Cooling fin suitable for electronic product

Abstract

The utility model provides a radiating fin suitable for an electronic product, and relates to the technical field of radiating of electronic products. The cooling fin suitable for the electronic product comprises a first substrate, and a plurality of first cooling fins are fixed to the upper end of the first substrate; a sliding groove is formed in the middle of the first base plate, a connecting structure is arranged on the inner wall of the sliding groove, and a second base plate is arranged on the connecting structure; the connecting structure can drive the second substrate to slide in the length direction of the sliding groove so that the cooling fins can be adjusted to the corresponding size according to the size of the electronic product. According to the cooling fin suitable for the electronic product, rotation operation is carried out by manually rotating the handle, the effect of adjusting the size of the cooling fin is achieved, the design of corresponding adjustment can be carried out according to the actual size of the electronic product, the application range of the cooling fin is effectively expanded, then the effect of improving the universality of the cooling fin is achieved, and rotation operation is carried out by manually rotating the handle; the effect of flexible installation is achieved, and the function of improving the use protection performance of the cooling fins is achieved.

Description

Technical Field

[0001] This utility model relates to a heat sink suitable for electronic products, belonging to the field of electronic product heat dissipation technology. Background Technology

[0002] With the rapid development of modern electronic technology, electronic products such as computer processors, graphics cards, and power amplifiers are constantly improving in performance. However, these performance improvements are often accompanied by a sharp increase in power consumption, which generates a lot of heat, thus requiring the use of heat sinks to assist in heat dissipation.

[0003] Existing heat sinks play a role in the daily heat dissipation of electronic products. However, in practical applications, the size of heat sinks is relatively fixed. This means that when dealing with various electronic products of different specifications, it is often necessary to adapt heat sinks of different sizes to achieve good heat dissipation. This undoubtedly limits the applicability of heat sinks and thus restricts their use.

[0004] Furthermore, heat sinks are typically installed by workers using bolts to rigidly fasten them to their designated positions on electronic products. During this tightening process, it's difficult to precisely control the bolt force, easily leading to excessive tightening. Excessive tightening force can damage electronic products. From an installation perspective, this method of heat sink installation clearly provides insufficient protection, resulting in inadequate protection during heat sink installation. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] This utility model provides a heat sink suitable for electronic products, in order to solve the problems of limited use of heat sinks in the prior art and insufficient protection during heat sink installation.

[0007] (II) Technical Solution

[0008] This utility model is achieved through the following technical solution: a heat sink applicable to electronic products, comprising a first substrate, wherein a plurality of first heat sink fins are fixed on the upper end of the first substrate;

[0009] The first substrate has a groove in the middle, and a connecting structure is provided on the inner wall of the groove. A second substrate is provided on the connecting structure. The connecting structure can slide along the length of the groove with the second substrate to adjust the heat sink to the corresponding size according to the size of the electronic product.

[0010] Preferably, the connection structure includes a second substrate, a plurality of second heat dissipation fins are fixed on the upper end of the second substrate, a groove is formed in the middle of the second substrate, thermally conductive double-sided adhesive is pasted on the lower surface of the second substrate, a lead screw is threadedly connected to the middle of the second substrate, a limit plate is fixed to one end of the lead screw, a stabilizing plate is fixed to the other side of the lead screw, and a handle is fixed to the other end of the lead screw.

[0011] Preferably, the outer surface of the second substrate is slidably connected to the inner wall of the groove, the groove passes through the middle of the first substrate, the outer surfaces of a plurality of second heat dissipation fins are slidably connected to the inner wall of the groove, and the plurality of second heat dissipation fins are distributed intersectingly with a plurality of first heat dissipation fins.

[0012] Preferably, the outer surface of the lead screw is threadedly connected to the middle of the second base plate, the outer surface of the lead screw is rotatably connected to the middle of the first base plate, the outer surface of the stabilizing disk is rotatably connected to the middle of the first base plate, the limiting disk is disposed inside the groove, and the handle is disposed on one side of the first base plate.

[0013] Preferably, two fixing frames are fixed at the disjoint ends of the first substrate and the second substrate. Each fixing frame has a frame groove in the middle. A sliding frame is slidably connected to the inner wall of each frame groove. A spring is fixed on one side of each sliding frame, and a rubber block is fixed on the other side of each sliding frame.

[0014] Preferably, each of the fixed frames has an L-shaped vertical section, the outer surface of each sliding frame is slidably connected to the inner wall of each frame groove, one end of each spring is fixed to one side of each sliding frame, and the other end of each spring is fixed to the inner wall of one end of each frame groove.

[0015] Preferably, one end of each rubber block is fixed to the other side of each sliding frame, each rubber block passes through the middle of one side of each frame groove, and the four rubber blocks are arranged in pairs facing each other.

