Three-temperature sorting machine capable of reducing semiconductor temperature loss

Abstract

The utility model relates to a three-temperature sorting machine capable of reducing temperature loss of a semiconductor, which comprises a preheating disc for heating or cooling a semiconductor material; the feeding device comprises a lower-layer driving part and a lower-layer platform pushed by the lower-layer driving part, a temperature conducting plate is fixedly installed in the lower-layer platform, and the temperature conducting plate is used for heating or cooling the semiconductor materials; the material moving mechanical arm is provided with an adsorption part capable of moving in the X direction, the Y direction and the Z direction, and the adsorption part absorbs the semiconductor materials and places the semiconductor materials on the preheating disc or the lower-layer platform; the testing device comprises a pushing assembly and a testing temperature control head pushed by the pushing assembly, and the testing temperature control head sucks the semiconductor material located on the lower-layer platform for temperature control; the semiconductor material is primarily heated or cooled through the preheating disc, and then the temperature of the semiconductor material is kept through the lower platform and the test temperature control head, so that the temperature of the semiconductor material in the whole process is kept, and the temperature loss during transfer of the semiconductor material is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more particularly to a three-temperature sorting machine that reduces semiconductor temperature loss. Background Technology

[0002] Chip environmental adaptability testing is a crucial step before the chip leaves the factory. Its purpose is to verify the chip's stability and adaptability under different environmental conditions, ensuring the chip's reliability and stability in extreme environments. Environmental adaptability testing typically employs a three-temperature test, which involves testing at low temperature, room temperature, and high temperature.

[0003] According to Chinese patent CN217963608U, a semiconductor testing and sorting machine at different temperatures is disclosed. This machine uses a loading robot to transfer chips from a first loading tray conveyor mechanism to a temperature regulating device. The temperature regulating device heats, cools, or temporarily stores the chips at room temperature. After temperature regulation, the loading robot transfers the chips from the temperature regulating device to the first positioning fixture of a shuttle device. The shuttle device moves, causing the first positioning fixture to approach the testing device. The testing robot then transfers the chips from the first positioning fixture to the testing device, which tests the chips. However, when the chips are transferred from the temperature regulating device to the shuttle device, the chips lose some heat during the transfer process, causing the testing conditions to not meet expectations and resulting in inaccurate chip testing results.

[0004] Therefore, it is necessary to develop a three-temperature sorting machine that reduces semiconductor temperature loss to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a three-temperature sorting machine that continuously maintains the temperature and reduces semiconductor temperature loss.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a three-temperature sorting machine for reducing semiconductor temperature loss, comprising:

[0007] Preheating plate, used to heat or cool semiconductor materials;

[0008] The feeding device includes a lower driving unit and a lower platform driven by the lower driving unit. A temperature-conducting plate is fixedly installed inside the lower platform, and the temperature-conducting plate heats or cools the semiconductor material.

[0009] The material handling robot is equipped with an adsorption section that can move in the X, Y, and Z directions. The adsorption section picks up semiconductor material and places it into the preheating tray or the lower platform.

[0010] The testing apparatus includes a pushing component and a test temperature control head pushed by the pushing component. The test temperature control head picks up semiconductor material located on the lower platform and controls its temperature.

[0011] Furthermore, the lower platform includes a heating element that is attached to the temperature-conducting plate, and when the heating element heats up, it increases the temperature of the temperature-conducting plate.

[0012] Furthermore, the temperature-conducting plate has a refrigerant flow channel, which extends in a tortuous manner within the temperature-conducting plate. When the cooling medium passes through the refrigerant flow channel, it reduces the temperature of the temperature-conducting plate.

[0013] Furthermore, the feeding device includes a support frame, an upper track mounted on the support frame, an upper drive unit mounted on one side of the upper track, and an upper platform pushed by the upper drive unit, wherein the upper platform is located above the lower platform.

[0014] Furthermore, a material tray is fixedly installed on the upper surface of both the lower platform and the upper platform, and the material tray has a material placement position formed by a recess inward from its surface.

