Slurry spreading disc for coating super-flat end electrode and dip coating end sealing device
By designing a rough surface on the slurry spreading tray to store and restrict slurry flow, combined with a dipping and sealing device, the problems of end-waist consistency and end-top flatness in MLCC production were solved, thus improving the sealing quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-03-06
AI Technical Summary
In current MLCC production, printing end-sealing methods result in poor consistency of end-waist dimensions, while dip coating end-sealing methods result in poor flatness of the end-top.
Design a slurry spreading tray for coating ultra-flat end electrodes. The surface of the slurry spreading tray is roughened to store slurry and restrict its flow. Combined with a dipping and sealing device, the chip is fixed by a suction cup and the end electrode is formed by the concave and convex parts of the slurry spreading tray.
It improves the consistency of the end waist and the flatness of the end tip of the terminal electrode, thus improving the end-sealing quality.
Smart Images
Figure CN223970313U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic components technology, specifically to a slurry spreading tray for coating ultra-flat electrodes and a dipping and sealing device. Background Technology
[0002] With the advent of the Internet of Things era, products from industries such as automobiles, mobile phones, and home appliances are playing an increasingly important role in people's lives. Multilayer ceramic capacitors (MLCCs) are one of the most important electronic components in the electronics and information industry.
[0003] Existing MLCCs (see) Figure 1 In the production technology, the main purpose of the end-capping process is to process a layer of end electrode paste (referred to as paste 2) at each end of the semi-finished chip (referred to as chip 5), so that the internal electrode 501 of chip 5 is led out from the ceramic body 502 of chip 5, forming a parallel structure of multiple capacitor plates. The structure of chip 5 is as follows: Figure 1 and Figure 2 As shown. The main processing methods for end sealing include printing (see...). Figure 3 ) and dipping (see Figure 4 There are two types, and the principle is explained below using the single-sided sealing process of chip 5.
[0004] I. Printed end sealing uses screen printing technology to print paste 2 onto the end of chip 5. The characteristic of this technology is that it can process the top of the terminal electrode (referred to as the terminal top 801) to be particularly flat. The principle of printed end sealing is as follows:
[0005] Step 1: Spreading the slurry (see...) Figure 3 -a); There is a certain distance between the lower surface of the screen 7 and the upper surface of the chip 5. After the paste 2 is spread on the upper surface of the screen 7, the printing squeegee 6 descends and moves from right to left.
[0006] Step 2, Scratching (see...) Figure 3 -b); The scraper 6 moves to the position of the chip 5. Due to the scraping force of the scraper 6, the paste 2 passes through the screen 7 and contacts the upper surface of the chip 5.
[0007] Step 3: Offline (see...) Figure 3 -c); The squeegee 6 continues to move to the left to squeegee, and the screen 7 on the right side of the squeegee 6 detaches from the chip 5 at the same time. The paste 2 adheres to the surface of the chip 5 until the upper surface of the chip 5 is sealed.
[0008] Step 4: Leveling (see...) Figure 3 -d); The paste 2 printed onto the chip 5 has a certain fluidity. The paste 2 can flow within a certain time, making the surface of the paste 2 smooth.
[0009] II. The coating and sealing method involves fixing the chip 5 to the suction cup 3 via the carrier plate 4, and then immersing the chip 5 into the slurry 2 to form the terminal electrode 8 (see...). Figure 2 The processing method of this technology is characterized by good dimensional consistency of the end electrode waist (referred to as end waist 802).
[0010] Step 1: Spreading the slurry (see...) Figure 4 -a); The slurry 2 is spread evenly on the upper surface of the slurry spreading tray 1, and there is a certain distance between the lower surface of the chip 5 and the upper surface of the slurry 2;
[0011] Step 2, Impregnation (see...) Figure 4 -b); The chip 5 gradually descends and is immersed in the slurry 2. When it descends to the lowest position, there is a certain distance between the lower surface of the chip 5 and the slurry spreading plate 1.
[0012] Step 3, pull back (see...) Figure 4 -c); Chip 5 is gradually pulled up and completely detached from paste 2, with paste 2 adhering to the lower surface of chip 5;
[0013] Step 4: Leveling (see...) Figure 4 -d); The paste 2 on chip 5 has a certain fluidity. The paste 2 can flow within a certain time, so that the surface of the paste 2 gradually becomes smooth.
