Cutting equipment for crystalline silicon piece

Abstract

The utility model relates to cutting equipment for a crystalline silicon piece, the cutting equipment is used for a photovoltaic panel, the cutting equipment comprises a workbench, a clamping device, a cutting device and a material guiding device, the clamping device is arranged on the workbench, the clamping device comprises a clamping part, the clamping part is movably arranged on the workbench in the horizontal direction, and the clamping part is used for clamping the crystalline silicon piece; the clamping device is arranged on the workbench, the cutting device is arranged on the workbench, the cutting device is used for cutting crystalline silicon pieces, the material guiding device is arranged below the clamping device and the cutting device, the material guiding device is used for conveying the cut crystalline silicon pieces, the material guiding device comprises a material guiding piece and a screen arranged on the material guiding piece, and the screen is used for screening the cut crystalline silicon pieces. The material guiding device can achieve conveying of the crystalline silicon pieces, and the cutting efficiency of the crystalline silicon pieces is effectively improved. In addition, the situation that the crystalline silicon pieces are scratched or knocked by the crystalline silicon fragments and the crystalline silicon powder is effectively avoided, and the cutting qualification rate of the crystalline silicon pieces is effectively increased.

Description

Technical Field

[0001] This disclosure relates to the field of photovoltaic panel manufacturing technology, and more specifically, to a cutting device for crystalline silicon components. Background Technology

[0002] Photovoltaic panels are devices that convert solar energy into electrical energy, and are one of the important technologies for achieving sustainable development and energy conservation and emission reduction goals.

[0003] Cutting is a very important step in the production of photovoltaic panels. In related technologies, after the cutting equipment cuts the crystalline silicon parts (such as polycrystalline silicon ingots or monocrystalline silicon rods), the cut material is directly piled up on the workbench. It requires manual periodic shutdown to collect the material, resulting in low cutting efficiency. In addition, because the fragments and debris generated during the cutting process accumulate together with the cut crystalline silicon parts, the crystalline silicon parts are also easily damaged. Utility Model Content

[0004] The purpose of this disclosure is to provide a cutting apparatus for crystalline silicon components to solve the problems existing in the related art.

[0005] To achieve the above objectives, this disclosure provides a cutting apparatus for crystalline silicon components, comprising:

[0006] Workbench;

[0007] A clamping device is disposed on the worktable. The clamping device includes a clamping part, which is movably disposed on the worktable in a horizontal direction. The clamping part is used to clamp the crystalline silicon device.

[0008] A cutting device, disposed on the worktable, is used for cutting crystalline silicon components; and

[0009] A feeding device is disposed below the clamping device and the cutting device. The feeding device is used to transport the cut crystal silicon parts. The feeding device includes a feeding component and a screen disposed on the feeding component. The screen is used to screen the cut crystal silicon parts.

[0010] Optionally, the guide is inclined such that the height of the upper surface of the end of the guide away from the cutting device is lower than the height of the upper surface of the end of the guide close to the cutting device.

[0011] The material guiding device also includes a plurality of elastic elements, one end of which is connected to the worktable and the other end of which is connected to the material guiding element, so that the material guiding element can reciprocate in the up-down direction under the gravity of the crystalline silicon.

[0012] Optionally, the guide includes an inclined guide plate, wherein the height of the upper surface of the guide plate at the end away from the cutting device is lower than the height of the upper surface of the guide plate at the end close to the cutting device.

[0013] The workbench is provided with a guide groove, the guide plate is installed in the guide groove, and the side wall of the guide plate abuts against the inner wall of the guide groove.

[0014] The guide plate has mounting holes, and the screen is installed in the mounting holes.

[0015] Optionally, the clamping device further includes a first drive assembly, a second drive assembly, and a mounting bracket;

[0016] The first drive component is disposed on the worktable, and the first drive component is connected to the second drive component and is used to drive the second drive component to move along the first direction;

[0017] The mounting bracket is used to mount the clamping part, and the second driving component is connected to the mounting bracket and used to drive the mounting bracket to move along a second direction, wherein the first direction and the second direction intersect.

