High-frequency multilayer circuit board

Abstract

The utility model provides a high-frequency multilayer circuit board, which relates to the technical field of high-frequency circuit boards and comprises a high-frequency multilayer circuit board body, and four corners of the high-frequency multilayer circuit board body are provided with mounting holes in a penetrating manner. According to the utility model, the mounting hole corresponds to the position of the convenient mounting and dismounting assembly and moves downwards, and when the high-frequency multilayer circuit board body touches the clamping block, the high-frequency multilayer circuit board body continues to move downwards; the clamping block moves towards the interior of the mounting column under the pressure of the high-frequency multi-layer circuit board body, the spring is extruded by the first rotating plate and the second rotating plate to deform, and after the high-frequency multi-layer circuit board body moves to the surface of the top of the lifting column, the clamping block is not subjected to the pressure of the high-frequency multi-layer circuit board body at the moment; by adopting the design, workers do not need to install the high-frequency multilayer circuit board by using screws, so that the labor intensity of the workers is reduced, and meanwhile, the circuit board is prevented from being damaged due to excessive installation force by using the screws.

Description

Technical Field

[0001] This utility model relates to the field of high-frequency circuit board technology, and in particular to high-frequency multilayer circuit boards. Background Technology

[0002] High-frequency circuit boards are special circuit boards with high electromagnetic frequencies. Generally speaking, high frequency can be defined as a frequency above 1 GHz. They have very high requirements for various physical properties, precision, and technical parameters. They are often used in automotive collision avoidance systems, satellite systems, radio systems, and other fields. Multilayer circuit boards are a product of the development of electronic technology towards high speed, multifunctionality, large capacity, and small size. Therefore, high-frequency multilayer circuit boards are particularly needed.

[0003] However, in the existing technology, when installing high-frequency multilayer circuit boards, most of the time screws are used to install the high-frequency multilayer circuit boards onto the mounting plate. However, when installing screws, excessive force may be used, which may damage the low-impedance multilayer circuit boards. At the same time, the screw installation method is relatively troublesome and increases the labor intensity of workers. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high-frequency multilayer circuit board, comprising: a high-frequency multilayer circuit board body, wherein mounting holes are provided through the four corners of the high-frequency multilayer circuit board body, and convenient installation and disassembly components are provided on the bottom surfaces of the four mounting holes, and lifting components are provided at the bottom of the four convenient installation and disassembly components, and mounting plates are threaded onto the bottom of the four lifting components.

[0006] In a preferred embodiment, the convenient installation and disassembly assembly includes an installation column, with a locking block movable groove extending through both sides inside the installation column. Limiting columns are fixedly connected to both sides of the bottom inside the installation column, and a rotating plate one and a rotating plate two are sleeved on the surface of the limiting columns.

[0007] In a preferred embodiment, a locking block is fixedly connected to one side of both rotating plate one and rotating plate two, a spring is fixedly connected to the top of the opposite sides of rotating plate one and rotating plate two, and a lever is fixedly connected to the top of both rotating plate one and rotating plate two.

[0008] In a preferred embodiment, the surfaces of the two card blocks are movably embedded inside the two card block movable slots.

[0009] In a preferred embodiment, the lifting assembly includes lifting columns, each with a threaded hole at its top and threads on its bottom surface, with the bottom threads of the four lifting columns embedded inside the four corners of the mounting plate.

[0010] In a preferred embodiment, the surfaces of the four mounting posts are movably embedded inside the four mounting holes, the surfaces of the bottom of the eight clips can be tightly fitted to the surface of the high-frequency multilayer circuit board body, and the surfaces of the bottom of the four mounting posts are threadedly embedded inside the four threaded holes.

[0011] In a preferred embodiment, the top surfaces of the four raised pillars are tightly fitted to the bottom of the high-frequency multilayer circuit board body.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] This invention involves first installing the lifting components and the convenient installation / removal components. The threads of the four lifting components are screwed into the four threaded holes on the surface of the mounting plate. Then, the bottom surfaces of the mounting posts of the four convenient installation / removal components are screwed into the four threaded holes respectively. The high-frequency multilayer circuit board body is placed above the four convenient installation / removal components, aligning the mounting holes with the positions of the convenient installation / removal components. The high-frequency multilayer circuit board body is moved downwards, causing the four convenient installation / removal components to be embedded inside the four mounting holes. The high-frequency multilayer circuit board body continues to move downwards. When the high-frequency multilayer circuit board body touches the locking block, it continues to move downwards. Under the pressure of the high-frequency multilayer circuit board body, the locking block moves inwards towards the mounting post. Simultaneously, rotating plates one and two, under the pressure of the locking block,... The limiting post rotates inward from the center. The spring is deformed by the compression of rotating plate one and rotating plate two, generating elastic force. When the high-frequency multilayer circuit board body moves to the surface of the top of the raised post, the locking block is no longer under the pressure of the high-frequency multilayer circuit board body. Under the action of the spring force, it returns to its initial position. The bottom of the locking block limits and fixes the high-frequency multilayer circuit board body. When disassembling, the two levers can be pinched and force is applied inward. The spring contracts, rotating plate one and rotating plate two rotate inward, and the locking block enters the interior of the locking block movable groove. It no longer limits the high-frequency multilayer circuit board body, so the high-frequency multilayer circuit board body can be pulled out to complete the disassembly. In this way, the designer does not need to use screws to install the high-frequency multilayer circuit board, reducing the labor intensity of the workers, and avoiding damage to the high-frequency multilayer circuit board caused by excessive force when using screws. Attached Figure Description

[0014] Figure 1 A schematic overview of the high-frequency multilayer circuit board provided by this utility model;

[0015] Figure 2 A schematic diagram showing the connection between the convenient installation and disassembly assembly and the lifting assembly for the high-frequency multilayer circuit board provided by this utility model.

