Flexible semiconductor chilling plate

Abstract

The embodiment of the utility model provides a flexible semiconductor chilling plate, and relates to the technical field of semiconductor refrigeration. The first flexible substrate of the flexible semiconductor chilling plate is provided with a first circuit layer. And the second flexible substrate is provided with a second circuit layer. The P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles are arranged between the first flexible substrate and the second flexible substrate, and the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles are connected in series through the first circuit layer and the second circuit layer. And the flexible filling layer is arranged in a gap between the first flexible substrate and the second flexible substrate. The fracture of the first circuit layer and the second circuit layer during bending can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration technology, and more specifically, to a flexible semiconductor refrigeration chip and its application. Background Technology

[0002] A thermoelectric cooler, also known as a semiconductor cooler, is a device that utilizes the thermoelectric effect of semiconductor materials to achieve cooling. The working principle of a thermoelectric cooler is primarily based on the Peltier effect: when direct current passes through a coupler composed of two different semiconductor materials connected in series, heat is absorbed and released at the two ends of the coupler, thus achieving cooling. Thermoelectric coolers offer many advantages, such as no sliding parts, high reliability, no pollution, no noise, no vibration, no wear, and long lifespan. These advantages have led to their widespread application in many fields, including automotive, medical, military, and aerospace.

[0003] However, existing thermoelectric coolers are made of rigid materials such as ceramic sheets, which cannot adapt to various complex installation environments and shape requirements. Flexible thermoelectric coolers, on the other hand, offer more possibilities for applications in different fields.

[0004] Existing flexible semiconductor cooling chips simply change the substrate to a flexible substrate, but the internal circuitry is easily damaged during bending and use, making it difficult to achieve industrial application. Utility Model Content

[0005] The purpose of this invention includes, for example, providing a flexible semiconductor refrigeration chip and its application, which can improve the problem of internal circuit damage caused by bending of the flexible semiconductor refrigeration chip.

[0006] The embodiments of this utility model can be implemented as follows:

[0007] This application provides a flexible semiconductor cooling chip, comprising:

[0008] A first flexible substrate is provided with a first circuit layer;

[0009] The second flexible substrate is provided with a second circuit layer;

[0010] P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles are disposed between a first flexible substrate and a second flexible substrate, and the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles are connected in series with each other through the first circuit layer and the second circuit layer.

[0011] A flexible filler layer is disposed in the gap between the first flexible substrate and the second flexible substrate.

[0012] In an optional embodiment, the flexible filler layer is formed by curing a filler liquid between the first flexible substrate and the second flexible substrate, so that the flexible filler layer cooperates with the first flexible substrate and the second flexible substrate to encapsulate and connect the P-type semiconductor thermoelectric particles, the N-type semiconductor thermoelectric particles, the first circuit layer and the second circuit layer inside.

[0013] In an optional embodiment, the semiconductor cooling chip further includes a flexible wrapping layer;

[0014] The flexible wrapping layer covers the outer periphery of the flexible semiconductor cooling chip.

[0015] In an optional embodiment, the flexible wrapping layer is made of the same material as the flexible filling layer.

[0016] In an optional embodiment, the flexible wrapping layer is connected to the flexible filling layer and is integrally formed with the flexible filling layer.

[0017] In an optional embodiment, the outer periphery of the flexible wrapping layer is provided with a deformation groove.

[0018] In an optional embodiment, the deformation groove is disposed on the side of the flexible wrapping layer corresponding to the heating side of the semiconductor cooling chip.

[0019] In an optional embodiment, the deformation groove includes multiple spaced transverse deformation grooves and multiple spaced longitudinal deformation grooves, wherein the transverse deformation grooves intersect the longitudinal deformation grooves.

[0020] In an optional embodiment, both the first flexible substrate and the second flexible substrate are made of polyimide material;

[0021] Both the first circuit layer and the second circuit layer are silver circuit layers;

[0022] The P-type semiconductor thermoelectric particle is a P-type bismuth telluride particle, and the N-type semiconductor thermoelectric particle is an N-type bismuth telluride particle.

[0023] Secondly, this application also provides the application of the flexible semiconductor cooling chip described in any of the above optional embodiments in medical devices.