[0018] Optionally, the first drive assembly includes a first U-shaped bracket, a first screw, a first slider, and a first motor;

[0019] The first U-shaped bracket includes a first base plate and two first side plates spaced apart along the first direction. The first base plate is used to be mounted on the workbench. The first screw is rotatably passed through the two first side plates. The first motor is mounted on one of the two first side plates and is connected to the first screw in a transmission manner.

[0020] The first slider is mounted on the first screw, and the first slider and the first screw cooperate to form a lead screw and nut mechanism. The second drive component is connected to the first slider.

[0021] Optionally, the second drive assembly includes a second U-shaped bracket, a second screw, a second slider, and a second motor;

[0022] The second U-shaped bracket includes a second base plate, a second side plate, and a third side plate. The second side plate and the third side plate are spaced apart along the second direction. The second side plate is connected to the first slider. The second screw is rotatably passed through the second side plate and the third side plate. The second motor is mounted on the third side plate and is drivenly connected to the second screw.

[0023] The second slider is mounted on the second screw, and the second slider and the second screw cooperate to form a lead screw and nut mechanism. The mounting bracket is mounted on the second slider.

[0024] Optionally, the clamping part includes a first clamping plate, a second clamping plate, an elastic pad, and a driving member;

[0025] The driving component is mounted on the mounting bracket, the first clamping plate is disposed at one end of the mounting bracket, the driving component is mounted at the other end of the mounting bracket, the driving component is connected to the second clamping plate and is used to drive the second clamping plate to move toward or away from the first clamping plate, so as to clamp or release the crystalline silicon device;

[0026] The elastic pads are provided on the surface of the first clamping plate near the second clamping plate and on the surface of the second clamping plate near the first clamping plate.

[0027] Optionally, the workbench includes a table body, a first support frame, a second support frame, and two support legs. The two support legs are used to support the table body, and the clamping device and the material guiding device are both disposed on the table body.

[0028] The first support frame and the second support frame are respectively installed on the upper and lower sides of the table body. The cutting device includes a third motor, a first roller, a second roller and diamond wire. The first roller is rotatably connected to the first support frame, and the second roller is rotatably connected to the second support frame. The third motor is mounted on the first support frame and is connected to the first roller in a transmission manner. The third motor is used to drive the first roller to rotate.

[0029] The diamond wire is threaded through the table and the material guiding device and tensioned on the first roller and the second roller.

[0030] Optionally, the workbench is provided with a material discharge port located below the screen, and the workbench also includes a U-shaped mounting bracket installed at the material discharge port;

[0031] The U-shaped mounting bracket includes a support plate and two connecting plates. One end of each of the two connecting plates is connected to the table body, and the other end of each connecting plate is connected to the support plate. The cutting device also includes a waste collection box, which is disposed on the support plate.

[0032] Optionally, the cutting device further includes a material collection box for collecting the cut crystalline silicon;

[0033] The workbench also includes a shelf, which is located on the side of the material guiding device away from the cutting device. The shelf is used to place the material collection box and is connected to the lower part of the support leg so that the height of the material collection box is lower than the height of the material guiding device.

[0034] With the above technical solution, since the guide for conveying the cut crystal silicon parts is located below the clamping device and the cutting device, and the guide is equipped with a screen for screening the cut crystal silicon parts, after the crystal silicon parts are cut, the cut crystal silicon parts can fall onto the guide and be conveyed to the crystal silicon parts collection device, thereby realizing the collection of the cut crystal silicon parts. In other words, there is no need to stop the machine periodically and collect the cut crystal silicon parts manually. The crystal silicon parts can be conveyed by the guide device, which effectively improves the cutting efficiency of crystal silicon parts.