[0014] However, the current screen printing end-sealing method suffers from the directional nature of the squeegee 6's scraping action (see...). Figure 5 This results in the edge 802 of the chip's facing side 503 being larger than that of the back side 504. Combined with gravity, this leads to poor dimensional consistency in the edge 802. Furthermore, the dipping coating sealing method results in differences in the flow direction of the paste 2 between the edge and central areas of the chip 5 during pull-back, as well as the different contact times between the paste 2 and the product (chip 5) (see...). Figure 6 The thickness of the paste 2 at the edge of chip 5 is relatively thin, while the thickness of the paste 2 in the central area is relatively thick, resulting in poor flatness of the top 801. Summary of the Invention
[0015] Therefore, this application provides a slurry spreading tray and a dipping and sealing device for coating ultra-flat electrodes, to solve the problems of poor consistency of end waist size or poor flatness of end top in the existing chip end electrode sealing process.
[0016] To achieve the above objectives, this application provides the following technical solution:
[0017] In a first aspect, a slurry spreading tray for coating ultra-flat end electrodes includes a tray body, one side of which is a slurry spreading surface, and the upper part of the slurry spreading surface is provided with a rough surface, the rough surface including a plurality of alternating protrusions and a plurality of recesses, the recesses being used to store end electrode slurry.
[0018] Optionally, the cross-section of the rough surface is triangular, circular, rectangular, or trapezoidal.
[0019] Optionally, the processing parameters of the roughened surface are determined based on the characteristics of the terminal electrode paste and the thickness of the chip end cap.
[0020] Optionally, the cross-section of the rough surface is triangular, the roughening is continuous and without intervals, the roughening is intersecting and the intersecting angle is 90°, and the protrusion of the rough surface is a square pyramid; let n be the number of openings in the recessed part per unit size, and for each opening position, L is the opening size, θ is the opening angle, and H is the opening depth; when the number of openings n is larger, the opening size L is smaller, and the viscosity of the end electrode paste used is reduced; when the number of openings n is constant, the opening size L is a constant value, the opening angle θ is larger, the opening depth H is smaller, and the end electrode paste is easier to fill into the opening; the paste thickness during the end sealing process is h, and during the immersion process, the bottom of the chip contacts the top of the rough surface, the size of the end waist is greater than h, and the thickness of the end top paste of the chip is (2 / 3)H.
[0021] Optionally, the disk body is made of metal, inorganic, or organic materials.
[0022] Optionally, the arrangement angle of the holes, grooves, and lines in the roughening process of the rough surface is 30°, 60°, or 90°.
[0023] Optionally, the angle between the arrangement direction of the holes, grooves, and lines in the roughening process and the slurry spreading direction is 0°, 30°, 60°, or 90°.
[0024] Optionally, the opening depth of the recess is 1.5 times the target thickness of the slurry at the top of the chip, and the opening angle is 90° to 120°.
[0025] Secondly, a coating and sealing device includes: a suction cup, a carrier plate, and a slurry spreading tray. The carrier plate is disposed on the bottom surface of the suction cup. The carrier plate is used to fix the chip. The slurry spreading tray is used to store the end electrode slurry. The slurry spreading tray is the slurry spreading tray for coating ultra-flat end electrodes described above.
[0026] Compared with the prior art, this application has at least the following beneficial effects:
[0027] Based on further analysis and research of existing technical problems, this application provides a slurry spreading tray and a dipping coating and sealing device for coating ultra-flat end electrodes. By processing a rough surface on one side of the slurry spreading surface of the tray, the recessed part of the rough surface can store slurry, where the slurry adheres to the chip surface to form the end electrode. The protrusion of the rough surface can block the large-scale flow of slurry, greatly reducing the phenomenon of unevenness at the end. Moreover, since the dipping coating and sealing method is still used, the end waist consistency is also very good. The structure of this slurry spreading tray is simple and easy to use, and the quality of the end electrode formed by this slurry spreading tray is greatly improved. Attached Figure Description
[0028] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).
