Liquid cooling plate structure and domain controller

Abstract

The utility model provides a liquid cooling plate structure and a domain controller, and relates to the technical field of vehicles, the liquid cooling plate structure comprises a liquid cooling plate body, a first heat dissipation assembly and a second heat dissipation assembly; the first heat dissipation assembly is arranged on one side of the liquid cooling plate body and is used for being in heat conduction connection with a piece to be subjected to heat dissipation, and the second heat dissipation assembly is arranged on the other side of the liquid cooling plate body and is used for being in heat conduction connection with another piece to be subjected to heat dissipation, so that heat dissipation of a double-chip plate can be realized; therefore, the technical effects of high practicability, high heat dissipation capability, high integration level and low cost are achieved.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, specifically to a liquid cooling plate structure and a domain controller. Background Technology

[0002] With the development of automotive intelligence, the workload of domain controllers is constantly increasing, and their heat generation is also increasing.

[0003] In the existing technology, water-cooled plates generally adopt a single-sided working design, with heat dissipation chips installed on only one side and the other side mainly used for connecting water pipes. This results in a limited heat dissipation area, and the layout of the heat dissipation protrusions is limited by the water pipe routing. It cannot be optimized for the heat distribution of different chips, nor can it dissipate heat from dual-chip boards. Utility Model Content

[0004] The purpose of this invention is to provide a liquid cooling plate structure and a domain controller to alleviate the technical problem of the inability to dissipate heat from dual-chip boards in the prior art.

[0005] In a first aspect, the present invention provides a liquid cooling plate structure, comprising: a liquid cooling plate body, a first heat dissipation component, and a second heat dissipation component; the first heat dissipation component is disposed on one side of the liquid cooling plate body and is used for thermally conductive connection with a component to be heatd, and the second heat dissipation component is disposed on the other side of the liquid cooling plate body and is used for thermally conductive connection with another component to be heatd.

[0006] Optionally, the first heat dissipation component and / or the second heat dissipation component are provided with a boss, one end of which abuts against the liquid cooling plate body, and the other end is used to conduct heat against the heat-generating element of the component to be dissipated.

[0007] Optionally, the boss is brazed to the liquid cooling plate body.

[0008] Optionally, the liquid cooling plate body is provided with a flow channel, and the extension path of the flow channel passes through at least one boss at the position where it is connected to the liquid cooling plate body.

[0009] Optionally, the liquid cooling plate body includes a first component and a second component, the first component is connected to a first heat dissipation component, the second component is connected to a second heat dissipation component, the first component and the second component are fitted and fixed together, and a flow channel is formed between the first component and the second component.

[0010] Optionally, the side of the first heat dissipation component and / or the second heat dissipation component away from the liquid cooling plate body is coated with thermally conductive adhesive, and is thermally connected to the component to be cooled through the thermally conductive adhesive.

[0011] Optionally, the liquid cooling plate body, the first heat dissipation component, and the second heat dissipation component are each provided with at least one heat dissipation boss positioning hole; the axes of the heat dissipation boss positioning holes of the liquid cooling plate body, the first heat dissipation component, and the second heat dissipation component coincide.

[0012] Secondly, this utility model also provides a domain controller, including: a housing, a first PCB board, a second PCB board, and the aforementioned liquid cooling plate structure; the first PCB board and the second PCB board are respectively disposed on both sides of the liquid cooling plate structure, and the first PCB board, the second PCB board, and the liquid cooling plate structure are located inside the housing.

[0013] Optionally, the housing includes an upper cover plate, a middle frame, and a lower cover plate; the upper cover plate and the lower cover plate are fixedly connected through the middle frame, and the liquid cooling plate structure is connected to the middle frame; the first PCB board is located on one side of the middle frame and abuts against one side of the liquid cooling plate structure; the second PCB board is located on the side of the middle frame away from the first PCB board and abuts against the side of the liquid cooling plate structure away from the first PCB board.

[0014] Optionally, the liquid cooling plate structure is provided with at least one first positioning structure, and the middle frame is provided with at least one second positioning structure, with the first positioning structure and the second positioning structure cooperating and connected.