[0024] The beneficial effects of the flexible semiconductor cooling chip fabrication process and its application according to the embodiments of this utility model include, for example:

[0025] This application replaces the rigid substrate of existing thermoelectric coolers with flexible first and second flexible substrates, enabling bending and thus adapting to complex application scenarios. Most importantly, this application incorporates flexible filling layers on the first and second flexible substrates. These flexible filling layers encapsulate the first and second circuit layers, as well as the P-type and N-type thermoelectric particles, internally, while providing support, connection, and fixation on the outside. This improves or prevents the first and second circuit layers from breaking due to bending, and also prevents the P-type and N-type thermoelectric particles from separating from the first and second circuit layers during bending, thereby allowing the flexible thermoelectric cooler to bend at greater angles. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the first flexible substrate and the first circuit layer of the flexible semiconductor cooling chip provided in this embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the second flexible substrate and the second circuit layer of the flexible semiconductor cooling chip provided in this embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the structure of the flexible semiconductor cooling chip provided in this embodiment of the present invention, in which P-type bismuth telluride particles and N-type bismuth telluride particles are installed on a first flexible substrate and a first circuit layer.

[0030] Figure 4 This is a schematic diagram of the structure of the flexible semiconductor refrigeration chip substrate provided in this embodiment of the utility model;

[0031] Figure 5 This is a cross-sectional view of the flexible semiconductor cooling chip provided in this embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the external structure of the flexible semiconductor cooling chip provided in this embodiment of the utility model.

[0033] Icons: 1-First flexible substrate; 2-Second flexible substrate; 3-First circuit layer; 4-Second circuit layer; 5-P-type bismuth telluride particles; 6-N-type bismuth telluride particles; 7-Filling layer; 8-Encapsulation layer. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0038] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0039] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0040] In existing thermoelectric coolers, P-type and N-type thermoelectric particles are typically fixed to a printed circuit between two substrates via welding or other methods to achieve series connection. Existing flexible thermoelectric coolers simply replace the rigid substrate of the original thermoelectric cooler with a flexible substrate, without altering other structural features. This leads to problems such as the internal printed circuit being pulled apart or the thermoelectric particles separating from the conductive layer during bending, resulting in a high failure rate and hindering industrial application.

[0041] To address the aforementioned problems, this embodiment provides a flexible semiconductor refrigeration chip and its application, which is bendable. This flexible semiconductor refrigeration chip can be used in medical devices to meet their cooling needs. Of course, this flexible semiconductor refrigeration chip can also be used in other devices, such as small refrigeration equipment.

[0042] Please refer to Figures 1 to 6 In this embodiment, the flexible semiconductor cooling chip includes a first flexible substrate 1, a second flexible substrate 2, P-type semiconductor thermoelectric particles, N-type semiconductor thermoelectric particles, and a flexible filling layer 7. The first flexible substrate 1 has a first circuit layer 3. The second flexible substrate 2 has a second circuit layer 4. The P-type and N-type semiconductor thermoelectric particles are disposed between the first and second flexible substrates 1 and 2, and are connected in series through the first circuit layer 3 and the second circuit layer 4. The flexible filling layer 7 is disposed within the gap between the first and second flexible substrates 1 and 2.

[0043] This embodiment replaces the rigid substrate of the existing thermoelectric cooler with a flexible first flexible substrate 1 and a flexible second flexible substrate 2, enabling bending and thus adapting to complex application scenarios. Most importantly, this application incorporates a flexible filling layer 7 on the first flexible substrate 1 and the second flexible substrate 2. This flexible filling layer 7 encapsulates the first circuit layer 3, the second circuit layer 4, and the P-type and N-type thermoelectric particles internally, while providing support, connection, and fixation on the outside. This improves or prevents the first circuit layer 3 and the second circuit layer 4 from breaking due to bending, and prevents the P-type and N-type thermoelectric particles from separating from the first circuit layer 3 and the second circuit layer 4 during bending of the flexible thermoelectric cooler, thereby allowing the flexible thermoelectric cooler to bend at greater angles.

[0044] In this embodiment, the flexible filling layer 7 is formed by curing a filling liquid between the first flexible substrate 1 and the second flexible substrate 2, so that the flexible filling layer 7 cooperates with the first flexible substrate 1 and the second flexible substrate 2 to encapsulate and connect the P-type semiconductor thermoelectric particles, the N-type semiconductor thermoelectric particles, the first circuit layer 3 and the second circuit layer 4 inside.

