of the gluing assembly, and the gluing assembly is used for gluing the wallboard frame located in the containing space. By means of the gluing system, automatic gluing of the wallboard frame can be achieved, the manual participation rate of gluing operation is reduced, the gluing efficiency of the wallboard frame is improved, the production efficiency of wallboards is improved, the production quality is guaranteed, and the use experience of a user on the gluing system is improved.

Description

Technical Field

[0001] This application relates to the field of industrial production technology, and in particular to an adhesive application system for a wall panel frame. Background Technology

[0002] In the current construction industry, adhesive application is a crucial step in the production of products such as wall panels. Currently, the adhesive application process for wall panels is generally performed by workers, but the use of caulking guns has several shortcomings.

[0003] First, manually applying glue using a glue gun is time-consuming. The pressure, speed, and movement of the glue all depend on the operator's skill and experience. When facing large-scale production or complex coating needs, manual glue application often cannot be completed quickly, leading to extended production cycles and impacting production efficiency. Second, manual glue application struggles to ensure uniform glue application. Due to the instability and variability of manual operation, even experienced operators cannot guarantee a completely consistent glue path every time. This can lead to problems such as poor adhesion in certain areas and appearance defects, affecting the overall product quality. Furthermore, prolonged handheld glue gun application not only easily causes hand fatigue and soreness but may also pose a potential health threat due to harmful gases released from glue evaporation. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides an adhesive application system for a wall frame, comprising:

[0005] A truss with a accommodating space in which the wall panel frame to be glued is placed;

[0006] An adhesive application assembly is mounted on the truss;

[0007] A processor, connected to the adhesive application assembly, is used to adjust the adhesive application position of the adhesive application assembly, which is used to apply adhesive to the wall panel frame located within the accommodating space.

[0008] The adhesive application system includes a conveying component and a first positioning component. The conveying component passes through the accommodating space, and the wall panel frame is conveyed to the adhesive application area of ​​the accommodating space through the conveying component.

[0009] The first positioning component is disposed on the conveying component and is used to position the wall panel frame during conveying so that the wall panel frame stays in the adhesive application area.

[0010] The first positioning component includes at least one telescopic module. The processor is connected to the first positioning component. The processor is used to control the telescopic module to extend when the conveying component conveys the wall panel frame to the adhesive application area, so as to protrude from the surface of the conveying component near the wall panel frame. The telescopic module is used to position the wall panel frame that has been conveyed to the adhesive application area.

[0011] The conveying assembly includes at least one conveying section, which corresponds to the adhesive application area;

[0012] The first positioning component is disposed on one side of the conveying section, and the first positioning component includes a plurality of telescopic modules, which are arranged at intervals in sequence along a direction perpendicular to the conveying direction of the conveying component to the wall panel frame.

[0013] The adhesive application system further includes a second positioning component and a third positioning component. The second positioning component and the third positioning component are disposed in the adhesive application area, spaced apart from the conveying component, and respectively located on opposite sides of the conveying component. The extension direction of the second positioning component and the extension direction of the third positioning component are parallel to the conveying direction of the conveying component to the wall panel frame.

[0014] The second positioning component and the third positioning component are connected to the processor. The processor is used to control the second positioning component and the third positioning component to move towards each other to position the wall panel frame after the first positioning component positions the wall panel frame.

[0015] The adhesive application system further includes a feeding component, which is spaced apart from the adhesive application component and connected to the processor and the adhesive application component respectively. The processor is used to control the feeding component to supply adhesive to the adhesive application component.

[0016] The feeding assembly includes a storage tank and a piston module. The piston module is disposed in the storage tank, corresponds to the storage tank, and is connected to the processor. The storage tank is used to store the adhesive, and the processor is used to adjust the advancing speed of the piston module in the storage tank to change the amount of adhesive dispensed by the feeding assembly.

[0017] The adhesive application assembly includes a dispensing valve, which is connected to both the material supply assembly and the processor. The processor controls the dispensing valve to apply adhesive to the wall panel frame.

[0018] The adhesive application system further includes a first guide rail, a second guide rail, and a lifting assembly. The first guide rail is disposed on the truss, and the second guide rail is disposed on the first guide rail, with the second guide rail sliding relative to the first guide rail. The lifting assembly is disposed on the second guide rail, with the lifting assembly sliding relative to the second guide rail.

