Semiconductor chip processing equipment

Abstract

The utility model relates to the field of chip processing, in particular to semiconductor chip processing equipment, and adopts the technical scheme that the semiconductor chip processing equipment comprises a feeding device, a transferring device, a receiving device, a conveying device and a discharging device which are sequentially arranged along a chip processing path, the adjusting device, the first detection device, the first material storage device, the smearing device, the second material storage device, the adsorption device, the second detection device and the third detection device are arranged in the chip conveying direction of the conveying device, the first material storage device is used for storing solder paste, and the smearing device is used for smearing the solder paste on a chip of the conveying device. The material storage device II is used for loading solder balls; the adsorption device is used for adsorbing a solder ball onto a chip of the conveying device, and the chip is a chip coated with solder paste; a material moving device and a collecting device are further arranged at the discharging end of the conveying device, and the material moving device is used for moving the chips to the discharging device or the collecting device. The method has the effect of improving the chip processing efficiency.

Description

Technical Field

[0001] This application relates to the field of chip processing, and more particularly to a semiconductor chip processing apparatus. Background Technology

[0002] Solder balls are mounted on the chip. The solder balls are mainly used to connect the chip's pads to the packaging substrate, enabling signal transmission and power supply between the chip and external circuits. The solder balls also play a role in heat dissipation and provide support for the chip, keeping it stable during the packaging process and reducing damage to the chip from external impacts.

[0003] Current chip solder ball mounting processes typically include screen printing and laser balling. Screen printing involves printing solder paste onto the substrate pads using a stencil, then reflow soldering heats the paste to a molten state, forming spherical shapes under surface tension. Laser balling involves storing pre-made solder balls in a machine, transporting them to designated positions on the pads using nitrogen (N2), and then heating the balls with a laser. After cooling, the solder balls firmly bond to the chip. Of these methods, screen printing is low-cost but struggles with mounting small solder balls and results in inconsistent uniformity. Laser mounting is less efficient and more expensive. Utility Model Content

[0004] In order to improve chip processing efficiency and chip processing quality, this application provides a semiconductor chip processing equipment.

[0005] This application provides a semiconductor chip processing equipment, which adopts the following technical solution:

[0006] A semiconductor chip processing apparatus includes a feeding device, a transfer device, a receiving device, a conveying device, and a discharging device arranged sequentially along a chip processing path. It also includes an adjustment device, a first detection device, a first storage device, a coating device, a second storage device, an adsorption device, a second detection device, and a third detection device arranged along the chip conveying direction of the conveying device. The first storage device is used to store solder paste; the coating device is used to apply solder paste to the chip of the conveying device; the second storage device is used to load solder balls; the adsorption device is used to adsorb solder balls onto the chip of the conveying device, which is a chip coated with solder paste; the discharging end of the conveying device is further provided with a transfer device and a collection device, the transfer device being used to move the chip to the discharging device or the collection device.

[0007] By adopting the above technical solutions, the feeding device conveys materials, the transfer device receives materials from the feeding device, and the receiving device transports materials to the conveying device, thereby improving the conveying efficiency of products and reducing manual handling time. Detection devices one, two, and three respectively perform processing inspections on each processing node of the materials, effectively improving the processing quality of the products. At the same time, it facilitates the unified handling of problematic materials and makes it easier to trace the source of problems in subsequent products. The adsorption device facilitates the unified installation of solder balls, improving the installation efficiency of solder balls and reducing the installation time. Detection device two improves the installation quality of solder balls and ensures the integrity of the number of solder balls installed.

[0008] Preferably, the feeding device is used to convey materials. The feeding device includes a mounting frame, a material platform mounted on the mounting frame, a conveyor belt mounted on the material platform, and baffles mounted on the mounting frame and located on both sides of the material platform along its length. The conveyor belt is located between the two baffles.

[0009] Preferably, the transfer device is located at the discharge end of the feeding device. The transfer device includes a transfer cylinder located at the discharge end of the feeding device, a transfer seat disposed at the piston end of the transfer cylinder, a linear motor disposed on the transfer seat, and a receiving seat disposed on the linear motor. The piston end of the transfer cylinder reciprocates along the conveying direction of the feeding device, and the linear motor is used to drive the receiving seat to move up and down.

[0010] Preferably, the receiving device is located at the discharge end of the transfer device. The receiving device includes a receiving bracket, a linear motor II mounted on the receiving bracket, a receiving seat II mounted on the linear motor II, positioning plates mounted on the bottom surface of the receiving seat II and located on both sides of the receiving seat II along its length, an adjustment component and a clamping component mounted on the receiving seat II. The positioning plate has a positioning groove along its length on the side facing the material. The linear motor II moves from the transfer device to the conveying device. The adjustment component is used to adjust the distance between the two positioning plates. The clamping component is used to clamp and guide the material into the positioning groove.

[0011] Preferably, the adjusting device includes a linear motor three, an adjusting seat mounted on the linear motor three, an adjusting cylinder one mounted on the adjusting seat, and an adjusting component one mounted on the piston end of the adjusting cylinder one. The adjusting cylinder one is used to drive the adjusting component one to move up and down. The linear motor three is used to drive the adjusting seat to move along the width direction of the conveying device. The adjusting seat is provided with a mounting platform for mounting the adjusting cylinder one. The adjusting component one includes an adjusting cylinder two mounted on the adjusting seat, an adjusting plate mounted on the piston end of the adjusting cylinder one, and several adjusting rods mounted on the bottom surface of the adjusting plate. The piston end of the adjusting cylinder two is connected to the mounting platform, and the piston movement direction of the adjusting cylinder two is consistent with the conveying direction of the conveying device.

[0012] Preferably, the detection device is located above the conveying device. The detection device is used to detect whether the chip position is properly adjusted. If the detection passes, the conveying device continues to convey the material; if the detection fails, the conveying device returns the material to the adjustment device for readjustment. The detection device includes a support base, a linear motor four mounted on the support base and located above the conveying device, a detection seat four mounted on the linear motor four, a detection cylinder four mounted on the detection seat four, and a detection camera four mounted on the piston end of the detection cylinder four. The detection cylinder four is used to drive the detection camera to move up and down, and the linear motor four reciprocates along the width direction of the conveying device.

