Mold cooling mechanism with rapid heat conduction assembly

Abstract

The utility model discloses a mold cooling mechanism with a rapid heat conduction assembly, and relates to the technical field of mold cooling. The mold cooling mechanism with the rapid heat conduction assembly comprises a bottom mold, a guide column is fixedly installed above the bottom mold, a movable mold is movably installed above the bottom mold, and heat dissipation mechanisms are installed on the left side and the right side of the bottom mold and the left side and the right side of the movable mold and used for cooling the mold. The heat dissipation mechanism comprises heat pipes installed on the left side and the right side of the bottom die and the left side and the right side of the movable die in a penetrating mode, cooling fins are fixedly installed on the outer sides of the heat pipes, flow guide covers are fixedly installed on the outer sides of the cooling fins, and vaporized cooling media in the top ends of the heat pipes are liquefied again through air flow and flow back to the bottom ends of the heat pipes under guiding of capillary structures; in this way, the heat pipe is directly connected with the bottom die and the movable die, cooling liquid is not introduced into the die through a pipeline structure, and the situation that the cooling liquid forms scales in the pipeline structure of the die due to continuous temperature change can be prevented.

Description

Technical Field

[0001] This utility model relates to the field of mold cooling technology, specifically a mold cooling mechanism with a rapid heat conduction component. Background Technology

[0002] The primary function of a mold cooling system is to control the temperature during the injection molding process, thereby improving production efficiency and product quality. It shortens cooling time by removing heat from the mold, preventing product deformation, warping, or dimensional inconsistencies. Furthermore, uniform cooling helps improve surface finish and reduce internal stress, thus enhancing overall product performance and lifespan. Cooling systems typically involve the circulation of a coolant (such as water or oil) within the mold to effectively remove heat.

[0003] The existing Chinese utility model patent with publication number CN219427403U discloses a mold cooling mechanism for hot runner molds, including a mold and a hot runner assembly. The hot runner assembly is disposed inside the mold, and mold cavities are disposed inside the mold and on both sides of the hot runner assembly. A water cooling mechanism is disposed outside the mold cavity, and a heat insulation mechanism to prevent heat exchange is disposed outside the hot runner assembly. This utility model has a simple structure and reasonable design. By setting a copper sleeve and an inner copper ring on the outside of the mold cavity, heat can be quickly absorbed and quickly conducted to the inside of the spiral runner. By placing the copper ring end of the inner copper ring inside the spiral runner, heat can be quickly diffused into the water flow and carried away by the cooling water, achieving a rapid heat dissipation effect. On the other hand, by covering the outside of the hot runner assembly with a ceramic layer, the cooling water of the spiral runner can be effectively isolated from the injection plastic inside the injection tube of the hot runner assembly, reducing heat exchange and thus ensuring the stability and consistency of the temperature inside the hot runner.

[0004] Because the heat exchange rate between the cooling medium and the mold is affected by the temperature difference between the cooling medium and the mold, the heat exchange rate decreases after the cooling medium absorbs heat and heats up. At the same time, this method requires the cooling medium to be circulated by a liquid pump, and the temperature of the cooling medium changes constantly, which causes impurities in the cooling medium to be deposited and scale to form on the surface of the mold pipes. In addition, in order to bring the cooling medium closer to the mold cavity, the pipe structure inside the mold has many bends, and the pipes inside the mold need to be cleaned during maintenance, which is very inconvenient. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a mold cooling mechanism with a rapid heat transfer component, which solves the problems of scaling in mold pipes and the decrease in heat exchange rate as the cooling medium temperature rises.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a mold cooling mechanism with a rapid heat conduction component, including a bottom mold, a guide column fixedly installed above the bottom mold, a movable mold movably installed above the bottom mold, and heat dissipation mechanisms installed on the left and right sides of the bottom mold and the movable mold for cooling the mold;

[0007] The heat dissipation mechanism includes heat pipes that are interspersed and installed on the left and right sides of the bottom mold and the moving mold. Heat sinks are fixedly installed on the outside of the heat pipes. A flow guide is fixedly installed on the outside of the heat sinks. A fixing frame is fixedly installed on one side of the flow guide. A motor is fixedly installed inside the fixing frame. A fan blade is fixedly installed on the outside of the motor shaft. A limit frame is fixedly installed between the flow guides. Flow guide pipes are fixedly installed on the left and right sides of the bottom mold.

[0008] Preferably, the moving mold and the guide post form a sliding connection, and the heat pipe has four different models with different heights and bending directions, and is installed alternately on the left and right sides of the bottom mold and the moving mold.

[0009] Preferably, the horizontal portion of the bottom end of the heat pipe is located below the bottom mold cavity and above the moving mold cavity, and the heat sink is vertically and equidistantly installed on the outside of the heat pipe.

[0010] Preferably, the flow guide is symmetrically installed on the left and right sides of the moving mold, and the contact surface between the flow guide and the moving mold is provided with an opening structure that fits into the heat pipe.