[0019] The adhesive application component is mounted on the lifting component and is slidably disposed relative to the lifting component;

[0020] The processor controls the adhesive application assembly to approach the wall panel frame along a first direction to apply adhesive to the area of ​​the wall panel frame that needs to be adhesiveed. The first direction is perpendicular to the extension direction of the first guide rail and the extension direction of the second guide rail.

[0021] The adhesive application system further includes an input component connected to the processor. The input component is used to input product information of the wall panel frame to obtain position information of the location where adhesive needs to be applied to the wall panel frame. The processor is used to adjust the adhesive application position of the adhesive application component based on the position information.

[0022] The beneficial effects of this application are as follows: Unlike existing technologies, the adhesive application system of this application includes a truss, an adhesive application assembly, and a processor. The truss has a receiving space in which the wall panel frame to be adhesively applied is placed. The adhesive application assembly is mounted on the truss, and the processor is connected to the adhesive application assembly to adjust its application position. The adhesive application assembly is used to apply adhesive to the wall panel frame located within the receiving space. The adhesive application system provided by this application enables automatic adhesive application to the wall panel frame, reducing manual intervention in the adhesive application process, improving the adhesive application efficiency of the wall panel frame, increasing the production efficiency of the wall panels, ensuring production quality, and enhancing the user experience of the adhesive application system. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] in:

[0025] Figure 1 This is a schematic diagram of the structure of an embodiment of the adhesive application system of this application;

[0026] Figure 2 This is a schematic diagram of another embodiment of the adhesive application system of this application;

[0027] Figure 3This is a schematic diagram of the structure of an embodiment of the adhesive application component of this application.

[0028] Reference numerals: 1. Glue application system; 11. Truss; 12. Glue application assembly; 121. Dispensing valve; 13. Second positioning assembly; 14. Feeding assembly; 141. Storage tank; 142. Piston module; 15. First guide rail; 16. Second guide rail; 17. Lifting assembly; 2. Wall panel frame. Detailed Implementation

[0029] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0030] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0031] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, the character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Furthermore, "many" in this application means two or more. Moreover, the term "at least one" in this application means any combination of at least two of any one or more of a plurality of objects. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C. Furthermore, the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0033] Please see Figure 1 , Figure 1This is a schematic diagram of an embodiment of the adhesive application system of this application. The adhesive application system for the wall panel frame proposed in this application is applied to the production of prefabricated steel-concrete structural wall panels, realizing automatic adhesive application on the wall panel frame. Fiberboard panels can then be laid on the adhesive-coated wall panel frame to form a steel-concrete structural wall panel; enabling the formed steel-concrete structural wall panel to be shipped for use in modular buildings and other scenarios. The adhesive application system 1 of this embodiment combines the adhesive application component 12 and the processor, among other components, onto the truss 11, allowing the adhesive application system 1 to function as a workstation for automatic adhesive application in industrial production. The processor controls the adhesive application component 12 to apply adhesive to the wall panel frame based on the position information of the adhesive application area, enabling the adhesive application system 1 provided in this application embodiment to achieve intelligent control in industrial production through the processor, reducing the difficulty and labor intensity of manual operation, and improving the production efficiency of the adhesive application system 1.

[0034] The adhesive application system 1 for the wall panel frame provided in this application embodiment includes a truss 11, an adhesive application assembly 12, and a processor (not shown).

[0035] The truss 11 has a receiving space where the wall panel frame to be glued is placed. The glue application assembly 12 is mounted on the truss 11. A processor is connected to the glue application assembly 12 and is used to adjust the glue application position of the assembly. The glue application assembly 12 is used to apply glue to the wall panel frame located within the receiving space. The glue application position may include parameters such as the distance and orientation of the glue application assembly 12 on the truss 11, and its distance from the wall panel frame to be glued.

[0036] Specifically, the processor can obtain the position information of each column on the wall panel frame to be glued, and control the glue application component 12 to adjust the glue application position based on the position information. The glue application component 12 can apply glue to the surface of each column, so that the glue application component 12 can apply glue to the wall panel frame in the accommodating space.

[0037] In one embodiment, the processor can obtain information about the wall panel frame to be glued in advance, and then determine the position information of each column in advance. That is, the processor can obtain the position information of the position where the glue application component 12 needs to be glued in advance. After the wall panel frame to be glued is placed in the accommodating space, the processor can then adjust the glue application position of the glue application component 12 based on the position information, so that the glue application component 12 can apply glue to the wall panel frame and improve the production efficiency of the glue application system 1.

