Pumping source patch welding equipment

Abstract

The utility model provides a pumping source patch welding device. The pumping source patch welding device comprises a machine table; the first feeding assembly is used for transferring the soldering lug to the pumping source; the second feeding assembly is used for transferring the chip to the pumping source; the welding assembly comprises a carrier table and a sealing cover part, the carrier table and the sealing cover part can move in a staggered mode, a heating groove is formed in the carrier table, the carrier table comprises a heating plate, the pumping source is assembled in the heating groove, the heating plate is used for conducting heat exchange with the pumping source located in the heating groove, and the sealing cover part is used for sealing the heating groove so that a closed space can be formed. The heating groove is provided with an exhaust port which is used for exhausting oxygen in the heating groove. According to the utility model, the pumping source is assembled on the welding assembly, the feeding assembly directly feeds the soldering lug and the chip to the pumping source on the welding assembly, and the welding of the chip on the pumping source can be completed at the welding assembly after the feeding is completed, so that the production efficiency is improved, the manual participation degree is reduced, and the yield of products is ensured.

Description

Technical Field

[0001] This utility model relates to the field of pump source welding technology, and in particular to a pump source patch welding device. Background Technology

[0002] Currently, the pump source placement machine and sintering process are handled by two separate machines. After the placement machine places the solder pads and chips, manual transfer is required. This transfer process can cause chip movement, necessitating an additional manual inspection step. Chips that are misaligned are manually corrected. Subsequently, the pump source is manually placed into the sintering furnace, severely impacting production efficiency. Furthermore, manual operation introduces significant uncertainties, making it impossible to guarantee product yield. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a pump source patch welding equipment that can guarantee the welding quality of pump source patches.

[0004] The embodiments of this utility model are achieved through the following technical solutions:

[0005] A pump source surface mount bonding (SMT) device includes: a machine base; a first loading assembly disposed on the machine base for transferring solder pads to a pump source; a second loading assembly disposed on the machine base for transferring chips to a pump source; and a bonding assembly disposed on the machine base, including a carrier platform and a sealing portion, wherein the carrier platform and the sealing portion are capable of offset movement. A heating tank is disposed on the carrier platform, and the carrier platform includes a heating plate. The pump source is assembled within the heating tank, and the heating plate exchanges heat with the pump source within the heating tank. The sealing portion seals the heating tank to form a closed space. The heating tank is equipped with an exhaust port for discharging oxygen from the heating tank. The pump source is mounted on the bonding assembly. The loading assembly directly loads the solder pads and chips onto the pump source on the bonding assembly. After loading, the chip bonding onto the pump source can be completed at the bonding assembly. This overcomes the defect of traditional processes requiring manual transfer of the pump source, which can cause chip misalignment, improves production efficiency, reduces manual intervention, and ensures product yield.

[0006] According to a preferred embodiment, the carrier platform further includes a fixture plate disposed on the heating plate, the fixture plate having a through-hole, and the area defined by the wall of the mounting hole and one side of the heating plate facing the fixture plate together forms the heating groove.

[0007] According to a preferred embodiment, the platform further includes a fixture plate, the heating groove is disposed on the fixture plate, and the bottom outer side of the heating groove is attached to the heating plate.

[0008] According to a preferred embodiment, the heating plate is provided with cooling channels for the flow of cooling medium.

[0009] According to a preferred embodiment, the heating plate has a plurality of flow channel grooves on one side away from the fixture plate, and the heating plate is provided with inlet holes and outlet holes, both of which are connected to the flow channel grooves; the carrier platform also includes a lower cover plate, which is assembled to the heating plate to close the flow channel grooves, and the groove wall of the flow channel groove, the hole wall of the inlet hole, the hole wall of the outlet hole, and the lower cover plate together constitute the cooling flow channel.

[0010] According to a preferred embodiment, the axial cross-sectional area of ​​the inflow hole is smaller than the axial cross-sectional area of ​​the flow channel groove.

