High-voltage box
By installing a heat dissipation structure and fan outside the high-voltage box, the problem of balancing protection level and heat dissipation effect is solved, achieving efficient heat dissipation and improved protection level, and reducing equipment failure rate and energy consumption.
Patent Information
- Application Number
- CN202423319775.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2034-12-31
AI Technical Summary
High-voltage boxes often face the challenge of simultaneously meeting protection and heat dissipation requirements, especially in scenarios with stringent protection standards. Poor heat dissipation can lead to overheating, affecting the failure rate and lifespan of the equipment.
The heat dissipation structure and cooling fan are set on the outside of the sealed enclosure, including a heat dissipation base plate and spaced heat dissipation fins. The airflow provided by the cooling fan removes heat while maintaining the enclosure's airtightness. The heat dissipation efficiency is improved by optimizing the design of the heat dissipation fins and fan.
It achieves efficient heat dissipation while improving the protection level, avoiding equipment failure due to overheating, extending service life and reducing energy consumption.
Smart Images
Figure CN223978326U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical equipment technology, specifically to a high-voltage box. Background Technology
[0002] In related technologies, high-voltage boxes primarily rely on natural cooling, depending on airflow to remove heat. However, due to the diversity of usage scenarios, the heat dissipation methods for high-voltage boxes vary. Some high-voltage boxes, used in scenarios with lower protection requirements, employ side ventilation openings for heat dissipation. These openings allow for good air exchange between the box and the outside, promoting heat dissipation. However, some high-voltage boxes, due to strict protection requirements, cannot use side ventilation openings or forced convection for heat dissipation. This leads to a significant accumulation of heat inside the box; for example, the local temperature of fuses can reach 90°C or even higher. This high-temperature condition not only significantly increases the failure rate but also severely negatively impacts the product's lifespan and reliability. Utility Model Content
[0003] The embodiments of this utility model provide a high-pressure box that can improve the technical problem that it is difficult to simultaneously meet the requirements of protection level and heat dissipation effect.
[0004] An embodiment of this utility model provides a high-pressure box, comprising:
[0005] Sealed enclosure with mounting cavity;
[0006] A heat dissipation structure includes a heat dissipation substrate and a plurality of heat dissipation fins. The heat dissipation substrate is disposed on the surface of the sealed housing opposite to the mounting cavity. The plurality of heat dissipation fins are connected to the surface of the heat dissipation substrate opposite to the sealed housing. The plurality of heat dissipation fins are spaced apart, and an air outlet is defined between two adjacent heat dissipation fins. The air outlet has an inlet and an outlet that are disposed opposite to each other.
[0007] A cooling fan is disposed on the side of the sealed housing away from the mounting cavity. The cooling fan is at least partially disposed opposite to the inlet to provide cooling airflow that can pass through the air duct.
[0008] In one embodiment, each of the heat dissipation fins includes a first end facing the cooling fan, and in the direction of extension of the air duct, the cooling fan and the first end have a first distance, the ratio of the first distance to the diameter of the cooling fan being between 1 and 2.
[0009] In one embodiment, the extension of the axis of the cooling fan is located between two adjacent cooling fins.
[0010] In one embodiment, there is a second distance between two adjacent heat dissipation fins, and the ratio of the diameter of the cooling fan to the second distance is between 1 and 1.2.
[0011] In one embodiment, the heat dissipation fins have a height H in the thickness direction of the heat dissipation substrate, and the ratio of the diameter of the cooling fan to the height H of the heat dissipation fins is between 0.8 and 1.
[0012] In one embodiment, each of the heat dissipation fins has a connection end connected to the heat dissipation substrate and a top end away from the heat dissipation substrate, and the thickness of at least one of the heat dissipation fins gradually decreases from the connection end to the top end.
[0013] In one embodiment, the cooling fan is disposed on the surface of the heat dissipation substrate opposite to the sealed housing.
[0014] In one embodiment, there are multiple cooling fans, which are arranged along the arrangement direction of the multiple cooling fins.
[0015] In one embodiment, the high-pressure box further includes:
[0016] A temperature detection device is disposed within the mounting cavity; and,
[0017] A control device is electrically connected to both the temperature detection device and the cooling fan.