[0045] In this embodiment, the flexible filler layer 7 is cured directly between the first flexible substrate and the second flexible substrate by the filling liquid, which can better achieve encapsulation and connection.

[0046] In this embodiment, the thermoelectric cooler further includes a flexible wrapping layer 8. The flexible wrapping layer 8 covers the outer periphery of the flexible thermoelectric cooler.

[0047] This embodiment, by providing a flexible wrapping layer 8 on the outside, forms a unified whole, which is more conducive to bending. Most importantly, it can improve or even prevent condensation from forming on the condensation surface.

[0048] Please refer to Figures 1 to 6 Specifically, the flexible wrapping layer 8 is made of the same material as the flexible filling layer 7.

[0049] In this embodiment, the flexible wrapping layer 8 and the flexible filling layer 7 are made of the same material, ensuring that the physical properties of the inner and outer materials are identical. For example, parameters such as elastic modulus, coefficient of thermal expansion, tensile strength, and yield strength are the same. This ensures that the forces experienced internally and externally are the same during bending, thereby improving or even preventing the first and second conductive layers from breaking. In particular, the changes in various parameters internally and externally are essentially the same when affected by temperature, which is also a major reason why the first and second conductive layers are not broken.

[0050] In this embodiment, the flexible wrapping layer 8 is connected to the flexible filling layer 7 and is integrally formed with the flexible filling layer 7.

[0051] In this embodiment, the flexible wrapping layer 8 and the flexible filling layer 7 are connected and integrally formed, which facilitates manufacturing and makes the connection tighter.

[0052] In this embodiment, the outer periphery of the flexible wrapping layer 8 is provided with deformation grooves.

[0053] In this embodiment, a deformation groove is provided on the outer periphery of the flexible wrapping part, so that stress can be better released when bending.

[0054] Specifically, the deformation groove is disposed on the side of the flexible wrapping layer 8 corresponding to the heating side of the semiconductor cooling chip.

[0055] The deformation groove is located on one side of the heating surface of the flexible wrapping layer 8, which ensures that the flexible semiconductor cooling chip is flat and easy to attach. Secondly, the deformation groove can also increase the heat dissipation area of ​​the heat dissipation surface.

[0056] Please refer to Figures 1 to 6 In this embodiment, the deformation groove includes multiple spaced transverse deformation grooves and multiple spaced longitudinal deformation grooves, wherein the transverse deformation grooves intersect with the longitudinal deformation grooves.

[0057] In this embodiment, the deformation groove is configured as multiple lateral deformation grooves and multiple longitudinal deformation grooves, so that the flexible semiconductor cooling chip can be bent both laterally and longitudinally.

[0058] In this embodiment, both the first flexible substrate 1 and the second flexible substrate 2 are made of polyimide. Both the first circuit layer 3 and the second circuit layer 4 are silver circuit layers. The P-type semiconductor thermoelectric particle is a P-type bismuth telluride particle 5, and the N-type semiconductor thermoelectric particle is an N-type bismuth telluride particle 6.

[0059] The reason why silver circuit layers are used in the first circuit layer 3 and the second circuit layer 4 is that silver has better ductility, which can improve the problem of being pulled apart during bending.

[0060] Please refer to Figures 1 to 6 The flexible semiconductor cooling chip fabrication process provided in this embodiment includes:

[0061] S1. A first circuit layer 3 is fabricated on the surface of the first flexible substrate 1, and a second circuit layer 4 is fabricated on the surface of the second flexible substrate 2.

[0062] S2. P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles are disposed between the first flexible substrate 1 and the second flexible substrate 2, and the P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles are connected to the first circuit layer 3 and the second circuit layer 4, and the P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles are connected in series to form a flexible semiconductor cooling chip substrate.

[0063] S3. A filling liquid is injected between the first flexible substrate 1 and the second flexible substrate 2 of the flexible semiconductor cooling chip substrate, and the filling liquid is cured to form a flexible filling layer 7 between the first flexible substrate 1 and the second flexible substrate 2.

