Heat pump heating laminating machine coupled with flat plate heat pipe technology

Abstract

The utility model discloses a heat pump heating laminating machine coupled with a flat plate heat pipe technology, and relates to the technical field of solar cell modules. The heating plate is internally provided with a plane heat pipe, the upper cavity is formed by sealing a heat insulation plate, an upper layer pressing frame and a silica gel plate, the heat insulation plate is located above the upper cavity, and the heat insulation plate and the upper layer pressing frame are sealed through a sealing silica gel strip; the silica gel plate is positioned below the upper chamber and is tightly connected with the upper pressing frame; the chamber lifting system is connected with the heating plate and the upper chamber; the lower cavity consists of a lower pressing frame, a lower bottom plate of the laminating machine and a silica gel plate; the heat pump system is connected with the plane heat pipe in the heating plate through a heat preservation pipeline; the vacuum system is respectively connected with the upper chamber and the lower chamber through pipelines; and the valves are respectively arranged on pipelines between the upper chamber and the vacuum system and between the lower chamber and the vacuum system. The heating temperature of different areas of the assembly can be rapidly adjusted in real time.

Description

Technical Field

[0001] This utility model belongs to the technical field of solar cell modules, specifically relating to a heat pump heating laminator with coupled flat plate heat pipe technology. Background Technology

[0002] Laminators are widely used in the encapsulation process of solar cell modules. During lamination, the laminator stacks tempered glass, encapsulating film, silicon wafer, encapsulating film, and backsheet (or tempered glass) into a whole, giving it high light transmittance, high sealing, and high photoelectric conversion efficiency.

[0003] Existing laminators are classified into two types based on their heating methods: thermal oil heating and electric heating. Thermal oil heating uses the temperature of high-temperature thermal oil to heat the plate. However, this type of laminator may experience oil leakage during long-term operation, preventing it from working around the clock and even causing the solar cells to become brittle or shift. Electric heating uses electricity to directly heat the heating plate. However, because the edges of the hot plate are in contact with the environment, it can cause uneven temperature distribution, resulting in lower temperatures around the edges and higher temperatures in the center. This can lead to insufficient cross-linking of the adhesive film, and serious consequences such as bubbles or deformation of the solar cell module.

[0004] Therefore, there is an urgent need in this field for a temperature-controlled laminator to ensure lamination effect and improve lamination efficiency. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model provides a heat pump heating laminator with coupled flat plate heat pipe technology, which can uniformly heat the workpiece, effectively transfer pressure, and improve the packaging quality.

[0006] The technical solution of this utility model is as follows:

[0007] In one aspect, this utility model provides a heat pump-heated laminator using coupled flat-plate heat pipe technology, comprising a heating plate, a chamber lifting system, an upper chamber, a lower chamber, a heat pump system, a vacuum system, and multiple valves. The heating plate contains flat heat pipes for controlling the heating temperature of the edges and center of the component to be laminated. The upper chamber is sealed by a heat transfer plate, an upper lamination frame, and a silicone plate. The heat transfer plate is located above the upper chamber and is sealed to the upper lamination frame by a silicone sealing strip. The silicone plate is located below the upper chamber and is tightly connected to the upper lamination frame. The upper chamber is used to uniformly pressurize the component to be laminated. The chamber lifting system is connected to the heating plate and the upper chamber, and is used to move the heating plate and the upper chamber vertically. The chamber lifting system is also connected to the top cover of the laminator to move the heating plate and the upper chamber vertically. The lower chamber consists of a lower lamination frame and the bottom of the laminator. The laminator is composed of a plate and a silicone plate, with the silicone plate located above the lower lamination frame and the lower base plate below the lower lamination frame. The lower chamber is used to hold the components to be laminated and to provide a vacuum environment for them. The heat pump system is connected to the planar heat pipes in the heating plate through insulated pipes to supply circulating working fluid to the planar heat pipes. The vacuum system is connected to the upper and lower chambers through pipes and valves to change the pressure inside the chambers. Valves are respectively installed on the pipes between the upper chamber and the vacuum system, and between the lower chamber and the vacuum system, to control the opening and closing of the pipes. The heat pump system is connected to the planar heat pipes in the heating plate through insulated pipes to supply circulating working fluid to the planar heat pipes.