[0015] This utility model provides a liquid-cooled plate structure and a domain controller, relating to the technical field of vehicles. The liquid-cooled plate structure includes: a liquid-cooled plate body, a first heat dissipation component, and a second heat dissipation component; the first heat dissipation component is disposed on one side of the liquid-cooled plate body and is used for thermally conductive connection with a component to be cooled, and the second heat dissipation component is disposed on the other side of the liquid-cooled plate body and is used for thermally conductive connection with another component to be cooled, which can realize heat dissipation of dual-chip boards to achieve the technical effects of high practicality, strong heat dissipation capacity, high integration and low cost. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 A schematic diagram of a liquid cooling plate structure provided in an embodiment of this utility model;

[0018] Figure 2 A schematic diagram of another liquid cooling plate structure provided in an embodiment of this utility model;

[0019] Figure 3 A schematic diagram of the heat dissipation boss positioning hole provided in an embodiment of this utility model;

[0020] Figure 4 A schematic diagram of the structure of a domain controller provided in an embodiment of this utility model;

[0021] Figure 5 A schematic diagram of the first positioning structure provided in an embodiment of this utility model.

[0022] Icons: 100-Liquid cooling plate body; 120-Flow channel; 130-Heat dissipation boss positioning hole; 200-First heat dissipation component; 300-Second heat dissipation component; 400-Boss; 510-House; 511-Upper cover plate; 512-Middle frame; 515-Lower cover plate; 520-First PCB board; 530-Second PCB board; 540-Liquid cooling plate structure; 541-First positioning structure. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0025] Figure 1 This is a schematic diagram of a liquid cooling plate structure provided for an embodiment of the present utility model. Figure 1 As shown, the structure includes: a liquid cooling plate body 100, a first heat dissipation component 200 and a second heat dissipation component 300; the first heat dissipation component 200 is disposed on one side of the liquid cooling plate body 100 and is used for thermally conductive connection with a component to be heatd, and the second heat dissipation component 300 is disposed on the other side of the liquid cooling plate body 100 and is used for thermally conductive connection with another component to be heatd.

[0026] like Figure 1 and Figure 2 As shown, the liquid cooling plate structure achieves independent and efficient heat dissipation for the components to be cooled on both sides by setting a first heat dissipation component 200 and a second heat dissipation component 300 on both sides of the liquid cooling plate body 100, and the first heat dissipation component 200 is thermally connected to one component to be cooled, and the second heat dissipation component 300 is thermally connected to the other component to be cooled, thereby effectively guiding heat from two different components to the liquid cooling plate for cooling, while having the advantages of high integration and low cost.

[0027] In one optional embodiment, the first heat dissipation component 200 and / or the second heat dissipation component 300 are provided with a boss 400, one end of which abuts against the liquid cooling plate body 100, and the other end is used to conduct heat to the heat-generating element of the component to be dissipated.

[0028] Specifically, the first heat dissipation component 200 includes a first connector and a plurality of protrusions 400. The protrusions 400 are disposed on the first connector, and the plurality of protrusions 400 are connected through the first connector. The position of each protrusion 400 on the first heat dissipation component 200 can be determined according to the heat dissipation area of ​​the component to be dissipated. That is, each protrusion 400 corresponds to a heat dissipation area.

[0029] The second heat dissipation component 300 includes a second connector and a plurality of protrusions 400. The protrusions 400 are disposed on the second connector and the plurality of protrusions 400 are connected through the second connector. The position of each protrusion 400 on the second heat dissipation component 300 can be determined according to the heat dissipation area of ​​the component to be dissipated. That is, each protrusion 400 corresponds to a heat dissipation area.

[0030] The protrusions 400 are used to make a thermally conductive connection between the component to be cooled and the liquid cooling plate body 100, so that each protrusion 400 is specifically fitted to the area to be cooled, thereby maximizing the heat dissipation efficiency. Furthermore, the position of each protrusion 400 on the first heat dissipation component 200 and the second heat dissipation component 300 can be customized according to the specific heat dissipation area of ​​the component to be cooled.