[0015] Furthermore, the preheating plate is provided with a heat-conducting material tray, which has a material discharge groove formed by indentation from its surface.

[0016] Furthermore, the material handling robot includes an X-axis drive assembly, a Y-axis drive assembly driven by the X-axis drive assembly, and a Z-axis drive assembly driven by the Y-axis drive assembly, with the adsorption part mounted at the end of the Z-axis drive assembly.

[0017] Furthermore, the Z-direction driving component is provided in pairs, each driving a pair of adsorption portions to move in the Z direction.

[0018] Furthermore, the material handling robot includes an adjustment slide rail and an adjustment slider movably connected to the adjustment slide rail. The Z-axis drive assembly and its adsorption part are mounted on the adjustment slider. The Z-axis drive assembly and its pair of adsorption parts can move relative to each other or in opposite directions.

[0019] Furthermore, the material handling robot is equipped with an adjustment drive motor, an adjustment transmission wheel driven by the adjustment drive motor, and an adjustment transmission belt surrounding the adjustment transmission wheel. The adjustment slider moves synchronously with the adjustment transmission belt.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model is a three-temperature sorting machine that reduces semiconductor temperature loss and has the feature of continuously maintaining temperature. Through the preheating plate, the semiconductor material is initially heated or cooled, and then the temperature of the semiconductor material is maintained by the lower platform. Finally, the temperature control head controls the temperature of the semiconductor material, realizing the temperature maintenance of the semiconductor material throughout the process and avoiding temperature loss during the transfer of semiconductor material. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0022] Figure 1 This is a three-dimensional structural diagram of a three-temperature sorting machine for reducing semiconductor temperature loss according to the present invention.

[0023] Figure 2 for Figure 1 The diagram shows the structure of the feeding device for a three-temperature sorter to reduce semiconductor temperature loss.

[0024] Figure 3 for Figure 2 The diagram shows the structure of the temperature control unit of the feeding device of a three-temperature sorter to reduce semiconductor temperature loss.

[0025] Figure 4 for Figure 3 The diagram shows the angle result of the other end of the temperature control unit of the feeding device of the three-temperature sorter to reduce semiconductor temperature loss.

[0026] Figure 5 for Figure 1 A top view of a three-temperature sorting machine designed to reduce semiconductor temperature loss;

[0027] Figure 6 for Figure 1 A schematic diagram of a partial structure of a material handling robot in a three-temperature sorting machine designed to reduce semiconductor temperature loss is shown.

[0028] Figure 7 for Figure 1 The diagram shows another angle of the transfer robot structure of the three-temperature sorting machine for reducing semiconductor temperature loss.

[0029] In the diagram: 1. Frame; 2. Feeding device; 3. Preheating tray; 4. Transfer robot; 5. Testing device; 21. Lower transfer assembly; 22. Upper transfer assembly; 23. Temperature control unit; 211. Lower track; 212. Lower drive unit; 213. Lower platform; 221. Support frame; 222. Upper track; 223. Upper drive unit; 224. Upper platform; 231. Temperature guide plate; 232. Heating element; 233. Refrigerant channel; 24. Material tray; 241. Material placement position; 31. Heat-conducting tray; 32. Discharge groove; 41. X-axis drive assembly; 42. Y-axis drive assembly; 43. Z-axis drive assembly; 4 4. Adsorption unit; 411. X-axis drive motor; 412. Moving frame; 421. Y-axis drive motor; 422. Moving plate; 431. Z-axis drive motor; 432. Transmission wheel; 433. Transmission belt; 434. Fixing plate; 435. Fixing slider; 436. Transmission belt fixing component; 437. Moving slide rail; 438. Clamping component; 439. Adjusting slide rail; 4310. Adjusting slider; 4311. Adjusting drive motor; 4312. Adjusting transmission wheel; 4313. Adjusting transmission belt; 441. Adsorption drive unit; 442. Adsorption head; 51. Support; 52. Pushing assembly; 53. Test temperature control head; 6. Inspection station. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please refer to Figures 1 to 7 This utility model is a three-temperature sorting machine for reducing semiconductor temperature loss. It includes a frame 1, a feeding device 2 mounted on the frame 1, a preheating plate 3 located on one side of the feeding device 2, a material transfer robot 4 moving back and forth between the feeding device 2 and the preheating plate 3, and a testing device 5 located at the end of the feeding device 2.