[0008] Optionally, the laminator also includes a floating joint, which is connected to the chamber lifting system and the top cover of the laminator. The floating joint can absorb minor misalignment errors in the upper chamber during vertical movement, ensuring that the upper chamber is pressurized evenly on the components to be laminated during the lamination process.

[0009] Optionally, the planar heat pipe has a capillary structure inside, which can quickly collect the liquefied circulating working fluid inside the planar heat pipe and transport it back to the heat pump system.

[0010] Optionally, the planar heat pipe is divided into two parts: one part is the edge heat pipe arranged along the edge of the heating plate, and the other part is the central heat pipe arranged in the center of the heating plate. The two parts are used together to control the heating temperature of the assembly to be laminated in zones.

[0011] Optionally, the heat transfer plate is embedded with a temperature sensor to provide real-time feedback on the thermal field distribution of the components to be laminated.

[0012] Optionally, the heat pump system is connected to the edge heat pipe and the central heat pipe respectively through insulated pipes to adjust the temperature of the circulating working fluid in the edge heat pipe and the central heat pipe, thereby adjusting the heating temperature of different areas of the component to be laminated in real time; wherein the edge heat pipe and the central heat pipe are respectively connected to different heat pumps in the heat pump system so as to control the temperature of different areas of the component to be laminated.

[0013] Optionally, the circulating working fluid used in the heat pump system can undergo a phase change at the temperature at which the adhesive film of the component to be laminated undergoes cross-linking, and the circulating working fluid after the phase change flows back to the heat pump system through the capillary wick in the planar heat pipe.

[0014] Optionally, the heat pump system uses external waste heat as a heat source to improve economic and environmental benefits.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1) The heating plate of this utility model has an edge heat pipe for heating the edge of the component to be laminated, and a central heat pipe for heating the middle part of the component to be laminated. The inlet and outlet of the edge heat pipe and the central heat pipe are respectively connected to different heat pumps in the heat pump system, so as to realize temperature control of different areas of the component to be laminated, and at the same time avoid problems such as deformation of the silicone plate and uneven lamination pressure caused by uneven heat distribution.

[0017] 2) The heat insulation board of this utility model is embedded with a temperature sensor, and the temperature sensor is evenly distributed around the edges and central areas of the heat insulation board. It can monitor the temperature of different areas of the component to be laminated during the lamination process, and transmit the monitoring data to the heat pump system. The heat pump system adjusts the temperature of the circulating working fluid in the edge heat pipe and the central heat pipe through the variable frequency compressor, thereby adjusting the heating temperature of different areas of the component to be laminated in real time.

[0018] 3) Both the edge heat pipes and the central heat pipes use flat plate heat pipe technology to form the working fluid circulation of the heat pump system. Flat plate heat pipe technology has the advantages of high heat transfer efficiency, simple structure and energy saving. It can eliminate local overheating of the lamination group in a short time and compensate for heat dissipation at the edge of the lamination group. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the device structure of a heat pump heating laminator with coupled flat plate heat pipe technology provided by an embodiment of this utility model;

[0020] Figure 2 yes Figure 1 A magnified view of a portion of the middle heating plate;

[0021] Figure 3 yes Figure 1 Schematic diagram of vacuum pumps and pipelines connected to the upper and lower chambers;

[0022] Figure 4 This is a schematic flowchart of a heat pump heating lamination method using coupled flat plate heat pipe technology provided by an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached figures