[0011] According to a preferred embodiment, a turbulence groove is provided on the side of the lower cover plate facing the heating plate, and the turbulence groove is used to connect two or more adjacent flow channels.

[0012] According to a preferred embodiment, the sealing portion includes an upper cover plate, on which a pressure block is mounted. The upper cover plate is longitudinally movable toward or away from the carrier platform, such that the pressure block abuts against or detaches from the chip. The upper cover plate is used to seal the heating groove.

[0013] According to a preferred embodiment, the upper cover plate includes a body and a guide plate connected to each other. The side of the body facing the platform is provided with an insert groove, and a first clearance hole is provided through the bottom of the insert groove. The guide plate is assembled in the insert groove. A guide hole is provided through the guide plate. The pressure block includes a limiting section, a guide section and a pressure head connected in sequence. The guide section passes through the guide hole, and the limiting section is used to limit the guide section to prevent it from disengaging from the guide hole longitudinally downward.

[0014] According to a preferred embodiment, a material handling notch is provided on the side wall of the heating tank. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A three-dimensional structural schematic diagram of the pump source patch welding equipment provided in this embodiment of the utility model;

[0017] Figure 2A first three-dimensional structural schematic diagram of the carrier platform is provided for the embodiments of this utility model;

[0018] Figure 3 A second three-dimensional structural schematic diagram of the carrier platform is provided for embodiments of this utility model;

[0019] Figure 4 This invention provides a three-dimensional structural diagram of the vehicle platform after the first linear module has been removed, for an embodiment of the present invention.

[0020] Figure 5 for Figure 4 Explosion-proof diagram of the structure;

[0021] Figure 6 A three-dimensional structural diagram of the heating plate provided in an embodiment of this utility model;

[0022] Figure 7 This is a schematic diagram of the structure of the cap assembly on the machine base provided in an embodiment of the present utility model;

[0023] Figure 8 This is an exploded structural diagram of the sealing portion provided in an embodiment of the present utility model;

[0024] Figure 9 A first exploded view of the assembly structure of the upper cover plate and the pressure block provided in this embodiment of the utility model;

[0025] Figure 10 for Figure 9 A partially enlarged schematic diagram of the structure at point A;

[0026] Figure 11 A second exploded view of the assembly structure of the upper cover plate and the pressure block provided in this embodiment of the utility model;

[0027] Figure 12 A three-dimensional structural diagram of the sealing portion provided in an embodiment of this utility model;

[0028] Figure 13 A three-dimensional structural diagram of the first gripping mechanism provided in an embodiment of this utility model.

[0029] Icons: 1. Machine base; 2. First feeding assembly; 21. First vision unit; 22. First gripping mechanism; 221. First mounting plate; 222. Second mounting plate; 2221. First adjusting block; 2222. Second adjusting block; 223. Balance spring; 224. Adjusting screw; 225. Third driving component; 226. Third mounting plate; 227. Fourth driving component; 2271. Fourth mounting plate; 2272. Negative pressure suction head; 228. Buffer spring; 23. First storage bin; 24. Second vision unit; 25. First moving plate; 26. Second moving plate; 3. Second feeding assembly; 31. Second storage bin; 32. Third vision unit; 33. Second gripping mechanism; 34. Fourth vision unit; 4. Welding assembly; 41. Carrier platform; 410. First linear module; 411. Pallet; 4111. First plate; 4112. Second plate; 4113. Heat insulation column; 412. Fixture plate; 4120. Heating tank ; 4121, Assembly hole; 41210, Material intake notch; 413, Heating plate; 4130, Baffle column; 4131, Flow channel groove; 4132, Inlet hole; 4133, Outlet hole; 414, Lower cover plate; 4140, Baffle groove; 415, Vortex tube; 416, Heat insulation plate; 42, Sealing part; 421, Sealing plate; 422, Upper cover plate; 4220, First clearance hole; 4221, Insert groove; 4222, Sealing ring groove; 4223. Guide plate; 42231, guide hole; 4224, body; 423, pressure block; 4231, limiting section; 4232, guide section; 4233, pressure head; 424, adjusting plate; 4241, second clearance hole; 4242, extension head; 425, frame plate; 426, longitudinal plate; 4261, first driving component; 4262, third clearance hole; 43, transmission screw; 5, support beam; a, pump source; X, first direction; Y, second direction; Z, longitudinal direction. Detailed Implementation