[0031] In one alternative embodiment, the boss 400 is a forging or a CNC machined part.

[0032] In one alternative embodiment, the boss 400 is brazed to the liquid cooling plate body 100.

[0033] Since internal blistering during the brazing process of die-cast parts can overflow onto the surface, in this application, the boss 400 that is thermally connected to the area to be cooled is a forged part or a CNC machined part. The boss 400 is directly fixed to the liquid cooling plate body 100 by brazing, which effectively solves the problem of internal blistering overflow onto the surface of die-cast parts during the brazing process. This ensures a good thermally conductive connection between the heat dissipation area and the liquid cooling plate body 100, and the connection between the boss 400 and the liquid cooling plate body 100 by brazing increases the connection strength and improves the thermal conductivity.

[0034] Furthermore, the boss 400 in this application is formed into a square column shape. It can be understood that in practical applications, the state of the boss 400 is not limited, such as it can also be a frustum or other irregular shapes.

[0035] Furthermore, the top area of ​​the boss 400 in this application is equal to the area of ​​the area to be dissipated.

[0036] In one alternative embodiment, the liquid cooling plate body 100 is provided with a flow channel 120, the extension path of which passes through at least one boss 400 connected to the liquid cooling plate body 100.

[0037] like Figure 3 As shown, the flow channel 120 is an irregularly shaped flow channel 120. The flow channel 120 flows through at least one connection position, which is the connection position between the boss 400 and the liquid cooling plate body 100. The fluid in the liquid cooling plate body 100 is directly guided to the heat dissipation area of ​​the heat dissipation component through the flow channel 120, which can achieve more effective heat exchange, reduce the temperature of the heat dissipation area, and thus improve the overall heat dissipation performance of the heat dissipation component.

[0038] In one optional embodiment, the liquid cooling plate body 100 includes a first component and a second component. The first component is connected to the first heat dissipation assembly 200, and the second component is connected to the second heat dissipation assembly 300. The first component and the second component are fitted and fixed together, and a flow channel 120 is formed between the first component and the second component.

[0039] In one alternative embodiment, the first component has a bent portion that bends away from the second component, and the bent portion and the second component form a flow channel 120.

[0040] Furthermore, the first component and the second component are brazed together.

[0041] Furthermore, in this application, the liquid cooling plate body 100 also includes a water inlet connector and a water outlet connector. The water inlet connector and the water outlet connector are fixed on the first component and are connected through the flow channel 120. The coolant enters the flow channel 120 through the water inlet connector and flows out from the water outlet connector after heat exchange.

[0042] In this application, the first component is a rectangular flow channel 120 plate, and the flow channel 120, water inlet and water outlet are provided on the flow channel 120 plate by CNC machining or forging process. The second component is a rectangular flat plate, and the flow channel 120 plate is fixed to one side of the flat plate by brazing process. The bent part of the flow channel 120 plate and the flat plate form a flow channel 120 for heat dissipation of the area to be heatd.

[0043] Furthermore, in this application, the thickness of the liquid cooling plate body 100 is 1.2 mm, wherein the flow channel 120 plate and the flat plate are made of lightweight aluminum alloy material AL3003 with a thickness of 0.8 mm, and a composite layer is provided on the side of the flow channel 120 plate facing the flat plate and the side of the flat plate facing the flow channel 120 plate, the composite layer being made of aluminum alloy material AL4343 with a thickness of 0.2 mm.

[0044] During the brazing process, the AL4343 composite layer is melted at high temperature to achieve the connection between the flow channel 120 plate and the flat plate.

[0045] In one optional embodiment, the side of the first heat dissipation component 200 and / or the second heat dissipation component 300 away from the liquid cooling plate body 100 is coated with thermally conductive adhesive and is thermally connected to the component to be cooled through the thermally conductive adhesive.

[0046] Since the top surface area of ​​the boss 400 on the first heat dissipation component 200 and / or the second heat dissipation component 300 is equal to the area of ​​the area to be dissipated, in order to make the area to be dissipated and the boss 400 have better thermal conductivity, thermally conductive adhesive is coated on the end face of the boss 400 that contacts the area to be dissipated. The thermally conductive adhesive fills the gap between the boss 400 and the area to be dissipated, thereby improving efficient heat dissipation.