[0024] 1-Heating plate; 2-Cavity lifting system; 3-Upper chamber; 4-Lower chamber; 5-Laminating component; 6-Heat pump system; 11-Heating module; 12-Laminator top cover; 21-Laminator base; 22-Hydraulic piston; 23-Floating joint; 31-Insulation plate; 32-Upper lamination frame; 33-Silicone plate; 41-Lower lamination frame; 42-Laminator bottom plate; 61-Edge heat pipe working fluid inlet pipe; 62-Edge heat pipe working fluid outlet pipe; 63-Central heat pipe working fluid inlet pipe; 64-Central heat pipe working fluid outlet pipe; 111-Heating plate outer frame; 112-Edge heat pipe; 113-Central heat pipe; V1-Lower chamber vacuum valve; V2-Upper chamber vacuum valve; V3-Lower chamber inflation valve; V4-Upper chamber inflation valve. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0029] First Implementation Method

[0030] To achieve efficient and uniform heating of components in the laminator, while minimizing problems such as decreased sealing and adhesion due to uneven heating during lamination, this embodiment provides a heat pump-heated laminator coupled with flat-plate heat pipe technology, such as... Figure 1 As shown, it illustrates the composition of a heat pump heating laminator using coupled flat plate heat pipe technology. This heat pump heating laminator mainly includes a heating plate 1, a chamber lifting system 2, an upper chamber 3, a lower chamber 4, a vacuum system, and a heat pump system 6.

[0031] The laminator also has a laminator top cover 12 and a laminator bottom plate 42; the heating plate 1 has a heating module 11 embedded in it, which is used to uniformly heat the component 5 to be laminated. The heating plate 1 is directly connected to and fixed to the laminator top cover 12. The laminator top cover 12 is also connected to the chamber lifting system 2. The chamber lifting system 2 is connected to the heating plate 1 and the upper chamber 3. The laminator top cover 12 controls the vertical movement of the heating plate 1 and the upper chamber 3 through the chamber lifting system 2.

[0032] like Figure 2 As shown, the heating module 11 consists of a heating plate frame 111, edge heat pipes 112, and a central heat pipe 113. The heating plate frame 111 is used to protect and fix the heat pipes. The edge heat pipes 112 are fixed to the edge of the heating module 11 and are used to heat the edge of the component 5 to be laminated. The central heat pipe 113 is fixed to the center of the heating module 11. The arrangement is reciprocating, which facilitates the provision of a uniform and stable heat source to the component 5 to be laminated. It should be noted that the inlet and outlet of the edge heat pipe 112 and the central heat pipe 113 are respectively connected to different heat pumps in the heat pump system so as to control the temperature separately and control the temperature of different areas of the component 5 to be laminated. At the same time, it avoids problems such as deformation of the silicone plate and uneven lamination pressure caused by uneven heat distribution.

[0033] The laminator also includes a floating joint 23, and the chamber lifting system 2 is composed of a laminator base 21, a hydraulic cylinder, and a hydraulic piston 22. The floating joint 23 can absorb minor misalignment errors between the hydraulic cylinder and the upper chamber 3, ensuring that the silicone plate 33 simultaneously contacts all areas of the component 5 to be laminated during the lamination process, so as to apply pressure evenly. The hydraulic piston 22 is located inside the hydraulic cylinder and can be driven by hydraulic oil to reciprocate axially along the inner wall of the hydraulic cylinder, that is, to perform vertical movement; the hydraulic piston 22 drives the heating plate and the upper chamber to move vertically. The upper chamber 3 is sealed by a heat transfer plate 31, an upper lamination frame 32, and a silicone plate 33. The heat transfer plate 31 is located above the upper chamber and is used to uniformly transfer the heat generated by the heating module 11 to the component to be laminated 5 through the silicone plate 33, and can reduce heat loss. The upper lamination frame 32 is made of steel and is sealed to the heat insulation plate 31 by a sealing silicone strip to ensure the airtightness of the upper chamber 3. The silicone plate 33 is located below the upper chamber and is tightly connected to the upper lamination frame 32 to provide the pressure for lamination of the component to be laminated 5.

[0034] The lower chamber 4 is composed of the lower lamination frame 41, the lower base plate of the laminator 42, and the silicone plate 33 when downward pressure is applied. It is used to support the component 5 to be laminated and to provide a sealed environment for it, ensuring that all the air in the component 5 to be laminated is completely removed. The silicone plate 33 is located above the lower lamination frame 41, and the lower base plate of the laminator 42 is located below the lower lamination frame 41.