[0064] This embodiment replaces the rigid substrate of the existing semiconductor refrigeration chip with a flexible first flexible substrate 1 and a flexible second flexible substrate 2. The semiconductor refrigeration chip made in this way can be bent, thus making it suitable for complex application scenarios. Most importantly, this application injects a filling liquid between the first flexible substrate 1 and the second flexible substrate 2 of the flexible semiconductor refrigeration chip substrate in step S3, and then cures the filling liquid to form a flexible filling layer 7 between the first flexible substrate 1 and the second flexible substrate 2. The flexible filling layer 7 can fill the gaps between P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles, as well as the gaps between the first flexible substrate 1 and the second flexible substrate 2. The flexible filling layer 7 can also encapsulate the first circuit layer 3, the second circuit layer 4, and the P-type and N-type semiconductor thermoelectric particles inside, forming support, fixation, and connection. The first flexible substrate 1 and the second flexible substrate 2 are connected and fixed through the cured flexible filling layer 7. In this way, during the bending process of the flexible semiconductor refrigeration chip, the flexible filling layer 7 can support and connect the first circuit layer 3, the second circuit layer 4, and the P-type and N-type semiconductor thermoelectric particles, thereby improving or preventing the first circuit layer 3 and the second circuit layer 4 from breaking during bending and the P-type and N-type semiconductor thermoelectric particles from separating from the first circuit layer 3 and the second circuit layer 4. The filling layer 7 allows the flexible semiconductor refrigeration chip to be bent at a greater angle. Secondly, the filling layer 7 helps to even out the temperature of the flexible semiconductor refrigeration chip, resulting in a more uniform temperature across the cooling surface.

[0065] Please refer to Figures 1 to 6 In this embodiment, step S3 includes the following sub-steps:

[0066] S31. Place the flexible semiconductor cooling chip substrate into a pre-made mold;

[0067] S32. Inject the pre-prepared filling liquid into the mold;

[0068] S33. The filler liquid is cured to form a flexible filler layer 7;

[0069] S34. Remove the prepared flexible semiconductor refrigeration chip from the mold.

[0070] In this embodiment, a mold is set up and the prepared flexible semiconductor cooling chip substrate is placed in the mold. Then, a filling liquid is injected into the mold. This ensures that the filling liquid can better penetrate into the gap between the first flexible substrate 1 and the second flexible substrate 2, filling the internal space. The filling liquid is then cured in the mold, thereby forming a flexible filling layer 7 that fills the gap between the first flexible substrate 1 and the second flexible substrate 2.

[0071] It should be noted that the curing of the filler liquid is generally achieved in a vacuum curing device, which can prevent the formation of air bubbles in the filler layer 7 and affect the effect.

[0072] In this embodiment, step S31 includes the following sub-steps:

[0073] S311. Make a mold, and make the internal space of the mold larger than the volume of the flexible semiconductor refrigeration chip substrate;

[0074] S312. Fix the flexible semiconductor refrigeration chip substrate in the mold, and form a gap between the outer periphery of the flexible semiconductor refrigeration chip substrate and the inner wall of the mold.

[0075] Please refer to Figures 1 to 6 Step S33 includes the following sub-steps;

[0076] S341. The filling liquid is cured to form a filling layer 7 between the first flexible substrate 1 and the second flexible substrate 2, and a flexible wrapping layer 8 is formed on the outer periphery of the flexible semiconductor cooling chip substrate; wherein the filling layer 7 and the flexible wrapping layer 8 are integrally formed.

[0077] In this embodiment, the internal space of the mold is set to be larger than the volume of the flexible semiconductor refrigeration chip substrate. This creates a gap between the outer periphery of the flexible semiconductor refrigeration chip and the mold, which is also filled with a filler liquid. After the filler liquid solidifies, a flexible wrapping layer 8 is formed on the outer periphery of the flexible semiconductor refrigeration chip substrate. This provides better support inside the first flexible substrate 1 and the second flexible substrate 2, while covering the outside of the first flexible substrate 1 and the second flexible substrate 2. This further improves the resistance of the first circuit layer 3 and the second circuit layer 4 to breakage during bending and also prevents damage to the first flexible substrate 1 and the second flexible substrate 2. This design also allows the filler layer 7 and the wrapping layer 8 to be formed in one step, forming a whole, which simplifies the process.

[0078] For example, the flexible semiconductor refrigeration substrate is a cuboid with dimensions of 20mm*20mm*2mm, and the internal space of the mold is at least 21mm*21mm*3mm. In this way, a gap of 0.5mm can be formed between each face of the flexible semiconductor refrigeration substrate and the side face of the internal space of the mold to accommodate the filling liquid.