[0030] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0031] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0033] Please refer to Figures 1 to 13 A pump source patch welding device includes a machine base 1, a first feeding component 2, a second feeding component 3 and a welding component 4, wherein the first feeding component 2, the second feeding component 3 and the welding component 4 are all disposed on the machine base 1. The first loading assembly 2 is used to transfer the solder sheet to the pump source a; the second loading assembly 3 is used to transfer the chip to the pump source a; the welding assembly 4 includes a carrier platform 41 and a cover part 42, the carrier platform 41 and the cover part 42 can move in a staggered manner, the carrier platform 41 is equipped with a heating tank 4120, the carrier platform 41 includes a heating plate 413, the pump source a is assembled in the heating tank 4120, the heating plate 413 is used to exchange heat with the pump source a in the heating tank 4120, the cover part 42 is used to cover the heating tank 4120 to form a closed space, the heating tank 4120 is equipped with an air inlet and an exhaust port, the air inlet is used to introduce nitrogen or inert gas into the heating tank 4120, preferably nitrogen, and the exhaust port is used to discharge oxygen in the heating tank 4120. In this embodiment, the pump source a is mounted on the welding assembly 4. The feeding assembly directly feeds the solder pads and chips onto the pump source a on the welding assembly 4. After feeding is completed, the chip can be welded onto the pump source a at the welding assembly 4. This overcomes the defect of chip displacement caused by manual transfer of the pump source a in the traditional process, improves production efficiency, reduces manual intervention, and ensures product yield.

[0034] Specifically, during soldering, the heating plate 413 serves as a heat source, transferring heat to the pump source a to melt the solder pads, thereby soldering the chip to the pump source a. During the soldering process, the heating tank 4120 is a closed space, and inert gas, mainly oxygen, is filled into the heating tank 4120 to expel the air inside, thus preventing excessive oxidation at the solder joint between the chip and the solder pads during the soldering process.

[0035] like Figures 2 to 5 As shown, the carrier platform 41 includes a heating plate 413 and a fixture plate 412 disposed on the heating plate 413. A mounting hole 4121 is provided through the fixture plate 412. The area defined by the wall of the mounting hole 4121 and the side of the heating plate 413 facing the fixture plate 412 forms a heating groove 4120. In this embodiment, the carrier platform 41 is attached to the heating plate 413 and can be detachably assembled using bolts or screws. The pump source a, mounted in the heating groove 4120, directly contacts the heating plate 413 and is heated by it. When it is necessary to replace a different model of pump source a, only the different fixture plates 412 need to be replaced.

[0036] In another embodiment, the platform 41 includes a heating plate 413 and a fixture plate 412, with a heating groove 4120 disposed on the fixture plate 412. The outer bottom surface of the heating groove 4120 is attached to the heating plate 413. In this embodiment, the thickness of the bottom of the heating groove 4120 is as thin as possible while ensuring structural integrity, so as to quickly transfer the heat from the heating plate 413 to the pump source a. The thickness of the bottom of the heating groove 4120 refers to the distance between the outer bottom surface and the inner bottom surface of the heating groove 4120.

[0037] like Figure 4 and Figure 5 As shown, a material handling notch 41210 is provided on the side wall of the heating tank 4120. This facilitates the placement and removal of the pump source a within the heating tank 4120.