[0013] Preferably, the material storage device includes a material storage base and a material storage box disposed on the material storage base, the top surface of the material storage box being open; the coating device includes a mounting base, a linear motor five disposed on the mounting base, a fixed base disposed on the linear motor five, a linear motor six disposed on the fixed base, a coating seat disposed on the linear motor six, and a coating block disposed on the coating seat, the linear motor five being used to drive the coating block from the material storage device one to the conveying device, and the linear motor six being used to drive the coating block to move up and down.

[0014] Preferably, a recycling device is provided between the storage device and the conveying device. The recycling device includes a recycling seat, a contact surface disposed on the recycling seat, baffles disposed on the recycling seat and located on both sides of the contact surface along its length, and a scraping component disposed on the recycling seat. A recycling box is provided at the end of the recycling seat away from the scraping component, and the end of the contact surface near the recycling box is inclined downwards.

[0015] Preferably, the second storage device includes a second storage base, a second storage box disposed on the second storage base, and a pushing cylinder disposed on the second storage base. The pushing cylinder is used to push the storage box to discharge material. The discharge end of the second storage device is provided with a vibration device. The vibration device is used to evenly disperse the solder balls. The vibration device includes a vibration base, a vibration disk disposed on the vibration base, and a vibration element disposed on the vibration base and located below the vibration disk. The vibration element is used to drive the vibration disk to vibrate.

[0016] Preferably, the adsorption device includes a linear motor seven, an adsorption seat mounted on the linear motor seven, a linear motor eight mounted on the adsorption seat, a mounting block mounted on the linear motor eight, a rotary motor mounted on the mounting block, and an adsorption block mounted at the output end of the rotary motor. The linear motor seven is used to drive the adsorption block to reciprocate between the storage device two and the conveying device. The vibration device is located in the movement path of the linear motor seven. The linear motor eight is used to drive the adsorption block to move up and down. The adsorption groove is located on the adsorption block.

[0017] Preferably, a cleaning device is provided between the second detection device and the vibration device. The cleaning device includes a cleaning frame and a cleaning tube set on the cleaning frame. One end of the cleaning tube is sealed, and the other end of the cleaning tube is connected to a vacuum device. The cleaning tube has a long groove along its length on the side facing the adsorption block.

[0018] Preferably, the second detection device is located in the moving path of the adsorption device and is used to detect whether the solder balls on the adsorption device are completely adsorbed; if the detection is successful, the adsorption device moves above the material to release the material; if the detection fails, the adsorption device needs to return to adsorb again; the second detection device includes a second detection seat and a second detection camera set on the second detection seat.

[0019] Preferably, the detection device three is located at the discharge end of the conveying device and is used to detect whether the solder balls on the chip are properly installed. The detection device three includes a detection base three, a linear motor nine arranged on the detection base three and extending along the width direction of the conveying device, a fixed frame arranged on the linear motor nine, a linear motor ten arranged on the fixed frame, and a detection camera three arranged on the linear motor ten. The linear motor nine is used to drive the detection camera three to move along the width direction of the conveying device, and the linear motor ten drives the detection camera three to move up and down.

[0020] In summary, the feeding device, transfer device, receiving device, and conveying device effectively improve material conveying efficiency, increase overall material processing efficiency, reduce manual handling frequency, and reduce manual handling costs. The adjusting device improves the uniformity of subsequent material processing positions, thereby improving material processing quality. Detection devices one, two, and three improve material processing quality, ensuring the quality and efficiency of solder ball installation and saving material processing costs. The adsorption device improves solder ball installation efficiency, while the cleaning device and detection device two improve the quality of solder ball installation by the adsorption device, ensuring the integrity of solder ball installation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 2 ;

[0023] Figure 3 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 3 ;

[0024] Figure 4 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 4 ;

[0025] Figure 5 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 5 ;

[0026] Figure 6 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 6 ;

[0027] Figure 7 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 7 ;

[0028] Figure 8 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 8 ;

[0029] Figure 9 This is a schematic diagram of the structure of a semiconductor chip processing equipment according to this application. Figure 9 .

[0030] Explanation of reference numerals in the attached drawings: 1. Base; 2. Feeding device; 21. Mounting frame; 22. Material platform; 23. Conveyor belt one; 24. Baffle one; 3. Transfer device; 31. Transfer cylinder; 32. Transfer seat; 33. Linear motor one; 34. Receiving seat one; 4. Receiving device; 41. Receiving bracket; 42. Linear motor two; 43. Receiving seat two; 44. Positioning plate; 441. Positioning groove; 45. Adjustment component; 46. Clamping component; 461. Drive component one; 462. Lifting cylinder; 463. Clamping seat; 464. Gripper; 5. Conveying device; 6. Adjustment device; 61. Linear motor three; 62. Adjustment seat; 63. Adjusting cylinder one; 64. Adjusting component one; 641. Adjusting cylinder two; 642. Adjusting plate; 643. Adjusting rod; 7. Detection device one; 71. Support base; 72. Linear motor four; 73. Detection seat one; 74. Detection cylinder one; 75. Detection camera one; 8. Material storage device one; 81. Material storage seat one; 82. Material storage box one; 9. Coating device; 91. Mounting base; 92. Linear motor five; 93. Fixed base; 94. Linear motor six; 95. Coating seat; 96. Coating block; 10. Material storage device two; 101. Material storage seat two; 102. Material storage box two; 103. Push cylinder; 11. Vibration device 111. Vibrating seat; 112. Vibrating plate; 113. Vibrating component; 12. Adsorption device; 121. Linear motor seven; 122. Adsorption seat; 123. Linear motor eight; 124. Mounting block; 125. Rotary motor; 126. Adsorption block; 13. Detection device two; 131. Detection seat two; 132. Detection camera two; 14. Cleaning device; 141. Cleaning frame; 142. Cleaning tube; 1421. Long groove; 15. Detection device three; 151. Detection seat three; 152. Linear motor nine; 153. Fixing frame; 154. Linear motor ten; 155. Detection camera three; 16. Material transfer device; 161. Support frame; 162. Linear motor eleven; 163. Transfer seat; 164. Transfer cylinder; 165. Pushing component; 166. Pushing block; 167. Transfer plate; 1671. Limiting groove; 17. Discharge device; 171. Mounting plate; 1711. Baffle plate; 172. Conveyor belt two; 18. Collection device; 181. Collection seat; 182. Clamping plate; 183. Baffle rod; 19. Mounting platform; 20. Recycling device; 201. Recycling seat; 202. Contact plane; 203. Baffle two; 204. Scraping assembly; 25. Recycling box; 26. Adjusting component two; 27. Material tray; 28. Pushing assembly. Detailed Implementation