[0079] Please refer to Figures 1 to 6 In this embodiment, the fabrication process of the flexible semiconductor cooling chip further includes:

[0080] S4. A deformation groove is processed on the side of the flexible wrapping layer 8 corresponding to the heat dissipation surface of the flexible semiconductor cooling chip substrate.

[0081] In this embodiment, a deformation groove is processed on the side of the flexible encapsulation layer 8 corresponding to the heat dissipation surface of the flexible semiconductor cooling chip substrate. This allows internal stress to be released through the deformation groove when the flexible semiconductor cooling chip is bent. The deformation groove can be mesh-like. The deformation groove also increases the heat dissipation area of ​​the heat dissipation surface, thus achieving better heat dissipation. Furthermore, this design allows the surface of the encapsulation layer 8 corresponding to the cooling side to be planar, which is more advantageous in use.

[0082] Of course, in some embodiments of this application, the deformation groove can also be formed together with the mold in step S341.

[0083] In this embodiment, the filler liquid is prepared by mixing polydimethylsiloxane and a curing agent.

[0084] Polydimethylsiloxane, also known as PDMS, is a polymer compound with good chemical and thermal stability, excellent electrical insulation properties, and can remain stable between -50℃ and 200℃.

[0085] In this embodiment, the filler liquid is prepared by polydimethylsiloxane and curing agent in a weight ratio of 10:1. The curing temperature of the filler liquid ranges from 40℃ to 50℃, and the curing time ranges from 6h to 8h.

[0086] Curing at the selected curing temperature can improve flexibility and make it easier to bend.

[0087] In one set of experiments, a curing temperature of 45℃ and a curing time of 7 hours resulted in a product with low hardness and good flexibility; the flexible semiconductor refrigeration chip could be bent to 80° without damaging the internal circuitry. In another set of experiments, a curing temperature of 120℃ and a curing time of 2 hours resulted in a product with relatively high hardness and relatively poor flexibility. Furthermore, the flexible refrigeration chip without the filler layer 7 and the coating layer became unusable after being bent to 55°, as the internal circuitry was damaged.

[0088] Please refer to Figures 1 to 6 In this embodiment, the first flexible substrate 1 and the second flexible substrate 2 are thin films made of polyimide material.

[0089] Polyimide, also known as PI, produces films with excellent flexibility, heat resistance, electrical insulation, lightweight properties, and good biocompatibility, making it widely used in electronics and electrical engineering. Polyimide films are yellow and transparent, with a relative density of 1.39–1.45. They exhibit outstanding high-temperature resistance, radiation resistance, chemical corrosion resistance, and electrical insulation properties, allowing for long-term use in air at 250–280°C. The tensile strength is 200 MPa at 20°C and greater than 100 MPa at 200°C. It is used as a substrate for flexible printed circuit boards and as an insulating material for various high-temperature motors and electrical appliances.

[0090] Please refer to Figures 1 to 6In this embodiment, step S1 includes the following sub-steps:

[0091] S11. A first circuit layer 3 is printed on the surface of a plasma-treated first flexible substrate 1 using a microelectronic printer, and a second circuit layer 4 is printed on the surface of a plasma-treated second flexible substrate 2. The first circuit layer 3 and the second circuit layer 4 are silver circuit layers, and the first circuit layer 3 and the second circuit layer 4 are heated and cured.

[0092] A microelectronic printer is used to print a first circuit layer 3 and a second circuit layer 4 of a certain size and in an array pattern on a first flexible substrate 1 and a second flexible substrate 2 that have been treated with plasma, and then heats and cures them to ensure the stability of the circuit.

[0093] In this embodiment, the P-type semiconductor thermoelectric particle is a P-type bismuth telluride particle 5, and the N-type semiconductor thermoelectric particle is an N-type bismuth telluride particle 6.

[0094] Step S2 includes the following sub-steps:

[0095] S21. A layer of conductive silver paste is printed on the surface of the first circuit layer 3 and the second circuit layer 4 in the area where P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 are installed respectively.

[0096] S22. P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 are alternately arranged in the area where conductive silver paste is applied in the first circuit layer 3.

[0097] S23. Connect external wires to the first circuit layer 3;

[0098] S24. The second flexible substrate 2 is disposed above the P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6, and the P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 correspond to the areas of conductive silver paste disposed on the second circuit layer 4.