[0035] like Figure 3 As shown, both the upper chamber 3 and the lower chamber 4 have vacuum holes and air filling holes, and are connected to the vacuum system through pipes. The pipes connecting the lower chamber 4 to the vacuum system are equipped with a lower chamber vacuum valve V1 and a lower chamber air filling valve V3, respectively. The pipes connecting the upper chamber 3 to the vacuum system are equipped with an upper chamber vacuum valve V2 and an upper chamber air filling valve V4, respectively, to control the pressure in the upper and lower chambers.

[0036] Reference Figure 1 and Figure 2 The heat pump system 6 of the laminator of this utility model has an edge heat pipe working fluid inlet pipe 61, an edge heat pipe working fluid outlet pipe 62, a central heat pipe working fluid inlet pipe 63, and a central heat pipe working fluid outlet pipe 64. The edge heat pipe working fluid inlet pipe 61 and the edge heat pipe working fluid outlet pipe 62 are respectively connected to the inlet end and outlet end of the edge heat pipe 112 closest to the outer frame 111 of the heating plate 1. The central heat pipe working fluid inlet pipe 63 and the central heat pipe working fluid outlet pipe 64 are respectively connected to the inlet end and outlet end of the central heat pipe 113 evenly distributed in the center of the heating plate 1. This allows for zoned heating of the component 5 to be laminated, avoiding problems such as reduced sealing performance, air bubbles, and incomplete cross-linking of the adhesive film inside the component due to insufficient heating at the edges of the component 5.

[0037] Preferably, the insulation plate 31 is embedded with temperature sensors, which are evenly distributed around the edges and in the central area of ​​the insulation plate. These sensors can monitor the temperature of different areas of the component 5 to be laminated during the lamination process and transmit the monitoring data to the heat pump system 6. The heat pump system 6 adjusts the temperature of the circulating working fluid in the edge heat pipe 112 and the central heat pipe 113 through a variable frequency compressor, thereby adjusting the heating temperature of different areas of the component 5 to be laminated in real time.

[0038] Preferably, the heat pump system 6 also includes an evaporator, which can obtain heat from external waste heat. Waste heat sources include sewage that may be generated in the solar cell module production line, power plant cooling water, industrial wastewater, etc., as well as groundwater, soil, air, etc. Any waste heat that can be recovered and supplied to the heat pump system 6 is applicable to this utility model, so as to improve the economic and environmental benefits of this utility model.

[0039] Preferably, both the edge heat pipe 112 and the central heat pipe 113 use flat plate heat pipe technology. The heat pump system 6 first sends the heated circulating working fluid into the edge heat pipe 112 and the central heat pipe 113 through the edge heat pipe working fluid inlet pipe 61 and the central heat pipe working fluid inlet pipe 63. At this time, the circulating working fluid is high-temperature steam. After heating the component 5 to be laminated, the circulating working fluid condenses into liquid circulating working fluid. At this time, the liquid circulating working fluid is quickly collected in the edge heat pipe working fluid outlet pipe 62 and the central heat pipe working fluid outlet pipe 64 through the capillary wick structure in the edge heat pipe 112 and the central heat pipe working fluid outlet pipe 64, and finally enters the heat pump system 6 for reheating. The gaseous circulating working fluid after heat exchange re-enters the edge heat pipe 112 and the central heat pipe 113, thereby forming the working fluid circulation of the heat pump system 6. This flat plate heat pipe technology has the advantages of high heat transfer efficiency, simple structure, and energy saving. It can eliminate local overheating of the component 5 to be laminated in a short time and compensate for the heat dissipation at the edge of the component 5 to be laminated.

[0040] Preferably, the present invention does not limit the specific working fluid in the heat pump system 6. Any working fluid used in heat pumps and microgroove planar heat pipes is applicable to the present invention. These circulating working fluids can undergo a phase change near the temperature at which the adhesive film in the laminated component 5 crosslinks, and after condensation, they flow back into the heat pump system 6 through the capillary wick in the planar heat pipe.