[0016] Figure 3Side sectional view of the convenient installation and disassembly assembly for the high-frequency multilayer circuit board provided by this utility model;

[0017] Figure 4 A schematic diagram of the internal components of the convenient installation and disassembly assembly for the high-frequency multilayer circuit board provided by this utility model.

[0018] Legend:

[0019] 1. High-frequency multilayer circuit board body; 101. Mounting hole; 2. Convenient installation and disassembly assembly; 201. Mounting post; 202. Movable slot for locking block; 203. Limiting post; 204. Rotating plate one; 205. Rotating plate two; 206. Locking block; 207. Spring; 208. Pry plate; 3. Lifting assembly; 301. Lifting post; 302. Threaded hole; 303. Thread; 4. Mounting plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution: a high-frequency multilayer circuit board, including: a high-frequency multilayer circuit board body 1, with mounting holes 101 through each of the four corners of the high-frequency multilayer circuit board body 1, and convenient installation and disassembly components 2 provided on the bottom surface of each of the four mounting holes 101, with lifting components 3 provided at the bottom of each of the four convenient installation and disassembly components 2, and mounting plates 4 threadedly fitted onto the bottom of each of the four lifting components 3.

[0022] Specifically: Align the mounting hole 101 with the position of the convenient installation and removal component 2, and move the high-frequency multilayer circuit board body 1 downwards. When the high-frequency multilayer circuit board body 1 touches the locking block 206, continue to move the high-frequency multilayer circuit board body 1 downwards. Under the pressure of the high-frequency multilayer circuit board body 1, the locking block 206 moves inwards towards the mounting post 201. The spring 207 is deformed by the compression of the rotating plate 1 204 and the rotating plate 205, generating elastic force. When the high-frequency multilayer circuit board body 1 moves to the surface of the top of the lifting post 301, the locking block 206 is no longer under the pressure of the high-frequency multilayer circuit board body 1 and returns to its initial position under the action of the elastic force of the spring 207. The bottom of the locking block 206 limits and fixes the high-frequency multilayer circuit board body 1. In this way, the designer does not need to use screws to install the high-frequency multilayer circuit board, reducing the labor intensity of the workers, and avoiding damage to the high-frequency multilayer circuit board caused by excessive force when using screws.

[0023] In one embodiment, the convenient installation and disassembly assembly 2 includes an installation column 201. Both sides of the installation column 201 are provided with a locking block movable groove 202. The two sides of the bottom of the installation column 201 are fixedly connected to a limiting column 203. The surface of the limiting column 203 is fitted with a rotating plate 1 204 and a rotating plate 205.

[0024] Specifically: the limiting post 203 provides space for the movement of the locking block 206, while the top part of the locking block 206 is embedded inside the mounting post 201 to avoid obstructing the installation of the high-frequency multilayer circuit board body 1.

[0025] In one embodiment, a locking block 206 is fixedly connected to one side of both rotating plate 1 204 and rotating plate 205, a spring 207 is fixedly connected to the top of the opposite side of rotating plate 1 204 and rotating plate 205, and a lever 208 is fixedly connected to the top of both rotating plate 1 204 and rotating plate 205.

[0026] Specifically: the limiting post 203 limits the rotation of rotating plate one 204 and rotating plate two 205.

[0027] In one embodiment, the surfaces of the two card blocks 206 are movably embedded inside the two card block movement slots 202.

[0028] Specifically: During the movement of the card block 206, a portion of its surface is always embedded inside the card block movable groove 202, which limits the movement of the card block 206, the rotating plate 1 204 and the rotating plate 205.

[0029] In one embodiment, the lifting component 3 includes a lifting column 301, the top of the lifting column 301 is provided with a threaded hole 302, the bottom surface of the lifting column 301 is provided with a thread 303, and the bottom threads of the four lifting columns 301 are embedded in the interior of the four corners of the mounting plate 4.

[0030] Specifically: Raising the installation position of the high-frequency multilayer circuit board body 1 facilitates the flow of air at the bottom of the high-frequency multilayer circuit board body 1 during use, thus promoting heat dissipation.

[0031] In one embodiment, the surfaces of the four mounting posts 201 are movably embedded inside the four mounting holes 101, the surfaces of the bottom of the eight clips 206 can be tightly attached to the surface of the high-frequency multilayer circuit board body 1, and the surfaces of the bottom of the four mounting posts 201 are threadedly embedded inside the four threaded holes 302.