[0029] Figure 1 A schematic diagram of the cross-sectional structure of an MLCC provided for existing technology;
[0030] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure at the mid-terminal electrode;
[0031] Figure 3 A schematic diagram of the printing end-sealing principle provided for existing technology;
[0032] Figure 4 A schematic diagram illustrating the principle of dip-coating end sealing in existing technology;
[0033] Figure 5 for Figure 3 Schematic diagram of printing directionality in China;
[0034] Figure 6 for Figure 4 Schematic diagram of the flow direction of the intermediate dipping coating slurry;
[0035] 1. Spreading tray; 2. Spreading material; 3. Suction cup; 4. Carrier plate; 5. Chip; 501. Internal electrode; 502. Ceramic body; 503. Front side; 504. Back side; 6. Squeegee; 7. Screen; 8. End electrode; 801. End top; 802. End waist.
[0036] Figure 7 A schematic diagram of the structure of a slurry spreading disc for coating ultra-flat electrodes according to an embodiment of this application;
[0037] Figure 8 for Figure 7 A schematic diagram illustrating the usage instructions for the intermediate slurry tray.
[0038] Explanation of reference numerals in the attached figures:
[0039] 1. Disc body; 2. Rough surface; 201. Recessed part; 202. Protruding part;
[0040] 3. Suction cup; 4. Carrier board; 5. Chip; 6. Paste. Detailed Implementation
[0041] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0042] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," "third," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "comprising," "including," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).
[0043] The terms used in this application, such as "upper," "lower," "left," "right," and "middle," are generally used to indicate the general relative positional relationship for the purpose of intuitive understanding by referring to the accompanying drawings, and are not absolute limitations on the positional relationship in the actual product.
[0044] One embodiment of this application provides a slurry spreading tray for coating ultra-flat electrodes, such as... Figure 7 and Figure 8 As shown, the slurry spreading tray includes a tray body 1, one side of which is a slurry spreading surface. A rough surface 2 is provided on the upper part of the slurry spreading surface. The rough surface 2 includes multiple alternating protrusions 202 and multiple recesses 201. The recesses 201 are used to store the end electrode slurry 6.
[0045] By designing the slurry spreading surface of the slurry spreading plate as a rough surface 2, the flowability of the slurry 6 is restricted, thereby improving the flatness of the end cap of the chip 5.
[0046] Preferably, the cross-section of the rough surface 2 is not limited to triangle, circle, rectangle, or trapezoid.
[0047] Preferably, the material of the disc body 1 is not limited to metal, inorganic, or organic materials.
[0048] Preferably, the arrangement angle of the holes, grooves, and lines roughened on the rough surface 2 is 30°, 60°, or 90°, etc.
[0049] Preferably, the angle between the arrangement direction of the holes, grooves, and lines in the roughened surface 2 and the slurry spreading direction is 0°, 30°, 60°, or 90°, etc.
[0050] In addition, the processing parameters of the rough surface 2 of the slurry spreading plate need to be adjusted according to the characteristics of the end electrode slurry 6 and the thickness requirements of the top sealing end of the chip 5. The adjustment parameters include, but are not limited to, the opening size, opening depth, opening angle, opening array method, and opening ratio (the proportion of openings per unit area) of the recess 201.
[0051] Preferably, the opening depth of the recess 201 is approximately 1.5 times the target thickness of the slurry at the top of the chip, and the optimal opening angle is 90° to 120°.
[0052] This application also provides a coating and sealing device, including: a suction cup 3, a carrier plate 4 and a slurry spreading tray. The bottom surface of the suction cup 3 is provided with the carrier plate 4, which is used to fix the chip 5. The slurry spreading tray is used to store the end electrode slurry 6, and the slurry spreading tray is the slurry spreading tray for coating ultra-flat end electrodes as described above.
[0053] like Figure 8 As shown, the usage instructions for the above embodiments are as follows:
[0054] Step 1: Spreading the slurry (see...) Figure 8 -a) Spread the slurry 6 evenly onto the rough surface 2 of the upper surface of the slurry spreading tray 1. The thickness of the slurry is thinner than that of the ordinary dipping method.
[0055] Step 2, Impregnation (see...) Figure 8 -b); The chip 5 is fixed to the suction cup 3 by the carrier plate 4, and then the chip 5 is gradually lowered and immersed in the slurry 6. When it is lowered to the lowest position, the lower surface of the chip 5 can be in close contact with the rough surface 2 of the slurry spreading plate.
[0056] Step 3, pull back (see...) Figure 8 -c); Then gradually pull up the chip 5, the paste 6 in the recessed part 201 of the paste spreading plate adheres to the surface of the product (chip 5), and the protrusion 202 of the paste spreading plate restricts the flow of the paste 6.