[0035] Furthermore, during the conveying process of crystalline silicon components, the screen set on the guide can screen the crystalline silicon components. Crystalline silicon fragments and dust generated during the cutting process can fall off the screen instead of accumulating with the cut crystalline silicon components. This effectively avoids the situation where crystalline silicon fragments and dust generated during the cutting process scratch or damage the cut crystalline silicon components, effectively improving the cutting qualification rate of crystalline silicon components, and also avoiding the cost increase caused by damage to crystalline silicon components.

[0036] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0037] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0038] Figure 1 This is a three-dimensional structural schematic diagram of a cutting device for crystalline silicon components provided in an exemplary embodiment of this disclosure.

[0039] Figure 2 yes Figure 1 An enlarged diagram of A in the diagram.

[0040] Figure 3 This is a three-dimensional structural diagram of the clamping part of a cutting device for crystalline silicon components provided in an exemplary embodiment of this disclosure, wherein a second screw and a second slider are shown.

[0041] Figure 4 This is a cross-sectional schematic diagram of a portion of the structure of a cutting device for crystalline silicon devices provided in an exemplary embodiment of this disclosure.

[0042] Explanation of reference numerals in the attached figures

[0043] 100-Cutting equipment for crystalline silicon components; 1-Workbench; 11-Table body; 12-First support frame; 13-Second support frame; 14-Support leg; 15-Discharge port; 16-U-shaped mounting bracket; 161-Support plate; 162-Connecting plate; 17-Placement plate; 18-Guide groove; 2-Clamping device; 21-Clamping part; 211-First clamping plate; 212-Second clamping plate; 213-Elastic pad; 214-Drive component; 22-First drive assembly; 221-First U-shaped bracket; 201-First base plate; 202-First side plate; 222-First screw; 223-First slider; 224-First motor; 23-Second drive assembly; 231-Second U-shaped bracket; 203-Second base plate; 204-Third side plate; 232-Second screw; 233-Second slider; 234-Second motor; 24-Mounting bracket; 3-Cutting device; 31-Third motor; 32-First roller; 33-Second roller; 34-Diamond wire; 4-Guiding device; 41-Guiding component; 411-Mounting hole; 42-Screw; 43-Elastic component; 5-Material collection box; 6-Fragment collection box. Detailed Implementation

[0044] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0045] In this disclosure, it should be understood that directional terms such as "upper," "lower," "first direction," and "second direction" are defined according to the orientation of the accompanying drawings and are only for the convenience of describing this disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational construction and operation, and therefore should not be construed as a limitation of this disclosure. The terms "inner" and "outer" refer to the inner and outer contours of the corresponding structures. Furthermore, it should be noted that the terms such as "first" and "second" are used to distinguish one element from another and do not have sequential or importance implications. Additionally, in the description with reference to the accompanying drawings, the same reference numerals in different drawings denote the same element; the first direction may refer to the length direction of the cutting device, and the second direction may refer to the width direction of the cutting device, as detailed in the accompanying drawings. Figure 1 and Figure 2 As shown.

[0046] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connect," "link," and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0047] like Figures 1 to 4 As shown, this disclosure provides a cutting device 100 for crystalline silicon components. The cutting device is used for photovoltaic panels and includes a worktable 1, a clamping device 2, a cutting device 3, and a guiding device 4. The clamping device 2 is disposed on the worktable 1 and includes a clamping part 21, which is movably disposed on the worktable 1 in a horizontal direction and is used to clamp the crystalline silicon component. The cutting device 3 is disposed on the worktable 1 and is used to cut the crystalline silicon component. The guiding device 4 is disposed below the clamping device 2 and the cutting device 3 and is used to transport the cut crystalline silicon component. The guiding device 4 includes a guiding component 41 and a screen 42 disposed on the guiding component 41 and is used to screen the cut crystalline silicon component.

[0048] In the above-mentioned cutting device 3, during the cutting process of the crystalline silicon part, the crystalline silicon part can be clamped by the clamping part 21 and moved in the horizontal direction under the drive of the clamping part 21, so that the crystalline silicon part can come into contact with the cutting device 3 and the cutting of the crystalline silicon part can be realized.