[0032] Specifically: the diameter of the lifting post 301 is larger than the opening diameter of the mounting hole 101, and the diameter of the mounting post 201 is smaller than the opening diameter of the high-frequency multilayer circuit board body 1, which facilitates the installation of the high-frequency multilayer circuit board body 1. At the same time, the top of the lifting post 301 can limit the high-frequency multilayer circuit board body 1.

[0033] In one embodiment, the top surfaces of the four raised pillars 301 are in close contact with the bottom of the high-frequency multilayer circuit board body 1.

[0034] Specifically: It works in conjunction with the bottom of the card block 206 to limit and fix the high-frequency multilayer circuit board body 1.

[0035] Working principle: First, install the lifting component 3 and the convenient installation and removal component 2. Screw the threads 303 of the four lifting components 3 into the four threaded holes on the surface of the mounting plate 4. Then, screw the bottom surfaces of the mounting posts 201 of the four convenient installation and removal components 2 into the four threaded holes 302 respectively. Place the high-frequency multilayer circuit board body 1 above the four convenient installation and removal components 2, so that the mounting holes 101 correspond to the positions of the convenient installation and removal components 2. Move the high-frequency multilayer circuit board body 1 downward, so that the four convenient installation and removal components 2 are embedded in the four mounting holes 101. Continue to move the high-frequency multilayer circuit board body 1 downward. When the high-frequency multilayer circuit board body 1 touches the locking block 206, continue to move the high-frequency multilayer circuit board body 1 downward. Under the pressure of the high-frequency multilayer circuit board body 1, the locking block 206 moves into the mounting post 201. At the same time, the rotating plate 1 204 and the rotating plate 205 move in a limited manner after being pressured by the locking block 206. Position post 203 rotates inwards from the center. Spring 207 deforms under the pressure of rotating plate 1 204 and rotating plate 205, generating elastic force. When the high-frequency multilayer circuit board body 1 moves to the surface of the top of the lifting post 301, the locking block 206 is no longer under the pressure of the high-frequency multilayer circuit board body 1 and returns to its initial position under the action of the elastic force of spring 207. The bottom of the locking block 206 limits and fixes the high-frequency multilayer circuit board body 1. When disassembling, the two lever plates 208 can be pinched and force is applied inwards. Spring 207 retracts, rotating plate 1 204 and rotating plate 205 rotate inwards, and locking block 206 enters the interior of the locking block movable groove 202 and no longer limits the high-frequency multilayer circuit board body 1. The high-frequency multilayer circuit board body 1 can then be pulled out to complete the disassembly. In this way, the designer does not need to use screws to install the high-frequency multilayer circuit board, reducing the labor intensity of the workers, and avoiding damage to the high-frequency multilayer circuit board caused by excessive force when using screws.

[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A high-frequency multilayer wiring board, characterized by The utility model relates to a high frequency multilayer circuit board body (1), four corners of high frequency multilayer circuit board body (1) are all provided with mounting hole (101), the surface of four mounting hole (101) bottom is all provided with convenient installation and removal component (2), the bottom of four convenient installation and removal component (2) is all provided with the lifting subassembly (3), the bottom of four lifting subassembly (3) is all provided with the mounting plate (4) of threaded sleeve. The convenient installation and removal component (2) includes the installation column (201), the both sides of installation column (201) inside are all provided with the card block movable slot (202), the both sides of the bottom of installation column (201) inside are fixedly connected with the limiting post (203), the surface of limiting post (203) is sleeved with rotating plate one (204) and rotating plate two (205).

2. The high-frequency multilayer wiring board according to claim 1, characterized by: The one side of rotating plate one (204) and rotating plate two (205) is fixedly connected with the card block (206), the top of the opposite side of rotating plate one (204) and rotating plate two (205) is fixedly connected with the spring (207), the top of rotating plate one (204) and rotating plate two (205) is fixedly connected with the board (208).

3. The high-frequency multilayer circuit board according to claim 2, characterized by: The surface of two card blocks (206) is movably embedded in the inside of two card block movable slots (202).

4. The high-frequency multilayer circuit board according to claim 3, characterized by: The lifting subassembly (3) includes the lifting column (301), the top of lifting column (301) is provided with the threaded hole (302), the surface of the bottom of lifting column (301) is provided with the screw thread (303), the bottom of four lifting column (301) is threadedly embedded in the inside of four corners of mounting plate (4).

5. The high-frequency multilayer circuit board according to Claim 1, characterized by: The surface of four installation column (201) is movably embedded in the inside of four mounting holes (101), the surface of eight card blocks (206) bottom can be tightly attached to the surface of high frequency multilayer circuit board body (1), the surface of four installation column (201) bottom is threadedly embedded in the inside of four threaded holes (302).

6. The high-frequency multilayer circuit board according to claim 3, characterized by: The surface of four lifting column (301) top is tightly attached to the bottom of high frequency multilayer circuit board body (1).

7. The high-frequency multilayer circuit board according to Claim 5, characterized by: ​

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