[0031] The following is in conjunction with the appendix Figures 1-9 The present invention will be further described below. The following embodiments are only used to more clearly illustrate the technical solution of this application, and should not be used to limit the protection scope of the present invention.

[0032] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inner", and "outer" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0033] This application discloses a semiconductor chip processing apparatus. (Refer to...) Figure 1 and Figure 2 The system includes a feeding device 2, a transfer device 3, a receiving device 4, a conveying device 5, and an output device 17, arranged sequentially along the chip processing path. The feeding device 2 loads and conveys materials. The transfer device 3, located at the output end of the feeding device 2, receives materials from the feeding device 2. The receiving device 4, located at the output end of the transfer device 3, receives materials from the transfer device 3 and then moves the materials to the feed end of the conveying device 5. An adjusting device 6 is located above the output end of the conveying device 5 to adjust the position of the materials on the conveying device 5.

[0034] Reference Figure 1 and Figure 3 Above the conveyor 5, a detection device 7 is also installed. The detection device 7 is used to detect whether the material position adjusted by the adjusting device 6 is accurately placed. The materials in this application are chips and a tray for loading the chips. The chips have grooves for loading solder balls, and the tray has slots for positioning the chips. The chips are placed on the tray with the grooved side facing upwards, facilitating the subsequent installation of solder balls onto the chips. In specific implementations, the materials can also be configured according to processing requirements.

[0035] Reference Figure 1 and Figure 4After the testing device 7 completes the chip testing, the conveying device 5 transports the tray containing the chips that have passed the testing. This application also includes a storage device 8 for storing solder paste and an applicator 9 for applying solder paste to the chips. After the conveying device 5 moves the tray to the processing area of ​​the applicator 9, the applicator 9 first moves to the storage device 8 to pick up the solder paste, and then moves to the conveying device 5 to apply the solder paste into the chip recess. This application also includes a storage device 10 for loading solder balls, a vibration device 11 for dispersing the solder balls, and an adsorption device 12 for adsorbing the solder balls. The conveying device 5 transports the chip with solder paste applied to the solder ball mounting area. The storage device 10 places the solder balls onto the vibration device 11, which vibrates to disperse the solder balls, facilitating adsorption by the adsorption device 12. The adsorption device 12 has adsorption grooves corresponding to the chip recesses, which adsorb the solder balls. After adsorbing the solder balls, the adsorption device 12 places them onto the material on the conveying device 5.

[0036] Reference Figure 1 and Figure 4 After the adsorption device 12 has finished adsorbing the solder balls, in order to avoid excess solder balls or incomplete adsorption of solder balls on the adsorption device 12, this application also includes a cleaning device 14 and a second detection device 13. The cleaning device 14 is used to clean the adsorption device 12 after adsorbing the solder balls, removing excess solder balls from the surface of the adsorption device 12. After cleaning, the adsorption device 12 moves to the second detection device 13 for detection. The second detection device 13 is used to detect whether the solder balls on the adsorption device 12 are completely adsorbed and whether the quality of the solder balls is normal. If there is a problem with the solder balls, this application also includes a material tray 27 for loading the problematic solder balls. The adsorption device 12 moves to the material tray 27, places the problematic solder balls into the material tray 27, and then returns to the vibration device 11 to adsorb solder balls. When the second detection device 13 passes the test, the adsorption device 12 moves above the chip to unload the chip, and then the conveying device 5 drives the chip to continue moving. To further ensure the placement quality of solder balls on the chip, this application also includes a detection device 3 15 and a transfer device 16. The detection device 3 15 is located at the discharge end of the conveying device 5 and is used to detect whether the solder balls on the chip are properly installed. Chips that pass the detection are moved to the discharge device 17 by the transfer device 16 for discharge, while chips that have problems are moved to another storage area by the transfer device 16. This application provides a collection device 18 for collecting such problematic chips.

[0037] Reference Figure 1 and Figure 2In this application, all structural components are mounted on the base 1, facilitating equipment maintenance and installation, and protecting the processing area floor. In practical implementation, they can also be directly installed or placed on the ground or a support. In this embodiment, the feeding device 2 is located at the feeding end of the base 1 and extends along the width of the base 1. The feeding device 2 includes a mounting frame 21, a material platform 22 mounted on the mounting frame 21 and extending along the length of the mounting frame 21, a conveyor belt 23 mounted on the material platform 22, and baffles 24 located on both sides of the material platform 22 along its length, which improve the stability of the material on the conveyor belt 23. This application provides several sets of conveyor belts 23 to improve the stability of material conveying. In this embodiment, two sets of material platforms 22 are provided, forming two layers of material conveying areas, which improves the storage space of the feeding device 2.

[0038] Reference Figure 1 and Figure 2 The transfer device 3 is located at the discharge end of the feeding device 2. The transfer device 3 includes a transfer cylinder 31 arranged along the width direction of the base 1, a transfer seat 32 arranged at the piston end of the transfer cylinder 31, a linear motor 33 arranged on the transfer seat 32, and a receiving seat 34 arranged at the output end of the linear motor 33. The piston end of the transfer cylinder 31 moves in the same direction as the conveying direction of the conveyor belt 23. The linear motor 33 is used to drive the receiving seat 34 to move up and down. The transfer cylinder 31 is used to drive the receiving seat 34 to move towards the feeding device 2, so that the receiving seat 34 can receive the material on the feeding device 2. The discharge end of the mounting frame 21 is provided with a pushing assembly 28. The pushing assembly 28 is located at the end of the transfer device 3 away from the receiving device 4. The pushing assembly 28 includes a cylinder and a pushing rod arranged at the piston end of the cylinder. The pushing rod has a groove for positioning the material on the side facing the material.