[0049] With the above technical solution, since the guide 41 for conveying the cut crystal silicon parts is located below the clamping device 2 and the cutting device 3, and the guide 41 is provided with a screen 42 for screening the cut crystal silicon parts, after the crystal silicon parts are cut, the cut crystal silicon parts can fall onto the guide 41 and be conveyed to the crystal silicon parts collection device (such as the material collection box 5 mentioned below) through the guide 41, thereby realizing the collection of the cut crystal silicon parts. In other words, there is no need to stop the machine regularly and collect the cut crystal silicon parts manually. The crystal silicon parts can be conveyed by the guide device 4, which effectively improves the cutting efficiency of crystal silicon parts.

[0050] Furthermore, during the conveying process of the crystalline silicon component, the screen 42 set on the guide 41 can screen the crystalline silicon component. The crystalline silicon fragments and dust generated during the cutting process can fall off the screen 42 instead of accumulating with the cut crystalline silicon component. This effectively avoids the crystalline silicon fragments and dust generated during the cutting process from scratching or damaging the cut crystalline silicon component, thus effectively improving the cutting qualification rate of the crystalline silicon component and avoiding the cost increase caused by damage to the crystalline silicon component.

[0051] Optionally, such as Figure 1 , Figure 2 and Figure 4 As shown, the guide member 41 is inclined so that the height of the upper surface of the end of the guide member 41 away from the cutting device 3 is lower than the height of the upper surface of the end of the guide member 41 close to the cutting device 3. The guide device 4 also includes a plurality of elastic members 43. One end of the plurality of elastic members 43 is connected to the worktable 1, and the other end of the plurality of elastic members 43 is connected to the guide member 41 so that the guide member 41 can reciprocate in the up and down direction under the gravity of the crystalline silicon.

[0052] Since the height of the upper surface of the end of the guide 41 away from the cutting device 3 is lower than the height of the upper surface of the end of the guide 41 close to the cutting device 3, in other words, the guide 41 is tilted towards the crystal silicon part collecting device. With this design, when the crystal silicon part is conveyed through the guide 41, the weight of the crystal silicon part itself will also drive the crystal silicon part to move towards the crystal silicon part collecting device. The crystal silicon part is not easy to get stuck on the guide 41, which effectively avoids the situation where the crystal silicon part gets stuck on the guide 41, causing the crystal silicon part to accumulate and affecting the subsequent cutting of the crystal silicon part.

[0053] Furthermore, since multiple elastic elements 43 are arranged between the guide element 41 and the worktable 1, and one end of the multiple elastic elements 43 is connected to the worktable 1 and the other end of the multiple elastic elements 43 is connected to the guide element 41, the guide device 4 can generate a small amplitude of shaking under the gravity of the crystal silicon parts during the conveying process, thereby improving the screening effect of the screen 42 on the cut crystal silicon parts, crystal silicon fragments and crystal silicon powder.

[0054] This disclosure does not limit the specific type of the guide member 41, as long as the guide member 41 can realize the conveying of the crystal silicon device. As one embodiment of this disclosure, such as... Figure 1 , Figure 2 and Figure 4As shown, the aforementioned guide component 41 may include an inclined guide plate. The height of the upper surface of the guide plate at the end away from the cutting device 3 is lower than the height of the upper surface of the guide plate at the end near the cutting device 3. A guide groove 18 is provided on the worktable 1, and the guide plate is installed in the guide groove 18. The side wall of the guide plate abuts against the inner wall of the guide groove 18. The guide plate has mounting holes 411, and the screen 42 is installed in the mounting holes 411. Since the guide component 41 is formed as an inclined guide plate, the guide plate does not need to be equipped with a driving component 214. The crystal silicon component can be transported by its own gravity. This simplifies the structure of the guide device 4 and reduces the energy consumption of the crystal silicon component during the transport process.

[0055] In addition, since the guide plate is installed on the guide groove 18, the side wall of the guide groove 18 can cooperate with the guide plate to guide the crystal silicon device, effectively preventing the crystal silicon device from falling from both sides of the guide plate and damaging the crystal silicon device.