[0038] Optionally, the glue application system 1 may include an input component (not shown), which is connected to the processor and is used to input product information of the wall panel frame and obtain the location information of the wall panel where glue needs to be applied. The processor can adjust the glue application position of the glue application component 12 based on the location information.

[0039] The input component can be a smart device such as a computer. Users can upload product information of the wall panel frame to the computer, such as uploading the design drawing of the wall panel frame (including the locations where glue needs to be applied). The computer then inputs the design drawing of the wall panel frame and obtains the location information of the locations where glue needs to be applied in the wall panel frame. Subsequently, the layout software on the computer can plan the glue application path of the glue application component 12 based on the location information of the locations where glue needs to be applied on the wall panel frame. The processor can further control the glue application component 12 to move based on the glue application path, sequentially applying glue to the locations where glue needs to be applied on the wall panel frame, thereby improving the movement efficiency and glue application efficiency of the glue application component 12 and improving the production efficiency of the glue application system 1.

[0040] In another embodiment, the adhesive application system 1 may further include an identification component (not shown). The image acquisition camera in the identification component can acquire images of the wall panel frame to be adhesiveed within the accommodating space. The image recognition module in the identification component can then scan and recognize the images acquired by the image acquisition camera to obtain the location information of the areas on the wall panel frame to be adhesiveed. It can be understood that the areas on the wall panel to be adhesiveed are the surfaces of the columns mentioned earlier. After obtaining the location information of the areas on the wall panel frame to be adhesiveed, the identification component can send this location information to the processor. Upon receiving the location information, the processor controls the adhesive application component 12 to apply adhesive to the wall panel frame, thereby improving the production efficiency of the adhesive application system 1. By setting the identification component to acquire the location information of the wall panel frame to be adhesiveed, the system can adapt to adhesive application operations for wall panel frames of different specifications. It also avoids uneven adhesive application on the wall panel frame when there are errors between the actual manufacturing of the wall panel frame and the design drawings, thus improving the practicality and intelligence of the adhesive application system 1.

[0041] In other embodiments, the processor in this application embodiment is used to perform operations such as receiving and processing the position information of the wall panel frame and the data of the adhesive application component 12. The processor can be a CPU (Central Processing Unit) or an integrated circuit chip, and has signaling processing capabilities. The processor can also be a general-purpose processor, a digital signaling processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc., and this application does not limit it in this way.

[0042] After the adhesive application system 1 has finished applying adhesive to the wall panel frame, a laying system (not shown) can be set up to lay fiberboard on the adhesive-coated wall panel frame, so that the fiberboard and the wall panel frame are bonded together by the adhesive to form a reinforced concrete structure wall panel.

[0043] Optionally, the adhesive application system 1 includes a conveying component and a first positioning component. The conveying component passes through the receiving space, and the wall panel frame is conveyed to the adhesive application area of ​​the receiving space through the conveying component. The first positioning component is disposed on the conveying component and is used to position the conveyed wall panel frame so that the wall panel frame stays in the adhesive application area.

[0044] Specifically, the conveying component can be, but is not limited to, overhead cranes, automated guided vehicles, automatic conveyors, conveyor belts, and other material handling components, used to convey the wall panel frame, enabling the wall panel frame to be glued to be transported from outside the receiving space to inside the receiving space for glue application. However, if a first positioning component is not set to position the wall panel frame conveyed by the conveying component, the position of the wall panel frame conveyed by the conveying component into the receiving space is uncontrollable. Consequently, the processor cannot accurately adjust the glue application position of the glue application component 12 to ensure that the glue application component 12 applies glue to the wall panel frame.

[0045] Therefore, this application provides a first positioning component that can position the wall panel frame during transmission so that the wall panel frame can stay in the adhesive application area, thereby improving the accuracy and uniformity of the adhesive application component 12 in applying adhesive to the wall panel frame and increasing the production efficiency of the adhesive application system 1.

[0046] The first positioning component can be installed in the conveying direction of the conveying component to the wall panel frame, so that when the wall panel frame is conveyed to the glue application area, the first positioning component can block and position the wall panel frame so that the wall panel frame stays in the glue application area.

[0047] Optionally, the first positioning component includes at least one telescopic module. A processor is connected to the first positioning component. The processor controls the telescopic module to extend and protrude from the surface of the conveying component near the wall panel frame when the conveying component delivers the wall panel frame to the adhesive application area. The telescopic module is used to position the wall panel frame delivered to the adhesive application area.