[0039] Reference Figure 2 and Figure 3The pushing component 28 pushes the material toward the receiving device 4. The receiving device 4 includes a receiving bracket 41 mounted on the base 1, a linear motor 42 mounted on the receiving bracket 41 and arranged along the width direction of the base 1, a receiving seat 43 located at the output end of the linear motor 42, positioning plates 44 located at the bottom of the receiving seat 43 and on both sides of the receiving seat 43 along its length, an adjusting component 45 mounted on the receiving seat 43 for adjusting the distance between the two positioning plates 44, and a clamping component 46 for clamping and pulling the material. The two positioning plates 44 extend along the length direction of the base 1 and are used to position the material on both sides along its length. The side of the positioning plate 44 facing the material has a positioning groove 441 along its length. The end of the positioning groove 441 facing the material is funnel-shaped, and the end where the material enters is wider, which facilitates the material entering the positioning groove 441 and improves the positioning effect of the positioning plate 44 on the material. The adjusting component 45 can be a double-headed cylinder, with the piston ends of the double-headed cylinders respectively connected to the corresponding positioning plates 44. The double-headed cylinders drive the positioning plates 44 to move closer or further away from each other. The adjusting component 45 can also be a combination of two sets of cylinders or a motor and lead screw.

[0040] Reference Figure 3 and Figure 4 The clamping assembly 46 includes a drive member 461 mounted on the base 1 and extending along the length of the base 1, a lifting cylinder 462 mounted on the drive member 461, a clamping seat 463 mounted on the piston end of the lifting cylinder 462, and a gripper 464 mounted on the clamping seat 463. In this embodiment, the drive member 461 is a linear drive structure such as a cylinder, motor, lead screw combination, or linear motor, mainly used by the gripper 464 to clamp the material and drive the material to move along the length of the positioning plate 44. The two positioning plates 44 position the material on both sides, and then the linear motor 42 drives the material to move towards the conveying device 5. The conveying device 5 includes a drive member 2 mounted along the length of the base 1 and a conveying seat mounted on the drive member 2. The drive member 2 is a linear motor. To improve the stability of the conveying seat movement, the base 1 is provided with a slide rail along its length, and the conveying seat is provided with a slider located on the slide rail. The drive member 2 drives the conveying seat to move along the length of the base 1. In the specific implementation process, the conveying device 5 can directly use a conveyor belt or a linear drive structure such as a motor, lead screw, or motor, gear, rack, etc., which is mainly used to drive the material to move in a straight line and facilitates the control of the conveying switch.

[0041] Reference Figure 3 and Figure 4After the receiving device 4 conveys the material to the feeding end of the conveying device 5, the feeding end of the conveying device 5 is equipped with an adjusting device 6 to adjust the position of the material, ensuring that all subsequent material processing is carried out in a uniform position. The adjusting device 6 includes a linear motor 61 mounted on the receiving bracket 41, an adjusting seat 62 mounted on the linear motor 61, an adjusting component 64 located on the bottom surface of the adjusting seat 62, and an adjusting cylinder 63 mounted on the adjusting seat 62 for driving the adjusting component 64 to move up and down. Adjusting component 64 includes an adjusting plate 642 mounted on the piston end of adjusting cylinder 63, an adjusting cylinder 641 mounted on adjusting seat 62 with a driving direction consistent with the moving direction of conveying device 5, and several adjusting rods 643 mounted on the bottom surface of adjusting plate 642. In this embodiment, an mounting platform 19 is mounted on adjusting seat 62, and adjusting cylinder 641 is mounted on mounting platform 19 to drive mounting platform 19 to reciprocate along the conveying direction of conveying device 5; adjusting cylinder 63 is mounted on mounting platform 19 to facilitate adjusting plate 642 to move up and down. The width of the bottom end of adjusting rod 643 gradually decreases downwards, and several adjusting rods 643 are set according to the material position. The adjusting rod 643 is located at the end of the material away from the discharge end of conveying device 5. Linear motor 61 drives adjusting seat 62 to move directly above the material on conveying device 5, and then adjusting cylinder 63 drives adjusting rod 643 to move down and insert into the end of the material. Adjusting cylinder 641 drives adjusting rod 643 to push the material to move.

[0042] Reference Figure 4 and Figure 5 After the material positions are adjusted, to ensure uniformity, the detection device 7 checks the materials to ensure their positions are correctly adjusted. The detection device 7 includes a support base 71 mounted on the base 1, a linear motor 72 mounted on the support base 71 and above the conveyor 5, a detection seat 73 mounted on the linear motor 72, a detection cylinder 74 mounted on the detection seat 73, and a detection camera 75 positioned at the piston end of the detection cylinder 74. The linear motor 72 extends along the width of the base 1 and drives the detection camera 75 to move along the width of the conveyor 5, enabling it to detect each material individually. The detection cylinder 74 moves the detection camera 75 up and down, facilitating focusing and improving detection accuracy. Materials that pass the detection are then conveyed by the conveyor 5 for solder paste application.

[0043] Reference Figure 4 and Figure 5The material storage device 8 includes a material storage base 81 mounted on a base 1 and a material storage box 82 mounted on the material storage base 81 for storing solder paste. The top surface of the material storage box 82 is open to facilitate the application block 96 to pick up the solder paste. The material storage base is also provided with a smoothing component for smoothing the solder paste. The smoothing component includes a smoothing block located above the material storage box 82 and a drive component 3 mounted on the material storage base 81 for moving the smoothing block along the length of the material storage box. The drive component 3 can be a linear drive structure such as a cylinder or a linear motor. The application device 9 includes a mounting base 91 mounted on a base 1, a linear motor 92 mounted on the mounting base 91, a fixed base 93 mounted on the linear motor 92, a linear motor 94 mounted on the fixed base 93, an application seat 95 mounted on the linear motor 94, and an application block 96 mounted on the application seat 95. The linear motor 92 is positioned along the width of the base 1. A material storage device 8 is located on the moving path of the linear motor 92. A recycling device 20 for collecting excess solder paste from the application device 9 is also installed on the base 1. The linear motor 94 drives the application seat 95 to move up and down, facilitating the application block 96 to pick up solder paste. In this embodiment, the bottom surface of the application block 96 is provided with several protrusions corresponding to the grooves on the material, for applying solder paste into the grooves of the material. In specific implementation, if the material has protrusions, the application block 96 is provided with grooves corresponding to the protrusions, and the application method is set according to the location where solder paste needs to be applied to the material.