[0032] Please refer to Figure 1 The frame 1 is in a horizontal position to support the feeding device 2, the preheating plate 3, the material transfer robot 4, and the testing device 5.

[0033] Please refer to Figures 1 to 4The feeding device 2 includes a lower transfer assembly 21 mounted on the frame 1, an upper transfer assembly 22 located above the lower transfer assembly 21, and a temperature control unit 23 for changing the temperature of the lower transfer assembly 21. The lower transfer assembly 21 includes a lower track 211 laid on the frame 1, a lower drive unit 212 mounted on the outside of the lower track 211, and a lower platform 213 pushed by the lower drive unit 212. The number of lower tracks 211 is a pair, which are arranged in parallel relative to each other, and their ends extend to the bottom of the testing device 5.

[0034] The lower drive unit 212 pushes the lower platform 213 to move along the lower track 211.

[0035] The upper transfer assembly 22 includes a support frame 221, an upper track 222 mounted on the support frame 221, an upper drive unit 223 mounted on one side of the upper track 222, and an upper platform 224 pushed by the upper drive unit 223. There is a pair of support frames 221, which are located on the upper surfaces of the two ends of the lower platform 213 respectively. The bottom of the support frame 221 is fixedly connected to the lower platform 213, and its top extends vertically upward. The upper track 222 is laid on the top of the support frame 221 and extends from one end of the support frame 221 to the other end. The upper track 222 is parallel to the lower track 211.

[0036] The upper drive unit 223 pushes the upper platform 224 to move along the upper track 222.

[0037] Please refer to Figures 3 to 4 The temperature control unit 23 includes a temperature-conducting plate 231 and a heating element 232 attached to the temperature-conducting plate 231. The temperature-conducting plate 231 is located inside the lower platform 213 and is fixedly connected to the lower platform 213. The temperature-conducting plate 231 has a refrigerant flow channel 233, which extends in a tortuous manner inside the temperature-conducting plate 231. When the cooling medium passes through the refrigerant flow channel 233, it lowers the temperature of the temperature-conducting plate 231. The heating element 232 is attached to the lower surface of the temperature-conducting plate 231. When the heating element 232 heats up, it raises the temperature of the temperature-conducting plate 231.

[0038] Both the lower platform 213 and the upper platform 224 are fixedly installed with a material tray 24. The material tray 24 has a material placement position 241 formed by recessing from its surface. The shape, position and number of the material placement positions 241 can be changed according to the requirements.

[0039] Please refer to Figure 5 The preheating plate 3 is provided with a heat-conducting material plate 31, which has a material discharge groove 32 formed by recessing from its surface inward. The shape, position and number of the material discharge groove 32 can be changed according to the requirements.

[0040] Please refer to Figure 1 and Figure 5 , Figure 7The material handling robot 4 includes an X-axis drive assembly 41, a Y-axis drive assembly 42, and a Z-axis drive assembly 43, as well as an adsorption unit 44 that is pushed by the X-axis drive assembly 41, the Y-axis drive assembly 42, and the Z-axis drive assembly 43. The X-axis drive assembly 41 includes an X-axis drive motor 411 and a moving frame 412 that is pushed by the X-axis drive motor 411. The X-axis drive motor 411 drives the moving frame 412 to move in the X direction. The Y-axis drive assembly 42 includes a Y-axis drive motor 421 and a moving plate 422 that is pushed by the Y-axis drive motor 421. The Y-axis drive motor 421 drives the moving plate 422 to move in the Y direction.