[0056] In other embodiments of this disclosure, the material guide 41 may further include multiple conveyor belt mechanisms, which are spaced apart, and a screen 42 is disposed between two adjacent conveyor belt mechanisms. Thus, the screen 42 can also screen the cut crystalline silicon parts, crystalline silicon fragments, and crystalline silicon powder.

[0057] It should be noted that this disclosure does not limit the specific structure of the clamping device 2, as long as the clamping part 21 provided on the clamping device 2 can move in the horizontal direction. As one embodiment of this disclosure, the clamping device 2 further includes a first driving assembly 22, a second driving assembly 23, and a mounting bracket 24. The first driving assembly 22 is disposed on the worktable 1, the first driving assembly 22 is connected to the second driving assembly 23 and is used to drive the second driving assembly 23 to move in a first direction, the mounting bracket 24 is used to mount the clamping part 21, the second driving assembly 23 is connected to the mounting bracket 24 and is used to drive the mounting bracket 24 to move in a second direction, the first direction and the second direction intersect.

[0058] Since the first direction and the second direction intersect, the first driving component 22 and the second driving component 23 cooperate with each other to enable the driving clamping part 21 to move in the horizontal direction, so that the crystal silicon component clamped on the clamping part 21 can contact the cutting device 3, thereby realizing the cutting of the crystal silicon component.

[0059] As another embodiment of this disclosure, the clamping device 2 may also include a robotic arm and a mounting bracket 24. The mounting bracket 24 is used to mount the clamping part 21. One end of the robotic arm is disposed on the worktable 1, and the other end of the robotic arm is connected to the mounting bracket 24. In this way, the robotic arm can also drive the clamping part 21 to move in the horizontal direction.

[0060] It should be noted that this disclosure does not limit the specific structure of the first driving component 22. As one embodiment of this disclosure, such as Figure 1 and Figure 2 As shown, the first drive assembly 22 includes a first U-shaped bracket 221, a first screw 222, a first slider 223, and a first motor 224. The first U-shaped bracket 221 includes a first base plate 201 and two first side plates 202 spaced apart along a first direction. The first base plate 201 is used to be mounted on the worktable 1. The first screw 222 is rotatably passed through the two first side plates 202. The first motor 224 is mounted on one of the two first side plates 202 and is connected to the first screw 222 in a transmission connection. The first slider 223 is fitted on the first screw 222. The first slider 223 and the first screw 222 cooperate to form a lead screw and nut mechanism. The second drive assembly 23 is connected to the first slider 223.

[0061] Since the first motor 224 is connected to the first screw 222, the first motor 224 can drive the first screw 222 to rotate, while the first slider 223 cannot rotate due to the restriction of the first base plate 201 of the first U-shaped bracket 221. Therefore, the first slider 223 can move along the first screw 222, thereby pushing the second drive structure to move in the first direction.

[0062] Furthermore, by adjusting the parameters (e.g., rotational speed) of the first motor 224, the moving speed and moving distance of the second drive structure can be easily controlled, thereby adjusting the moving speed of the clamping part 21 along the first direction, which facilitates the cutting of the crystalline silicon part.

[0063] In other embodiments of this disclosure, the first drive assembly 22 may include a first bracket, a linear motor, and a first fixing block. The first bracket is mounted on the worktable 1 and used to mount the linear motor. The first fixing block is connected to the push rod of the linear motor, and the second drive assembly 23 is connected to the first fixing block. In this way, the linear motor can also drive the first fixing block to move along a first direction, thereby driving the second drive assembly 23 to move.