[0038] like Figures 4 to 6 As shown, the heating plate 413 is equipped with cooling channels for the flow of cooling medium. This cooling medium is used to rapidly cool the pump source a and the heating plate 413 after welding.

[0039] like Figure 3 As shown, the platform 41 also includes a vortex tube 415, which is connected to a cooling channel for supplying cooling medium into the channel. The vortex tube 415 can supply low-temperature gas into the cooling channel to quickly remove heat from the heating plate 413 and the pump source a. In this case, the cooling medium is gas.

[0040] Of course, in another embodiment, a liquid pump can also be used to pump cooling liquid to the cooling channel to remove heat from the heating plate 413 and the pump source a.

[0041] Specifically, such as Figure 5 and Figure 6 As shown, the heating plate 413 has multiple flow channel grooves 4131 on its side away from the fixture plate 412. The heating plate 413 is equipped with inlet holes 4132 and outlet holes 4133, both of which are connected to the flow channel grooves 4131. The carrier platform 41 also includes a lower cover plate 414, which is fitted onto the heating plate 413 to seal the flow channel grooves 4131. The groove walls of the flow channel grooves 4131, the walls of the inlet holes 4132 and the outlet holes 4133, and the lower cover plate 414 together constitute a cooling flow channel. In this embodiment, preferably, the flow channel grooves 4131 extend along the first direction X, and the multiple flow channel grooves 4131 are spaced apart along the second direction Y. This allows for uniform cooling of all parts of the heating plate 413. In this embodiment, the first direction X and the second direction Y are perpendicular, and both the first direction X and the second direction Y are parallel to the heating plate 413.

[0042] Furthermore, the axial cross-sectional area of ​​the inlet hole 4132 is smaller than the axial cross-sectional area of ​​the flow channel 4131. Thus, the flow velocity of the cooling medium decreases after entering the flow channel 4131 through the inlet hole 4132, allowing the cooling medium to fully contact the heating plate 413 and exchange heat.

[0043] In some embodiments, a turbulence column 4130 is disposed within the flow channel 4131. The turbulence column 4130 can turbulent the cooling medium within the flow channel 4131, so that the cooling medium within the flow channel 4131 can fully and uniformly exchange heat with the heating plate 413, thereby improving the utilization rate and heat exchange efficiency of the cooling medium.

[0044] Optionally, the lower cover plate 414 is detachably mounted to the heating plate 413 by bolts or screws. In this embodiment, the bolts or screws are threaded onto the baffle column 4130. Alternatively, bolts or screws used to connect the fixture plate 412 and the heating plate 413 can also be connected to the baffle column 4130.

[0045] like Figure 5 As shown, a turbulence groove 4140 is provided on the side of the lower cover plate 414 facing the heating plate 413. The turbulence groove 4140 is used to connect two or more adjacent flow channels 4131. Under the action of the turbulence groove 4140, two or more adjacent flow channels 4131 are connected, thereby enabling the cooling medium in different flow channels 4131 to be fully mixed, further improving the utilization rate of the cooling medium and the heat exchange efficiency.

[0046] like Figures 1 to 5 As shown, the carrier platform 41 also includes a pallet 411, and a lower cover plate 414 is assembled to the pallet 411 via a heat insulation plate 416. The pallet 411 is adjustablely assembled to the machine base 1 via a first linear module 410. Figure 1 As shown, the first linear module 410 drives the tray 411 to move along the second direction Y to adjust the spatial position between the pump source a and the cover part 42, so that the solder pads and chips on the pump source a and subsequent soldering can be carried out on the same machine 1.

[0047] like Figure 4 and Figure 5As shown, the support plate 411 includes a first plate 4111, a second plate 4112, and a heat insulation column 4113. The first plate 4111 is assembled to and driven by the first linear module 410, and the second plate 4112 is assembled to the heat insulation plate 416. The first plate 4111 and the second plate 4112 are connected by the heat insulation column 4113. This arrangement reduces the contact area between the first plate 4111 and the second plate 4112. Based on the heat insulation plate 416, it further reduces the amount of heat generated by the heating plate 413 transferred to the first plate 4111, thereby avoiding affecting the performance of the first linear module 410. At the same time, during the heating and welding process of the pump source a, heat loss can be reduced, and the heat generated by the heating plate 413 can be fully utilized.

