M2 solid-state mobile hard disk radiator

Abstract

The utility model relates to a radiator for an M2 solid-state mobile hard disk. The radiator mainly comprises a customized water container, a water pump, a semiconductor refrigeration module, a semiconductor radiating fin, a water-cooling radiating head and a main control mainboard, the radiator is unique in design, the radiating module is located above the right side of the customized water container, the water pump is located below the left side, the water-cooling radiating head is located in front of the middle, and the M2 solid-state mobile hard disk is placed in front of the water-cooling radiating head. And the main control mainboard plays a role in fixing the M2 solid-state mobile hard disk at the same time. The utility model aims to solve the problem of high-temperature disk falling during running of the M2 solid-state mobile hard disk and improve the data transmission stability.

Description

Technical Field

[0001] This invention relates to the field of computer peripheral heat dissipation technology, and in particular to a heat dissipation device for M.2 solid-state portable hard drives. Background Technology

[0002] With the rapid development of computer technology, M.2 solid-state drives (SSDs) have become widely used in laptops, desktops, and other portable electronic devices due to their small size and high-speed data transfer capabilities. However, as data transfer speeds increase, the heat generated by M.2 SSDs during operation also increases, and overheating can lead to performance degradation or even damage. Existing cooling solutions typically include the use of heat sinks, fans, or liquid cooling systems, but these solutions often have the following shortcomings:

[0003] (1) Limited versatility: Heat sinks on the market often cannot adequately adapt to different sizes of M.2 SSDs, especially those with a standard width of 58 mm or less. (2) Low heat dissipation efficiency: Most common heat sinks on the market use air cooling technology. While air cooling has advantages such as low cost and simple structure, its heat dissipation efficiency often fails to meet requirements under high heat load conditions. This is specifically manifested in the following aspects:

[0004] Limited heat dissipation performance: The heat dissipation performance of air-cooled heat sinks mainly depends on the fan speed and the design of the heat sink, which can easily reach a bottleneck under high heat load conditions, especially in small devices with limited space.

[0005] Sensitive to ambient temperature: Air-cooled heat dissipation is quite sensitive to ambient temperature, and its heat dissipation effect will decrease significantly in high-temperature environments.

[0006] Liquid cooling systems are expensive and complex, making them unsuitable for miniaturized equipment. Summary of the Invention

[0007] To address the problem of M.2 solid-state drives (SSDs) overheating under high loads, leading to performance degradation or even damage, this invention provides a highly efficient heat dissipation M.2 SSD cooler. Existing cooling solutions mostly employ passive cooling or simple air-cooling designs, which have limited effectiveness in cooling M.2 SSDs under high-performance requirements. They cannot effectively solve the overheating problem under prolonged high-load operation, and liquid cooling systems are costly, complex, and unsuitable for miniaturized devices.

[0008] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0009] An M.2 solid-state portable hard drive cooler is provided, which includes a customized water container, a water pump, a semiconductor cooling module, a semiconductor heat sink, a water-cooled heat sink head, and a main control motherboard.

[0010] This radiator features a custom-designed water container with a water pump located on the lower left side, responsible for circulating the liquid to the water-cooling head for heat exchange. The water-cooling head is positioned at the front center of the water container, directly contacting the hard drive for efficient cooling. A semiconductor cooling module is located at the upper right to cool the liquid. The main control board not only automatically controls the cooling system's operating mode based on the current temperature, but also secures the M.2 SSD and indirectly directs heat generated by the main control board to the water-cooling head via the M.2 SSD, ensuring stable operation of the control system while maintaining close contact between the M.2 SSD and the water-cooling head.

[0011] The heatsink's main control board integrates an intelligent temperature control system, including a temperature sensor and a control unit. The temperature sensor monitors the operating temperature of the M.2 SSD and the water temperature in real time, while the control unit automatically adjusts the water pump speed and the operating status of the semiconductor cooling module based on this temperature data to achieve optimal heat dissipation. Furthermore, this design allows users to replace the cooling module and water pump themselves as needed, improving system flexibility and maintainability.