[0064] It should be noted that this disclosure does not limit the specific structure of the second driving component 23. As one embodiment of this disclosure, such as... Figure 1 and Figure 2As shown, the second drive assembly 23 may include a second U-shaped bracket 231, a second screw 232, a second slider 233, and a second motor 234. The second U-shaped bracket 231 includes a second base plate 203, a second side plate, and a third side plate 204. The second side plate and the third side plate 204 are spaced apart along a second direction. The second side plate is connected to the first slider 223. The second screw 232 is rotatably passed through the second side plate and the third side plate 204. The second motor 234 is mounted on the third side plate 204 and is connected to the second screw 232 in a transmission connection. The second slider 233 is fitted on the second screw 232. The second slider 233 and the second screw 232 cooperate to form a lead screw and nut mechanism. The mounting bracket 24 is mounted on the second slider 233.

[0065] Since the second motor 234 is connected to the second screw 232, the second motor 234 can drive the second screw 232 to rotate. However, the second slider 233 cannot rotate due to the restriction of the second base plate 203 of the second U-shaped bracket 231. Therefore, the second slider 233 can move along the second screw 232, thereby pushing the second drive structure to move in the second direction.

[0066] Furthermore, by adjusting the parameters (e.g., rotational speed) of the second motor 234, the moving speed and moving distance of the second drive structure can be easily controlled, thereby adjusting the moving speed of the clamping part 21 along the second direction, which facilitates the cutting of the crystalline silicon part.

[0067] In other embodiments of this disclosure, the second drive assembly 23 may include a second bracket, a linear motor, and a second fixing block. The second bracket is mounted on the worktable 1 and used to mount the linear motor. The second fixing block is connected to the push rod of the linear motor, and the mounting bracket 24 is connected to the second fixing block. In this way, the linear motor can also drive the second fixing block to move in the second direction, thereby driving the mounting bracket 24 and the clamping part 21 provided on the mounting bracket 24 to move.

[0068] This disclosure does not limit the specific structure of the clamping part 21. As one embodiment of this disclosure, such as Figures 1 to 3As shown, the clamping part 21 includes a first clamping plate 211, a second clamping plate 212, elastic pads 213, and a driving member 214. The driving member 214 is mounted on the mounting bracket 24. The first clamping plate 211 is disposed at one end of the mounting bracket 24, and the driving member 214 is mounted at the other end of the mounting bracket 24. The driving member 214 is connected to the second clamping plate 212 and is used to drive the second clamping plate 212 to move toward or away from the first clamping plate 211 to clamp or release the crystalline silicon device. Elastic pads 213 are provided on the surface of the first clamping plate 211 near the second clamping plate 212 and on the surface of the second clamping plate 212 near the first clamping plate 211. Since the second clamping plate 212 can move toward or away from the first clamping plate 211 under the action of the driving member 214, the clamping or releasing of the crystalline silicon device by the clamping part 21 can be achieved by controlling the driving member 214.

[0069] Furthermore, since elastic pads 213 are provided on the surface of the first clamping plate 211 near the second clamping plate 212 and the surface of the second clamping plate 212 near the first clamping plate 211, when the first clamping plate 211 and the second clamping plate 212 jointly clamp the crystal silicon component, the first clamping plate 211 and the second clamping plate 212 will not directly contact the crystal silicon component, and the elastic pads 213 can form a flexible contact with the crystal silicon component, thereby avoiding damage to the crystal silicon component by the clamping part 21.

[0070] Optionally, such as Figure 1 and Figure 4 As shown, the workbench 1 includes a table body 11, a first support frame 12, a second support frame 13, and two support legs 14. The two support legs 14 support the table body 11. A clamping device 2 and a guiding device 4 are both mounted on the table body 11. The first support frame 12 and the second support frame 13 are respectively mounted on the upper and lower sides of the table body 11. The cutting device 3 includes a third motor 31, a first roller 32, a second roller 33, and a diamond wire 34. The first roller 32 is rotatably connected to the first support frame 12, and the second roller 33 is rotatably connected to the second support frame 13. The third motor 31 is mounted on the first support frame 12 and is connected to the first roller 32 for transmission. The third motor 31 drives the first roller 32 to rotate. The diamond wire 34 passes through the table body 11 and the guiding device 4 and is tensioned on the first roller 32 and the second roller 33. The diamond wire 34 tensioned on the first roller 32 and the second roller 33 can rotate at high speed under the rotation of the first roller 32, thereby enabling the cutting of crystalline silicon parts.

