Polishing pad pasting auxiliary assembly

Abstract

The utility model provides a polishing pad pasting auxiliary assembly, which is used for pasting a polishing pad on a polishing disk, and comprises a cross laser positioning device used for emitting cross laser rays; the fixing mechanism is used for fixing the cross laser positioning device above a polishing disk; wherein the cross laser positioning device is configured to position the pasting position of the polishing pad by irradiating the polishing pad on the polishing disc from top to bottom. According to the polishing pad pasting auxiliary assembly, through the positioning function of the cross-shaped laser rays, the pasting error of the polishing pad is remarkably reduced, and no matter whether an observation window exists or not, deviation can be effectively reduced, pasting time is shortened, and pasting efficiency is improved. Meanwhile, when the laser lines scan the surface of the polishing pad, the positions of bubbles or wrinkles can be clearly displayed, the detection efficiency is improved, and potential quality hazards are remarkably reduced. Finally, accurate positioning and timely detection reduce the re-pasting condition caused by deviation or defects, and the waste rate of consumables is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a polishing pad bonding auxiliary component. Background Technology

[0002] In semiconductor manufacturing, Chemical Mechanical Polishing (CMP) equipment is one of the key pieces of equipment for achieving wafer surface planarization. Polishing pads in CMP machines are consumables, and their performance directly affects the polishing quality. Because polishing pads gradually wear down or become contaminated during use, they typically need to be replaced regularly during routine PM operations to ensure process stability. In practice, polishing pads are usually fixed to the polishing pads using adhesive bonding. However, manual bonding presents the following problems:

[0003] In existing technologies, some polishing pads have observation windows for process monitoring or alignment reference, but not all polishing pads have this feature. For polishing pads with observation windows, manual application requires ensuring the window is aligned with the predetermined position on the polishing pad to facilitate subsequent monitoring of process parameters. However, manual operation presents the following problems:

[0004] Alignment difficulties: Whether it is a polishing pad with an observation window or a polishing pad without an observation window, it is difficult to accurately judge the position when manually applying it. Especially for polishing pads with observation windows, the deviation between the observation window and the predetermined position is large, which easily leads to re-application, wasting time and materials.

[0005] Bubble and wrinkle issues: During the application process, bubbles or wrinkles can easily form between the polishing pad and the polishing disk. These defects are not easily detected by the naked eye. If not detected in time, they will affect the flatness and lifespan of the polishing pad, thereby reducing the quality of wafer polishing.

[0006] Inefficiency: To ensure the quality of the application, operators need to repeatedly adjust the position of the polishing pad and carefully check for air bubbles or wrinkles after application. This process is time-consuming, especially in daily PM operations with high change frequency, where the efficiency problem is particularly prominent.

[0007] Waste of consumables: Due to alignment errors or air bubbles, some polishing pads need to be removed and reapplied after application, resulting in waste of consumables and increased production costs.

[0008] Current technology lacks a simple and effective auxiliary tool to solve the above problems. Traditional methods rely entirely on the operator's experience and skill, lacking standardized positioning and detection methods, leading to inconsistencies and inefficiencies in the bonding process. Therefore, there is an urgent need for an auxiliary tool that can improve the bonding accuracy of polishing pads, facilitate bubble detection, and shorten operation time to meet the demands of modern semiconductor manufacturing for efficient and high-quality maintenance.

[0009] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0010] In view of the problems in the prior art, the purpose of this utility model is to provide a polishing pad pasting auxiliary component, which overcomes the difficulties of the prior art and can solve the problem of low efficiency and accuracy of polishing pad pasting alignment in related technologies.

[0011] This disclosure provides a polishing pad adhesion aid assembly for adhering a polishing pad to a polishing disk, comprising:

[0012] A cross-shaped laser positioning device used to emit cross-shaped laser lines;

[0013] A fixing mechanism is used to fix the cross laser positioning device above the polishing disc;

[0014] The cross laser positioning device is configured to locate the bonding position of the polishing pad by irradiating the polishing pad on the polishing disk from above.

[0015] Optionally, the fixing mechanism includes an adsorption component, and the cross laser positioning device is detachably adsorbed and fixed above the polishing disc by the adsorption component.

[0016] Optionally, the fixing mechanism includes a bracket fixed above the polishing disc, and the cross laser positioning device is mounted on the bracket.

[0017] Optionally, the cross laser positioning device includes a laser emitter and an adjustment component, the adjustment component being configured to adjust the angle and position of the cross laser line.