[0016] This utility model provides a heat sink suitable for electronic products, which has the following beneficial effects:

[0017] (1) The heat sink for electronic products can be rotated by manually turning the handle, so that the slide, the second substrate, the second heat sink fin, the groove, the thermally conductive double-sided adhesive, the lead screw, the limit plate, the stabilizing plate and the handle work together to achieve the effect of adjusting the size of the heat sink. The design can be adjusted according to the actual size of the electronic product, which effectively expands the application range of the heat sink and thus improves the versatility of the heat sink.

[0018] (2) The heat sink for this applicable electronic product is rotated by manually turning the handle, so that the lead screw, fixed frame, bracket groove, sliding frame, spring and rubber block work together to achieve the effect of flexible installation. While installing the heat sink, it can effectively protect the electronic product and prevent the electronic product from being damaged due to improper installation, thereby improving the protective function of the heat sink. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a partial cross-sectional view of the present invention;

[0021] Figure 3 This is a cross-sectional view of the fixing frame of this utility model;

[0022] Figure 4 This utility model Figure 3 Enlarged view of the structure of part A.

[0023] [Explanation of Key Component Symbols]

[0024] 1. First substrate; 2. First heat dissipation fin; 3. Slide groove; 4. Second substrate; 5. Second heat dissipation fin; 6. Groove; 7. Thermally conductive double-sided adhesive; 8. Lead screw; 9. Limiting plate; 10. Stabilizing plate; 11. Handle; 12. Fixing frame; 13. Frame groove; 14. Sliding frame; 15. Spring; 16. Rubber block. Detailed Implementation

[0025] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0026] Example 1

[0027] This utility model provides a heat sink suitable for electronic products.

[0028] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4The system includes a first substrate 1, which cooperates with a second substrate 4 to achieve the effect of adjusting the size of the heat sink. Several first heat sink fins 2 are fixed on the upper end of the first substrate 1. A sliding groove 3 is provided in the middle of the first substrate 1. The sliding groove 3 provides space support for the movement of the second substrate 4 and the second heat sink fins 5. A connecting structure is provided on the inner wall of the sliding groove 3. The connecting structure includes the second substrate 4. Several second heat sink fins 5 are fixed on the upper end of the second substrate 4. A groove 6 is provided in the middle of the second substrate 4. Thermally conductive double-sided adhesive 7 is pasted on the lower surface of the second substrate 4. A lead screw 8 is threadedly connected to the middle of the second substrate 4. A limit plate 9 is fixed to one end of the lead screw 8. A stabilizing plate 10 is fixed to the other side of the lead screw 8. A handle 11 is fixed to the other end of the lead screw 8.

[0029] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that the outer surface of the second substrate 4 is slidably connected to the inner wall of the groove 3, the groove 3 passes through the middle of the first substrate 1, the outer surfaces of several second heat dissipation fins 5 are slidably connected to the inner wall of the groove 3, the several second heat dissipation fins 5 are interspersed with several first heat dissipation fins 2, the outer surface of the lead screw 8 is threadedly connected to the middle of the second substrate 4, the outer surface of the lead screw 8 is rotatably connected to the middle of the first substrate 1, the outer surface of the stabilizing disk 10 is rotatably connected to the middle of the first substrate 1, the limiting disk 9 is set inside the groove 6, and the handle 11 is set on one side of the first substrate 1.

[0030] In use, this invention involves manually rotating the handle 11. The screw 8, fixed to it, rotates synchronously under the stabilizing action of the stabilizing plate 10 and the inner wall of the first substrate 1. Since the screw 8 is threadedly connected to the outer surface of the second substrate 4, the rotating screw 8, guided by the sliding groove 3 on the first substrate 1, causes the second substrate 4 to slide. As the second substrate 4 slides, the second heat dissipation fin 5 fixed above it also moves synchronously. This changes the relative position of the first heat dissipation fin 2 and the second heat dissipation fin 5 fixed above the first substrate 1, causing them to cooperate. During this process, because the second substrate 4 is slidably installed inside the first substrate 1, a specific height difference is created when the second substrate 4 slides out. At this point, a thermally conductive double-sided adhesive tape 7 can be cut to the appropriate size based on the specific dimensions of the slide and then attached to the lower surface of the second substrate 4. In this way, it can be ensured that both the first substrate 1 and the second substrate 4 can be in close contact with the electronic product, so as to achieve the effect of heat sink size adjustment. The design can be adjusted according to the actual size of the electronic product, which effectively expands the application range of the heat sink and thus improves the versatility of the heat sink.