[0011] Preferably, the diameter of the center tube of the flow guide is smaller than the diameter of the two ends, the motor is installed at the front and rear ends of the flow guide and the flow guide tube through a fixing bracket, the bottom of the limiting bracket is fixedly connected to the moving mold, and the two ends are fixedly connected to the flow guides on both sides respectively.

[0012] Preferably, the fixing frame is fixedly connected to the air guide and the limiting frame by screws, and the fan blades on the front and rear sides of the air guide and the limiting frame are mirror symmetrical and have the same air outlet direction.

[0013] Beneficial effects

[0014] This invention provides a mold cooling mechanism with a rapid heat conduction component. Compared with the prior art, it has the following advantages:

[0015] (1) The mold cooling mechanism with heat conduction component has a heat pipe. The inner wall of the heat pipe is provided with a capillary structure to guide the low boiling point medium back to the part of the heat pipe located inside the bottom mold and the moving mold. The low boiling point medium inside the heat pipe will absorb the heat of the bottom mold and the moving mold and vaporize, and move to the top of the heat pipe. The airflow will cause the vaporized cooling medium inside the top of the heat pipe to re-liquefy and flow back to the bottom of the heat pipe under the guidance of the capillary structure, forming a cycle. In this way, the heat pipe is directly connected to the bottom mold and the moving mold, and the coolant is not introduced into the mold through the pipe structure. This can prevent the coolant from forming scale inside the mold pipe structure due to continuous temperature changes.

[0016] (2) The mold cooling mechanism with heat transfer components, through the setting of heat sinks, the heat sinks are located outside the heat pipe. The position of the fan blades when driven by the motor is restricted by the flow guide and the flow guide pipe, so that the airflow passes through the gap between the heat sinks. The heat sinks can increase the contact area between the heat pipe and the airflow so that the airflow can carry away the heat. The internal air pressure of the heat pipe is lower than the standard atmospheric pressure. The low boiling point medium inside will release latent heat at the top of the heat pipe and condense into liquid. It returns to the bottom through the capillary structure of the heat pipe wall to form a circulation. Heat is quickly transferred through the vaporization latent heat to improve the cooling efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the connection structure between the bottom mold and the moving mold of this utility model;

[0019] Figure 3 This is a schematic diagram of the heat sink installation structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the installation structure of the guide tube of this utility model;

[0021] In the diagram: 1. Bottom mold; 11. Guide pillar; 12. Moving mold; 2. Heat dissipation mechanism; 21. Heat pipe; 22. Heat sink; 23. Radiator; 24. Fixing frame; 25. Motor; 26. Fan blade; 27. Limiting frame; 28. Radiator tube. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution: a mold cooling mechanism with a rapid heat conduction component, including: a bottom mold 1, a guide column 11 fixedly installed above the bottom mold 1, a movable mold 12 movably installed above the bottom mold 1, and heat dissipation mechanisms 2 installed on the left and right sides of the bottom mold 1 and the movable mold 12 for cooling the mold.

[0024] The heat dissipation mechanism 2 includes heat pipes 21 that are interspersed and installed on the left and right sides of the bottom mold 1 and the moving mold 12. Heat sinks 22 are fixedly installed on the outside of the heat pipes 21. A flow guide shroud 23 is fixedly installed on the outside of the heat sinks 22. A fixing frame 24 is fixedly installed on one side of the flow guide shroud 23. A motor 25 is fixedly installed inside the fixing frame 24. A fan blade 26 is fixedly installed on the outside of the rotating shaft of the motor 25. A limit frame 27 is fixedly installed between the flow guide shrouds 23. Flow guide pipes 28 are fixedly installed on the left and right sides of the bottom mold 1.

[0025] The moving mold 12 and the guide post 11 form a sliding connection. The heat pipe 21 comes in four different models with varying heights and bending directions, and is alternately installed on the left and right sides of the bottom mold 1 and the moving mold 12. The horizontal portion of the bottom end of the heat pipe 21 is located below the cavity of the bottom mold 1 and above the cavity of the moving mold 12. The heat sink 22 is vertically and equidistantly installed on the outside of the heat pipe 21. The air guide shroud 23 is symmetrically installed on the left and right sides of the moving mold 12, and the contact surface between the air guide shroud 23 and the moving mold 12 has openings for fitting the heat pipe 21. The central diameter of the air guide shroud 23 is smaller than the diameters at both ends. The motor 25 is installed at the front and rear ends of the air guide shroud 23 and the air guide pipe 28 via a fixing bracket 24. The bottom of the limiting bracket 27 is fixedly connected to the moving mold 12, and both ends are fixedly connected to the air guide shrouds 23 on both sides. The fixing bracket 24 is fixedly connected to the air guide shroud 23 and the limiting bracket 27 via screws. The fan blades 26 on the front and rear sides of the air guide shroud 23 and the limiting bracket 27 are mirror-symmetrical, with the same airflow direction.