[0012] Compared with the prior art, the advantages of the present invention are as follows:

[0013] Highly efficient heat dissipation: By combining water cooling and semiconductor cooling technologies, the heat dissipation efficiency of the M.2 solid-state portable hard drive is significantly improved, ensuring the stability and lifespan of the M.2 solid-state portable hard drive under high load conditions.

[0014] Intelligent management: The built-in intelligent temperature control system can automatically adjust the heat dissipation strategy, optimize energy use, and reduce unnecessary energy consumption.

[0015] High flexibility and compatibility: Supports user-customized replacement of cooling components to meet personalized needs in different scenarios.

[0016] Compact structure: The overall design takes into account portability and space utilization efficiency, making it suitable for mobile application scenarios and space-constrained scenarios. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the M2 solid-state portable hard drive heat sink provided in an embodiment of this application;

[0019] Figure 2 This is a front view of the M2 solid-state portable hard drive heat sink provided in this embodiment of the application;

[0020] Figure 3 This is a side view of the M2 solid-state portable hard drive heat sink provided in an embodiment of this application;

[0021] Figure 4 This is provided by the embodiments of this application. Figure 2 Sectional view of mid-section AA;

[0022] Figure 5 This is an exploded view of the M2 solid-state portable hard drive heatsink provided in the embodiments of this application.

[0023] Figure 6 This is a flowchart of the temperature control system's operation.

[0024] The above figures include the following reference numerals:

[0025] 1. Water pump; 2. M.2 solid-state portable hard drive; 3. Water cooling head; 4. Water guide pipe; 5. Hot end semiconductor heat sink; 6. Cold end semiconductor heat sink; 7. Semiconductor cooling module; 8. Main control motherboard; 9. Custom water container; 10. Main control board fixing screws. Detailed Implementation

[0026] This application provides a heatsink for M.2 solid-state drives (SSDs) to address the problem in existing technologies where M.2 SSDs easily overheat under high loads, leading to performance degradation or even damage. This invention offers a highly efficient heatsink for M.2 SSDs. Existing heat dissipation solutions often employ passive cooling or simple air-cooling designs, which have limited effectiveness in cooling M.2 SSDs under high-performance requirements and cannot effectively solve the overheating problem under prolonged high-load operation.

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Please refer to the following: Figures 1 to 5This embodiment provides a heat sink for an M2 solid-state portable hard drive, including: a custom water container 9, a water pump 1, a guide pipe 4, and a water-cooled heat sink 3. The water pump 1, the guide pipe 4, and the water-cooled heat sink 3 constitute a basic water-cooling system. In this system, the water pump 1 is located to the left rear of the custom water container. Its function is to guide the water in the custom water container 9 through the guide pipe 4 to the water-cooled heat sink, and then guide the water to the chamber 101 through the guide pipe 4 on the other side of the water-cooled heat sink 4. A semiconductor cooling module 7 and at least two semiconductor heat sinks (marked as 5 and 6 respectively) are located to the upper right of the custom water container. A main control board 8 also serves as a cover plate and fixes the M2 solid-state portable hard drive 2 to the custom water container 9 with the main control board fixing screws 10. The main control board 8 fixes the M2 solid-state portable hard drive with a thermally conductive silicone pad, which also directs the heat from the M2 solid-state portable hard drive to the water-cooled heat sink.

[0029] Water flows through a guide pipe and then through a water-cooled heat sink. From the other end of the heat sink, the water flows into chamber 101 and then through the cold-end semiconductor heat sink 6, transferring heat to the cold-end semiconductor heat sink 6. At the same time, the semiconductor cooling module 7 transfers the heat absorbed by the cold-end semiconductor heat sink 6 to the hot-end semiconductor heat sink 5, thereby achieving rapid cooling of the water. After cooling, the water will flow into the water container 9 through the groove 102 reserved in the customized water container 9, thereby achieving the purpose of circulating heat dissipation and cooling.