[0048] like Figure 1 , Figures 7 to 12 As shown, the sealing portion 42 includes an upper cover plate 422, on which a pressure block 423 is mounted. The upper cover plate 422 can move closer to or further away from the carrier stage 41 along the longitudinal direction Z, so that the pressure block 423 abuts against or detaches from the chip. The upper cover plate 422 is used to seal the heating groove 4120. In this embodiment, the upper cover plate 422 seals the heating groove 4120 to form a closed space, which facilitates maintaining a low-oxygen environment during the welding process of the pump source a; the pressure block 423 abuts against the chip to ensure that the chip position is stable and does not shift during the hot melting of the solder pad.

[0049] Optionally, the upper cover plate 422 includes a body 4224 and a guide plate 4223 connected to each other. The body 4224 has an insert groove 4221 on one side facing the platform 41. A first clearance hole 4220 is provided through the bottom of the insert groove 4221. The guide plate 4223 is fitted into the insert groove 4221. A guide hole 42231 is provided through the guide plate 4223. The pressure block 423 includes a limiting section 4231, a guide section 4232, and a pressure head 4233 connected in sequence. The guide section 4232 passes through the guide hole 42231. The limiting section 4231 is used to limit the guide section 4232 to prevent it from disengaging from the guide hole 42231 longitudinally downwards along the Z-axis. Figure 9 , Figure 10 and Figure 11As shown, in use, the side of the body 4224 facing the platform 41 is fitted to the upper side of the jig plate 412 to cover the heating groove 4120. Specifically, the side of the body 4224 facing the platform 41 has a sealing ring groove 4222 along the mounting groove 4221 for mounting a sealing strip. The guide plate 4223 is detachably connected to the body 4224 by bolts or screws. The first clearance hole 4220 is used to avoid the pressure block 423, preventing interference between the body 4224 and the pressure block 423. During use, the pressure block 423, under the action of gravity, causes the limiting section 4231 to overlap the upper side of the guide plate 4223. When the body 4224 abuts against the fixture plate 412 to form a cover for the heating tank 4120, the pressure block 423, specifically the pressure head 4233, abuts against the chip. Under the reaction action of the chip, the guide section 4232 moves a certain distance longitudinally Z upward in the guide hole 42231, causing the limiting section 4231 to detach from the upper side of the guide plate 4223. The chip is then pressed tightly by the weight of the pressure block 423.

[0050] Furthermore, in order to improve the sealing performance of the heating tank 4120, a cover plate 421 is provided on the side of the body 4224 away from the guide plate 4223 to block the first clearance hole 4220.

[0051] like Figure 7 , Figure 8 and Figure 12 As shown, the cover portion 42 also includes a longitudinal plate 426 movably disposed on the machine base 1. A frame plate 425 is mounted on the top of the longitudinal plate 426. An adjusting plate 424 is disposed on the side of the frame plate 425 near the machine base 1. An upper cover plate 422 is mounted on the adjusting plate 424. A first driving member 4261 is disposed on the longitudinal plate 426 or the frame plate 425 for driving the adjusting plate 424 to move closer to or away from the carrier platform 41 along the longitudinal direction Z. In this embodiment, a second clearance hole 4241 is provided through the adjusting plate 424, and the upper cover plate 422 is mounted on the adjusting plate 424 and passes through the second clearance hole 4241. A third clearance hole 4262 is provided through the longitudinal plate 426, and an extension head 4242 is provided on the adjusting plate 424. The extension head 4242 passes through the third clearance hole 4262, and the first driving member 4261 acts on the extension head 4242. Optionally, the first driving element 4261 is a lead screw motor, mounted on the longitudinal plate 426, with the lead screw of the motor hinged to the extension head 4242 to drive the adjusting plate 424 to move longitudinally along the Z-axis. In other embodiments, the first driving element 4261 may also be a cylinder or an electric cylinder.