[0018] In one embodiment, the high-pressure box further includes a heating element disposed within the mounting cavity;
[0019] The sealed enclosure includes a heat-conducting plate, the heat dissipation structure is mounted on the heat-conducting plate, and the heating element is thermally connected to the heat-conducting plate.
[0020] The beneficial effects of the embodiments of this utility model are as follows:
[0021] In this embodiment of the invention, the heat dissipation substrate can quickly conduct heat out of the sealed enclosure, and the multiple spaced heat dissipation fins further increase the contact area with the outside air. The cooling airflow provided by the cooling fan can quickly remove heat from the heat dissipation fins, thereby improving the heat dissipation efficiency of the entire heat dissipation system and preventing overheating inside the high-voltage enclosure. Because a sealed enclosure is used, and the heat dissipation structure and cooling fan are not compromised by the enclosure's seal, efficient heat dissipation is achieved while simultaneously improving the high-voltage enclosure's protection level, avoiding limitations on usage scenarios. In other words, in this embodiment of the invention, by setting a heat dissipation structure and cooling fan outside the sealed enclosure, efficient heat dissipation of the high-voltage enclosure can be achieved while simultaneously improving its protection level, thus addressing the technical problem of simultaneously failing to meet protection level and heat dissipation performance requirements. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a three-dimensional schematic diagram of the high-pressure box provided in an embodiment of this utility model;
[0024] Figure 2 yes Figure 1 A magnified view of part A in the diagram;
[0025] Figure 3 yes Figure 1 A front view of the high-voltage box in the middle;
[0026] Figure 4 yes Figure 1 A top view of the high-voltage box in the middle;
[0027] Figure 5 yes Figure 1 A side view of the high-voltage box in the diagram.
[0028] Explanation of reference numerals in the attached figures:
[0029] 100. High-pressure box; 1. Sealed box body; 11. Heat-conducting plate; 2. Heat dissipation structure; 21. Heat dissipation base plate; 22. Heat dissipation fins; 221. First end; 222. Connecting end; 223. Top end; 23. Air duct; 231. Inlet; 232. Outlet; 3. Cooling fan; 4. Bracket. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.
[0031] This application proposes a high-pressure box. Figures 1 to 5 These are some embodiments of this application.
[0032] See Figure 1 and Figure 2 The high-pressure box 100 includes a sealed box body 1, a heat dissipation structure 2, and a cooling fan 3. The sealed box body 1 has an installation cavity. The heat dissipation structure 2 includes a heat dissipation base plate 21 and a plurality of heat dissipation fins 22. The heat dissipation base plate 21 is disposed on the surface of the sealed box body 1 away from the installation cavity (that is, the heat dissipation base plate 21 is disposed on the outer surface of the sealed box body 1). The plurality of heat dissipation fins 22 are connected to the surface of the heat dissipation base plate 21 away from the sealed box body 1. The plurality of heat dissipation fins 22 are spaced apart, and an air duct 23 is defined between two adjacent heat dissipation fins 22. The air duct 23 has an inlet 231 and an outlet 232 disposed opposite to each other. The cooling fan 3 is disposed on the side of the sealed box body 1 away from the installation cavity. The cooling fan 3 is at least partially disposed opposite to the inlet 231 to provide heat dissipation airflow that can pass through the air duct 23.
[0033] In the technical solution of this application, the heat dissipation substrate 21 can quickly conduct heat out of the sealed enclosure 1, and the multiple spaced heat dissipation fins 22 further increase the contact area with the outside air. The cooling airflow provided by the cooling fan 3 can quickly remove the heat from the heat dissipation fins 22, thereby improving the heat dissipation efficiency of the entire heat dissipation system and preventing overheating inside the high-voltage box 100. Because a sealed enclosure 1 is used, and the arrangement of the heat dissipation structure 2 and the cooling fan 3 does not compromise the sealing performance of the sealed enclosure 1, efficient heat dissipation is achieved while improving the protection level of the high-voltage box 100, avoiding limitations on usage scenarios. That is, in the embodiment of this utility model, by setting the heat dissipation structure 2 and the cooling fan 3 outside the sealed enclosure 1, efficient heat dissipation of the high-voltage box 100 can be achieved while improving the protection level of the high-voltage box 100, thereby solving the technical problem that it is difficult to simultaneously meet the requirements of protection level and heat dissipation effect.