[0030] The main control motherboard 8 has two reserved soldering points for temperature control probes, 104 and 105 respectively. Temperature control probe 104 is used to detect the water temperature in water container 9 and needs to be in direct contact with the water. To ensure the accuracy of the detection and the stable operation of the system, a waterproof thermistor is selected for temperature control probe 104. Using conventional non-waterproof thermistors may result in inaccurate temperature readings due to water interference, thus affecting the temperature control effect of the system. Waterproof thermistors can effectively avoid water interference with temperature measurement, ensuring the accuracy and reliability of temperature data.

[0031] The temperature control probe 105 is used to detect the temperature of the M.2 SSD 2. Since the main controller motherboard 8 and the M.2 SSD 2 are fixed together by a thermally conductive silicone pad, a surface-mount thermistor can be directly used for the temperature control probe 105. The thermally conductive silicone pad not only fixes the M.2 SSD but also conducts heat generated by the main controller motherboard 8 to the M.2 SSD 2, and then from the M.2 SSD to the water cooling head. Therefore, the temperature control probe 105 can indirectly reflect the temperature changes of the main controller motherboard 8.

[0032] In practical applications, the two temperature control probes 104 and 105 are not actually welded as described; instead, welding holes are provided for easy welding connections during use. The system operation flow is as follows:

[0033] 1. Power-on initialization: After the user starts the device, the system enters the initialization phase, and the main control motherboard 8 begins to read the values ​​of the ADC (analog-to-digital converter).

[0034] 2. Temperature Calculation: By reading the ADC value, the system calculates the resistance of the thermistor. Then, the Steinhart-Hart equation is used to convert the resistance value into the corresponding temperature.

[0035] 3. Temperature Correction and Judgment: The system applies a correction value to the calculated temperature change to improve the accuracy of temperature measurement. Next, the system determines whether the temperature of the converted M.2 solid-state drive exceeds 28 degrees Celsius.

[0036] If the temperature is higher than 28℃: the system starts the water pump and begins to circulate the cooling water.

[0037] Water temperature detection: At the same time, the system detects whether the water temperature is higher than 30 degrees Celsius.

[0038] If the water temperature is higher than 30℃: the system will activate the semiconductor cooling device to lower the water temperature.

[0039] 4. Temperature recovery and equipment shutdown: When the converted temperature is detected to be below 25 degrees Celsius, the system automatically shuts down the water pump and semiconductor cooling device and enters standby mode.

[0040] 5. Cyclic control: The above process is continuously cyclical to ensure that all components in the system are maintained within the optimal operating temperature range, preventing overheating that could lead to performance degradation or hardware damage.

[0041] This implementation scheme achieves efficient thermal management between the main control motherboard and the M.2 SSD by rationally configuring waterproof and surface-mount thermistors and combining them with the thermal conductivity of thermally conductive silicone pads. Simultaneously, the intelligent temperature control process ensures the stability and reliability of the system under different operating environments, significantly improving the lifespan of the M.2 SSD and the user experience.

[0042] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A M2 solid state mobile hard drive heat sink, characterized in that: A customized water container; a water pump located below the left side of the customized water container; at least one semiconductor refrigeration module; At least two semiconductor heat sinks; a water-cooled heat dissipation head located in the front of the customized water container; A main control board is used as a cover plate and is fixed to the customized water container through a main control board fixing screw; wherein the M2 solid-state mobile hard disk is placed in front of the water-cooled heat dissipation head, and the main control board is also used to fix the M2 solid-state mobile hard disk.

2. The M2 solid-state mobile hard drive heat spreader of claim 1, wherein: The main control board is connected with the M2 solid-state mobile hard disk through a heat-conducting silica gel pad, which is used to fix the M2 solid-state mobile hard disk and conduct the heat generated by the M2 solid-state mobile hard disk during work to the main control board.

3. The M2 solid-state mobile hard drive heat sink of claim 1, wherein: The main control board includes a temperature sensor and a control unit; the temperature sensor is used to monitor the working temperature of the M2 solid-state mobile hard disk and the water temperature in real time; the control unit is used to automatically adjust the rotating speed of the water pump or the working mode of the semiconductor refrigeration module according to the feedback data of the temperature sensor.

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