[0044] Reference Figure 4 and Figure 5The recycling device 20 is located on the conveying path of the linear motor 92. The recycling device 20 includes a recycling seat 201 mounted on the base 1, a contact plane 202 mounted on the recycling seat 201, baffles 203 mounted on the recycling seat 201 and located on both sides of the contact plane 202 along its length, and a scraping component 204 mounted on the recycling seat 201 for scraping solder paste from the contact plane 202. The scraping component 204 is located at one end of the contact plane 202. The recycling seat 201 is provided with a recycling box 25 located at the end of the contact plane 202 away from the scraping component 204. A baffle 3 is provided at the end of the recycling box 25 away from the contact plane 202. The scraping assembly 204 includes a scraper located on the contact plane 202 and a drive component four disposed on the recycling seat 201 for moving the scraper along the length of the contact plane 202. The drive component four is a linear motor, cylinder, or linear drive structure such as a motor or lead screw. The drive component four drives the scraper to scrape the solder paste on the contact plane 202. The end of the contact plane 202 near the recycling box 25 is sloped to facilitate the flow of solder paste into the recycling box 25. Linear motor five 92 drives the application block 96 to move to the storage box one 82. Linear motor six 94 drives the application block 96 to pick up the solder paste in the storage box one 82. Then, linear motor five 92 drives the application block 96 with solder paste to move to the material on the conveying device 5. Then, linear motor six 94 drives the application block 96 to press down to contact the material and apply the solder paste to the material. After the application is completed, the linear motor 92 drives the application block 96 to move onto the contact plane 202. The application block 96 presses down to stick the excess solder paste onto the contact plane 202. Then, the drive unit 4 drives the scraper to scrape the solder paste on the contact plane 202 into the recycling box 25.

[0045] Reference Figure 6 and Figure 7After the material on the conveying device 5 is coated with solder paste, the conveying device 5 conveys the material to the solder ball installation step. The material storage device 2 10 includes a material storage base 2 101, a material storage box 2 102 set on the material storage base 2 101, and a pushing cylinder 103 set on the material storage base 2 101 for pushing the material storage box to discharge. The top surface of the material storage box 2 102 is provided with an openable box cover. The end of the material storage box 2 102 facing the vibration device 11 has a discharge port. A cover plate located at the discharge port is installed on the material storage box 2 102. The upper end of the cover plate is hinged to the material storage box 2 102 through a rotating shaft. The pushing cylinder 103 is located at the end of the material storage box 2 102 away from the discharge port. The piston end of the pushing cylinder 103 is provided with a pushing sleeve. The pushing sleeve is located at the lower end of the material storage box 2 102. The pushing sleeve is used to reduce the wear of the pushing cylinder 103 on the material storage box 2 102. The storage base 2 101 is provided with ear seats for positioning the storage box 2 102. The two sides of the storage box 2 102 are connected to the ear seats through rotating shafts. The storage base 2 101 is also provided with a guide plate located below the storage box 2 102 for receiving the solder balls from the outlet. The guide plate is inclined downwards, with the lower end facing the vibration device 11, for guiding the solder balls into the vibration device 11.

[0046] Reference Figure 6 and Figure 7 The vibration device 11 includes a vibration seat 111, a vibration disk 112 disposed on the vibration seat 111, and a vibration element 113 disposed on the vibration seat 111 and located below the vibration disk 112. The vibration seat 111 is mounted on a base 1. The vibration element 113 includes a vibration motor mounted on the vibration seat 111 and an eccentric block disposed at the output end of the vibration motor. The vibration element 113 drives the vibration disk 112 to vibrate, causing the solder balls in the vibration disk 112 to vibrate and disperse, facilitating subsequent adsorption by the adsorption device 12. In this embodiment, the outer wall of the vibration seat 111 is surrounded by a recovery tray located below the vibration disk 112. The outer circumferential size of the recovery tray is larger than that of the vibration disk 112, mainly used to collect fallen solder balls. The recovery tray in this application is a proportionally enlarged size of the vibration disk 112, resulting in good recovery effect and preventing solder balls from falling everywhere and interfering with the processing environment. To facilitate the placement or replenishment of solder balls, in the specific implementation process, a robotic arm and several solder ball boxes can be installed on the base 1. One end of the solder ball box is open, which makes it easy for the robotic arm to grab and pour the solder balls, and replenish the solder balls into the storage box 2 102, thus shortening the replenishment time.

[0047] Reference Figure 6 and Figure 7The adsorption device 12 includes a linear motor 121 mounted on one side of the mounting base 91 along its length, an adsorption seat 122 mounted on the linear motor 121, a linear motor 123 mounted on the adsorption seat 122, a mounting block 124 mounted on the linear motor 123, a rotary motor 125 mounted on the mounting block 124, and an adsorption block 126 mounted on the rotary motor 125. The adsorption device 12 has several adsorption grooves corresponding to material grooves. The adsorption grooves are mounted on the adsorption block 126 and are located at the positions on the material where solder balls need to be installed. The adsorption end of the adsorption groove is arc-shaped to facilitate the adsorption and positioning of solder balls. A vacuum suction tube is connected to the end of the adsorption groove furthest from the adsorption end. The vacuum suction tube is connected to a vacuum pump to facilitate the adsorption of solder balls by the adsorption groove. Once the adsorption groove has absorbed all the solder balls, any excess solder balls cannot enter the adsorption groove.

