Optical engine based on CPO technology

Abstract

The utility model discloses an optical engine based on the CPO technology, which relates to the technical field of optical communication, and is characterized by comprising a transmitting end module, a receiving end module, a PCB (printed circuit board), an optical fiber connecting line assembly and a shell assembly, wherein the receiving end module comprises multiple groups of receiving end assemblies, the multiple groups of receiving end assemblies are arranged on the front surface of the PCB side by side in an array manner, and each group of receiving end assembly comprises a trans-impedance amplifier TIA chip, a receiving end PIC chip and a receiving end FA optical fiber array; the transmitting terminal module comprises a plurality of groups of transmitting terminal assemblies, and each group of transmitting terminal assembly comprises a driver chip, a transmitting terminal PIC chip, a first transmitting terminal FA optical fiber array and a second transmitting terminal FA optical fiber array; the Driver chip is electrically connected with the transmitting end PIC chip, and the transmitting end PIC chip is in optical coupling connection with the transmitting end FA optical fiber array; and the light engine is electrically connected with external electronic equipment through a Socket PAD on the back surface of the PCB. The device has the characteristics of small size, low performance loss, low power consumption and high reliability.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical engine based on CPO technology. Background Technology

[0002] With the rapid development of artificial intelligence, large-scale distributed cluster training of models poses greater challenges to optical communication networks, particularly placing stringent requirements on the high bandwidth, low loss, low power consumption, and high reliability of optical transceiver modules. Traditional pluggable optical modules integrate optical transmitting devices (TOSA, including lasers), optical receiving devices (ROSA, including photodetectors), functional circuits, and optical (electrical) interfaces into a single structural unit, transmitting data with switches via pluggable connectors. However, traditional pluggable optical modules have several design limitations: increasing transmission rates leads to decreased signal integrity and increased link loss; pursuing more transmission channels and smaller dimensions results in increasingly crowded internal space, increasing the difficulty of optoelectronic device layout design and causing serious heat dissipation problems; simultaneously, high-density integration increases the risk of device failure and reduces system reliability. Utility Model Content

[0003] In view of the problems existing in the prior art, the purpose of this utility model is to provide a light engine based on CPO technology, which is characterized by small size, low performance loss, low power consumption and high reliability.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an optical engine based on CPO technology, comprising a transmitter module, a receiver module, a PCB board, an optical fiber connector assembly, and a housing assembly; the optical fiber connector assembly is disposed on one side of the PCB board for extracting the optical signal from the optical engine; the housing assembly is disposed outside the PCB board for wrapping and protecting the PCB board; the transmitter module and the receiver module are disposed on the front side of the PCB board; wherein, the receiver module comprises multiple sets of receiver components, which are arranged in a parallel array on the front side of the PCB board, and each set of receiver components includes a transimpedance amplifier (TIA) chip, a receiver PIC chip, and a receiver FA fiber array; the transimpedance amplifier... The transceiver TIA chip is electrically connected to the receiver PIC chip, and the receiver PIC chip is optically coupled to the receiver FA fiber array. The transmitter module includes multiple sets of transmitter terminal assemblies, which are arranged side-by-side on the front of the PCB board. Each set of transmitter terminal assemblies includes a driver chip, a transmitter PIC chip, a first transmitter FA fiber array, and a second transmitter FA fiber array. The driver chip is electrically connected to the transmitter PIC chip, and the first and second transmitter FA fiber arrays are optically coupled to the transmitter PIC chip, respectively. The optical engine is electrically connected to external electronic devices through a socket pad on the back of the PCB board.

[0005] Furthermore, the transimpedance amplifier (TIA) chip is electrically connected to the receiver PIC chip via wire bonding; the driver chip is electrically connected to the transmitter PIC chip via wire bonding.

[0006] Furthermore, the receiving optical fiber is optically coupled to the receiving end PIC chip via a V-groove coupling method.

[0007] Furthermore, the first transmitting optical fiber is optically coupled to the transmitting PIC chip via a V-groove coupling method; the second transmitting optical fiber is optically coupled to the transmitting PIC chip via a V-groove coupling method.

[0008] Furthermore, the optical fiber connector assembly includes a first optical fiber connector, a second optical fiber connector, and a third optical fiber connector; the receiving optical fiber is led out through the first optical fiber connector, the first transmitting optical fiber is led out through the second optical fiber connector, and the second transmitting optical fiber is led out through the third optical fiber connector.