[0048] Specifically, the telescopic module can be positioned in the section corresponding to the conveying component and the adhesive application area. Before the conveying component transports the wall panel frame to the adhesive application area, the telescopic module can be in a retracted state, meaning it does not protrude from the surface of the conveying component and does not affect the conveying function of the conveying component. When the conveying component transports the wall panel frame to the adhesive application area, the processor controls the telescopic module to extend, protruding from the surface of the conveying component near the wall panel frame. The protruding telescopic module contacts the wall panel frame, blocking and positioning the wall panel frame being transported to the adhesive application area, so that the wall panel frame remains in the adhesive application area. Then, the processor can control the adhesive application component 12 to apply adhesive to the wall panel frame in the adhesive application area, improving the production efficiency of the adhesive application system 1.

[0049] Optionally, the conveying assembly includes at least one conveying section, which corresponds to the adhesive application area.

[0050] The first positioning component is disposed on one side of the conveying section, and the first positioning component includes multiple telescopic modules, which are arranged sequentially at intervals along a direction perpendicular to the conveying direction of the conveying component to the wall panel frame. Furthermore, when the processor controls the extension of the multiple telescopic modules, the telescopic modules protruding from the surface of the conveying component can contact the front end of the wall panel frame along the conveying direction of the conveying component to the wall panel frame, thereby preventing the wall panel frame from being further conveyed and causing the wall panel frame to stop on the adhesive application area.

[0051] Optionally, the adhesive application system further includes a second positioning component 13 and a third positioning component. The second positioning component 13 and the third positioning component are disposed in the adhesive application area, spaced apart from the conveying component, and located on opposite sides of the conveying component. The extension directions of the second positioning component 13 and the third positioning component are parallel to the conveying direction of the conveying component to the wall panel frame. The second positioning component 13 and the third positioning component can be positioning components of the same structure.

[0052] The second positioning component 13 and the third positioning component are connected to the processor. The processor is used to control the second positioning component 13 and the third positioning component to move towards each other after the first positioning component positions the wall panel frame, thereby moving the wall panel frame for positioning.

[0053] Specifically, since the second positioning component 13 and the third positioning component are located on opposite sides of the conveying component, that is, after the first positioning component blocks and positions the wall panel frame, the second positioning component 13 and the third positioning component are located on opposite sides of the wall panel frame, and the two sides where the second positioning component 13 and the third positioning component are located are adjacent to the side where the first positioning component is located. The processor controls the second positioning component 13 and the third positioning component to move towards each other, that is, the second positioning component 13 and the third positioning component move closer to the wall panel frame, so that the second positioning component 13 and the third positioning component clamp the wall panel frame through the opposite sides of the wall panel frame, thereby achieving positioning and fixing of the wall panel frame.

[0054] After the first positioning component, the second positioning component 13, and the fourth positioning component fix the wall panel frame, the processor then controls the adhesive application component 12 to apply adhesive to the fixed wall panel frame. This avoids uneven adhesive application caused by displacement of the wall panel frame during the adhesive application process, thereby improving the adhesive application efficiency of the adhesive application component 12 and increasing the production efficiency of the adhesive application system 1.

[0055] Optionally, please refer to Figure 2 , Figure 2This is a schematic diagram of another embodiment of the adhesive application system of this application. The adhesive application system 1 also includes a feeding component 14, which is disposed at a distance from the adhesive application component 12 and is connected to the processor and the adhesive application component 12 respectively. The processor is used to control the feeding component 14 to supply adhesive to the adhesive application component 12.

[0056] Specifically, after the processor controls the glue application component 12 to move to the position where glue needs to be applied, the processor controls the feeding component 14 to provide glue to the glue application component 12 so that the glue application component 12 can apply glue to the wall panel frame, thereby improving the production efficiency of the glue application system 1.

[0057] Optionally, the feeding assembly 14 may include a storage tank and a piston module.

[0058] The piston module is located in the storage tank, corresponding to the storage tank and connected to the processor. The storage tank is used to store adhesive, and the processor is used to adjust the advancing speed of the piston module in the storage tank to change the amount of adhesive dispensed by the feeding assembly 14.