[0034] In some embodiments of this application, each heat dissipation fin 22 includes a first end 221 facing the cooling fan 3, and a first distance exists between the cooling fan 3 and the first end 221 in the extending direction of the air duct 23 (see...). Figure 4(a) The ratio of the first distance to the diameter of the cooling fan 3 is between 1 and 2. In these embodiments, when the ratio of the first distance to the diameter of the cooling fan 3 is less than 1, that is, the distance between the cooling fan 3 and the first end 221 of the heat dissipation fin 22 is too close, the airflow blown by the cooling fan 3 does not diffuse sufficiently before reaching the heat dissipation fin 22, the coverage area of the airflow is small, and part of the heat dissipation fin 22 may not receive effective cooling airflow, which is not conducive to the overall heat dissipation of the heat dissipation fin 22, resulting in low overall heat dissipation efficiency. This may cause the temperature inside the high-pressure box 100 to not drop in time, affecting the normal operation of the equipment. When the ratio of the first distance to the diameter of the cooling fan 3 is greater than 2, that is, the distance between the cooling fan 3 and the first end 221 of the heat dissipation fin 22 is too far, as the distance increases, the airflow blown by the cooling fan 3 will gradually weaken during propagation, the wind force will gradually decrease, and its heat carrying capacity will decrease. This reduces the heat exchange efficiency between the heat dissipation fin 22 and the airflow, resulting in slow heat dissipation. Similarly, it cannot meet the high-efficiency heat dissipation requirements of the high-pressure box 100, which may cause the temperature inside the sealed box 1 to be too high, leading to equipment failure and other problems. In these embodiments, the ratio of the first distance to the diameter of the cooling fan 3 is controlled between 1 and 2. This distance range allows the airflow blown out by the cooling fan 3 to have enough space to diffuse and form a relatively large coverage area, while the airflow will not be excessively attenuated due to the distance, thereby achieving a better heat dissipation effect.
[0035] In some embodiments of this application, the extension line of the axis of the cooling fan 3 is located between two adjacent heat dissipation fins 22. In these embodiments, the extension line of the axis of the cooling fan 3 is located between two adjacent heat dissipation fins 22, that is, the cooling fan 3 faces the heat dissipation duct 23. This allows the airflow blown by the fan to enter the duct 23 more smoothly, reducing airflow loss and turbulence, and improving heat dissipation efficiency. The design of facing the duct 23 allows the heat dissipation airflow to be evenly distributed on the two adjacent heat dissipation fins 22, so that heat can be evenly dissipated. By improving heat dissipation efficiency and uniform heat dissipation, the internal temperature of the equipment can be reduced, the failure rate caused by overheating can be reduced, thereby improving the reliability and service life of the product.
[0036] In some embodiments of this application, a second distance is provided between two adjacent heat dissipation fins 22 (see...). Figure 4In embodiment b), the ratio of the diameter of the cooling fan 3 to the second distance is between 1 and 1.2. In these embodiments, when the ratio of the diameter of the cooling fan 3 to the second distance between two adjacent heat dissipation fins 22 is less than 1, it means that the diameter of the cooling fan 3 is too small and cannot completely cover the width of the air duct 23 defined by the two adjacent heat dissipation fins 22. Because the diameter of the cooling fan 3 is too small, the airflow it blows cannot completely cover the width of the air duct 23, resulting in some heat dissipation fins 22 not receiving enough airflow for effective heat exchange, thus reducing the overall heat dissipation efficiency. When the ratio of the diameter of the cooling fan 3 to the second distance is greater than 1.2, that is, the diameter of the cooling fan 3 is too large, the larger diameter cooling fan 3 will occupy more space, which is not conducive to the miniaturization design of the enclosure. In addition, generally speaking, the larger the diameter of the cooling fan 3, the higher the power consumption required for its operation, which will increase the overall energy consumption of the equipment and does not meet the requirements of energy saving. The ratio of the diameter of the cooling fan 3 to the second distance between two adjacent heat dissipation fins 22 is controlled between 1 and 1.2. This ratio range ensures that the airflow blown out by the cooling fan 3 can basically completely cover the width of the air duct 23 defined by the two adjacent heat dissipation fins 22. The cooling airflow can fully exchange heat with the heat dissipation fins 22 and remove heat, thereby ensuring high heat dissipation efficiency. This allows the heat inside the equipment to be dissipated in time, maintaining the normal operating temperature of the equipment. The size of the cooling fan 3 is well matched with the width of the air duct 23, without occupying too much space. This helps to achieve a compact structural design, improve space utilization, and avoid excessive power consumption caused by an excessively large diameter of the cooling fan 3. This helps to reduce the overall energy consumption of the equipment, meets energy-saving requirements, and improves the performance of the equipment in terms of power consumption.