[0009] Furthermore, the optical engine is electrically connected to external electronic devices via a Socket PAD on the back of the PCB board. Specifically, a socket area is provided on the back of the PCB board, and multiple Socket PADs are provided in the socket area. The Socket PADs are used to make electrical connections with external switches.

[0010] Furthermore, the Socket PAD includes a power supply PAD, a high-speed signal PAD, and a low-speed signal PAD; wherein, the high-speed signal input / output terminals of the transimpedance amplifier (TIA) chip or driver chip are connected to the high-speed signal PAD of the Socket after being blocked by an AC capacitor; when the pads of the AC capacitor and the high-speed signal PAD in the Socket PAD are placed vertically overlapping, the electrical connection between the pads of the AC capacitor and the high-speed signal PAD is achieved through PCB vias.

[0011] Furthermore, the housing assembly includes at least a first housing, a second housing, and a third housing, which are detachably connected; the first housing is disposed above the PCB board and can cover the front of the PCB board and the devices and optical fibers located on the front of the PCB board; the second housing is provided with at least a second PCB board cavity for accommodating the PCB board and a second optical fiber cavity for accommodating the optical fiber; and the third housing at least covers the outer periphery of the mating body formed by the cooperation of the first housing and the second housing.

[0012] Furthermore, it also includes a fourth housing, which is disposed below the second housing, and the fourth housing is provided with a through hole for socket connection.

[0013] Furthermore, the fiber optic connector assembly is provided with a flange, and the first housing and the second housing are respectively provided with an upper flange groove and a lower flange groove. When the first housing and the second housing are fitted together, the upper flange groove and the lower flange groove form a complete flange groove, and the flange of the fiber optic connector assembly is fixed between the first housing and the second housing through the flange groove.

[0014] The beneficial effects of this utility model are as follows: Compared with other models, the CPO optical engine provided by this utility model is smaller, which allows the host side to integrate more CPO optical engines, achieve greater data throughput, ensure the reliability of CPO optical engines, can be flexibly placed, has a shorter communication link, achieves lower loss, and reduces overall communication power consumption and insertion loss. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the light engine structure of this utility model;

[0016] Figure 2This is an exploded view of the structure of the light engine of this utility model;

[0017] Figure 3 This is a structural diagram used to display the PCB board and housing assembly;

[0018] Figure 4 This is a schematic diagram of the front structure of the PCB board of this utility model;

[0019] Figure 5 This is a schematic diagram showing the structure of the receiver PIC chip and the receiver FA fiber array.

[0020] Figure 6 This is a schematic diagram showing the structure of the transmitter PIC chip and the transmitter FA fiber array.

[0021] Figure 7 This is a schematic diagram of the back of the PCB board of this utility model.

[0022] Figure 8 This is a schematic diagram of the structure of the first housing of this utility model;

[0023] Figure 9 This is a schematic diagram of the structure of the second shell of this utility model;

[0024] Figure 10 This is a schematic diagram of the structure of the third housing of this utility model.

[0025] Reference numerals: 1. Receiver module; 11. Receiver assembly; 111. Transimpedance amplifier (TIA) chip; 112. Receiver PIC chip; 1121. Fourth V-groove; 113. Receiver FA fiber array; 1131. First substrate; 1132. First cover plate; 1133. Receiver-side fiber; 114. First cover; 2. Transmitter module; 21. Transmitter terminal assembly; 211. Driver chip; 212. Transmitter PIC chip; 2121. Fifth V-groove; 2122. Sixth V-groove; 213. First transmitter FA fiber array; 2131. Second substrate; 2132. Second cover plate; 2133. First transmitter-side fiber; 214. Second transmitter FA fiber array; 2142 1. Third cover plate; 2143. Second transmitting side optical fiber; 215. Second cover; 216. Third cover; 3. PCB board; 31. Positioning groove; 32. Socket PAD; 4. Optical fiber connection cable assembly; 41. First optical fiber connection cable; 42. Second optical fiber connection cable; 43. Third optical fiber connection cable; 5. Housing assembly; 51. First housing; 511. First PCB board cavity; 512. First device cavity; 513. First optical fiber cavity; 52. Second housing; 522. Second PCB board cavity; 523. Second optical fiber cavity; 53. Third housing; 531. Flange; 54. Fourth housing; 542. Second device cavity; 7. Waveguide adhesive; 8. UV adhesive; 9. Flange; 101. Upper flange groove; 102. Lower flange groove. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the figures, and the terms "bottom surface" and "top surface," "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0029] Existing optical engine technology refers to the integration of an optical transmitting device (TOSA, including a laser), an optical receiving device (ROSA, including a photodetector), functional circuitry, and an optical (electrical) interface into a single structural unit. The optical engine transmits data to the switch via a pluggable connector. However, with the rapid development of artificial intelligence, large-scale distributed cluster training of models poses greater challenges to optical communication networks, especially in terms of high bandwidth, low loss, low power consumption, and high reliability. This indirectly demands increasingly higher transmission rates, more transmission channels, smaller dimensions, and higher transmission link losses for traditional pluggable optical modules; consequently, this leads to cramped internal space within the optical module, highlighting heat dissipation and reliability issues.