[0026] Specifically, the guide post 11 can restrict the movement direction of the moving mold 12. When the moving mold 12 is fitted with the bottom mold 1, the recesses on the top surface of the bottom mold 1 and the bottom surface of the moving mold 12 will fit together to form a mold cavity. The low-boiling-point medium inside the heat pipe 21 will absorb the heat of the bottom mold 1 and the moving mold 12 and vaporize, moving towards the top of the heat pipe 21. The flow guide shroud 23 and the flow guide pipe 28 restrict the position of the fan blade 26 when it is driven by the motor 25 to generate airflow, so that the airflow passes through the gap between the heat sink 22. The heat sink 22 can increase the contact area between the heat pipe 21 and the airflow to remove heat. The cooling medium vaporized at the top of the heat pipe 21 will release latent heat and condense into liquid, returning to the bottom through the capillary structure of the heat pipe 21 wall to form a circulation. Heat is quickly transferred through the vaporization of latent heat. At the same time, the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0027] During operation, the inner wall of heat pipe 21 is equipped with a capillary structure to guide the low-boiling-point medium backflow to the portion of heat pipe 21 located inside the bottom mold 1 and moving mold 12. The low-boiling-point medium inside heat pipe 21 absorbs heat from the bottom mold 1 and moving mold 12 and vaporizes, moving towards the top of heat pipe 21. Airflow causes the vaporized cooling medium inside the top of heat pipe 21 to re-liquefy and, guided by the capillary structure, flow back to the bottom of heat pipe 21, forming a circulation. In this way, heat pipe 21 is directly connected to the bottom mold 1 and moving mold 12. This method avoids introducing coolant into the mold through a pipe structure, preventing the coolant from escaping due to continuous temperature changes. In cases where scale forms inside the pipe structure, the heat sink 22 is located outside the heat pipe 21. The flow guide 23 and the flow guide tube 28 restrict the position of the fan blade 26 when it is driven by the motor 25 to generate airflow, so that the airflow passes through the gaps between the heat sink 22. The heat sink 22 can increase the contact area between the heat pipe 21 and the airflow so that the airflow can carry away heat. The internal air pressure of the heat pipe 21 is lower than the standard atmospheric pressure. The low boiling point medium inside the heat pipe 21 will release latent heat at the top of the heat pipe 21 and condense into liquid. It returns to the bottom through the capillary structure of the heat pipe 21 wall to form a circulation. Heat is quickly transferred through the vaporization latent heat to improve cooling efficiency.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mold cooling mechanism with heat rapid conduction assembly, comprising a bottom mold (1), a guide column (11) is fixedly installed above the bottom mold (1), a movable mold (12) is movably installed above the bottom mold (1), characterized in that: The bottom die (1) and the left and right sides of the movable die (12) are provided with heat dissipation mechanisms (2) for cooling the mold; The heat dissipation mechanism (2) comprises heat pipes (21) installed between the left and right sides of the bottom die (1) and the movable die (12), the outer side of the heat pipe (21) is fixedly provided with a heat sink (22), the outer side of the heat sink (22) is fixedly provided with a flow guide cover (23), one side of the flow guide cover (23) is fixedly provided with a fixed frame (24), the inside of the fixed frame (24) is fixedly provided with a motor (25), the outer side of the rotating shaft of the motor (25) is fixedly provided with a fan blade (26), the flow guide cover (23) is fixedly provided with a limiting frame (27) between them, and the left and right sides of the bottom die (1) are fixedly provided with flow guide pipes (28).

2. The mold cooling mechanism with rapid heat conduction assembly according to claim 1, characterized in that: The movable die (12) and the guide column (11) are connected in sliding connection, the heat pipes (21) have four types of different heights and bending directions, and are alternately installed on the left and right sides of the bottom die (1) and the movable die (12).

3. The mold cooling mechanism with rapid heat conduction assembly of claim 1, wherein: The horizontal part of the bottom end of the heat pipe (21) is located below the mold cavity of the bottom die (1) and above the mold cavity of the movable die (12), and the heat sink (22) is vertically and equidistantly installed on the outer side of the heat pipe (21).

4. The mold cooling mechanism with rapid heat conduction assembly of claim 1, wherein: The flow guide cover (23) is symmetrically installed on the left and right sides of the movable die (12), and the contact surface between the flow guide cover (23) and the movable die (12) is provided with an opening structure matched with the heat pipe (21).

5. The mold cooling mechanism with rapid heat conduction assembly of claim 1, wherein: The center pipe diameter of the flow guide cover (23) is smaller than the pipe diameters at both ends, the motor (25) is installed at the front and rear ends of the flow guide cover (23) and the flow guide pipe (28) through the fixed frame (24), the bottom of the limiting frame (27) is fixedly connected with the movable die (12), and both ends are fixedly connected with the flow guide covers (23) on both sides.

6. The mold cooling mechanism with rapid heat conduction assembly of claim 1, wherein: The fixed frame (24) is fixedly connected between the flow guide cover (23) and the limiting frame (27) through screws, and the fan blades (26) on the front and rear sides of the flow guide cover (23) and the limiting frame (27) are mirror-symmetric and have the same air outlet direction.

Images