[0037] In some embodiments of this application, see Figure 3 and Figure 5In the thickness direction of the heat dissipation substrate 21, the heat dissipation fins 22 have a height H, and the ratio of the diameter of the cooling fan 3 to the height H of the heat dissipation fins 22 is between 0.8 and 1. In these embodiments, according to the principle of heat exchange, the airflow blown by the cooling fan 3 needs to have sufficient coverage in the height direction of the heat dissipation fins 22 in order to effectively remove heat. If the fan diameter is too small, the airflow blown by it cannot cover the entire heat dissipation fins 22 well in the height direction, resulting in insufficient airflow for effective heat exchange in the upper or lower parts of the heat dissipation fins 22, thereby reducing the overall heat dissipation efficiency. This may prevent the heat dissipation fins 22 from fully exerting their heat dissipation function, and the heat inside the device cannot be dissipated in time, affecting the normal operation of the device. On the other hand, an excessively large diameter of the cooling fan 3 will exceed the height range of the heat dissipation fins 22, requiring more space to accommodate this excessively large cooling fan 3, which is not conducive to the compact design of the overall structure of the device. At the same time, an excessively large cooling fan 3 may generate unnecessary energy loss and reduce airflow utilization efficiency. The ratio of the diameter of the cooling fan 3 to the height H of the heat sink fins 22 is set between 0.8 and 1. This ratio range ensures that the airflow blown by the cooling fan 3 can cover the entire heat sink fins 22 in the height direction. The cooling airflow can fully exchange heat with the heat sink fins 22 and remove heat, thereby ensuring high heat dissipation efficiency. This allows the heat inside the equipment to be dissipated in time and maintain the normal operating temperature of the equipment. The size of the cooling fan 3 is well matched with the height of the heat sink fins 22, without occupying too much space. This helps to achieve a compact design and improve space utilization. It also avoids excessive power consumption caused by an excessively large diameter of the cooling fan 3, which helps to reduce the overall energy consumption of the equipment, meets energy-saving requirements, and improves the performance of the equipment in terms of power consumption.
[0038] In some embodiments of this application, see Figure 2 Each heat dissipation fin 22 has a connection end 222 connected to the heat dissipation substrate 21 and a top end 223 away from the heat dissipation substrate 21. The thickness of at least one heat dissipation fin 22 gradually decreases from the connection end 222 to the top end 223. In these embodiments, the gradual decrease in thickness of at least one heat dissipation fin 22 from the connection end 222 to the top end 223 forms two inclined or curved sides that are oppositely arranged and connected between the connection end 222 and the top end 223. According to geometric principles, when the heat dissipation fin 22 has inclined or curved sides, its surface area increases within the same height H range compared to a heat dissipation fin 22 with a constant thickness. This is because the inclined or curved sides increase the additional heat dissipation area. According to the principles of heat conduction and heat radiation, a larger heat dissipation area can improve heat dissipation efficiency, making it easier for heat to dissipate into the environment, thereby more effectively reducing the temperature of the device. In some examples, the cross-section of the heat dissipation fin 22 is trapezoidal, which is simple in structure and easy to manufacture.