[0052] like Figure 7As shown, the longitudinal plate 426 is slidably mounted on the machine base 1 via a slide rail slider assembly. Specifically, the longitudinal plate 426 can move along the second direction Y to adjust the spatial position between the cover portion 42 and the carrier platform 41. A second driving member is disposed on the machine base 1 for driving the longitudinal plate 426 to move. In some embodiments, the second driving member includes, but is not limited to, a cylinder, a hydraulic cylinder, or an electric actuator. It can also be as follows: Figure 7 The lead screw drive mechanism is shown. Specifically, the transmission lead screw is rotatably mounted on the machine base 1 and extends along the second direction Y. The longitudinal plate 426 is threadedly connected to the transmission lead screw 43. The transmission lead screw 43 is driven by a motor mounted on the machine base 1. The working principle of the lead screw drive mechanism is existing technology and will not be described in detail here.

[0053] like Figure 1 As shown, a support beam 5 is provided on the machine base 1. The support beam 5 is located on one side of the welding assembly 4 in the second direction Y. The support beam 5 extends along the first direction X. The first loading assembly 2 includes a first vision unit 21, a second vision unit 24, a first gripping mechanism 22, and a first storage bin 23. The first vision unit 21, the second vision unit 24, and the first storage bin 23 are located on one side of the welding assembly 4 in the first direction X. The first gripping mechanism 22 is movably mounted on the support beam 5. The first storage bin 23 is used to store welding pieces. The first gripping mechanism 22 is used to transfer the welding pieces in the first storage bin 23 to the pump source a mounted on the welding assembly 4. Specifically, in use, the first vision unit 21 identifies the welding pieces in the first storage bin 23 and guides the first gripping mechanism 22 to grip the welding pieces. During the transfer of the welding pieces to the welding assembly 4, the second vision unit 24 identifies the posture of the welding pieces to guide the first gripping mechanism 22 to adjust the posture of the welding pieces for accurate mounting into the pump source a.

[0054] like Figure 13As shown, the first gripping mechanism 22 includes a first mounting plate 221 disposed on the support beam 5. A second mounting plate 222 is slidably mounted on the first mounting plate 221 via a slide rail slider assembly. A first adjusting block 2221 and a second adjusting block 2222 are disposed on the second mounting plate 222. An adjusting screw 224 is rotatably mounted on the first mounting plate 221 and is threadedly connected to the first adjusting block 2221. A third mounting plate 226 is slidably mounted on the second mounting plate 222 via a cross roller guide. A third driving member 225 is assembled on the second adjusting block 2222 and is used to drive the third mounting plate 226 to move relative to the second mounting plate 222. A balance spring 223 is disposed between the second adjusting block 2222 and the third mounting plate 226. A fourth mounting plate 2271 is slidably mounted on the third mounting plate 226 via a cross roller guide. A buffer spring 228 is provided between the third mounting plate 226 and the fourth mounting plate 2271. The first mounting plate 221, the second mounting plate 222, the third mounting plate 226, and the fourth mounting plate 2271 are parallel and all extend along the longitudinal direction Z. The connection point between the buffer spring 228 and the fourth mounting plate 2271 is higher than the connection point between the buffer spring 228 and the third mounting plate 226. A fourth driving member 227 is mounted on the fourth mounting plate 2271. A negative pressure suction head 2272 is mounted on the fourth driving member 227. The negative pressure suction head 2272 can be driven by the fourth driving member 227 to rotate around the central axis of the negative pressure suction head 2272. The axial direction of the negative pressure suction head 2272 is parallel to the longitudinal direction Z.