[0018] Optionally, the adjustment assembly includes a rotation mechanism connected to the laser emitter via a rotation shaft and configured to adjust the angle of the crosshair laser line.

[0019] Optionally, the adjustment assembly includes a lifting mechanism connected to the laser emitter via a slide rail and a locking screw, for adjusting the height of the crosshair laser line.

[0020] Optionally, the cross laser positioning device includes a plurality of laser emitters, which are fixed by a bracket and arranged in a cross pattern to form the cross laser line.

[0021] Optionally, the mounting position of the fixing mechanism is connected to the polishing disc via an adjustable connector, the length of which is adapted to polishing discs of different sizes.

[0022] Optionally, a cushioning pad is also provided at the bottom of the fixing mechanism.

[0023] Optionally, the polishing pad and polishing disc are size-adapted, and the crosshair laser line is configured to assist in aligning the viewing window on the polishing pad and polishing disc.

[0024] The polishing pad bonding auxiliary component proposed in this disclosure has the following advantages:

[0025] A polishing pad adhesion aid component for attaching polishing pads to a polishing pad includes: a cross-shaped laser positioning device for emitting a cross-shaped laser line; and a fixing mechanism for fixing the cross-shaped laser positioning device above the polishing pad. The cross-shaped laser positioning device is configured to position the polishing pad by irradiating it from above onto the polishing pad on the polishing pad. This embodiment of the polishing pad adhesion aid component significantly reduces adhesion errors through the positioning function of the cross-shaped laser line. Regardless of whether an observation window is present, it effectively reduces deviations, shortens adhesion time, and improves adhesion efficiency. Simultaneously, when the laser line scans the surface of the polishing pad, it can clearly display the location of bubbles or wrinkles, improving detection efficiency and significantly reducing potential quality issues. Ultimately, accurate positioning and timely detection reduce the need for re-adhesion due to deviations or defects, reducing material waste.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0027] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0028] Figure 1 The diagram shows the architecture of the polishing pad pasting auxiliary component and its positioning principle according to the embodiments of this disclosure, wherein the polishing pad does not have an observation window.

[0029] Figure 2 For the corresponding Figure 1 Top view;

[0030] Figure 3 A schematic diagram illustrating the principle of bubble detection using a moving polishing pad;

[0031] Figure 4 A schematic diagram showing the shape of the laser line when there are no bubbles;

[0032] Figure 5 A schematic diagram showing the shape of the laser line when air bubbles are present;

[0033] Figure 6A schematic diagram showing the positioning principle of the polishing pad with an observation window;

[0034] Figure 7 For the corresponding Figure 6 Top view;

[0035] Figure 8 This is a schematic diagram of a polishing pad bonding auxiliary component provided for an embodiment of this disclosure.

[0036] Label Explanation:

[0037] 1. Cross laser positioning device; 2. Fixing mechanism; 3. Polishing disc; 4. Polishing pad; 4a. Bubble; 10. Laser emitter; 11. Adjustment component; 20. Bracket; 21. Base; 22. Telescopic arm; 40. Observation window; 110. Lifting mechanism; 111. Slide rail; 112. Locking screw; 113. Slider. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0039] Furthermore, the accompanying drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0040] This disclosure provides a polishing pad application aid for accurately and efficiently applying polishing pads to polishing discs during routine preventive maintenance (PM) operations. This tool is particularly suitable for polishing machines requiring frequent pad replacements, aiming to improve application accuracy, reduce consumable waste, and increase operational efficiency, especially providing a flexible solution for polishing pads with or without viewing windows. Figure 1 As shown, the polishing pad bonding aid assembly includes the following components:

[0041] Cross laser positioning device 1, used to emit cross laser lines;

[0042] The fixing mechanism 2 is used to fix the cross laser positioning device 1 above the polishing disk 3.

[0043] Among them, combined Figures 1-4 The cross-shaped laser positioning device 1 is configured to locate the bonding position of the polishing pad 4 on the polishing disk 3 by irradiating it from above. Specifically, its basic principle is as follows:

[0044] The cross laser positioning device 1 is installed above the polishing pad 3 by fixing mechanism 2, and its position is adjusted so that the cross laser line is aligned with the predetermined pasting position of the polishing pad 4.

[0045] When applying the polishing pad, the operator places the polishing pad 4 on the polishing disk 3 according to the guidance of the cross laser line, aligning the laser line with the edge of the polishing pad 4, without the need for repeated adjustments.