[0071] In another embodiment of this disclosure, the workbench 1 may further include a table body 11 and a support frame, and the cutting device 3 may include a laser emitter. The support frame is mounted on the table body 11, and the laser emitter is fixed to the support frame. In this way, the laser emitter can also cut crystalline silicon components using a laser.

[0072] To collect the crystalline silicon blocks and fragments sieved through screen 42, optionally, as follows: Figure 4 As shown, the workbench 1 can also be provided with a material discharge port 15, which is located below the screen 42. The workbench 1 also includes a U-shaped mounting bracket 24, which is installed at the material discharge port 15. The U-shaped mounting bracket 24 includes a support plate 161 and two connecting plates 162. One end of each connecting plate 162 is connected to the table body 11, and the other end of each connecting plate 162 is connected to the support plate 161. The cutting equipment 100 also includes a waste collection box 6, which is set on the support plate 161. In other words, the waste collection box 6 is installed below the screen 42 through the U-shaped mounting bracket 24. The crystalline silicon blocks and crystalline silicon fragments screened out by the screen 42 will not fall everywhere, but can be collected in the waste collection box 6, effectively avoiding the situation where crystalline silicon blocks and crystalline silicon fragments fall everywhere and pollute the site and environment.

[0073] In addition, when the fragment collection box 6 collects a large amount of crystalline silicon blocks and fragments, the operator can also directly lift the fragment collection box 6 through the opening of the U-shaped mounting bracket 24, and after cleaning, put the fragment collection box 6 back onto the workbench 1 through the opening of the U-shaped mounting bracket 24. The fragment collection box 6 is easy to install and remove on the workbench 1.

[0074] To facilitate the collection of the diced silicon crystal components, optionally, such as Figure 1 and Figure 4 As shown, the cutting device 100 may further include a material collection box 5 for collecting the cut crystalline silicon. The worktable 1 also includes a shelf 17 located on the side of the guiding device 4 away from the cutting device 3. The shelf 17 is used to place the material collection box 5 and is connected to the lower part of the support leg 14 so that the height of the material collection box 5 is lower than the height of the guiding device 4. The material collection box 5, located on the side of the guiding device 4 away from the cutting device 3, can collect the cut crystalline silicon parts, improving the collection efficiency of the crystalline silicon parts.

[0075] Furthermore, since the height of the material collection box 5 is lower than the height of the material guiding device 4, the crystalline silicon components conveyed by the material guiding device 4 can fall directly into the material collection box 5, effectively avoiding the situation where the height of the material collection box 5 is higher than the material guiding device 4, the crystalline silicon components cannot fall into the material collection box 5, and the material collection box 5 cannot collect the crystalline silicon components.

[0076] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0077] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0078] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A cutting apparatus for a crystalline silicon piece, for a photovoltaic panel, characterized in that, The utility model relates to a cutting device for cutting crystal silicon pieces, and a material guiding device for conveying the cut crystal silicon pieces. The material guiding device comprises a material guiding piece and a screen arranged on the material guiding piece, and the screen is used for screening the cut crystal silicon pieces. The material guiding piece is arranged obliquely, so that the height of the upper surface of the end of the material guiding piece away from the cutting device is lower than the height of the upper surface of the end of the material guiding piece close to the cutting device. The material guiding device further comprises a plurality of elastic pieces, one end of each of the elastic pieces is connected to the workbench, and the other end of each of the elastic pieces is connected to the material guiding piece, so that the material guiding piece can reciprocate in the up-down direction under the action of the gravity of the crystal silicon. The material guiding piece comprises an obliquely arranged material guiding plate, the height of the upper surface of the end of the material guiding plate away from the cutting device is lower than the height of the upper surface of the end of the material guiding plate close to the cutting device. A material guiding groove is formed in the workbench, the material guiding plate is installed in the material guiding groove, and the side wall of the material guiding plate abuts against the inner wall of the material guiding groove.