[0055] Furthermore, such as Figure 1 As shown, a first movable plate 25 is mounted on the support beam 5 via a slide rail slider assembly, and a second movable plate 26 is mounted on the first movable plate 25 via the slide rail slider assembly. The first movable plate 25 and the second movable plate 26 are driven by a linear module or other means such as a cylinder or an electric cylinder. Specifically, the first movable plate 25 can move relative to the support beam 5 along a first direction X, and the second movable plate 26 can move relative to the first movable plate 25 along a second direction Y.

[0056] When using, such as Figure 1 and Figure 13As shown, the first mounting plate 221 is fixedly mounted on the second movable plate 26 and is driven by the second movable plate 26 to move along the second direction Y. The adjusting screw 224 is used to adjust the position of the second mounting plate 222 in the longitudinal direction Z. The third driving component 225 is a voice coil motor, which is used to drive the third mounting plate 226 to move along the longitudinal direction Z. The balance spring 223 is a magnetic spring, which is used to balance the gravity of the third mounting plate 226 and other structures mounted on the third mounting plate 226. The fourth driving component 227 is a hollow shaft stepper motor. The negative pressure suction head 2272 is inserted into the hollow stepper motor and is driven by it to rotate. The negative pressure suction head 2272 is connected to a negative pressure source (not shown in the figure) and is used to pick up the solder sheet. The buffer spring 228 is used to prevent the negative pressure suction head 2272 from moving excessively upward along the longitudinal direction Z under the reaction force of the solder sheet when it comes into contact with the solder sheet. It works with the fourth mounting plate 2271 and the third mounting plate 226 to achieve flexible contact between the negative pressure suction head 2272 and the solder sheet.

[0057] In this embodiment, as Figure 1 As shown, the second feeding assembly 3 is located on the other side of the welding assembly 4 in the first direction X, opposite to the first feeding assembly 2. The second feeding assembly 3 includes a third vision section 32, a fourth vision section 34, a second storage bin 31, and a second gripping mechanism 33. The second storage bin 31 is used to store chips. The second gripping mechanism 33 and the first gripping mechanism 22 have the same structure and working principle, and will not be described again here. In addition, the assembly structure of the second gripping mechanism 33 on the support beam 5 is the same as the assembly structure of the first gripping mechanism 22 on the support beam 5, and will not be described again here.

[0058] In some embodiments, the first vision unit 21 is integrated with or separate from the first gripping mechanism 22, and the third vision unit 32 is integrated with or separate from the second gripping mechanism 33. Specifically, when the vision unit and the gripping mechanism are separate, the storage bin corresponding to the gripping mechanism is movably mounted on the machine base 1 via a linear module or other existing adjustment mechanism, so that the storage bin and the corresponding first vision unit 21 or third vision unit 32 can move relative to each other to facilitate the identification of solder pads and chips in the storage bin. For example, when the first vision unit 21 is integrated with the first gripping mechanism 22, the first vision unit 21 is mounted on the first mounting plate 221.

[0059] In this embodiment, the first visual unit 21, the second visual unit 24, the third visual unit 32, and the fourth visual unit 34 are cameras.

[0060] This embodiment also provides a method for patch bonding of pump source a, using the aforementioned patch bonding equipment, and includes the following steps:

[0061] S1: Assemble the pump source a into the heating tank 4120;

[0062] S2: The welding sheet is transferred to the pump source a via the first feeding component 2;

[0063] S3: The chip is transferred to the pump source a via the second feeding component 3 and attached to the corresponding solder pad;

[0064] S4: Heat pump source a to heat melt the welding sheet.

[0065] In this way, the chip mounting (solder pad and chip assembly to pump source a) and soldering processes of pump source a can be performed on the same machine 1, reducing the degree of manual intervention in traditional processes and ensuring the chip soldering quality on pump source a. Furthermore, the following steps are included before step S4:

[0066] S40: Seal the heating tank 4120 to form a closed space;

[0067] S41: Drain the oxygen from the heating tank 4120.