[0059] Specifically, such as Figure 2 As shown, the storage tank can be cylindrical, and the part of the piston module disposed in the storage tank can be circular with the same area as the bottom surface of the storage tank. Furthermore, the processor can control the piston module to advance in the storage tank, and the glue in the storage tank is squeezed into the glue application assembly 12 under the push of the piston module, so that the feeding assembly 14 supplies glue to the glue application assembly 12.

[0060] In practical applications, when the piston module maintains a constant pushing speed, different types of adhesives or different operating temperatures will affect the amount of adhesive dispensed by the feeding component 14. If the pushing speed of the piston module remains constant, uneven adhesive application by the coating component 12 to the wall panel frame can easily occur under different operating environments (different smells) or when different types of adhesives are stored in the storage tank, making it impossible to guarantee the consistency of adhesive application to the wall panel frame. Therefore, the processor is also used to adjust the pushing speed of the piston module in the storage tank to change the amount of adhesive dispensed by the feeding component 14. This ensures the uniformity of adhesive application to the wall panel frame by the coating component 12 when applying adhesives at different temperatures or using different adhesives, achieving controllability of the amount of adhesive dispensed by the feeding component 14, improving the quality and stability of adhesive application, and enhancing the practicality and production efficiency of the coating system 1.

[0061] Optionally, please refer to Figure 3 , Figure 3 This is a schematic diagram of an embodiment of the adhesive application assembly of this application. The adhesive application assembly 12 includes a dispensing valve 121, which is connected to the feeding assembly 14 and the processor respectively. The processor is used to control the dispensing valve 121 to apply adhesive to the wall panel frame.

[0062] Specifically, the processor can control the dispensing valve 121 to move to the position where glue needs to be applied, during which the dispensing valve 121 is in a closed state. After the dispensing valve 121 is in the position where glue needs to be applied, the processor controls the dispensing valve 121 to open and controls the feeding assembly 14 to supply glue to the dispensing valve 121. The glue flows out from the dispensing valve 121 and is applied to the wall panel frame. At the same time, the processor can also control the dispensing valve 121 to move, so as to apply glue to a certain area.

[0063] After the dispensing valve 121 finishes applying adhesive to the current area, the processor controls the dispensing valve 121 to move to the next location where adhesive needs to be applied, and controls the dispensing valve 121 to close. This prevents adhesive from dripping onto other operating components during the movement process, thus affecting the operating efficiency of the operating components and improving the safety and practicality of the adhesive application system 1.

[0064] Optionally, please refer to the following: Figure 2 and Figure 3 The adhesive application system 1 also includes a first guide rail 15, a second guide rail 16, and a lifting assembly 17.

[0065] A first guide rail 15 is mounted on the truss 11, and a second guide rail 16 is mounted on the first guide rail 15. The second guide rail 16 and the first guide rail 15 are slidably arranged relative to each other. Specifically, two parallel first guide rails 15 can be mounted on the truss 11, and the two ends of the second guide rail 16 are respectively mounted on the first guide rails 15 to maintain the stability of the sliding of the second guide rail 16 relative to the first guide rail 15. A lifting assembly 17 is mounted on the second guide rail 16, and the lifting assembly 17 is slidably arranged relative to the second guide rail 16. An adhesive application assembly 12 is mounted on the lifting assembly 17, and is slidably arranged relative to the lifting assembly 17.

[0066] The processor controls the adhesive application assembly 12 to approach the wall panel along a first direction to apply adhesive to the area of ​​the wall panel to be coated. The first direction is perpendicular to the extension direction of the first guide rail 15 and the second guide rail 16.

[0067] Specifically, such as Figure 2 The extending directions of the first guide rail 15 and the second guide rail 16 can be perpendicular to each other. Therefore, movement of the second guide rail 16 on the first guide rail 15 can drive the lifting assembly 17 and the adhesive application assembly 12 to move in the extending direction of the first guide rail 15. And movement of the lifting assembly 17 on the second guide rail 16 can drive the adhesive application assembly 12 to move in the extending direction of the second guide rail 16, enabling horizontal movement of the adhesive application assembly 12.

[0068] Furthermore, the glue application component 12 slides on the lifting component 17 along a first direction, which is perpendicular to the extension direction of the first guide rail 15 and the second guide rail 16, i.e., the first direction is the direction of gravity. The processor can control the movement of the second guide rail 16 on the first guide rail 15, the movement of the lifting component 17 on the second guide rail 16, and the movement of the glue application component 12 on the lifting component 17 to realize the three-dimensional movement of the glue application component 12, thereby improving the movement efficiency of the glue application component 12 and improving the production efficiency of the glue application system 1.