[0046] Combination Figure 4 and Figure 5 As shown, after pasting, the surface of the polishing pad 4 is scanned with a cross laser line. If there are bubbles 4a or wrinkles, the laser line will produce obvious light and shadow changes at the defect, making it easy for operators to find and deal with them in time.

[0047] refer to Figures 6-7 If the polishing pad 4 is provided with an observation window 40, the cross laser line emitted by the cross laser positioning device 1 can coincide with the edge of the observation window 40 on the polishing pad 4, thereby achieving precise positioning of the polishing pad without the need for repeated position adjustments.

[0048] Compared with the prior art, the polishing pad bonding auxiliary assembly of the present disclosure has the following significant advantages:

[0049] Improved alignment accuracy: The positioning function of the cross laser line significantly reduces the adhesion error of the polishing pad 4, effectively reducing deviation regardless of whether there is an observation window 40.

[0050] Facilitates bubble detection: When the laser line scans the surface of the polishing pad 4, the location of bubbles or wrinkles can be clearly displayed, improving detection efficiency and significantly reducing potential quality issues.

[0051] Reduced work time: No need to repeatedly adjust the position of polishing pad 4, shortening the time required for each application and improving application efficiency.

[0052] Reduce consumable waste: Precise positioning and timely detection reduce the need for re-pasting due to deviations or defects, thus lowering the consumable waste rate.

[0053] Highly adaptable: The tool is flexibly designed and can be used with both polishing pads with and without viewing windows, covering a wider range of application scenarios.

[0054] In an alternative embodiment, the polishing pad 4 and polishing disk 3 are size-matched to ensure a tight fit when attached. The crosshair laser line is configured to assist in aligning the viewing window 40 on the polishing pad 4 and polishing disk 3 (when present), or only to align the edge of the polishing pad 4 (when no viewing window is present).

[0055] The specific implementation is as follows:

[0056] For the polishing pad 4 with the viewing window 40, the cross laser line is adjusted by the adjustment component to make it coincide with the edge of the viewing window 40.

[0057] For polishing pads without an observation window, the laser line forms a tangent with the outer edge of the polishing pad to ensure correct overall positioning.

[0058] In one embodiment of this disclosure, such as Figure 8 As shown, the cross laser positioning device 1 consists of a laser emitter 10 and an adjustment component 11. The laser emitter 10 can emit a red cross laser line, which has high visibility.

[0059] The cross laser positioning device 1 may include multiple laser emitters 10 (e.g., two), which are fixed by a bracket 20 and arranged in a cross pattern to form a stable cross laser line. Each laser emitter 10 is a small laser diode, mounted on an aluminum alloy bracket in an "X" shape, with the two laser emitters located at opposite ends of the bracket and their emission directions perpendicular to each other.

[0060] The bracket 12 is fixed to the fixing mechanism 2 by screws, ensuring that the laser lines of the two laser emitters 10 are aligned with the polishing pad 4 (e.g., ...). Figure 1 As shown, the surfaces intersect to form a clear cross shape.

[0061] In this embodiment, the adjustment component 11 can fine-tune the angle of each laser emitter 10 to ensure that the intersection point is located at the center of the polishing pad 4 or the observation window 40 (e.g., Figure 1 (As shown) center.

[0062] In use, the two laser emitters 10 operate simultaneously, generating intersecting laser lines that cover the entire surface of the polishing pad 4, enhancing the visibility and stability of the positioning. Tests show that this design improves the accuracy of bubble detection, making it particularly suitable for large polishing pads.

[0063] In this embodiment of the disclosure, the adjustment component 11 can be configured to adjust the angle and position of the crosshair laser line. For example... Figure 8 As shown, the adjustment assembly 11 may include a rotating mechanism (not shown) and a lifting mechanism 110.

[0064] The rotating mechanism includes a rotating shaft perpendicular to the polishing surface of the polishing pad, and the laser emitter 10 can rotate around the rotating shaft, so that the crosshair laser line can be aligned with the polishing pad 4 (e.g., ...). Figure 1 The edge or observation window 40 (as shown) Figure 6 As shown, the laser line is tangent to each other, so the rotating mechanism can adjust the angle of the laser line.

[0065] The lifting mechanism 110 can adjust the height of the laser line to adapt to different operating needs.

[0066] The lifting mechanism 110 is used to precisely adjust the height of the cross laser line to accommodate polishing pads 4 of different thicknesses (e.g., ...). Figure 1 (As shown) or to meet different working distance requirements. The lifting mechanism 110 is connected to the laser emitter 10 via a slide rail 111 and a locking screw 112. The slide rail 111 is made of aluminum alloy and is mounted on the bracket 20 of the fixing mechanism 2 or the adsorption assembly. The locking screw 112 is manually adjustable, and the position of the laser emitter 10 on the slide rail 111 is locked or released by rotating it.