[0068] Furthermore, step S41 includes:

[0069] S410: Nitrogen or inert gas is introduced into the heating tank 4120 through the air inlet;

[0070] S411: Exhaust the gas in the heating tank 4120 through the exhaust port;

[0071] S412: Repeat the above steps multiple times until the oxygen content in the heating tank 4120 reaches the standard.

[0072] This effectively reduces the oxygen content in the heating bath 4120 area, preventing excessive oxidation of the welding position during the welding process.

[0073] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A pump source patch welding apparatus, characterized by, The application relates to a welding device for a chip and a pump source. The device comprises a machine table, a first feeding assembly arranged on the machine table and used for transferring the chip to the pump source, a second feeding assembly arranged on the machine table and used for transferring the pump source to the chip, a welding assembly arranged on the machine table and comprising a carrier table and a cover part, the carrier table and the cover part can move in a staggered mode, the carrier table is provided with a heating groove, the pump source is arranged in the heating groove, the heating plate exchanges heat with the pump source arranged in the heating groove, the cover part is used for covering the heating groove so that the heating groove forms a closed space, and the heating groove is provided with an exhaust port used for exhausting oxygen in the heating groove. The carrier table further comprises a jig plate arranged on the heating plate, the jig plate is provided with an assembly hole penetrating through the jig plate, and a region defined by the hole wall of the assembly hole and a side of the heating plate facing the jig plate forms the heating groove. The carrier table further comprises a jig plate, and the heating groove is arranged on the jig plate and is attached to the heating plate at the outer side of the bottom of the heating groove. The heating plate is provided with a cooling flow channel.

2. The pump source patch welding apparatus of claim 1, wherein, The heating plate is provided with a plurality of flow channel grooves on a side of the heating plate away from the jig plate, and the heating plate is provided with an inflow hole and an outflow hole, and the inflow hole and the outflow hole are both communicated to the flow channel grooves.

3. The pump source patch welding apparatus of claim 1, wherein, The carrier table further comprises a lower cover plate, the lower cover plate is arranged on the heating plate to close the flow channel grooves, and the flow channel grooves, the hole wall of the inflow hole, the hole wall of the outflow hole and the lower cover plate jointly form the cooling flow channel.

4. The pump source patch welding apparatus of claim 2 or 3, wherein, The axial cross-sectional area of the inflow hole is smaller than the axial cross-sectional area of the flow channel groove.

5. The pump source patch welding apparatus of claim 4, wherein, A turbulence groove is arranged on a side of the lower cover plate facing the heating plate, and the turbulence groove is used for communicating two or more adjacent flow channel grooves. The cover part comprises an upper cover plate, the upper cover plate is provided with a pressing block, the upper cover plate can move towards or away from the carrier table in the longitudinal direction so that the pressing block abuts against or is separated from the chip, and the upper cover plate is used for covering the heating groove.

6. The pump source patch welding apparatus of claim 5, wherein, The upper cover plate comprises a body and a guide plate connected to each other, a clamping groove is arranged on a side of the body facing the carrier table, a first avoiding hole penetrating through the bottom of the clamping groove is arranged, and the guide plate is arranged in the clamping groove.

7. The pump source patch welding apparatus of claim 5, wherein, A guide hole penetrating through the guide plate is arranged, the pressing block comprises a limiting section, a guide section and a pressing head connected in sequence, the guide section is arranged in the guide hole, and the limiting section is used for limiting the guide section to prevent the guide section from being separated from the guide hole in the longitudinal direction.

8. The pump source patch welding apparatus of claim 1, wherein, A material taking notch is arranged on the side wall of the heating groove.

9. The pump source patch welding apparatus of claim 8, wherein, ​ ​ 10. The pump source patch welding apparatus of claim 1, wherein, ​

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