[0057] Step 4: Leveling (see...) Figure 8 -d); The paste 6 on chip 5 has a certain fluidity. The paste 6 can flow within a certain time, so that the surface of the paste 6 gradually becomes smooth. At this point, the single-sided sealing process of chip 5 is completed.
[0058] An example of this application:
[0059] When the cross section of the rough surface is triangular, the roughening is continuous without intervals, and the cross roughening is intersecting with an angle of 90°, the protruding part of the rough surface should be a square pyramid, with n openings per unit size. For each opening, L is the opening size, θ is the opening angle, and H is the opening depth. The larger the number of openings n, the smaller the opening size L, and the viscosity of the end electrode paste should be appropriately reduced to facilitate the paste filling into the opening. When the number of openings n is constant, the opening size L is also a constant value. The larger the opening angle θ, the smaller the opening depth H, and the easier it is for the end electrode paste to fill into the opening. During the end-sealing process, the paste thickness is h, and during immersion, the bottom of the chip contacts the top of the rough surface. In theory, the size of the end waist is slightly larger than h, and the paste thickness at the top of the chip end is approximately (2 / 3)H.
[0060] The paste spreading tray provided in this application is a roughened paste spreading tray that uses a dip-coating end-sealing method. Unlike conventional smooth paste spreading trays, it combines the advantages of printing and dip-coating methods. By using methods such as polishing, sandblasting, embossing, milling, and chemical etching, a rough surface is processed on the paste spreading side surface of the paste spreading tray. The recessed part of this rough surface can store paste, and the paste adheres to the chip surface to form the end electrode. The protrusion of this rough surface can block the large-scale flow of paste, greatly reducing the phenomenon of unevenness at the end. Moreover, since the dip-coating end-sealing method is still used, the end waist consistency is also very good.
[0061] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.
Claims
1. A spreader plate for coating a superflat end electrode, characterized in that The rough surface includes a plurality of convex parts and a plurality of concave parts which are alternately arranged, and the concave parts are used for storing the electrode paste.
2. The spreading disc for coating super-flat end electrodes according to claim 1, characterized in that The cross section of the rough surface is triangular or circular or rectangular or trapezoidal.
3. The spreading disc for coating super-flat end electrodes according to claim 1, characterized in that The processing parameters of the rough surface are determined according to the characteristics of the electrode paste and the thickness of the top end of the chip.
4. The spreading disc for coating super-flat end electrodes according to claim 3, characterized in that The cross section of the rough surface is triangular, the rough surface is continuously roughened without interval, the cross-roughening is arranged at an angle of 90°, and the convex part of the rough surface is a quadrangular pyramid. Note: the number of openings of the concave part in a unit size is n, L is the opening size, θ is the opening angle, and H is the opening depth; when the opening number n is larger, the opening size L is smaller, and the viscosity of the electrode paste used is reduced; when the opening number n is constant, the opening size L is a constant value, the opening angle θ is larger, and the opening depth H is smaller, so that the electrode paste is more easily filled into the opening; the thickness of the paste during the end sealing process is h, and the bottom of the chip is in contact with the top of the rough surface during the paste immersion, the size of the end waist is larger than h, and the thickness of the paste at the top end of the chip is (2 / 3)H.
5. The spreading disc for coating super-flat end electrodes according to claim 1, characterized in that The material of the disc body is metal material or inorganic material or organic material.
6. The spreading disc for coating super-flat end electrodes according to claim 1, characterized in that The arrangement angle of the holes, grooves and lines of the roughening processing of the rough surface is 30° or 60° or 90°.
7. The spreading platter for coating ultraplanar tip electrodes of claim 1, wherein, The arrangement angle of the holes, grooves and lines of the roughening processing of the rough surface is 30° or 60° or 90°.
8. The spreading platter for coating super-smooth tip electrodes of claim 1, wherein, The opening depth of the concave part is 1.5 times the target thickness of the paste at the top end of the chip, and the opening angle is 90° to 120°.
9. A dip-capping device comprising: The suction disc, the carrier plate and the paste disc, the bottom surface of the suction disc is provided with the carrier plate, the carrier plate is used for fixing the chip, and the paste disc is used for storing the electrode paste; characterized in that the paste disc adopts the paste disc for coating super-flat electrode according to claim 1.