[0039] This application does not limit the specific location of the cooling fan 3; the cooling fan 3 can also be located on the surface of the sealed housing 1 away from the mounting cavity. See Figure 2 , Figure 4 and Figure 5 In some embodiments of this application, the cooling fan 3 is disposed on the surface of the heat dissipation substrate 21 facing away from the sealed housing 1. In these embodiments, the heat dissipation substrate 21 is disposed on the surface of the sealed housing 1 facing away from the mounting cavity, and the cooling fan 3 is disposed on the surface of the heat dissipation substrate 21 facing away from the sealed housing 1. Since the heat dissipation substrate 21 can quickly conduct heat from the sealed housing 1, the cooling fan 3, while providing cooling airflow to the heat dissipation fins 22, can also drive airflow over a larger area of the heat dissipation substrate 21, effectively dissipating heat from the high-temperature heat dissipation substrate 21, preventing heat accumulation on the heat dissipation substrate 21, and further improving the heat dissipation effect. In addition, the heat dissipation substrate 21 covers the surface of the sealed housing 1 facing away from the mounting cavity, and the cooling fan 3 is mounted on the heat dissipation substrate 21, so that the cooling fan 3 can be compactly installed while the heat dissipation substrate 21 covers a sufficient area of the sealed housing 1. This layout makes full use of the space outside the sealed housing 1, avoids the cooling fan 3 occupying additional space, helps to reduce the overall size of the device, and meets the requirements of device miniaturization. The heat dissipation base plate 21 provides a stable mounting foundation for the cooling fan 3, eliminating the need for additional structures on the sealed enclosure 1 to secure the cooling fan 3. This is more conducive to ensuring the structural integrity and protection level of the sealed enclosure 1. In some examples, the high-voltage box 100 includes a bracket 4, through which the cooling fan 3 is fixedly mounted on the heat dissipation base plate 21.
[0040] In some embodiments of this application, see Figure 1 and Figure 4 Multiple cooling fans 3 are provided, and the multiple cooling fans 3 are arranged along the arrangement direction of the multiple heat dissipation fins 22. In these embodiments, multiple cooling fans 3 are provided and arranged along the arrangement direction of the multiple heat dissipation fins 22. The multiple cooling fans 3 can provide heat dissipation airflow at different positions, making heat dissipation more uniform, increasing the uniformity of heat dissipation, and improving the overall heat dissipation capacity.
[0041] In some embodiments of this application, the high-pressure box 100 further includes a temperature detection device (not shown in the figure) and a control device (not shown in the figure). The temperature detection device is located inside the mounting cavity, and the control device is electrically connected to both the temperature detection device and the cooling fan 3. In these embodiments, the temperature detection device can monitor the temperature inside the mounting cavity in real time. When the temperature changes, the control device can control the speed or start / stop of the cooling fan 3 based on the detected temperature signal. This can save energy while meeting heat dissipation requirements, and improve the technical problem of energy waste or untimely heat dissipation caused by the cooling fan 3's inability to adjust its operating state according to actual temperature requirements. In some examples, multiple cooling fans 3 are provided, and the speed or start / stop of multiple cooling fans 3 is uniformly controlled by the control device. The control logic is simple and easy to implement, reducing the complexity of the control program and lowering the probability of control device failure. In some examples, multiple cooling fans 3 are provided, and the speed or start / stop of each cooling fan 3 is controlled by a separate control device, achieving refined control, improving heat dissipation effect, and saving energy. In some examples, multiple temperature detection devices are provided, distributed within the mounting cavity, which is beneficial for comprehensive monitoring of the temperature inside the mounting cavity. In some examples, the temperature detection device is a temperature sensor wire. In some examples, the high-voltage box 100 is equipped with a BMS (Battery Management System), which acts as the control device for the cooling fan 3. It can control the start, stop, or speed of the cooling fan 3 based on the temperature monitored in real time by the temperature detection device.
[0042] Understandably, the heat dissipation substrate 21 can quickly conduct heat out of the sealed box 1. The part of the sealed box 1 that connects to the heat dissipation substrate 21 is made of a thermally conductive material, such as metal or other non-metals with high thermal conductivity.