[0041] Z-axis drive assembly 43 includes a Z-axis drive motor 431, a transmission wheel 432 driven by the Z-axis drive motor 431, a transmission belt 433 surrounding the transmission wheel 432, and a fixed plate 434 disposed on the surface of the movable plate 422. The fixed plate 434 extends vertically downward from the top of the movable plate 422 to below the movable plate 422. A fixed slider 435 and a transmission belt fixing member 436 are installed on the inner side of the fixed plate 434. The fixed slider 435 is movably connected to a movable slide rail 437, which is arranged vertically along the fixed slider 432. 35. The transmission belt fixing member 436 is fixedly connected to the fixing plate 434 at one end and extends outward at the other end. The transmission wheel 432 is installed on the transmission belt fixing member 436. The Z-axis drive motor 431 is located above the fixing plate 434 and drives the transmission wheel 432 to rotate. The transmission belt 433 around the transmission wheel 432 moves synchronously. The top of the moving slide rail 437 is provided with a clamping member 438. One end of the clamping member 438 is fixedly connected to the moving slide rail 437 and the other end clamps the transmission belt 433. The bottom of the moving slide rail 437 is provided with an adsorption part 44.

[0042] Preferably, a pair of Z-direction drive components 43 are provided, each driving a pair of adsorption parts 44 to move in the Z direction. The surface of the moving plate 422 is also provided with an adjustment slide rail 439 and an adjustment slider 4310 movably connected to the adjustment slide rail 439. Another Z-direction drive component 43 and its adsorption part 44 are mounted on the adjustment slider 4310. Specifically, the moving plate 422 is also provided with an adjustment drive motor 4311, an adjustment transmission wheel 4312 driven by the adjustment drive motor 4311, and an adjustment transmission belt 4313 surrounding the adjustment transmission wheel 4312. The adjustment slider 4310 moves synchronously with the adjustment transmission belt 4313. The pair of Z-direction drive components 43 and their pair of adsorption parts 44 can move relative to each other or in opposite directions.

[0043] The adsorption unit 44 includes an adsorption drive unit 441 and an adsorption head 442 connected to the adsorption drive unit 441. The adsorption drive unit 441 is mounted on the bottom of the movable slide rail 437. The top of the adsorption head 442 is connected to the adsorption drive unit 441, and its bottom extends vertically downward.

[0044] Please refer to Figure 7The testing device 5 includes a bracket 51, a push component 52 mounted on the bracket 51, and a test temperature control head 53 driven by the push component 52. The bottom of the bracket 51 is fixedly connected to the frame 1, and its top extends vertically upward. The push component 52 is mounted on the top of the bracket 51 and drives the test temperature control head 53 to move vertically. The test temperature control head 53 is prior art and will not be explained in detail. The test temperature control head 53 can pick up semiconductors and heat or cool them.

[0045] Furthermore, the frame 1 has a testing station 6, which is located below the test temperature control head 53.

[0046] In use, this utility model discloses a three-temperature sorting machine for reducing semiconductor temperature loss. The preheating plate 3 and the lower platform 213 are heated or cooled to a predetermined temperature. The X-axis drive assembly 41, Y-axis drive assembly 42, and Z-axis drive assembly 43 drive the adsorption unit 44 to adsorb semiconductor material and place it into the preheating plate 3. The semiconductor material is then heated or cooled. A transfer robot 4 places the preheated semiconductor material onto the lower platform 213. The temperature control unit 23 continuously heats or cools the semiconductor material via a temperature guide plate 231. The lower drive unit 212 pushes the lower platform 213 along the lower track 211. The device moves to the bottom of the testing device 5, and the push component 52 drives the test temperature control head 53 to move vertically, pick up the semiconductor material, and heat or cool the semiconductor. It works with other devices to test the semiconductor material. After the test is completed, the upper drive unit 223 pushes the upper platform 224 to move along the upper track 222. The upper platform 224 is located above the lower platform 213. The testing device 5 puts the tested semiconductor material into the upper platform 224. The upper platform 224 moves out of the testing device 5, and then the transfer robot 4 puts the tested semiconductor material into the corresponding position according to its performance.