[0030] To address the problems existing in the prior art, this utility model provides an optical engine based on CPO technology, comprising: a transmitter module, a receiver module, a PCB board, an optical fiber connector assembly, and a housing assembly; the optical fiber connector assembly is disposed on one side of the PCB board and is used to extract the optical signal of the optical engine; the housing assembly is disposed outside the PCB board and is used to wrap and protect the PCB board.

[0031] like Figures 1-3 As shown, the transmitter module 2 and the receiver module 1 are disposed on the front side of the PCB board 3. The transmitter module 2 is located on the side closer to the fiber optic connector assembly 4, and the receiver module 1 is located on the side farther away from the fiber optic connector assembly 4.

[0032] like Figure 3 , Figure 4 As shown, the receiver module 1 includes multiple receiver components 11, which are arranged side-by-side on the front side of the PCB board 3. Each receiver component 11 includes a transimpedance amplifier (TIA) chip 111, a receiver PIC chip 112, and a receiver FA fiber array 113. The TIA chip 111 is electrically connected to the PIC chip 112, and the PIC chip 112 is optically coupled to the FA fiber array 113. The TIA chip 111 is positioned on the PCB board 3 away from the fiber optic connector assembly 4, relative to the PIC chip 112.

[0033] Specifically, the transimpedance amplifier (TIA) chip and the receiver PIC chip are electrically connected via wire bonding. Wire bonding is a common method for connecting chips using gold wires, achieving electrical connection between chips by connecting the chip's pins with gold wires. In this invention, the electrical connection between the transimpedance amplifier (TIA) chip and the receiver PIC chip is achieved through wire bonding. Wire bonding is a simple and low-cost method, suitable for chips with small-pitch pins. During the wire bonding process, a low-dielectric-constant insulating adhesive can be used to protect the gold wires, facilitating fiber optic routing and top heat dissipation for the wire-bonded chip.

[0034] Specifically, such as Figure 5 As shown, the receiving-end FA fiber array 113 includes a first substrate 1131, a first cover plate 1132, and a receiving-side fiber 1133. A first V-groove is provided on the first substrate 1131 or the first cover plate 1132, and the receiving-side fiber 1133 is fixed between the first substrate 1131 and the first cover plate 1132 through the first V-groove. The receiving-side fiber 1133 is optically coupled to the receiving-end PIC chip 112.

[0035] Preferably, the receiving optical fiber is optically coupled to the receiving end PIC chip via a V-groove coupling method. For example... Figure 5 As shown, the receiving-side PIC chip 112 has a first optical coupling region for optical coupling with the receiving-side optical fiber. A fourth V-groove 1121 is arrayed within the first optical coupling region. The receiving-side optical fiber 1133 is disposed within the fourth V-groove 1121, with the fiber core of the receiving-side optical fiber 1133 contacting the inner wall of the fourth V-groove 1121. A first cover 114 is disposed above the first optical coupling region, covering the fourth V-groove 1121. The bottom surface of the first cover 114 is bonded to the receiving-side PIC chip 112 using UV adhesive 8. Waveguide glue 7 is also disposed between the bottom surface of the first cover 114 and the receiving-side PIC chip 112. The waveguide glue 7 is disposed at the end of the receiving-side optical fiber 1131 and at least serves to fill the gap between the end face of the receiving-side optical fiber 1131 and the receiving-side PIC chip 112. The waveguide adhesive 7 can fix the relative position of the receiving-side optical fiber 1131 and the receiving-end PIC chip 112, preventing changes in their relative positions and ensuring the coupling quality between the fiber end face and the PIC chip end face. In a specific embodiment, the waveguide adhesive can be made of a conventional optical adhesive with high light transmittance. The first cover is made of silicon dioxide.

[0036] In one specific embodiment, to ensure that the height difference between the portion of the receiving optical fiber within the fourth V-groove and the portion between the first substrate and the first cover plate is within a preset range, a spacer is provided on the first substrate. The spacer is positioned between the first substrate and the PCB board. The height and tilt angle of the spacer are set to appropriate values ​​to ensure that the receiving optical fiber can fan out within its bending radius. The spacer is made of a material with good mechanical strength and wear resistance, such as metal or engineering plastic.