[0043] In some embodiments of this application, the high-pressure box 100 further includes a heating element (not shown in the figure, such as a fuse), which is disposed in the mounting cavity; the sealed box body 1 includes a heat-conducting plate 11, the heat dissipation structure 2 is mounted on the heat-conducting plate 11, and the heating element is thermally connected to the heat-conducting plate 11. In these embodiments, the heating element of the high-pressure box 100 is disposed within the mounting cavity. The sealed box 1 includes a heat-conducting plate 11, and the heating element is thermally connected to the heat-conducting plate 11 (either through direct contact or through thermally conductive adhesive or heat sinks). The heat dissipation structure 2 is mounted on the heat-conducting plate 11. The heat-conducting plate 11 provides an efficient path for heat conduction from the heating element. When the heating element is connected to the heat-conducting plate 11 through direct contact, thermally conductive adhesive, or heat sinks, heat can be quickly transferred from the heating element to the heat-conducting plate 11, avoiding disorderly heat diffusion within the mounting cavity. This helps to directionally conduct heat to the heat dissipation structure 2, improving the directionality and efficiency of heat conduction and reducing the impact of heat on other components within the mounting cavity. This helps maintain the normal operating temperature range of other components within the mounting cavity, improves the overall stability of the equipment, and reduces the risk of equipment failure due to localized overheating. In some examples, the heat-conducting plate 11 is a thermally conductive material plate, such as a metal plate or other non-metallic plates with high thermal conductivity.
[0044] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A high pressure tank characterized by, The high-voltage box comprises: a sealed box body provided with a mounting cavity; a heat dissipation structure comprising a heat dissipation base plate and a plurality of heat dissipation fins, the heat dissipation base plate being arranged on a surface of the sealed box body away from the mounting cavity, the plurality of heat dissipation fins being connected to a surface of the heat dissipation base plate away from the sealed box body, the plurality of heat dissipation fins being arranged at intervals, and an air duct being defined between two adjacent heat dissipation fins, the air duct having an inlet and an outlet arranged oppositely; and a heat dissipation fan arranged on a side of the sealed box body away from the mounting cavity, the heat dissipation fan being arranged at least partially opposite to the inlet to provide a heat dissipation airflow capable of passing through the air duct. Each of the heat dissipation fins comprises a first end facing the heat dissipation fan, and a second end away from the heat dissipation fan, wherein a first distance is defined between the heat dissipation fan and the first end in the extension direction of the air duct, and the ratio of the first distance to the diameter of the heat dissipation fan is between 1 and 2.
2. The high pressure tank of claim 1, wherein An extension line of the axis of the heat dissipation fan is located between two adjacent heat dissipation fins.
3. The high pressure tank of claim 1, wherein A second distance is defined between two adjacent heat dissipation fins, and the ratio of the diameter of the heat dissipation fan to the second distance is between 1 and 1.
2.
4. The high pressure tank of claim 3, wherein In the thickness direction of the heat dissipation base plate, the heat dissipation fins have a height H, and the ratio of the diameter of the heat dissipation fan to the height H of the heat dissipation fins is between 0.8 and 1.
5. The high pressure tank of claim 1, wherein Each of the heat dissipation fins has a connecting end connected to the heat dissipation base plate and a top end away from the heat dissipation base plate, and the thickness of at least one of the heat dissipation fins gradually decreases from the connecting end to the top end.
6. The high pressure tank of claim 1, wherein The heat dissipation fan is arranged on the surface of the heat dissipation base plate away from the sealed box body.
7. The high pressure tank of claim 1, wherein A plurality of heat dissipation fans are arranged along the arrangement direction of the plurality of heat dissipation fins.
8. The high pressure tank of claim 1, wherein The high-voltage box further comprises:
9. The high pressure tank according to any one of claims 1 to 8, characterized in that a temperature detection device arranged in the mounting cavity; and a control device electrically connected to the temperature detection device and the heat dissipation fan.
10. The high-voltage box according to any one of claims 1 to 8, wherein the high-voltage box further comprises a heat generating element arranged in the mounting cavity; the sealed box body comprises a heat conduction plate, the heat dissipation structure is arranged on the heat conduction plate, and the heat generating element is in heat conduction connection with the heat conduction plate.