[0048] Reference Figure 6 and Figure 7 Linear motor 7 121 extends along the width of base 1. Vibration device 11, detection device 2 13, and cleaning device 14 are all located on the moving path of linear motor 7 121. Linear motor 7 121 drives adsorption seat 122 from vibration device 11 to conveying device 5. Linear motor 8 123 drives mounting block 124 to move up and down, facilitating adsorption block 126 to adsorb solder balls and facilitating subsequent cleaning by cleaning device 14. Rotary motor 125 rotates adsorption block 126, facilitating the rotation of adsorption block 126 to correspond with the placement direction of vibrating plate 112, and facilitating subsequent alignment of adsorption block 126 with the material placement direction, facilitating material feeding or suction by adsorption block 126.

[0049] Reference Figure 7 and Figure 8 The cleaning device 14 is located between the detection device 2 13 and the vibration device 11. After the adsorption block 126 adsorbs the solder balls, it first goes to the cleaning device 14 to clean the excess solder balls, and then moves to the detection device 2 13 for detection. The cleaning device 14 includes a cleaning frame 141 and a cleaning tube 142 installed on the cleaning frame 141. The cleaning tube 142 is connected to a vacuum pump. The cleaning tube 142 has a long groove 1421 along its length on the side facing the adsorption block 126. After the adsorption block 126 passes through the cleaning tube 142, the long groove 1421 adsorbs the adsorption block 126. Solder balls that are not in the adsorption groove are not positioned by the adsorption groove's suction force, making it easy for the long groove 1421 to collect the solder balls and collect excess solder balls on the adsorption block 126.

[0050] Reference Figure 7 and Figure 8The detection device 2 13 includes a detection base 2 131 and a detection camera 2 132 mounted on the detection base 2 131. The detection base 2 131 is mounted on the base 1, and the detection surface of the detection camera 2 132 is set facing the adsorption end of the adsorption block 126. The detection camera 2 132 is used to detect whether all the adsorption slots on the adsorption block 126 have adsorbed solder balls, and at the same time to detect whether the solder balls have surface defects or other problems. The adsorption block 126 that has passed the detection is moved to the material on the conveying device 5 by the linear motor 7 121, and the linear motor 8 123 drives the adsorption block 126 to approach the material, and then the solder balls are placed on the material.

[0051] Reference Figure 7 and Figure 8 After the solder balls are installed on the material, it is conveyed by the conveyor 5 to the inspection device 3 15 for final inspection to check the quality of the solder ball installation. The inspection device 3 15 includes an inspection base 3 151, a linear motor 9 152 mounted on the inspection base 3 151 and extending along the width of the conveyor 5, a fixing frame 153 mounted on the linear motor 9 152, a linear motor 11 154 mounted on the fixing frame 153, and an inspection camera 3 155 mounted on the linear motor 11 154. The linear motor 9 152 drives the inspection camera 3 155 to move along the width of the base 1, facilitating the sequential inspection of the materials on the conveyor 5. The linear motor 11 154 drives the inspection camera 3 155 closer to the materials, facilitating the inspection of the solder ball installation quality on the materials. Materials that pass the inspection are conveyed by the conveyor 5 to the discharge end, where the material transfer device 16 picks up the materials and delivers them to the discharge device 17. Materials that are found to be defective are picked up by the receiving device 4 and transferred to the collection device 18.

[0052] Reference Figure 8 and Figure 9 The material transfer device 16 includes a support frame 161, a linear motor 162 mounted on the support frame 161, a material transfer seat 163 mounted on the linear motor 162, a material transfer cylinder 164 mounted on the material transfer seat 163, a pusher 165 mounted on the piston end of the material transfer cylinder 164, a pusher block 166 mounted on one end of the pusher 165, and material transfer plates 167 mounted at the bottom of the material transfer seat 163 for positioning the material on both sides along its length. The pusher block 166 is located at one end of the material transfer plate 167 and between the two material transfer plates 167. A limiting groove 1671 is formed along the length of the material transfer plate 167 on the side facing the material. The end of the limiting groove 1671 near the conveying device 5 is funnel-shaped, and the wider end faces the conveying device 5.

[0053] Reference Figure 8 and Figure 9The discharge device 17 includes a mounting plate 171 and a second conveyor belt 172 mounted on the mounting plate 171. A baffle plate 1711 is provided at the end of the mounting plate 171 away from the conveyor device 5. Position sensors can be installed at each processing node of the equipment in this application to detect the material position and improve the accuracy of the position of each node. The collection device 18 includes a collection seat 181, clamping plates 182 mounted on the collection seat 181 for positioning the material on both sides, and a baffle rod 183 mounted on the side of the collection seat 181 away from the conveyor device 5. The collection seat 181 is provided with an adjusting component 26 for adjusting the distance between the two clamping plates 182. The adjusting component 26 can be a double-headed cylinder, a motor, a double-headed screw, etc. When the adjusting component 26 is a double-headed cylinder, the clamping plates 182 are located at the piston end of the double-headed cylinder, and the distance between the two clamping plates 182 is controlled by the double-headed cylinder.

[0054] The implementation principle of a semiconductor chip processing equipment according to an embodiment of this application is as follows: The feeding device 2 is used for both conveying and storing materials. Multiple sets of materials can be placed on the feeding device 2. During equipment operation, the conveyor belt 23 can feed materials sequentially. The transfer device 3 picks up the materials from the feeding device 2 and aligns them with the discharge end of the receiving device 4 to facilitate receiving by the receiving device 4. After receiving the materials, the receiving device 4 conveys the materials to the conveying device 5. After placement, it returns to the feeding end to continue receiving materials.

[0055] The material on conveyor 5 first needs to be positioned. Adjustment device 6 adjusts the material's position on conveyor 5 to ensure consistency in subsequent processing positions and improve the accuracy of subsequent operations. After adjustment by adjustment device 6, detection device 7 checks whether the material's position adjustment is correct. There are two possible outcomes: 1. If the material position is still deviated, conveyor 5 returns the material to adjustment device 6 for further adjustment, and then continues to check; 2. If the material position is correctly adjusted, conveyor 5 directly conveys the material to the next processing node. To save adjustment time and improve overall processing efficiency, conveyor 5 is equipped with multiple sets to accelerate conveying efficiency and shorten waiting time for subsequent steps.