[0041] Second Implementation Method

[0042] This embodiment provides a lamination method for a heat pump-heated laminator coupled with flat-plate heat pipe technology, the method including as follows: Figure 4 The steps shown are: component feeding stage S1, preheating and pre-compression stage S2, circulating heating stage S3, and component unloading stage S4.

[0043] The following explains each step.

[0044] Component feeding stage S1

[0045] Turn on the vacuum system, keeping the lower chamber inflation valve V3 open, the lower chamber vacuum valve V1 closed, the upper chamber vacuum valve V2 open, and the upper chamber inflation valve V4 closed. At this time, the pressure in the lower chamber 4 is atmospheric pressure, and the upper chamber 3 is in a vacuum state. Lay the component 5 to be laminated in the high-temperature cloth, and then put it into the lower chamber 4 of the laminator. The chamber lifting system 2 slowly descends, driving the heating plate 1 and the upper chamber 3 to descend together until the upper lamination frame 32 tightly adheres the silicone plate 33 to the lower lamination frame 41. At this time, the chamber lifting system stops moving, so that the lower chamber 4 is in a sealed state, and the laminator is kept in a sealed state.

[0046] Preheating and pre-compression stage S2

[0047] Keep the vacuum system open, open the lower chamber vacuum valve V1, and close the lower chamber inflation valve V3 to fully expel the air and dust around the component to be laminated 5. At the same time, close the upper chamber vacuum valve V2 to prevent air from flowing back from the lower chamber 4 to the upper chamber 3. When the vacuum levels of the upper and lower chambers are close, slowly open the upper chamber inflation valve V4. At this time, the pressure in the upper chamber 3 gradually increases. During this process, the silicone plate 33 initially pressurizes the component to be laminated 5. At the same time, the heat pump system 6 is turned on to control the working fluid circulation temperature near the melting temperature of the adhesive film in the component to be laminated 5 (when the component to be laminated 5 is a solar cell module, since the melting temperature of the adhesive film of the solar cell module is 80℃, the circulating working fluid temperature in the edge heat pipe is 85-90℃, and the circulating working fluid temperature in the central heat pipe is 80-85℃). The component to be laminated 5 is pre-bonded and fixed under the condition of initial heating and pressurization to avoid the problem of displacement of the internal structure of the component to be laminated 5 due to excessively rapid heating and pressurization.

[0048] Cyclic heating stage S3

[0049] With the vacuum system kept open, the lower chamber 4 remains in a full vacuum state, while the pressure in the upper chamber 3 reaches atmospheric pressure. The silicone plate 33 fully compresses the component 5 to be laminated. At this time, the circulating temperature of the working fluid in the heat pump system 6 is controlled near the cross-linking temperature of the adhesive film in the component 5 to be laminated (when the component 5 to be laminated is a solar cell module, since the cross-linking temperature of the adhesive film of the solar cell module to be laminated is 130℃, the circulating working fluid temperature in the edge heat pipe is 140-145℃, and the circulating working fluid temperature in the central heat pipe is 135-140℃). During the heating process, the temperature sensor inside the heat insulation plate 31 is used to control the temperature. The feedback signal constructs a real-time temperature field for the component 5 to be laminated. The heat pump system adjusts the circulating working fluid temperature of the edge heat pipe 112 and the central heat pipe 113 in real time according to the real-time temperature field of the component 5 to be laminated. Since there is unavoidable heat loss at the edges of the upper chamber 3 and the lower chamber 4 of the laminator, the temperature of the edge heat pipe 112 is generally set in the range of 140-145℃, and the temperature of the central heat pipe 113 is set in the range of 135℃-140℃. This temperature setting can compensate for the heat loss at the edges of the component 5 to be laminated and avoid problems such as voids or decreased viscosity caused by uneven heating of the adhesive film in the component 5 to be laminated.