2. The cutting apparatus of claim 1, wherein, An installation hole is formed in the material guiding plate, and the screen is installed in the installation hole. The clamping device further comprises a first driving assembly, a second driving assembly and a mounting bracket.

3. The cutting apparatus of claim 2, wherein, The first driving assembly is arranged on the workbench, is connected to the second driving assembly and is used for driving the second driving assembly to move in a first direction. The mounting bracket is used for mounting the clamping part, the second driving assembly is connected to the mounting bracket and is used for driving the mounting bracket to move in a second direction, and the first direction intersects the second direction. The first driving assembly comprises a first U-shaped bracket, a first screw rod, a first sliding block and a first motor.

4. The cutting apparatus of claim 1, wherein, The first U-shaped bracket comprises a first bottom plate and two first side plates arranged in the first direction at intervals, the first bottom plate is used for being mounted on the workbench, the first screw rod is rotatably arranged through the two first side plates, and the first motor is mounted on one of the two first side plates and is in transmission connection with the first screw rod. The first sliding block is sleeved on the first screw rod, the first sliding block cooperates with the first screw rod to form a screw nut mechanism, and the second driving assembly is connected to the first sliding block. The second driving assembly comprises a second U-shaped bracket, a second screw rod, a second sliding block and a second motor.

5. The cutting apparatus of claim 4, wherein, The second U-shaped bracket comprises a second bottom plate, a second side plate and a third side plate, the second side plate and the third side plate are arranged in the second direction at intervals, the second side plate is connected to the first sliding block, the second screw rod is rotatably arranged through the second side plate and the third side plate, and the second motor is mounted on the third side plate and is in transmission connection with the second screw rod. ​ ​ 6. The cutting apparatus of claim 5, wherein, ​ ​ The second sliding block is sleeved on the second screw rod, and the second sliding block cooperates with the second screw rod to form a ball screw mechanism.

7. The cutting apparatus of claim 4, wherein, The clamping part comprises a first clamping plate, a second clamping plate, an elastic gasket and a driving member; The driving member is installed on the mounting bracket, the first clamping plate is arranged at one end of the mounting bracket, the driving member is installed at the other end of the mounting bracket, and the driving member is connected to the second clamping plate and used to drive the second clamping plate to move towards the direction of approaching or moving away from the first clamping plate, so as to clamp or release the crystalline silicon piece. The surface of the first clamping plate close to the second clamping plate and the surface of the second clamping plate close to the first clamping plate are both provided with the elastic gasket.

8. The cutting apparatus according to any one of claims 1 to 7, characterized in that, The workbench comprises a table body, a first support frame, a second support frame and two support legs, the two support legs are used to support the table body, and the clamping device and the material guiding device are arranged on the table body. The first support frame and the second support frame are respectively installed on the upper and lower sides of the table body, the cutting device comprises a third motor, a first roller, a second roller and a diamond wire, the first roller is rotatably connected to the first support frame, the second roller is rotatably connected to the second support frame, the third motor is arranged on the first support frame and in transmission connection with the first roller, and the third motor is used to drive the first roller to rotate. The diamond wire is arranged through the table body and the material guiding device and is tensioned on the first roller and the second roller.

9. The cutting apparatus of claim 8, wherein, The workbench is provided with a material falling port, the material falling port is located below the screen, and the workbench further comprises a U-shaped mounting bracket. The U-shaped mounting bracket comprises a support plate and two connecting plates, one end of each of the two connecting plates is connected to the table body, the other end of each of the two connecting plates is connected to the support plate, and the cutting device (100) further comprises a broken piece collecting box.

10. The cutting apparatus of claim 8, wherein, The cutting device (100) further comprises a material collecting box, and the material collecting box is used to collect the cut crystalline silicon. The workbench further comprises a storage plate, the storage plate is located on the side of the material guiding device away from the cutting device, the storage plate is used to place the material collecting box, and the storage plate is connected to the lower part of the support leg, so that the height of the material collecting box is lower than the height of the material guiding device.

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