[0056] The conveyor 5 transports the inspected material to the solder paste application node. The application device 9 moves to the storage device 8 to pick up solder paste, then moves back to the conveyor 5 and lowers to apply the solder paste to the surface of the material. The application device 9 then returns to the storage device 8. Before returning, the application device 9 needs to transfer any excess solder paste from the application block 96 to the recycling device 20 before proceeding to the next application step. This improves the quality of subsequent solder paste application, prevents excess solder paste overflow, and enhances chip processing quality.

[0057] After the solder paste is applied to the material, solder balls need to be installed. The conveying device 5 conveys the material to the solder ball installation area. The adsorption device 12 moves to the front of the vibration device 11, and the storage device 10 pours the solder balls into the vibration device 11. The vibration device 11 vibrates and disperses the solder balls. Then, the adsorption device 12 moves above the vibration device 11 to adsorb the solder balls. Through vacuum adsorption, after the solder balls enter the adsorption tank, the adsorption end of the adsorption tank is blocked by the solder balls, and the adsorption source is turned off. At this time, the adsorption tank will not adsorb any excess solder balls. Due to the small size of the solder balls, excess solder balls will adhere to the bottom of the adsorption block 126 due to static electricity and other influences. At this time, the excess solder balls need to be cleaned off. The adsorption device 12 moves to the cleaning device 14 for cleaning. The cleaning device 14 vacuum adsorbs the excess solder balls through the elongated groove 1421. Since the excess solder balls are not positioned by the adsorption force of the adsorption tank, the elongated groove 1421 can easily clean the excess solder balls.

[0058] After the cleaning device 14 completes the cleaning, the adsorption device 12 moves to the detection device 13 for testing. The device checks whether all the solder balls have been adsorbed in the adsorption tanks at the bottom of the adsorption block 126. Three scenarios are possible: 1. If the test passes, the adsorption device 12 moves directly to the material on the conveying device 5 to discharge the material. 2. If the test fails, the adsorption is incomplete, with some adsorption tanks empty. In this case, the adsorption device 12 moves to the vibration device 11 to re-adsorb the solder balls. After adsorption, it moves back to the cleaning device 14 for cleaning, and the detection device 13 performs the test. 3. If the test fails, the solder balls have quality problems, such as surface damage or deformation. In this case, the adsorption device 12 moves to the material tray 27, places the batch of solder balls in the tray, and then returns to the vibration device 11 to adsorb a new batch of solder balls. The cleaning and testing process is then repeated.

[0059] The adsorption device 12, which passes the test, directly installs the solder balls onto the material in the conveying device 5. The conveying device 5 then transports the installed material to the testing device 15 for testing to check the quality of the solder ball installation. There are two possible outcomes: 1. If the test passes, the material is directly transferred by the transfer device 16 to the discharge device 17 for storage; 2. If the test fails, the material is moved by the transfer device 16 to the collection device 18 for handling by staff.

[0060] This application allows for batch installation of solder balls, improving product processing efficiency; each stage of this application includes testing results, improving product processing quality, reducing the cost of manual testing, saving processing time, and increasing production efficiency.

[0061] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor chip processing apparatus, characterized by: The device comprises a feeding device (2), a transfer device (3), a receiving device (4), a conveying device (5) and a discharging device (17) arranged in sequence along a chip processing path, and further comprises an adjusting device (6), a detecting device (7), a storing device (8), a smearing device (9), a storing device (10), an adsorbing device (12), a detecting device (13) and a detecting device (15) arranged along a chip conveying direction of the conveying device (5), the storing device (8) is used for storing solder paste, the smearing device (9) is used for smearing the solder paste on the chip of the conveying device (5), the storing device (10) is used for loading solder balls, the adsorbing device (12) is used for adsorbing the solder balls to the chip of the conveying device (5), which is the chip smeared with the solder paste, the discharging end of the conveying device (5) is further provided with a material moving device (16) and a collecting device (18), and the material moving device (16) is used for moving the chip to the discharging device (17) or the collecting device (18).

2. The semiconductor chip processing apparatus of claim 1, wherein: The feeding device (2) is used for conveying materials, and comprises a mounting frame (21), a material table (22) arranged on the mounting frame (21), a conveying belt (23) arranged on the material table (22), and a baffle (24) arranged on the mounting frame (21) and located at both sides of the material table (22) in the length direction, wherein the conveying belt (23) is located between the two baffles (24).

3. The semiconductor chip processing apparatus of claim 1, wherein: The transfer device (3) is located at the discharging end of the feeding device (2), and comprises a transfer cylinder (31) located at the discharging end of the feeding device (2), a transfer seat (32) arranged at the piston end of the transfer cylinder (31), a linear motor (33) arranged on the transfer seat (32), and a receiving seat (34) arranged on the linear motor (33), wherein the piston end of the transfer cylinder (31) reciprocates along the conveying direction of the feeding device (2), and the linear motor (33) is used to drive the receiving seat (34) to move up and down.

4. The semiconductor chip processing apparatus of claim 1, wherein: The receiving device (4) is located at the discharging end of the transfer device (3), and comprises a receiving support (41), a linear motor (42) arranged on the receiving support (41), a receiving seat (43) arranged on the linear motor (42), positioning plates (44) arranged on the bottom surface of the receiving seat (43) and located at both sides of the receiving seat (43) in the length direction, an adjusting assembly (45) arranged on the receiving seat (43), and a clamping assembly (46), wherein a positioning groove (441) is formed in the length direction on the side of the positioning plate (44) facing the material, the moving path of the linear motor (42) is from the transfer device (3) to the conveying device (5), the adjusting assembly (45) is used to adjust the distance between the two positioning plates (44), and the clamping assembly (46) is used to clamp and guide the material into the positioning groove (441).