[0067] Its usage method is as follows:

[0068] After installing the cross laser positioning device 1, loosen the locking screw 112 and move the laser emitter 10 up and down along the slide rail 111 until the cross laser line is aligned with the surface of the polishing pad 4 or the edge of the observation window 40.

[0069] Tighten the locking screw 112 to ensure the laser emitter 10 is in a stable position.

[0070] Turn on the laser emitter 10 and check if the laser line clearly covers the surface of the polishing pad 4. If fine adjustments are needed, repeat the above steps.

[0071] The advantage of this embodiment is that the lifting mechanism 110 improves the flexibility of the laser line, is suitable for polishing pads of various thicknesses, shortens the adjustment time, and improves the positioning accuracy.

[0072] In this embodiment of the disclosure, the lifting mechanism 110 may further include a slider 113, which cooperates with the slide rail 111, for example, by being threadedly connected to the slide rail 111. In this case, the slide rail 111 selects a screw, and the locking screw 112 passes through the slider 113 and abuts against the slide rail 111 when locked.

[0073] In this embodiment, the fixing mechanism 2 adopts a bracket design, and the bracket 20 is fixedly installed on the machine frame next to the polishing disc 3. The bracket 20 is made of aluminum alloy and includes a base 21 and a telescopic arm 22. The base 21 is fixed to the machine base by bolts, and the length of the telescopic arm 22 is adjustable, with the end connected to the cross laser positioning device 1.

[0074] The laser emitter of the cross laser positioning device 1 emits a cross laser line. The adjustment components include an angle fine-tuning knob, which allows for precise adjustments to ensure accurate alignment of the laser line with the edge of the polishing pad 4.

[0075] Its usage method is as follows:

[0076] Fix the bracket 20 to the polishing disc 3 (e.g.) Figure 1 Above or to one side (as shown), adjust the telescopic arm 22 so that the cross laser positioning device 1 is positioned above the predetermined pasting area of ​​the polishing pad 4.

[0077] Turn on the laser emitter 10 and adjust the laser line so that it forms a tangent with the edge of the polishing pad 4.

[0078] Place the polishing pad 4 on the polishing disc 3 and stick it according to the laser line. After flattening, check whether the edges are uniform.

[0079] Use a laser line to scan the surface of polishing pad 4 to observe whether there are air bubbles. If so, deal with them promptly.

[0080] In another embodiment, the fixing mechanism 2 can also employ an adsorption assembly design, including multiple suction cups and connecting rods. The suction cups are made of rubber and can be adsorbed onto the upper surface or side of the polishing disc 3 through negative pressure. The connecting rods are made of stainless steel and are used to fix the cross laser positioning device 1 above the polishing disc 3. In this way, the cross laser positioning device 1 is detachably adsorbed and fixed above the polishing disc 3 by the adsorption assembly. The advantage of the adsorption assembly is that it is easy to install and remove, and it is only used during PM operations without interfering with the normal operation of the machine.

[0081] by Figure 6 and Figure 8 Taking the polishing pad 4 with the observation window 40 as an example, the operation method is as follows:

[0082] The suction cup of the fixing mechanism 2 is attached to the polishing pad 3, and the angle of the connecting rod is adjusted so that the cross laser positioning device 1 is positioned above the predetermined pasting area of ​​the polishing pad 4.

[0083] Turn on the laser emitter and adjust the rotation and lifting mechanisms so that the crosshair laser line coincides with the frame of the observation window 40 on the polishing pad 4.

[0084] Place the polishing pad 4 on the polishing disc 3, stick it according to the laser line, flatten it, and then turn off the laser emitter.

[0085] Turn the laser emitter back on and scan the surface of polishing pad 4 with the crosshair laser line. If bubbles 4a are found (e.g.) Figure 4 (As shown), handle it promptly.

[0086] In an optional implementation, the laser emitter supports red-green dual-color switching, with the color selected via a control switch to adapt to the light reflection characteristics of different polishing pad materials. The adjustment assembly includes an electric lifting mechanism, driven by a motor for height adjustment, and is equipped with a remote control for convenient remote operation.

[0087] The fixing mechanism 2 combines the dual design of the adsorption component and the bracket, allowing users to choose the installation method according to their actual needs. Furthermore, the distance between the fixing mechanism's installation position and the center of the polishing pad 3 is adjustable to accommodate polishing pads of different sizes.