[0047] This invention relates to a three-temperature sorting machine that reduces semiconductor temperature loss. It features continuous temperature maintenance. The semiconductor material is initially heated or cooled by a preheating plate, and then its temperature is maintained by a lower platform. Finally, a temperature control head controls the temperature of the semiconductor material, thus achieving temperature maintenance throughout the entire process and preventing temperature loss during semiconductor material transfer.

[0048] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A three-temperature handler for reducing temperature losses in a semiconductor, characterized by, It includes: Preheating disc (3), the semiconductor material is warmed up or cooled down; Feeding device (2), including lower driving part (212), lower platform (213) driven by lower driving part (212), temperature guide plate (231) is fixedly installed in lower platform (213), temperature guide plate (231) is warmed up or cooled down to semiconductor material; Material transfer manipulator (4) is provided with adsorption part (44) that can move in X, Y, Z three directions, semiconductor material is placed in preheating disc (3) or lower platform (213) by adsorption part (44); Testing device (5), including push assembly (52), test temperature control head (53) driven by push assembly (52), semiconductor material on lower platform (213) is taken by test temperature control head (53), and temperature control is carried out.

2. The three-temperature handler for reducing temperature losses of semiconductors of claim 1, wherein, The lower platform (213) includes a heating sheet (232) that fits the temperature guide plate (231), and the heating sheet (232) increases the temperature of the temperature guide plate (231) when it generates heat.

3. The three-temperature handler for reducing temperature losses of semiconductors of claim 1, wherein, The temperature guide plate (231) is provided with a coolant flow channel (233), and the coolant flow channel (233) extends zigzagly in the temperature guide plate (231). When the cooling medium passes through the coolant flow channel (233), the temperature of the temperature guide plate (231) is reduced.

4. The three-temperature handler for reducing temperature losses of semiconductors of claim 1, wherein, The feeding device (2) includes a support frame (221), an upper rail (222) mounted on the support frame (221), an upper driving part (223) mounted on one side of the upper rail (222), and an upper platform (224) driven by the upper driving part (223). The upper platform (224) is located above the lower platform (213).

5. The three-temperature handler for reducing temperature losses of semiconductors of claim 4, wherein, The upper surface of the lower platform (213) and the upper platform (224) is fixedly installed with a material placing disc (24), and the material placing disc (24) has a material placing position (241) formed by recessing inward from its surface.

6. The three-temperature handler for reducing temperature losses of semiconductors of claim 1, wherein, The preheating disc (3) is provided with a heat-conducting tray (31), and the heat-conducting tray (31) has a material placing groove (32) formed by recessing inward from its surface.

7. The three-temperature handler for reducing temperature losses of semiconductors of claim 1, wherein, The material transfer manipulator (4) includes an X-direction driving assembly (41), a Y-direction driving assembly (42) driven by the X-direction driving assembly (41), and a Z-direction driving assembly (43) driven by the Y-direction driving assembly (42). The adsorption part (44) is mounted at the end of the Z-direction driving assembly (43).

8. The three-temperature handler for reducing temperature losses of semiconductors of claim 7, wherein, The Z-direction driving assembly (43) is provided with a pair of Z-direction driving assemblies (43) respectively driving a pair of adsorption parts (44) to move in the Z-direction.

9. The three-temperature handler for reducing temperature losses of semiconductors of claim 8, wherein, The material transfer manipulator (4) includes a position adjusting slide rail (439) and a position adjusting slide block (4310) movably connected to the position adjusting slide rail (439). The Z-direction driving assembly (43) and the adsorption part (44) thereof are mounted on the position adjusting slide block (4310), and the pair of Z-direction driving assemblies (43) and the pair of adsorption parts (44) thereof can move relatively or oppositely.

10. The three-temperature handler for reducing temperature losses of semiconductors of claim 9, wherein, The material moving manipulator (4) is provided with a position adjusting driving motor (4311), a position adjusting transmission wheel (4312) driven by the position adjusting driving motor (4311) and a position adjusting transmission belt (4313) surrounding the position adjusting transmission wheel (4312), and the position adjusting sliding block (4310) moves synchronously with the position adjusting transmission belt (4313).

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