[0037] like Figure 3 , 4 As shown, the transmitter module 2 includes multiple sets of transmitter terminal assemblies 21, which are arranged side-by-side on the front side of the PCB board 3. Each set of transmitter terminal assemblies 21 includes a driver chip 211, a transmitter PIC chip 212, a first transmitter FA fiber array 213, and a second transmitter FA fiber array 214. The driver chip 211 is electrically connected to the transmitter PIC chip 212, and the first transmitter FA fiber array 213 and the second transmitter FA fiber array 214 are optically coupled to the transmitter PIC chip 212, respectively.

[0038] Preferably, a suitable distance is reserved between adjacent transmitter FA fiber arrays to accommodate the receiver-side fiber, facilitating optical coupling between the receiver-side fiber and the receiver-side PIC chip, while ensuring that the receiver-side fiber can fan out within its bending radius. Those skilled in the art will understand that the distance between transmitter FA fiber arrays can be adjusted according to actual conditions to meet the design requirements of different optical engines. Similarly, on the receiver side…

[0039] Specifically, the driver chip and the transmitter PIC chip are electrically connected via wire bonding. Similarly, during the wire bonding process, a low-dielectric-constant insulating adhesive can be used to protect the gold wires.

[0040] Specifically, such as Figure 6As shown, the first transmitter FA fiber array 213 includes a second substrate 2131, a second cover plate 2132, and a first transmitter-side fiber 2133; a second V-groove is provided on the second substrate 2131 or the second cover plate 2132, and the first transmitter-side fiber 2133 is fixed between the second substrate 2131 and the second cover plate 2132 through the second V-groove. The second transmitter FA fiber array 214 includes a third substrate, a third cover plate 2142, and a second transmitter-side fiber 2143; a third V-groove is provided on the third substrate or the third cover plate 2143, and the second transmitter-side fiber 2143 is fixed between the third substrate and the third cover plate through the third V-groove. The first transmitter-side fiber 2133 and the second transmitter-side fiber 2143 are optically coupled to the transmitter PIC chip 212.

[0041] Specifically, the first transmitting optical fiber is optically coupled to the transmitting end PIC chip via a V-groove coupling method. For example... Figure 6 As shown, the transmitting PIC chip 212 has a second optical coupling region for optical coupling with the first transmitting optical fiber. A fifth V-groove 2121 is arrayed within the second optical coupling region, and the first transmitting optical fiber 2133 is disposed within the fifth V-groove 2121, with the fiber core of the first transmitting optical fiber 2133 contacting the inner wall of the fifth V-groove 2121. A second cover 215 is disposed above the second optical coupling region, covering the fifth V-groove 2121. The bottom surface of the second cover 215 is bonded to the transmitting PIC chip 212 using UV adhesive 8. Waveguide adhesive 7 is also disposed between the bottom surface of the second cover 215 and the transmitting PIC chip 212, located at the end of the first transmitting optical fiber 2133, and at least used to fill the gap between the end face of the first transmitting optical fiber 2133 and the transmitting PIC chip 212. The arrangement of the waveguide adhesive and the second cover here is similar to that of the waveguide adhesive and the first cover on the receiver PIC chip described above, and will not be repeated here.

[0042] In one specific embodiment, similarly, to ensure that the height difference between the portion of the first transmitting optical fiber within the fifth V-groove and the portion between the second substrate and the second cover plate is within a preset range, a pad is provided under the second substrate. The arrangement of the pad under the second substrate is similar to that under the first substrate and will not be described again.

[0043] Specifically, the second transmitting optical fiber is also optically coupled to the transmitting end PIC chip via a V-groove coupling method. For example... Figure 6As shown, the transmitting PIC chip 212 has a third optical coupling region for optical coupling with the second transmitting optical fiber 2143. A sixth V-groove 2122 is arrayed within the third optical coupling region, and the second transmitting optical fiber 2143 is disposed within the sixth V-groove 2122, with the fiber core of the second transmitting optical fiber 2143 contacting the inner wall of the sixth V-groove 2122. A third cover is disposed above the third optical coupling region, covering the sixth V-groove 2122. The bottom surface of the third cover is bonded to the transmitting PIC chip 212 using UV adhesive 8. Waveguide adhesive 7 is also disposed between the bottom surface of the third cover and the transmitting PIC chip 212, located at the end of the second transmitting optical fiber 2143, and at least used to fill the gap between the end face of the second transmitting optical fiber 2143 and the transmitting PIC chip 212. The arrangement of the waveguide adhesive and the third cover here is similar to that of the waveguide adhesive and the first cover on the receiving PIC chip described above, and will not be repeated here.