[0099] S25. The conductive silver paste is heated and cured to fix the P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 to the first circuit layer 3 and the second circuit layer 4 to form a flexible semiconductor cooling substrate.

[0100] A layer of conductive silver paste is printed on the corresponding area of ​​the first circuit layer 3 and the second circuit layer 4 using a microelectronic printer. Then, P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 are alternately arranged on the first circuit layer 3, and external wires are connected at the wire connection points. Then, the second flexible substrate 2 is installed on top of the P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6. The newly printed conductive silver paste is heated and cured, thereby fixing the position of the P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 and forming a series-connected thermocouple composed of P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6.

[0101] Utilizing the Peltier effect in semiconductor materials, when current passes through the contact surface of two different materials, electrons in one material are activated and move towards the other, creating a heat difference near the contact surface, resulting in heat absorption or release. To improve the efficiency of the Peltier effect, bismuth telluride semiconductor material with high thermoelectric properties is selected. A flexible cooling chip is powered by a DC power supply and external wires. When DC current passes through a thermocouple formed by P-type bismuth telluride particles 5 and N-type bismuth telluride particles 6 connected in series, heat is absorbed and released at the two ends of the thermocouple, thus achieving the purpose of cooling.

[0102] In summary, this embodiment replaces the rigid substrate of the existing thermoelectric cooler with a flexible first flexible substrate 1 and a flexible second flexible substrate 2, enabling bending and thus making it suitable for complex application scenarios. Most importantly, this application provides a flexible filling layer 7 on the first flexible substrate 1 and the second flexible substrate 2. The flexible filling layer 7 can encapsulate the first circuit layer 3, the second circuit layer 4, and the P-type and N-type thermoelectric particles internally, while forming support, connection, and fixation on the outside. This improves or prevents the first circuit layer 3 and the second circuit layer 4 from breaking due to bending during the bending process of the flexible thermoelectric cooler, and also prevents the P-type and N-type thermoelectric particles from separating from the first circuit layer 3 and the second circuit layer 4, thereby allowing the flexible thermoelectric cooler to bend at a greater angle.

[0103] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A flexible semiconductor refrigeration sheet, characterized by, include: A first flexible substrate (1) is provided with a first circuit layer (3); The second flexible substrate (2) is provided with a second circuit layer (4); P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles are disposed between a first flexible substrate (1) and a second flexible substrate (2), and the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles are connected in series through the first circuit layer (3) and the second circuit layer (4); A flexible filling layer (7) is disposed in the gap between the first flexible substrate (1) and the second flexible substrate (2); the flexible filling layer (7) is formed by curing a filling liquid between the first flexible substrate (1) and the second flexible substrate (2) so that the flexible filling layer (7) cooperates with the first flexible substrate (1) and the second flexible substrate (2) to wrap the P-type semiconductor thermoelectric particles, the N-type semiconductor thermoelectric particles, the first circuit layer (3) and the second circuit layer (4) inside and connect them to each other; the semiconductor cooling chip also includes a flexible wrapping layer (8); the flexible wrapping layer (8) covers the outer periphery of the flexible semiconductor cooling chip; the material of the flexible wrapping layer (8) is the same as the material of the flexible filling layer (7); the flexible wrapping layer (8) is connected to the flexible filling layer (7) and is integrally formed with the flexible filling layer (7).

2. The flexible semiconductor cooling chip according to claim 1, characterized in that, The flexible wrapping layer (8) has deformation grooves on its outer periphery.

3. The flexible semiconductor refrigeration sheet of claim 2, wherein, The deformation groove is disposed on one side of the flexible wrapping layer (8) corresponding to the heating side of the semiconductor cooling chip.

4. The flexible semiconductor refrigeration sheet of claim 3, wherein, The deformation groove includes multiple spaced transverse deformation grooves and multiple spaced longitudinal deformation grooves, wherein the transverse deformation grooves intersect with the longitudinal deformation grooves.

5. The flexible semiconductor refrigeration sheet according to any one of claims 1 to 4, wherein Both the first flexible substrate (1) and the second flexible substrate (2) are made of polyimide. Both the first circuit layer (3) and the second circuit layer (4) are silver circuit layers; The P-type semiconductor thermoelectric particle is a P-type bismuth telluride particle (5), and the N-type semiconductor thermoelectric particle is an N-type bismuth telluride particle (6).

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