[0088] When in use, the operator can adjust the height and angle of the laser line via remote control, making it suitable for both scenarios with and without an observation window.

[0089] The mounting position of the fixing mechanism 2 is connected to the polishing disc 3 via an adjustable connector. The length of the connector can accommodate polishing discs and pads of different sizes. The connector is a telescopic aluminum alloy rod with an embedded spring and locking buckle. The operator can adjust the rod length by rotating the locking buckle.

[0090] The installation process is as follows:

[0091] One end of the connector is fixed to the side of the polishing disc 3 or the machine frame, and the other end is connected to the cross laser positioning device 1.

[0092] Adjust the length of the connector according to the actual dimensions of the polishing pad 4 and the polishing disc 3 so that the laser positioning device is located at a specific position above the polishing pad.

[0093] Tighten the connector to ensure a stable position.

[0094] This embodiment is applicable to polishing machines of various specifications, such as polishing discs with a certain diameter, and the adjustment time is shortened, significantly improving the versatility of the tool.

[0095] In this embodiment, the fixing mechanism 2 also includes a buffer pad (not shown in the figure), which is disposed at the bottom of the fixing mechanism, for example, at the bottom of the base 21, specifically between the contact surface between the fixing mechanism 2 and the machine tool, or between the contact surface between the fixing mechanism 2 and the polishing disc 3, to reduce the impact of vibration on positioning accuracy. The buffer pad is made of silicone and is installed at the bottom of the adsorption assembly or the bracket.

[0096] The functions and effects of the cushioning pad are as follows:

[0097] During adsorption fixation, the buffer pad absorbs minor vibrations on the polishing disc surface, preventing the cross laser positioning device 1 from shifting due to vibration.

[0098] When mounted on a bracket, the cushioning pad reduces direct contact between metal parts, lowers noise, and extends equipment life.

[0099] Test results show that adding a buffer pad improves the stability of the laser line, making it particularly suitable for machines operating in high-frequency vibration environments, and also significantly reduces positioning errors.

[0100] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A polishing pad attaching aid assembly for attaching a polishing pad (4) to the bottom surface of a polishing disk (3), characterized in that, The application relates to a cross laser positioning device (1) for emitting a cross laser line, a fixing mechanism (2) for fixing the cross laser positioning device (1) above a polishing disc (3), wherein the cross laser positioning device (1) is configured to position a sticking position of a polishing pad (4) on the polishing disc (3) by irradiating the polishing pad (4) from top to bottom. The fixing mechanism (2) comprises a suction assembly, and the cross laser positioning device (1) is detachably fixed above the polishing disc (3) through the suction assembly. The fixing mechanism (2) comprises a support (20) fixed above the polishing disc (3), and the cross laser positioning device (1) is installed on the support (20).

2. The polishing pad attachment aid assembly of claim 1, wherein, The cross laser positioning device (1) comprises a laser emitter (10) and an adjusting assembly (11) configured to adjust the angle and position of the cross laser line.

3. The polishing pad attachment aid assembly of claim 1, wherein, The adjusting assembly (11) comprises a rotating mechanism connected with the laser emitter (10) through a rotating shaft and configured to adjust the angle of the cross laser line.

4. The polishing pad attachment aid assembly of claim 1, wherein, The adjusting assembly (11) comprises a lifting mechanism (110) connected with the laser emitter (10) through a sliding rail (111) and a locking screw (112) and used for adjusting the height of the cross laser line.

5. The polishing pad adhesion aid assembly of claim 4, wherein, The cross laser positioning device (1) comprises a plurality of the laser emitters (10) fixed through the support (20) and arranged in a cross shape to form the cross laser line.

6. The polishing pad attachment aid assembly of claim 4, wherein, The fixing mechanism (2) is connected with the polishing disc (3) through an adjustable connecting piece, and the length of the connecting piece is adjustable to adapt to polishing discs (3) of different sizes.

7. The polishing pad attachment aid assembly of claim 4, wherein, A buffer pad is arranged at the bottom of the fixing mechanism (2).

8. The polishing pad adhesion aid assembly of claim 1, wherein, The polishing pad (4) and the polishing disc (3) are matched in size, and the cross laser line is configured to assist in aligning an observation window (40) on the polishing pad (4) and the polishing disc (3).

9. The polishing pad attachment aid assembly of claim 1, wherein, ​ 10. The polishing pad adhesion aid assembly of any one of claims 1 to 9, wherein, ​

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