[0044] By adopting the above technical solution, the coupling method between the receiver PIC chip, the transmitter PIC chip and the corresponding optical fiber adopts V-groove coupling. Compared with the traditional end-face coupling method, this avoids the need for PCB board cutouts, ensures PCB board layout space, and helps to reduce size. At the same time, the V-groove coupling method can ensure the coupling quality between the optical fiber end face and the PIC chip end face, improving the performance of the optical engine.

[0045] In one specific embodiment, similarly, to ensure that the height difference between the portion of the second transmitting optical fiber within the sixth V-groove and its portion between the third substrate and the third cover plate is within a preset range, a pad is provided on the third substrate. The arrangement of the pad under the third substrate is similar to that of the pad under the first substrate, and will not be described again. This height difference within the preset range ensures that the optical fiber can fan out within its bending radius.

[0046] Specifically, such as Figure 3 As shown, the fiber optic connector assembly 4 includes a first fiber optic connector 41, a second fiber optic connector 42, and a third fiber optic connector 43.

[0047] The aforementioned receiving-side optical fiber is led out through a first optical fiber connector, the aforementioned first transmitting-side optical fiber is led out through a second optical fiber connector, and the aforementioned second transmitting-side optical fiber is led out through a third optical fiber connector. Specifically, "led out through optical fiber connectors" refers to assembling optical fibers into corresponding optical fiber connectors and leading out the optical engine through these connectors. Technicians can install optical fiber connectors on these connectors for optical communication connections with other external photonic modules. Specifically, the first optical fiber connector is used to connect to an external photonic module to achieve multi-channel optical signal reception; one of the second and third optical fiber connectors is used to connect to an external finished laser module, and the other is used to connect to an external photonic module to achieve multi-channel optical signal transmission. Those skilled in the art will readily understand that the first, second, and third optical fiber connectors can be selected with appropriate models to connect with other modules according to the actual switch application scenario.

[0048] In one specific embodiment, four 4-channel 4x100G transimpedance amplifier (TIA) chips are used, along with four 4-channel 4x100G receiver PIC chips. Simultaneously, four 4-channel 4x100G driver chips are used, along with four 4-channel 4x100G transmitter PIC chips.

[0049] By adopting the above technical solution, this invention replaces the built-in laser with an external pre-built laser, allowing the use of an external pre-built laser module as the light source. This significantly reduces the heat dissipation pressure on the optical engine and improves its reliability. The optical engine of this invention does not include the DSP signal processing chip found in traditional optical engines, thus further reducing the size of the optical engine, lowering costs, reducing signal noise, reducing power consumption, and improving the performance of the optical engine. Simultaneously, the transimpedance amplifier (TIA) chip, with its inherent equalization capability, compensates for the performance degradation caused by removing the DSP.

[0050] This invention provides a Co-Packaged Optics (CPO) optical engine. Unlike traditional pluggable optical modules, it integrates a photonic integrated circuit (PIC) and an electronically driven integrated circuit (EIC) on the same substrate and then connects them to a host ASIC. The CPO optical engine moves unnecessary functional circuits (such as power supply circuits and laser circuits) to the host side, making it smaller and allowing for the integration of more CPO optical engines on the host side, thus achieving higher data throughput. Furthermore, this invention removes the laser and uses an external laser source, significantly reducing the heat dissipation burden of the CPO and ensuring its reliability. Compared to traditional pluggable optical modules, which can only have their connectors placed around the switch board, the CPO optical engine of this invention is connected to the host dedicated integrated circuit chip on the same substrate, allowing for flexible placement. This eliminates the positional limitations of traditional pluggable optical modules, resulting in a shorter communication link between the host dedicated integrated circuit chip and the CPO optical engine, achieving lower losses and reducing overall communication power consumption.

[0051] Specifically, such as Figure 4 , 7 As shown, the PCB board 3 is rectangular, with positioning slots 31 on both the left and right sides to facilitate high-precision positioning with the housing assembly; a certain width is reserved along the edge of the PCB board 3 to prevent the placement of components and wiring, and it is only used for pressing and assembling with the housing assembly.