[0047] Furthermore, the gap between the boss 400 and the area to be cooled is 0.5 to 1 mm.

[0048] In one optional embodiment, the liquid cooling plate body 100, the first heat dissipation component 200 and the second heat dissipation component 300 are each provided with at least one heat dissipation boss positioning hole 130; the axes of the heat dissipation boss positioning holes 130 of the liquid cooling plate body 100, the first heat dissipation component 200 and the second heat dissipation component 300 coincide.

[0049] like Figure 3 As shown, the heat dissipation boss positioning hole 130 is used to position and limit the first heat dissipation component 200 and the second heat dissipation component 300 when they are fixed to the liquid cooling plate body 100. The first heat dissipation component 200 and the liquid cooling plate body 100 are both provided with at least one heat dissipation boss positioning hole 130. During brazing, graphite positioning pins are used to position the first heat dissipation component 200 and the liquid cooling plate body 100, and the second heat dissipation component 300 and the liquid cooling plate body 100 are also used for positioning. This achieves precise positioning of the heat dissipation components and effectively prevents them from shifting or deforming during brazing, thereby improving brazing quality, ensuring a tight bond between the heat dissipation components and the liquid cooling plate body 100, and better utilizing their heat dissipation performance.

[0050] Furthermore, in this application, the heat dissipation boss positioning hole is a 130mm round hole.

[0051] Figure 4 A schematic diagram of the structure of a domain controller provided in an embodiment of this utility model is shown below. Figure 4As shown, the domain controller includes: a housing 510, a first PCB board 520, a second PCB board 530, and the aforementioned liquid cooling plate structure 540; the first PCB board 520 and the second PCB board 530 are respectively disposed on both sides of the liquid cooling plate structure 540, and the first PCB board 520, the second PCB board 530, and the liquid cooling plate structure 540 are located inside the housing 510.

[0052] In the application, the first PCB board 520 and the second PCB board 530 are heat dissipation components.

[0053] In one optional embodiment, the housing 510 includes an upper cover plate 511, a middle frame 512, and a lower cover plate 515; the upper cover plate 511 and the lower cover plate 515 are fixedly connected through the middle frame 512, and the liquid cooling plate structure 540 is connected to the middle frame 512; a first PCB board 520 is disposed on one side of the middle frame 512 and abuts against one side of the liquid cooling plate structure 540; a second PCB board 530 is disposed on the side of the middle frame 512 away from the first PCB board 520 and abuts against the side of the liquid cooling plate structure 540 away from the first PCB board 520.

[0054] In one optional embodiment, the liquid cooling plate structure 540 is provided with at least one first positioning structure 541, and the middle frame 512 is provided with at least one second positioning structure, wherein the first positioning structure 541 and the second positioning structure are connected in cooperation.

[0055] Furthermore, in this application, as Figure 5 As shown, the first positioning structure 541 is a mounting hole. The mounting hole is set on the flat plate of the liquid cooling plate body 100. The liquid cooling plate structure 540 is fixed to the middle frame 512 by bolts through the mounting hole, thereby reducing the length of the bolts.

[0056] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0057] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0058] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0059] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A liquid-cooled plate structure, characterized in that, The liquid cooling plate structure comprises a liquid cooling plate body (100), a first heat dissipation assembly (200) and a second heat dissipation assembly (300); the first heat dissipation assembly (200) is arranged on one side of the liquid cooling plate body (100) and is used for being in thermal contact with a heat dissipation object, and the second heat dissipation assembly (300) is arranged on the other side of the liquid cooling plate body (100) and is used for being in thermal contact with another heat dissipation object. The first heat dissipation assembly (200) and / or the second heat dissipation assembly (300) is provided with a boss (400), one end of the boss (400) is in abutment with the liquid cooling plate body (100), and the other end is used for being in thermal abutment with a heating element of the heat dissipation object.