[0069] Through the above methods, the adhesive application system 1 provided in this application can automatically apply adhesive to the wall panel frame, thereby reducing manual operation while improving adhesive application efficiency and quality, and thus realizing intelligent control of adhesive application for wall panel frames in the industrial production field.

[0070] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A gluing system for wall panel frames, characterized in that, The application relates to a wallboard frame gluing system. The wallboard frame gluing system comprises a truss, a gluing assembly and a processor. The truss has a containing space in which the wallboard frame to be glued is placed. The gluing assembly is arranged on the truss.

2. The gluing system according to claim 1, characterized in that The processor is connected with the gluing assembly and is used for adjusting the gluing position of the gluing assembly. The wallboard frame gluing system comprises a conveying assembly and a first positioning assembly.

3. The gluing system according to claim 2, characterized in that The conveying assembly is arranged in the containing space.

4. The gluing system according to claim 3, characterized in that The wallboard frame is conveyed to the gluing area of the containing space through the conveying assembly. The first positioning assembly is arranged on the conveying assembly and is used for positioning the wallboard frame in the conveying process so that the wallboard frame stays in the gluing area.

5. The gluing system according to claim 2, wherein The first positioning assembly comprises at least one telescopic module. The processor is connected with the first positioning assembly.

6. The gluing system according to claim 1, wherein When the wallboard frame is conveyed to the gluing area by the conveying assembly, the processor controls the telescopic module to extend so as to protrude from the surface of the conveying assembly close to the wallboard frame.

7. The gluing system according to claim 6, characterized in that The telescopic module is used for positioning the wallboard frame conveyed to the gluing area.

8. The gluing system according to claim 6, wherein The conveying assembly comprises at least one conveying section corresponding to the gluing area. The first positioning assembly is arranged on one side of the conveying section. The first positioning assembly comprises a plurality of telescopic modules. The telescopic modules are arranged in sequence along the direction perpendicular to the conveying direction of the conveying assembly. The wallboard frame gluing system further comprises a second positioning assembly and a third positioning assembly. The second positioning assembly and the third positioning assembly are arranged at the gluing area and are spaced apart from the conveying assembly. The second positioning assembly and the third positioning assembly are arranged on opposite sides of the conveying assembly. The extension directions of the second positioning assembly and the third positioning assembly are parallel to the conveying direction of the conveying assembly. The second positioning assembly and the third positioning assembly are connected with the processor. After the wallboard frame is positioned by the first positioning assembly, the processor controls the second positioning assembly and the third positioning assembly to move towards each other so as to position the wallboard frame. The wallboard frame gluing system further comprises a feeding assembly. The feeding assembly is spaced apart from the gluing assembly and is connected with the processor and the gluing assembly. The processor is used for controlling the feeding assembly to provide glue to the gluing assembly. The feeding assembly comprises a storage tank and a piston module. The piston module is arranged in the storage tank corresponding to the storage tank and is connected with the processor. The storage tank is used for storing the glue. The processor is used for adjusting the advancing speed of the piston module in the storage tank so as to change the glue output of the feeding assembly. The gluing assembly comprises a dispensing valve. The dispensing valve is connected with the feeding assembly and the processor. The processor is used for controlling the dispensing valve to glue the wallboard frame.

9. The gluing system according to claim 1, wherein The gluing system further comprises a first guide rail, a second guide rail and a lifting assembly, the first guide rail is arranged on the truss, the second guide rail is arranged on the first guide rail, and the second guide rail is arranged in sliding connection with the first guide rail; the lifting assembly is arranged on the second guide rail, and the lifting assembly is arranged in sliding connection with the second guide rail; The gluing assembly is arranged on the lifting assembly and arranged in sliding connection with the lifting assembly; The processor is configured to control the gluing assembly to move towards the wallboard frame along a first direction to glue the position of the wallboard frame that needs to be glued, and the first direction is perpendicular to the extension direction of the first guide rail and the extension direction of the second guide rail.

10. The gluing system according to claim 1, characterized in that The gluing system further comprises an input assembly connected with the processor, and the input assembly is configured to input product information of the wallboard frame to obtain position information of the position of the wallboard frame that needs to be glued; The processor is configured to adjust the gluing position of the gluing assembly based on the position information.

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