[0052] The PCB board has a multi-layer structure, and the optical engine is electrically connected to external electronic devices via a socket pad on the back of the PCB board. Specifically, for example... Figure 7 As shown, a socket area is provided on the back of PCB board 3, and multiple Socket PAD32s are arranged in the socket area for electrical connection with external switches. Through the internal circuitry of the PCB board, the Socket PADs are electrically connected to components on the front of the PCB board, such as the transmitter PIC chip, receiver PIC chip, driver chip, and transimpedance amplifier (TIA) chip. This technical solution, combined with the socket connection, significantly shortens the path for high-speed electrical signal transmission between the optical engine and external electronic devices, greatly reducing insertion loss and making it possible to eliminate the DSP signal processing chip, thereby further reducing cost, size, and power consumption.

[0053] Preferably, the aforementioned Socket PAD includes a power supply PAD, a high-speed signal PAD, and a low-speed signal PAD. The high-speed signal input / output terminals of the transimpedance amplifier (TIA) chip or driver chip are connected to the high-speed signal PAD in the Socket PAD after DC blocking by an AC capacitor. When the AC capacitor pads and the high-speed signal PAD in the Socket PAD are positioned vertically overlapping, electrical connection between the AC capacitor pads and the high-speed signal PAD is achieved through PCB vias. The high-speed signal PAD and AC capacitor pads in the aforementioned Socket PAD coincide on both sides of the PCB board; that is, the projection of the AC capacitor pads on the front side of the PCB board onto the back side of the PCB board coincides with the projection of the Socket PAD on the back side of the PCB board. By adopting the above technical solution, the length of the high-speed signal trace is shortened, and signal impedance discontinuities are designed together for impedance optimization, effectively reducing return loss.

[0054] As will be readily understood by those skilled in the art, the location and number of pads can be adjusted according to actual conditions to meet the design requirements of different optical engines. However, it is important to note that high-speed pads should be distributed as far below the corresponding high-speed chips as possible to reduce the transmission path of high-speed electrical signals and minimize insertion loss.

[0055] It will be readily understood by those skilled in the art that, apart from the receiver and transmitter components, the placement and wiring of other components on the PCB board can be adjusted according to actual conditions to meet the design requirements of different optical engines. However, it should be noted that components can be placed on the front or back of the PCB board; when placed on the back of the PCB board, a certain distance must be maintained from the socket area to prevent accidental short circuits during socket connection.

[0056] By adopting the above technical solution, the optical engine of this utility model uses a socket connection to replace the traditional pluggable connection for electrical connection, which shortens the path of high-speed electrical signal transmission between the optical engine and external electronic devices, reduces insertion loss, and at the same time reduces the size of the optical engine.

[0057] like Figures 1-2 As shown, the housing assembly 5 is disposed on the outside of the PCB board 3. The housing assembly 5 includes at least a first housing 51, a second housing 52 and a third housing 53, which are detachably connected.

[0058] like Figure 2 , Figure 8As shown, the first housing 51 is disposed above the PCB board 3, capable of covering the front side of the PCB board 3 and the devices and optical fibers located on the front side of the PCB board 3. The first housing 51 is provided with at least a first PCB board cavity 511 for accommodating the PCB board, a first device cavity 512 for accommodating the devices on the front side of the PCB board, and a first optical fiber cavity 513 for accommodating the optical fibers. The aforementioned first PCB board cavity 511, first device cavity 512, and first optical fiber cavity 513 can be formed as follows: Figure 8 The cavity shown can also be formed into multiple cavities; the specific number and size of the cavities can be adjusted according to the actual situation. The components on the front of the PCB board include the transmitter PIC chip, the receiver PIC chip, the driver chip, and the transimpedance amplifier (TIA) chip, etc.

[0059] like Figure 2 , Figure 9 As shown, the second housing 52 is provided with at least a second PCB board cavity 522 for accommodating the PCB board 3 and a second optical fiber cavity 523 for accommodating the optical fiber on the front side of the PCB board 3. The aforementioned second PCB board cavity and second optical fiber cavity can be formed as a single cavity or as multiple cavities; the specific number and size of the cavities can be adjusted according to actual conditions. It is readily understood by those skilled in the art that, depending on different design requirements, the depth of the second PCB board cavity may not penetrate the upper and lower surfaces of the second housing, forming only a groove, or it may penetrate the upper and lower surfaces of the second housing, forming a hole.