2. The liquid cold plate structure of claim 1, wherein, The boss (400) and the liquid cooling plate body (100) are connected by brazing.

3. The liquid cold plate structure of claim 2, wherein, The liquid cooling plate body (100) is provided with a flow channel (120), and the extension path of the flow channel (120) passes through the position where at least one boss (400) is connected with the liquid cooling plate body (100).

4. The liquid cold plate structure of claim 2, wherein, The liquid cooling plate body (100) comprises a first component and a second component, the first component is connected with the first heat dissipation assembly (200), the second component is connected with the second heat dissipation assembly (300), the first component and the second component are fixedly attached, and the flow channel (120) is formed between the first component and the second component.

5. The liquid cold plate structure of claim 4, wherein, The first heat dissipation assembly (200) and / or the second heat dissipation assembly (300) is coated with a thermal conductive adhesive on the side away from the liquid cooling plate body (100), and is in thermal contact with the heat dissipation object through the thermal conductive adhesive.

6. The liquid cold plate structure of claim 1, wherein, At least one heat dissipation boss positioning hole (130) is arranged on the liquid cooling plate body (100), the first heat dissipation assembly (200) and the second heat dissipation assembly (300); and the axes of the heat dissipation boss positioning holes (130) of the liquid cooling plate body (100), the first heat dissipation assembly (200) and the second heat dissipation assembly (300) coincide.

7. The liquid cold plate structure of claim 1, wherein, The liquid cooling plate structure comprises a liquid cooling plate body (100), a first heat dissipation assembly (200) and a second heat dissipation assembly (300); the first heat dissipation assembly (200) is arranged on one side of the liquid cooling plate body (100) and is used for being in thermal contact with a heat dissipation object, and the second heat dissipation assembly (300) is arranged on the other side of the liquid cooling plate body (100) and is used for being in thermal contact with another heat dissipation object.

8. A domain controller, characterized by The first heat dissipation assembly (200) and / or the second heat dissipation assembly (300) is provided with a boss (400), one end of the boss (400) is in abutment with the liquid cooling plate body (100), and the other end is used for being in thermal abutment with a heating element of the heat dissipation object. The boss (400) and the liquid cooling plate body (100) are connected by brazing. The liquid cooling plate body (100) is provided with a flow channel (120), and the extension path of the flow channel (120) passes through the position where at least one boss (400) is connected with the liquid cooling plate body (100). The liquid cooling plate body (100) comprises a first component and a second component, the first component is connected with the first heat dissipation assembly (200), the second component is connected with the second heat dissipation assembly (300), the first component and the second component are fixedly attached, and the flow channel (120) is formed between the first component and the second component. The first heat dissipation assembly (200) and / or the second heat dissipation assembly (300) is coated with a thermal conductive adhesive on the side away from the liquid cooling plate body (100), and is in thermal contact with the heat dissipation object through the thermal conductive adhesive. At least one heat dissipation boss positioning hole (130) is arranged on the liquid cooling plate body (100), the first heat dissipation assembly (200) and the second heat dissipation assembly (300); and the axes of the heat dissipation boss positioning holes (130) of the liquid cooling plate body (100), the first heat dissipation assembly (200) and the second heat dissipation assembly (300) coincide.

9. The domain controller of claim 8, wherein, The shell (510) comprises an upper cover plate (511), a middle frame (512) and a lower cover plate (515); the upper cover plate (511) is fixedly connected with the lower cover plate (515) through the middle frame (512), and the liquid cooling plate structure (540) is connected with the middle frame (512); the first PCB (520) is arranged on one side of the middle frame (512) and abuts against one side of the liquid cooling plate structure (540); the second PCB (530) is arranged on the side of the middle frame (512) away from the first PCB (520) and abuts against the side of the liquid cooling plate structure (540) away from the first PCB (520).

10. The domain controller of claim 9, wherein, The liquid cooling plate structure (540) is provided with at least one first positioning structure (541), and the middle frame (512) is provided with at least one second positioning structure; the first positioning structure (541) is connected with the second positioning structure in a matched mode.

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