[0050] If the real-time temperature field changes subsequently, the working fluid temperature flowing through the edge heat pipe 112 and the central heat pipe 113 can be adjusted by controlling the heat pump system 6 to achieve a uniform surface temperature of the component 5 to be laminated.

[0051] Component unloading stage S4

[0052] After lamination is completed, keep the vacuum system on, open the lower chamber inflation valve V3, close the lower chamber vacuum valve V1, close the upper chamber inflation valve V4, and open the upper chamber vacuum valve V2. When the upper chamber 3 is in a full vacuum state and the lower chamber 4 is inflated to atmospheric pressure, the chamber lifting system 2 slowly rises, driving the heating plate 1 and the upper chamber 3 to rise vertically together, finally causing the silicone plate 33 to leave the lower lamination frame 41, and the laminated component 5 to be laminated is taken out.

[0053] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. For those skilled in the art, various modifications and improvements can be made without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A heat pump heating laminator coupled with a flat plate heat pipe technology, characterized by, The utility model relates to a vacuum laminating machine, comprising: a heating plate with a planar heat pipe inside; an upper chamber sealed by a heat transfer plate, an upper laminating frame and a silica gel plate, the heat transfer plate is above the upper chamber, and the heat transfer plate and the upper laminating frame are sealed by a sealing silica gel strip; the silica gel plate is below the upper chamber and is closely connected with the upper laminating frame; a chamber lifting system connected with the heating plate and the upper chamber, used to drive the heating plate and the upper chamber to move vertically; a lower chamber composed of a lower laminating frame, a lower bottom plate of a laminating machine and a silica gel plate, the silica gel plate is above the lower laminating frame, and the lower bottom plate of the laminating machine is below the lower laminating frame; the lower chamber is used to carry a component to be laminated and provide a vacuum environment for the component to be laminated; a heat pump system connected with the planar heat pipe in the heating plate through an insulation pipeline, used to transport circulating working medium for the planar heat pipe; a vacuum system connected with the upper chamber and the lower chamber through pipelines; a plurality of valves arranged on the pipelines between the upper chamber and the vacuum system and between the lower chamber and the vacuum system, used to control the opening and closing of the pipelines; the planar heat pipe is divided into two parts, one part is an edge heat pipe arranged along the edge of the heating plate, and the other part is a central heat pipe arranged in the center of the heating plate, and the two parts are used to control the heating temperature of the component to be laminated in different zones.

2. The heat pump heating laminator coupled with the plate heat pipe technology of claim 1, wherein, Further comprising: a floating joint connected with the chamber lifting system and the upper cover of the laminating machine, used to absorb the small misalignment error of the upper chamber during vertical movement, and ensure that the upper chamber uniformly pressurizes the component to be laminated during lamination.

3. The heat pump heating laminator coupled with the plate heat pipe technology as claimed in claim 1, wherein, The planar heat pipe has a capillary structure inside, which can collect the liquefied circulating working medium in the planar heat pipe and transport it back to the heat pump system.

4. The heat pump heating laminator coupled with the plate heat pipe technology as claimed in claim 3, wherein, The heat transfer plate is embedded with a temperature sensor to real-time feedback the thermal field distribution of the component to be laminated.

5. The heat pump heating laminator coupled with the plate heat pipe technology as claimed in claim 1, wherein, The heat pump system is connected with the edge heat pipe and the central heat pipe through insulation pipelines, used to adjust the temperature of the circulating working medium in the edge heat pipe and the central heat pipe, so as to real-time adjust the heating temperature of different zones of the component to be laminated; the edge heat pipe and the central heat pipe are connected with different heat pumps in the heat pump system, so as to control the temperature of different zones of the component to be laminated.

6. The heat pump heating laminator coupled with the plate heat pipe technology of claim 1, wherein, The circulating working medium used by the heat pump system can change phase at the temperature when the adhesive film of the component to be laminated is crosslinked, and the phase-changed circulating working medium flows back to the heat pump system through the capillary structure in the planar heat pipe.

7. The heat pump heating laminator coupled with the plate heat pipe technology as claimed in claim 1, wherein, The heat pump system uses external waste heat as a heat source.

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