[0060] In a specific embodiment, such as Figure 2 , Figure 9 As shown, the second PCB cavity 522 extends through the upper and lower surfaces of the second housing 52. In this case, the PCB board 3 is housed within the second PCB cavity 522. Preferably, as shown... Figure 2 As shown, a fourth housing 54 is provided below the second housing 52. The fourth housing 54 has a through hole for socket connection, so that external electronic devices can be electrically connected to the socket PAD on the back of the PCB board 3 through the through hole. The fourth housing also has a second device cavity 542 for accommodating devices on the back of the PCB board 3.

[0061] By adopting the above technical solution, using a fourth shell to wrap the PCB board and drilling holes in the Socket area to avoid the Socket PAD, the shielding effect of the CPO optical engine can be improved, and the contact area between the shell and the PCB board can be increased, thereby increasing the reliability of the shell wrapping.

[0062] It is readily understood by those skilled in the art that, depending on different design requirements, the depth of the second device cavity 542 may not penetrate the upper and lower surfaces of the fourth housing, forming a groove, or it may penetrate the upper and lower surfaces of the fourth housing, forming a groove. Figure 2 The image shows a hole.

[0063] Preferably, such as Figure 2 , Figure 7 , Figure 8 As shown, the fiber optic connector assembly is provided with a flange 9. The first housing 51 and the second housing 52 are respectively provided with an upper flange groove 101 and a lower flange groove 102. When the first housing and the second housing are engaged, the upper flange groove 101 and the lower flange groove 102 form a complete flange groove. The flange 9 of the fiber optic connector assembly 4 is fixed between the first housing 51 and the second housing 52 through the flange groove, thereby fixing the fiber optic connector assembly 4 between the first housing 51 and the second housing 52. In one specific embodiment, the first, second, and third optical fiber connectors are respectively provided with a first flange, a second flange, and a third flange. The first housing is provided with a first upper flange groove, a second upper flange groove, and a third upper flange groove, and the second housing is provided with a first lower flange groove, a second lower flange groove, and a third lower flange groove. When the first and second housings are mated, the first upper flange groove and the first lower flange groove, the second upper flange groove and the second lower flange groove, and the third upper flange groove and the third lower flange groove form complete flange grooves. The first flange, the second flange, and the third flange are fixed between the first and second housings through different flange grooves, thereby fixing the first, second, and third optical fiber connectors between the first and second housings. It will be readily understood by those skilled in the art that the first, second, and third optical fiber connectors can also share flanges, and the location and number of flanges can be adjusted according to actual conditions to meet the design requirements of different optical engines.

[0064] In the above embodiments, those skilled in the art will readily understand that the upper flange groove of the first housing can form a single groove with the PCB board cavity, device cavity, and fiber optic cavity, or it can be formed as multiple grooves. The specific number and size of the grooves can be adjusted according to actual conditions. Similarly, the lower flange groove of the second housing can also form a single groove with the PCB board cavity, device cavity, and fiber optic cavity, or it can be formed as multiple grooves. The specific number and size of the grooves can be adjusted according to actual conditions.

[0065] like Figure 2 , Figure 10As shown, the third housing 53 is at least used to enclose the outer periphery of the mating body formed by the first housing 51 and the second housing 52. The second housing 52 is connected to the first housing 51 by a threaded structure. A snap-fit ​​structure is provided between the first housing 51 and the third housing 53 to securely connect them. In one specific embodiment, the fourth housing 54 is pressed and fixed between the flanges 531 of the second housing 52 and the third housing 53. It will be readily understood by those skilled in the art that the connection method between the housing components can be adjusted according to actual conditions to meet different design requirements of the optical engine.

[0066] In summary, the advantages of this invention are as follows: 1) Replacing the built-in laser with an external pre-built laser allows the use of an external pre-built laser module to provide the light source, greatly reducing the heat dissipation pressure on the optical engine and improving its reliability. 2) The coupling method between the receiver PIC chip, the transmitter PIC chip, and the corresponding optical fiber adopts a V-groove coupling method. Compared with the traditional end-face coupling method, this avoids the need for PCB board cutouts, ensuring PCB board layout space and facilitating size reduction. Simultaneously, the V-groove coupling method ensures the coupling quality between the optical fiber end face and the PIC chip end face, improving the performance of the optical engine. 3) Using a socket connection instead of the traditional pluggable connection for electrical connection shortens the path for high-speed electrical signal transmission between the optical engine and external electronic devices, reducing insertion loss. It also reduces the size of the optical engine and lowers power consumption. 4) It offers good shielding and a highly reliable housing.