[0031] Example 2

[0032] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 Based on Embodiment 1, a flexible installation function has been added;

[0033] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that each of the first substrate 1 and the second substrate 4 has two fixed brackets 12 at their disjoint ends. Each fixed bracket 12 has a bracket groove 13 in the middle. Each bracket groove 13 has a sliding bracket 14 slidably connected to its inner wall. Each sliding bracket 14 has a spring 15 fixed on one side and a rubber block 16 fixed on the other side. Each fixed bracket 12 has an L-shaped vertical section. The outer surface of each sliding bracket 14 is slidably connected to the inner wall of each bracket groove 13. One end of each spring 15 is fixed to one side of each sliding bracket 14, and the other end of each spring 15 is fixed to the inner wall of one end of each bracket groove 13. One end of each rubber block 16 is fixed to the other side of each sliding bracket 14. Each rubber block 16 passes through the middle of one side of each bracket groove 13, and the four rubber blocks 16 are arranged in pairs facing each other.

[0034] In use, this invention involves manually rotating the handle 11, causing the lead screw 8 fixed to the handle 11 to slide the second substrate 4, which is threaded onto its outer surface, within the limiting position of the slide groove 3. During this process, the sliding second substrate 4 moves together with the two fixed frames 12, which are respectively fixed at their ends away from the first substrate 1. This adjustment continues until the space formed by the first substrate 1 and the second substrate 4 can fit the size of the electronic product. At this time, four rubber blocks 16, which are slidably connected to the inner wall of the fixed frames 12, are pressed tightly against both sides of the electronic product. Due to the pressure from the electronic product, the rubber blocks 16 will displace, and the moving rubber blocks 16 will cause the sliding frame 14, which is fixed to them, to slide under the stable support of the inner wall of the frame groove 13. The sliding frame 14 will apply pressure to the spring 15, which is fixed to it, causing the spring 15 to undergo elastic deformation and accumulate elastic force. This elastic force will then react on the rubber blocks 16, ensuring that they are always pressed tightly against both sides of the electronic product with appropriate pressure. This achieves a flexible installation effect, effectively protecting electronic products while installing the heat sink and preventing damage caused by improper installation, thereby improving the protective performance of the heat sink.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat sink for electronic products comprising a first substrate (1), characterized in that: The first substrate (1) is fixed with a plurality of first heat dissipation fins (2) on the upper end; The first substrate (1) is provided with a sliding groove (3) in the middle, and the inner wall of the sliding groove (3) is provided with a connecting structure, and the connecting structure is provided with a second substrate (4); the connecting structure can slide with the second substrate (4) in the length direction of the sliding groove (3), so as to adjust the size of the heat dissipation fin to the corresponding size according to the size of the electronic product.

2. The heat sink for electronic products according to claim 1, wherein: The connecting structure includes a second substrate (4), a plurality of second heat dissipation fins (5) are fixed on the upper end of the second substrate (4), a groove (6) is formed in the middle of the second substrate (4), a heat-conducting double-sided adhesive tape (7) is pasted on the lower surface of the second substrate (4), a lead screw (8) is threadedly connected to the middle of the second substrate (4), one end of the lead screw (8) is fixed with a limiting disc (9), the other side of the lead screw (8) is fixed with a stabilizing disc (10), and the other end of the lead screw (8) is fixed with a handle (11).

3. The heat sink of claim 2, wherein: The outer surface of the second substrate (4) is slidably connected to the inner wall of the sliding groove (3), the sliding groove (3) penetrates the middle of the first substrate (1), the outer surfaces of a plurality of second heat dissipation fins (5) are slidably connected to the inner wall of the sliding groove (3), and a plurality of second heat dissipation fins (5) and a plurality of first heat dissipation fins (2) are distributed in cross.

4. The heat sink of claim 2, wherein: The outer surface of the lead screw (8) is threadedly connected to the middle of the second substrate (4), the outer surface of the lead screw (8) is rotatably connected to the middle of the first substrate (1), the outer surface of the stabilizing disc (10) is rotatably connected to the middle of the first substrate (1), the limiting disc (9) is arranged in the groove (6), and the handle (11) is arranged on one side of the first substrate (1).

5. The heat sink of claim 1, wherein: The first substrate (1) and the second substrate (4) are fixed with two fixing frames (12) at the opposite ends, a frame groove (13) is formed in the middle of each fixing frame (12), a sliding frame (14) is slidably connected to the inner wall of each frame groove (13), a spring (15) is fixed to one side of each sliding frame (14), and a rubber block (16) is fixed to the other side of each sliding frame (14).

6. The heat sink for electronic products according to claim 5, wherein: Each vertical cutting surface of the fixing frame (12) is L-shaped, the outer surface of each sliding frame (14) is slidably connected to the inner wall of each frame groove (13), one end of each spring (15) is fixed to one side of each sliding frame (14), and the other end of each spring (15) is fixed to the inner wall of one end of each frame groove (13).

7. The heat sink of claim 5, wherein: One end of each rubber block (16) is fixed to the other side of each sliding frame (14), each rubber block (16) penetrates the middle of one side of each frame groove (13), and four rubber blocks (16) are arranged in pairs.

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