5. The semiconductor chip processing apparatus of claim 1, wherein: The adjusting device (6) comprises a linear motor three (61), an adjusting seat (62) arranged on the linear motor three (61), an adjusting cylinder one (63) arranged on the adjusting seat (62), and an adjusting part one (64) arranged at the piston end of the adjusting cylinder one (63), the adjusting cylinder one (63) is used to drive the adjusting part one (64) to move up and down, the linear motor three (61) is used to drive the adjusting seat (62) to move along the width direction of the conveying device (5), the adjusting seat (62) is provided with a mounting table (19) for mounting the adjusting cylinder one (63), the adjusting part one (64) comprises an adjusting cylinder two (641) arranged on the adjusting seat (62), an adjusting plate (642) arranged at the piston end of the adjusting cylinder one (63), and a plurality of adjusting rods (643) arranged at the bottom surface of the adjusting plate (642), the piston end of the adjusting cylinder two (641) is connected with the mounting table (19), and the piston moving direction of the adjusting cylinder two (641) is consistent with the conveying direction of the conveying device (5).

6. The semiconductor chip processing apparatus of claim 1, wherein: The detection device one (7) is located above the conveying device (5), the detection device one (7) is used to detect whether the chip position is adjusted, if the detection is passed, the conveying device (5) continues to convey the material; if the detection is not passed, the conveying device (5) returns the material to the adjusting device (6) for re-adjustment; the detection device one (7) comprises a support seat (71), a linear motor four (72) arranged on the support seat (71) and located above the conveying device (5), a detection seat one (73) arranged on the linear motor four (72), a detection cylinder one (74) arranged on the detection seat one (73), and a detection camera one (75) arranged at the piston end of the detection cylinder one (74), the detection cylinder one (74) is used to drive the detection camera to move up and down, and the linear motor four (72) is reciprocally driven along the width direction of the conveying device (5).

7. The semiconductor chip processing apparatus of claim 1, wherein: The storage device one (8) comprises a storage seat one (81) and a storage box one (82) arranged on the storage seat one (81), and the top surface of the storage box one (82) is open; the smearing device (9) comprises a mounting seat (91), a linear motor five (92) arranged on the mounting seat (91), a fixing seat (93) arranged on the linear motor five (92), a linear motor six (94) arranged on the fixing seat (93), a smearing seat (95) arranged on the linear motor six (94), and a smearing block (96) arranged on the smearing seat (95), the linear motor five (92) is used to drive the smearing block (96) to move from the storage device one (8) to the conveying device (5), and the linear motor six (94) is used to drive the smearing block (96) to move up and down.

8. The semiconductor chip processing apparatus of claim 1, wherein: The storage device one (8) and the conveying device (5) are further provided with a recycling device (20), the recycling device (20) comprises a recycling seat (201), a contact plane (202) arranged on the recycling seat (201), a baffle two (203) arranged on the recycling seat (201) and located on both sides of the length direction of the contact plane (202), and a scraping assembly (204) arranged on the recycling seat (201), one end of the recycling seat (201) away from the scraping assembly (204) is provided with a recycling box (25), and one end of the contact plane (202) close to the recycling box (25) is inclined downward.

9. The semiconductor chip processing apparatus of claim 1, wherein: The storage device two (10) comprises a storage seat two (101), a storage box two (102) arranged on the storage seat two (101), and a pushing air cylinder (103) arranged on the storage seat two (101), the pushing air cylinder (103) is used for pushing the storage box to discharge; the discharging end of the storage device two (10) is provided with a vibrating device (11), the vibrating device (11) is used for uniformly dispersing tin balls, the vibrating device (11) comprises a vibrating seat (111), a vibrating disc (112) arranged on the vibrating seat (111), and a vibrating piece (113) arranged on the vibrating seat (111) and located below the vibrating disc (112), the vibrating piece (113) is used for driving the vibrating disc (112) to vibrate.

10. A semiconductor chip processing apparatus according to claim 9, wherein: The adsorption device (12) comprises a linear motor seven (121), an adsorption seat (122) arranged on the linear motor seven (121), a linear motor eight (123) arranged on the adsorption seat (122), a mounting block (124) arranged on the linear motor eight (123), a rotary motor (125) arranged on the mounting block (124), and an adsorption block (126) arranged on the output end of the rotary motor (125), the linear motor seven (121) is used for driving the adsorption block (126) to move back and forth between the storage device two (10) and the conveying device (5), the vibrating device (11) is located on the movement path of the linear motor seven (121), and the linear motor eight (123) is used for driving the adsorption block (126) to move up and down.

11. The semiconductor chip processing apparatus of claim 9, wherein: The detection device two (13) and the vibrating device (11) are provided with a cleaning device (14), the cleaning device (14) is used for cleaning the excess tin balls on the adsorption device (12), the cleaning device (14) comprises a cleaning frame (141) and a cleaning pipe (142) arranged on the cleaning frame (141), one end of the cleaning pipe (142) is sealed, the other end of the cleaning pipe (142) is connected with a vacuum pumping equipment, and a long slot (1421) is formed in the length direction on the side of the cleaning pipe (142) facing the adsorption block (126).

12. The semiconductor chip processing apparatus of claim 1, wherein: The second detection device (13) is located in the moving path of the adsorption device (12), and is used for detecting whether the tin balls on the adsorption device (12) are completely adsorbed; if the detection is passed, the adsorption device (12) moves above the material to discharge; if the detection is not passed, the adsorption device (12) needs to return to re-adsorb; the second detection device (13) comprises a second detection seat (131) and a second detection camera (132) arranged on the second detection seat (131).

13. The semiconductor chip processing apparatus of claim 1, wherein: The third detection device (15) is located at the discharging end of the conveying device (5), and is used for detecting whether the tin balls on the chip are well installed; the third detection device (15) comprises a third detection seat (151), a ninth linear motor (152) arranged on the third detection seat (151) and extending along the width direction of the conveying device (5), a fixing frame (153) arranged on the ninth linear motor (152), a tenth linear motor (154) arranged on the fixing frame (153) and a third detection camera (155) arranged on the tenth linear motor (154); the ninth linear motor (152) is used for driving the third detection camera (155) to move along the width direction of the conveying device (5); and the tenth linear motor (154) drives the third detection camera (155) to move up and down.

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