[0067] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of the utility model without departing from the scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A light engine based on CPO technology, characterized by: The optical engine comprises a transmitting end module, a receiving end module, a PCB board, an optical fiber connecting line assembly and a shell assembly; the optical fiber connecting line assembly is arranged on one side of the PCB board and used for leading out optical signals of the optical engine; the shell assembly is arranged outside the PCB board and used for wrapping and protecting the PCB board; The transmitting end module and the receiving end module are arranged on the front surface of the PCB board; The receiving end module comprises a plurality of receiving end assemblies, and the plurality of receiving end assemblies are arranged side by side on the front surface of the PCB board; each receiving end assembly comprises a transimpedance amplifier (TIA) chip, a receiving end PIC chip and a receiving end FA optical fiber array; the TIA chip is electrically connected with the receiving end PIC chip, and the receiving end PIC chip is optically coupled with the receiving end FA optical fiber array; The transmitting end module comprises a plurality of transmitting end sub-assemblies, and the plurality of transmitting end sub-assemblies are arranged side by side on the front surface of the PCB board; each transmitting end sub-assembly comprises a driver chip, a transmitting end PIC chip, a first transmitting end FA optical fiber array and a second transmitting end FA optical fiber array; the driver chip is electrically connected with the transmitting end PIC chip, and the first transmitting end FA optical fiber array and the second transmitting end FA optical fiber array are respectively optically coupled with the transmitting end PIC chip; The optical engine is electrically connected with an external electronic device through a socket PAD on the back surface of the PCB board; The receiving end FA optical fiber array comprises a first base plate, a first cover plate and a receiving side optical fiber; The first transmitting end FA optical fiber array comprises a second base plate, a second cover plate and a first transmitting side optical fiber; The second transmitting end FA optical fiber array comprises a third base plate, a third cover plate and a second transmitting side optical fiber. The TIA chip is electrically connected with the receiving end PIC chip through wire bonding, and the driver chip is electrically connected with the transmitting end PIC chip through wire bonding.

2. The light engine of claim 1, wherein: The receiving side optical fiber is optically coupled with the receiving end PIC chip through a V-shaped groove coupling mode.

3. The light engine of claim 1, wherein: The first transmitting side optical fiber is optically coupled with the transmitting end PIC chip through a V-shaped groove coupling mode, and the second transmitting side optical fiber is optically coupled with the transmitting end PIC chip through a V-shaped groove coupling mode.

4. The light engine of claim 1, wherein: The optical fiber connecting line assembly comprises a first optical fiber connecting line, a second optical fiber connecting line and a third optical fiber connecting line; the receiving side optical fiber is led out through the first optical fiber connecting line, the first transmitting side optical fiber is led out through the second optical fiber connecting line, and the second transmitting side optical fiber is led out through the third optical fiber connecting line.

5. The light engine of claim 1, wherein: The optical engine is electrically connected with an external electronic device through a socket PAD on the back surface of the PCB board, specifically, a socket area is arranged on the back surface of the PCB board, a plurality of socket PADs are arranged in the socket area, and the socket PADs are used for electrically connecting with an external switch.

6. The light engine of any of claims 1-5, wherein: ​ 7. The light engine of claim 6, wherein: The Socket PAD includes a power supply type PAD, a high-speed signal type PAD and a low-speed signal type PAD; wherein the high-speed signal input / output end of a trans-impedance amplifier TIA chip or a driver chip is connected to the Socket high-speed signal type PAD after AC capacitor direct-current isolation processing; when the pads of the AC capacitor and the high-speed signal type PAD in the Socket PAD are placed on top of each other, the electrical connection between the pads of the AC capacitor and the high-speed signal type PAD is realized through a PCB via hole.

8. The light engine of any of claims 1-5, wherein: The shell assembly includes at least a first shell, a second shell and a third shell, and the first shell, the second shell and the third shell are detachably connected; the first shell is arranged above the PCB board and can cover the front surface of the PCB board and the devices and optical fibers located on the front surface of the PCB board; the second shell is provided with at least a second PCB board cavity for accommodating the PCB board and a second optical fiber cavity for accommodating the optical fiber; and the third shell at least wraps the outer periphery of the fitting body formed by the first shell and the second shell.

9. The light engine of claim 8, wherein: The fourth shell is further included, which is arranged below the second shell and is provided with a through hole for Socket connection.

10. The light engine of claim 8, wherein: The optical fiber connection line assembly is provided with a flange, and the first shell and the second shell are respectively provided with an upper flange groove and a lower flange groove; when the first shell and the second shell are matched, the upper flange groove and the lower flange groove form a complete flange groove, and the flange of the optical fiber connection line assembly is fixed between the first shell and the second shell through the flange groove.

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